USD973609S1 - Upper shield with showerhead for a process chamber - Google Patents

Upper shield with showerhead for a process chamber Download PDF

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Publication number
USD973609S1
USD973609S1 US29/732,229 US202029732229F USD973609S US D973609 S1 USD973609 S1 US D973609S1 US 202029732229 F US202029732229 F US 202029732229F US D973609 S USD973609 S US D973609S
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United States
Prior art keywords
showerhead
process chamber
upper shield
view
elevation view
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US29/732,229
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English (en)
Inventor
Sarath Babu
Ananthkrishna Jupudi
Yueh Sheng Ow
Junqi Wei
Kelvin Tai Ming BOH
Kang Zhang
Yuichi Wada
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Applied Materials Inc
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Applied Materials Inc
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Priority to US29/732,229 priority Critical patent/USD973609S1/en
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUPUDI, ANANTHKRISHNA, BABU, Sarath, BOH, Kelvin Tai Ming, OW, Yueh Sheng, WEI, JUNQI, ZHANG, KANG
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WADA, YUICHI
Priority to TW109305849F priority patent/TWD215716S/zh
Priority to TW109305849D01F priority patent/TWD215717S/zh
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
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US29/732,229 2020-04-22 2020-04-22 Upper shield with showerhead for a process chamber Active USD973609S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/732,229 USD973609S1 (en) 2020-04-22 2020-04-22 Upper shield with showerhead for a process chamber
TW109305849F TWD215716S (zh) 2020-04-22 2020-10-22 用於處理腔室的具噴頭的上護罩
TW109305849D01F TWD215717S (zh) 2020-04-22 2020-10-22 用於處理腔室的具噴頭的上護罩

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/732,229 USD973609S1 (en) 2020-04-22 2020-04-22 Upper shield with showerhead for a process chamber

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USD973609S1 true USD973609S1 (en) 2022-12-27

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US29/732,229 Active USD973609S1 (en) 2020-04-22 2020-04-22 Upper shield with showerhead for a process chamber

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US (1) USD973609S1 (zh)
TW (2) TWD215717S (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD992614S1 (en) * 2018-12-06 2023-07-18 Tokyo Electron Limited Focus ring
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring

Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5762748A (en) 1992-08-27 1998-06-09 Applied Materials, Inc Lid and door for a vacuum chamber and pretreatment therefor
US20040149216A1 (en) * 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
US20070034337A1 (en) 2002-09-30 2007-02-15 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20100291319A1 (en) * 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
US20120305190A1 (en) 2011-05-31 2012-12-06 Lam Research Corporation Gas distribution system for ceramic showerhead of plasma etch reactor
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
US9728380B2 (en) 2012-08-31 2017-08-08 Novellus Systems, Inc. Dual-plenum showerhead with interleaved plenum sub-volumes
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD198930S (zh) 2018-04-20 2019-08-01 日商東京威力科創股份有限公司 基板搬運用保持墊之部分
TWD198931S (zh) 2018-04-20 2019-08-01 日商東京威力科創股份有限公司 基板搬運用保持墊之部分
US10577689B2 (en) 2016-09-23 2020-03-03 Applied Materials, Inc. Sputtering showerhead
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
US20210335581A1 (en) * 2020-04-22 2021-10-28 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20220223367A1 (en) * 2021-01-12 2022-07-14 Applied Materials, Inc. Reduced substrate process chamber cavity volume

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5762748A (en) 1992-08-27 1998-06-09 Applied Materials, Inc Lid and door for a vacuum chamber and pretreatment therefor
US20070034337A1 (en) 2002-09-30 2007-02-15 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US20040149216A1 (en) * 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US20100291319A1 (en) * 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20120305190A1 (en) 2011-05-31 2012-12-06 Lam Research Corporation Gas distribution system for ceramic showerhead of plasma etch reactor
US9728380B2 (en) 2012-08-31 2017-08-08 Novellus Systems, Inc. Dual-plenum showerhead with interleaved plenum sub-volumes
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US10577689B2 (en) 2016-09-23 2020-03-03 Applied Materials, Inc. Sputtering showerhead
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD198930S (zh) 2018-04-20 2019-08-01 日商東京威力科創股份有限公司 基板搬運用保持墊之部分
TWD198931S (zh) 2018-04-20 2019-08-01 日商東京威力科創股份有限公司 基板搬運用保持墊之部分
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
US20210335581A1 (en) * 2020-04-22 2021-10-28 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20220223367A1 (en) * 2021-01-12 2022-07-14 Applied Materials, Inc. Reduced substrate process chamber cavity volume

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PCT International Search Report and Written Opinion for PCT/US2021/027957 dated Aug. 6, 2021.
Search Report for Taiwan Design Application No. 109305849, dated Mar. 29, 2021.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD992614S1 (en) * 2018-12-06 2023-07-18 Tokyo Electron Limited Focus ring
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring

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Publication number Publication date
TWD215716S (zh) 2021-12-01
TWD215717S (zh) 2021-12-01

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