TWD228390S - 用於半導體製造設備的腔壁的襯墊 - Google Patents
用於半導體製造設備的腔壁的襯墊 Download PDFInfo
- Publication number
- TWD228390S TWD228390S TW112302415F TW112302415F TWD228390S TW D228390 S TWD228390 S TW D228390S TW 112302415 F TW112302415 F TW 112302415F TW 112302415 F TW112302415 F TW 112302415F TW D228390 S TWD228390 S TW D228390S
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor manufacturing
- manufacturing apparatus
- chamber wall
- wall liner
- chamber
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000006227 byproduct Substances 0.000 abstract description 2
- 239000000356 contaminant Substances 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
Images
Abstract
【物品用途】;本設計物品用於安裝在進行半導體製程的腔室，以防止製程副產品產生的污染物沉積在腔室的內壁上。;【設計說明】;（省略之）
Description
本設計物品用於安裝在進行半導體製程的腔室，以防止製程副產品產生的污染物沉積在腔室的內壁上。
（省略之）
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR30-2022-0049283 | 2022-11-25 | ||
| KR20220049283 | 2022-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD228390S true TWD228390S (zh) | 2023-11-01 |
Family
ID=88875469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112302415F TWD228390S (zh) | 2022-11-25 | 2023-05-17 | 用於半導體製造設備的腔壁的襯墊 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1034493S1 (zh) |
| TW (1) | TWD228390S (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD215697S (zh) | 2020-03-19 | 2021-12-01 | 美商應用材料股份有限公司 | 用於基板處理腔室的限制襯墊 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7252738B2 (en) * | 2002-09-20 | 2007-08-07 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
| US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
| WO2012024061A2 (en) * | 2010-08-20 | 2012-02-23 | Applied Materials, Inc. | Extended life deposition ring |
| USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
| USD716239S1 (en) * | 2013-11-06 | 2014-10-28 | Applied Materials, Inc. | Upper chamber liner |
| USD717746S1 (en) * | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
| USD711331S1 (en) * | 2013-11-07 | 2014-08-19 | Applied Materials, Inc. | Upper chamber liner |
| USD716240S1 (en) * | 2013-11-07 | 2014-10-28 | Applied Materials, Inc. | Lower chamber liner |
| JP1546801S (zh) * | 2015-06-12 | 2016-03-28 | ||
| USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
| CN110892502B (zh) * | 2017-06-01 | 2022-10-04 | 欧瑞康表面处理解决方案股份公司普费菲孔 | 用于脆性材料的安全经济蒸发的靶组件 |
| JP1612684S (zh) * | 2018-02-08 | 2018-09-03 | ||
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
-
2023
- 2023-05-11 US US29/891,977 patent/USD1034493S1/en active Active
- 2023-05-17 TW TW112302415F patent/TWD228390S/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD215697S (zh) | 2020-03-19 | 2021-12-01 | 美商應用材料股份有限公司 | 用於基板處理腔室的限制襯墊 |
Also Published As
| Publication number | Publication date |
|---|---|
| USD1034493S1 (en) | 2024-07-09 |
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