TWD215403S - 用於基板處理腔室的沉積環 - Google Patents

用於基板處理腔室的沉積環 Download PDF

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Publication number
TWD215403S
TWD215403S TW109305257D01F TW109305257D01F TWD215403S TW D215403 S TWD215403 S TW D215403S TW 109305257D01 F TW109305257D01 F TW 109305257D01F TW 109305257D01 F TW109305257D01 F TW 109305257D01F TW D215403 S TWD215403 S TW D215403S
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TW
Taiwan
Prior art keywords
design
deposition ring
processing chamber
substrate processing
derivative
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Application number
TW109305257D01F
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English (en)
Inventor
伊利亞 拉維斯基
凱斯Ａ 米勒
吉留剛一
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD215403S publication Critical patent/TWD215403S/zh

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Abstract

【物品用途】;本設計係關於用於基板處理腔室的沉積環之外觀設計。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;本衍生設計案與原設計(第109305257號申請案)案差異在於，本衍生設計沉積環上的「凹槽」係以虛線表示(即不主張設計之部分)。

Description

用於基板處理腔室的沉積環
本設計係關於用於基板處理腔室的沉積環之外觀設計。
圖式所揭露之虛線部分，為本案不主張設計之部分。
本衍生設計案與原設計(第109305257號申請案)案差異在於，本衍生設計沉積環上的「凹槽」係以虛線表示(即不主張設計之部分)。
TW109305257D01F 2020-03-20 2020-09-18 用於基板處理腔室的沉積環 TWD215403S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/728,822 2020-03-20
US29/728,822 USD934315S1 (en) 2020-03-20 2020-03-20 Deposition ring for a substrate processing chamber

Publications (1)

Publication Number Publication Date
TWD215403S true TWD215403S (zh) 2021-11-21

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TW109305257F TWD215402S (zh) 2020-03-20 2020-09-18 用於基板處理腔室的沉積環
TW109305257D01F TWD215403S (zh) 2020-03-20 2020-09-18 用於基板處理腔室的沉積環

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US (1) USD934315S1 (zh)
JP (2) JP1696760S (zh)
TW (2) TWD215402S (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1646505S (zh) * 2018-12-07 2019-11-25
USD941787S1 (en) * 2020-03-03 2022-01-25 Applied Materials, Inc. Substrate transfer blade
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD984895S1 (en) * 2020-12-22 2023-05-02 Applied Materials, Inc. Packaging insert for a process chamber component
USD983915S1 (en) * 2021-02-03 2023-04-18 Bradley R. Mason Flattened ring-shaped golf alignment stick stand
USD983297S1 (en) * 2021-02-03 2023-04-11 Bradley R. Mason Ring-shaped golf alignment stick stand
USD984571S1 (en) * 2021-02-03 2023-04-25 Bradley R. Mason Disc-shaped golf alignment stick stand
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60162139A (ja) 1984-01-31 1985-08-23 Natl House Ind Co Ltd 空調装置
JP2623673B2 (ja) 1988-04-19 1997-06-25 オムロン株式会社 電磁継電器
US4949884A (en) * 1989-12-11 1990-08-21 Dahl Gordon T Paint can lid with drip-free pour spout
USD403337S (en) * 1997-08-05 1998-12-29 Applied Materials, Inc. High conductance low wall deposition upper shield
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
US20040074933A1 (en) * 2002-10-16 2004-04-22 Trenley Tilbrook Paint can and paint can lid with extendable and retractable lid spout
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US8133368B2 (en) * 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
US9181619B2 (en) * 2010-02-26 2015-11-10 Fujifilm Corporation Physical vapor deposition with heat diffuser
US9834840B2 (en) 2010-05-14 2017-12-05 Applied Materials, Inc. Process kit shield for improved particle reduction
USD649986S1 (en) * 2010-08-17 2011-12-06 Ebara Corporation Sealing ring
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
JP1438319S (zh) * 2011-09-20 2015-04-06
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
CN105008582A (zh) * 2013-01-04 2015-10-28 东曹Smd有限公司 具有增强的表面轮廓和改善的性能的硅溅射靶及其制造方法
FR3002242B1 (fr) * 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
USD738451S1 (en) * 2014-11-11 2015-09-08 Mary Olson Golf ball target for chipping and putting
US10546733B2 (en) 2014-12-31 2020-01-28 Applied Materials, Inc. One-piece process kit shield
USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1546800S (zh) * 2015-06-12 2016-03-28
SG10202108705SA (en) 2015-07-03 2021-09-29 Applied Materials Inc Process kit having tall deposition ring and deposition ring clamp
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
US10103012B2 (en) 2015-09-11 2018-10-16 Applied Materials, Inc. One-piece process kit shield for reducing the impact of an electric field near the substrate
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
US10648071B2 (en) 2016-11-19 2020-05-12 Applied Materials, Inc. Process kit having a floating shadow ring
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
WO2018220067A1 (en) * 2017-06-01 2018-12-06 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
US10998172B2 (en) 2017-09-22 2021-05-04 Applied Materials, Inc. Substrate processing chamber having improved process volume sealing
TWD197827S (zh) 2017-12-19 2019-06-01 日商荏原製作所股份有限公&#x5 半導體晶圓研磨用彈性膜
JP1605779S (zh) 2017-12-19 2018-06-04
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

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Publication number Publication date
JP1696765S (zh) 2021-10-11
USD934315S1 (en) 2021-10-26
JP1696760S (zh) 2021-10-11
TWD215402S (zh) 2021-11-21

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