TWD215697S - 用於基板處理腔室的限制襯墊 - Google Patents

用於基板處理腔室的限制襯墊 Download PDF

Info

Publication number
TWD215697S
TWD215697S TW109305178F TW109305178F TWD215697S TW D215697 S TWD215697 S TW D215697S TW 109305178 F TW109305178 F TW 109305178F TW 109305178 F TW109305178 F TW 109305178F TW D215697 S TWD215697 S TW D215697S
Authority
TW
Taiwan
Prior art keywords
substrate processing
processing chamber
design
liner
sectional
Prior art date
Application number
TW109305178F
Other languages
English (en)
Inventor
喬瑟夫 佩里
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD215697S publication Critical patent/TWD215697S/zh

Links

Images

Abstract

【物品用途】;本設計請求具有視覺效果之用於基板處理腔室的限制襯墊。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;放大剖面圖為俯視圖中依據16-16之截線所取之剖面圖。

Description

用於基板處理腔室的限制襯墊
本設計請求具有視覺效果之用於基板處理腔室的限制襯墊。
圖式所揭露之虛線部分，為本案不主張設計之部分。
放大剖面圖為俯視圖中依據16-16之截線所取之剖面圖。
TW109305178F 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊 TWD215697S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/728,614 USD979524S1 (en) 2020-03-19 2020-03-19 Confinement liner for a substrate processing chamber
US29/728,614 2020-03-19

Publications (1)

Publication Number Publication Date
TWD215697S true TWD215697S (zh) 2021-12-01

Family

ID=76083950

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305178D01F TWD215698S (zh) 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊
TW109305178F TWD215697S (zh) 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109305178D01F TWD215698S (zh) 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊

Country Status (3)

Country Link
US (1) USD979524S1 (zh)
JP (2) JP1692414S (zh)
TW (2) TWD215698S (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD228390S (zh) 2022-11-25 2023-11-01 南韓商Ａｐ系統股份有限公司 用於半導體製造設備的腔壁的襯墊
USD1034493S1 (en) 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0821395A3 (en) 1996-07-19 1998-03-25 Tokyo Electron Limited Plasma processing apparatus
US6129808A (en) 1998-03-31 2000-10-10 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US6464843B1 (en) 1998-03-31 2002-10-15 Lam Research Corporation Contamination controlling method and apparatus for a plasma processing chamber
US6178919B1 (en) 1998-12-28 2001-01-30 Lam Research Corporation Perforated plasma confinement ring in plasma reactors
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6890861B1 (en) 2000-06-30 2005-05-10 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US6506254B1 (en) 2000-06-30 2003-01-14 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US20030092278A1 (en) 2001-11-13 2003-05-15 Fink Steven T. Plasma baffle assembly
US20040075036A1 (en) * 2002-10-04 2004-04-22 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20040118344A1 (en) 2002-12-20 2004-06-24 Lam Research Corporation System and method for controlling plasma with an adjustable coupling to ground circuit
US7972467B2 (en) 2003-04-17 2011-07-05 Applied Materials Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
US7267741B2 (en) 2003-11-14 2007-09-11 Lam Research Corporation Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
KR100621778B1 (ko) * 2005-06-17 2006-09-11 삼성전자주식회사 플라즈마 처리 장치
US7837826B2 (en) 2006-07-18 2010-11-23 Lam Research Corporation Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
US20080110567A1 (en) 2006-11-15 2008-05-15 Miller Matthew L Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution
JP5567486B2 (ja) 2007-10-31 2014-08-06 ラム リサーチ コーポレーション 窒化シリコン−二酸化シリコン高寿命消耗プラズマ処理構成部品
SG187387A1 (en) 2007-12-19 2013-02-28 Lam Res Corp Film adhesive for semiconductor vacuum processing apparatus
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
JP5432629B2 (ja) 2009-08-07 2014-03-05 東京エレクトロン株式会社 バッフル板及びプラズマ処理装置
JP2013503494A (ja) 2009-08-31 2013-01-31 ラム リサーチ コーポレーション プラズマ閉じ込めを実施するためのマルチペリフェラルリング構成
SG178286A1 (en) 2009-08-31 2012-03-29 Lam Res Corp Radio frequency (rf) ground return arrangements
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
US20110226739A1 (en) 2010-03-19 2011-09-22 Varian Semiconductor Equipment Associates, Inc. Process chamber liner with apertures for particle containment
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
US8826855B2 (en) 2010-06-30 2014-09-09 Lam Research Corporation C-shaped confinement ring for a plasma processing chamber
US9490106B2 (en) 2011-04-28 2016-11-08 Lam Research Corporation Internal Faraday shield having distributed chevron patterns and correlated positioning relative to external inner and outer TCP coil
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
SG11201402447TA (en) 2011-11-24 2014-06-27 Lam Res Corp Plasma processing chamber with flexible symmetric rf return strap
US20140113453A1 (en) 2012-10-24 2014-04-24 Lam Research Corporation Tungsten carbide coated metal component of a plasma reactor chamber and method of coating
CN103794460B (zh) 2012-10-29 2016-12-21 中微半导体设备(上海)有限公司 用于半导体装置性能改善的涂层
US8893702B2 (en) 2013-02-20 2014-11-25 Lam Research Corporation Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
FR3002242B1 (fr) * 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD729730S1 (en) * 2013-06-06 2015-05-19 Jon Simon Gillespie-Brown Power charging ring
KR101455311B1 (ko) * 2013-07-11 2014-10-27 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링
US9123661B2 (en) 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9330927B2 (en) 2013-08-28 2016-05-03 Lam Research Corporation System, method and apparatus for generating pressure pulses in small volume confined process reactor
US9184029B2 (en) 2013-09-03 2015-11-10 Lam Research Corporation System, method and apparatus for coordinating pressure pulses and RF modulation in a small volume confined process reactor
US10196728B2 (en) 2014-05-16 2019-02-05 Applied Materials, Inc. Plasma spray coating design using phase and stress control
JP1546800S (zh) * 2015-06-12 2016-03-28
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
CN106898534B (zh) 2015-12-21 2019-08-06 中微半导体设备(上海)股份有限公司 等离子体约束环、等离子体处理装置与基片处理方法
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
CN109643630A (zh) 2016-08-26 2019-04-16 应用材料公司 用于等离子体处理腔室的等离子体屏
KR102641441B1 (ko) * 2016-09-28 2024-02-29 삼성전자주식회사 링 어셈블리 및 이를 포함하는 척 어셈블리
JP1584906S (zh) * 2017-01-31 2017-08-28
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
USD895777S1 (en) * 2017-09-20 2020-09-08 Gardner Denver Petroleum Pumps Llc Header ring
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD228390S (zh) 2022-11-25 2023-11-01 南韓商Ａｐ系統股份有限公司 用於半導體製造設備的腔壁的襯墊
USD1034493S1 (en) 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP1686347S (zh) 2021-05-31
TWD215698S (zh) 2021-12-01
JP1692414S (zh) 2021-08-16
USD979524S1 (en) 2023-02-28

Similar Documents

Publication Publication Date Title
TWD214316S (zh) 基板處理腔室的內部護罩
TWD220838S (zh) 用於基板處理腔室的限制板
TWD212933S (zh) 用於處理腔室基板支撐件的基底板
TWD207742S (zh) 用於基材處理室的處理遮罩件
TWD210892S (zh) 用於基板處理腔室的沉積環
TWD215403S (zh) 用於基板處理腔室的沉積環
TWD215400S (zh) 基板處理腔室的製程護罩
TWD215399S (zh) 基板處理腔室的製程護罩
TWD210894S (zh) 用於基材處理室的處理遮罩件
TWD215697S (zh) 用於基板處理腔室的限制襯墊
TWD218929S (zh) 基板處理系統的主要框架
TWD218927S (zh) 基板處理系統的主要框架
TWD222060S (zh) 擴香器之部分
TWD215717S (zh) 用於處理腔室的具噴頭的上護罩
TWD229606S (zh) 瓶子
TWD229607S (zh) 瓶子
TWD222669S (zh) 用於半導體處理腔室中的蓋環
TWD230779S (zh) 真空泵浦的零件之部分
TWD227251S (zh) 基板處理腔室用的基板支撐件
TWD230777S (zh) 真空泵浦的零件之部分
TWD210660S (zh) 門板之部分(三十八)
TWD226529S (zh) 連接器之部分
TWD222403S (zh) 面罩之部分
TWD225956S (zh) 眼鏡（３４）之部分
TWD230778S (zh) 真空泵浦的零件之部分