USD941787S1 - Substrate transfer blade - Google Patents

Substrate transfer blade Download PDF

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Publication number
USD941787S1
USD941787S1 US29/726,488 US202029726488F USD941787S US D941787 S1 USD941787 S1 US D941787S1 US 202029726488 F US202029726488 F US 202029726488F US D941787 S USD941787 S US D941787S
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US
United States
Prior art keywords
substrate transfer
transfer blade
view
blade
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/726,488
Inventor
Sultan Malik
Srinivas D. Nemani
Adib M. Khan
Qiwei Liang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/726,488 priority Critical patent/USD941787S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Khan, Adib M., LIANG, QIWEI, MALIK, SULTAN, NEMANI, SRINIVAS D.
Application granted granted Critical
Publication of USD941787S1 publication Critical patent/USD941787S1/en
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Description

FIG. 1 is a top perspective view of a substrate transfer blade embodying our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a front elevation view thereof;
FIG. 8 is a rear elevation view thereof;
FIG. 9 is a cross-sectional view thereof taken along line 9-9 in FIG. 4; and,
FIG. 10 is an enlargement view thereof for the portion referenced in FIG. 9.
The broken lines in the drawings illustrate portions of the substrate transfer blade that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate transfer blade, as shown and described.
US29/726,488 2020-03-03 2020-03-03 Substrate transfer blade Active USD941787S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/726,488 USD941787S1 (en) 2020-03-03 2020-03-03 Substrate transfer blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/726,488 USD941787S1 (en) 2020-03-03 2020-03-03 Substrate transfer blade

Publications (1)

Publication Number Publication Date
USD941787S1 true USD941787S1 (en) 2022-01-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/726,488 Active USD941787S1 (en) 2020-03-03 2020-03-03 Substrate transfer blade

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US (1) USD941787S1 (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080178801A1 (en) * 2007-01-29 2008-07-31 Applied Materials, Inc. Process kit for substrate processing chamber
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
US20170088949A1 (en) 2015-09-30 2017-03-30 Applied Materials, Inc. High temperature vapor delivery system and method
US20170287752A1 (en) 2016-03-29 2017-10-05 Applied Materials, Inc. Integrated metrology and process tool to enable local stress/overlay correction
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
US20180261480A1 (en) 2017-03-10 2018-09-13 Applied Materials, Inc. High pressure wafer processing systems and related methods
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
US20190096638A1 (en) * 2017-09-22 2019-03-28 Applied Materials, Inc. Substrate processing chamber having improved process volume sealing
US10347475B2 (en) * 2005-10-31 2019-07-09 Applied Materials, Inc. Holding assembly for substrate processing chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD904640S1 (en) * 2019-01-21 2020-12-08 Applied Materials, Inc. Substrate carrier
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10347475B2 (en) * 2005-10-31 2019-07-09 Applied Materials, Inc. Holding assembly for substrate processing chamber
US20080178801A1 (en) * 2007-01-29 2008-07-31 Applied Materials, Inc. Process kit for substrate processing chamber
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
US20170088949A1 (en) 2015-09-30 2017-03-30 Applied Materials, Inc. High temperature vapor delivery system and method
JP2017101318A (en) 2015-09-30 2017-06-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ High temperature vapor supply system and method
US20170287752A1 (en) 2016-03-29 2017-10-05 Applied Materials, Inc. Integrated metrology and process tool to enable local stress/overlay correction
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
US20180261480A1 (en) 2017-03-10 2018-09-13 Applied Materials, Inc. High pressure wafer processing systems and related methods
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
US20190096638A1 (en) * 2017-09-22 2019-03-28 Applied Materials, Inc. Substrate processing chamber having improved process volume sealing
USD904640S1 (en) * 2019-01-21 2020-12-08 Applied Materials, Inc. Substrate carrier
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber

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