TWD215697S - 用於基板處理腔室的限制襯墊 - Google Patents

用於基板處理腔室的限制襯墊 Download PDF

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Publication number
TWD215697S
TWD215697S TW109305178F TW109305178F TWD215697S TW D215697 S TWD215697 S TW D215697S TW 109305178 F TW109305178 F TW 109305178F TW 109305178 F TW109305178 F TW 109305178F TW D215697 S TWD215697 S TW D215697S
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Taiwan
Prior art keywords
substrate processing
processing chamber
design
liner
sectional
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TW109305178F
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English (en)
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喬瑟夫 佩里
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美商應用材料股份有限公司
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Publication of TWD215697S publication Critical patent/TWD215697S/zh

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Abstract

【物品用途】;本設計請求具有視覺效果之用於基板處理腔室的限制襯墊。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;放大剖面圖為俯視圖中依據16-16之截線所取之剖面圖。

Description

用於基板處理腔室的限制襯墊
本設計請求具有視覺效果之用於基板處理腔室的限制襯墊。
圖式所揭露之虛線部分，為本案不主張設計之部分。
放大剖面圖為俯視圖中依據16-16之截線所取之剖面圖。
TW109305178F 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊 TWD215697S (zh)

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US29/728,614 2020-03-19
US29/728,614 USD979524S1 (en) 2020-03-19 2020-03-19 Confinement liner for a substrate processing chamber

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TWD215697S true TWD215697S (zh) 2021-12-01

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TW109305178D01F TWD215698S (zh) 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊
TW109305178F TWD215697S (zh) 2020-03-19 2020-09-15 用於基板處理腔室的限制襯墊

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JP (2) JP1686347S (zh)
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TWD228390S (zh) 2022-11-25 2023-11-01 南韓商Ａｐ系統股份有限公司 用於半導體製造設備的腔壁的襯墊

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Publication number Priority date Publication date Assignee Title
TWD228390S (zh) 2022-11-25 2023-11-01 南韓商Ａｐ系統股份有限公司 用於半導體製造設備的腔壁的襯墊
USD1034493S1 (en) 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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Publication number Publication date
JP1692414S (zh) 2021-08-16
TWD215698S (zh) 2021-12-01
USD979524S1 (en) 2023-02-28
USD1051867S1 (en) 2024-11-19
JP1686347S (zh) 2021-05-31

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