TWD220838S - 用於基板處理腔室的限制板 - Google Patents

用於基板處理腔室的限制板 Download PDF

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Publication number
TWD220838S
TWD220838S TW110303814F TW110303814F TWD220838S TW D220838 S TWD220838 S TW D220838S TW 110303814 F TW110303814 F TW 110303814F TW 110303814 F TW110303814 F TW 110303814F TW D220838 S TWD220838 S TW D220838S
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TW
Taiwan
Prior art keywords
substrate processing
processing chamber
confinement plate
design
sectional
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TW110303814F
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English (en)
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喬瑟夫 佩里
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美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD220838S publication Critical patent/TWD220838S/zh

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Abstract

【物品用途】;本設計請求具有視覺效果之用於基板處理腔室的限制板。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。;放大剖面圖為俯視圖中依據8-8之截線所取之剖面圖。

Description

用於基板處理腔室的限制板
本設計請求具有視覺效果之用於基板處理腔室的限制板。
圖式所揭露之虛線部分,為本案不主張設計之部分。
放大剖面圖為俯視圖中依據8-8之截線所取之剖面圖。
TW110303814F 2020-03-19 2020-09-16 用於基板處理腔室的限制板 TWD220838S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/728,616 USD943539S1 (en) 2020-03-19 2020-03-19 Confinement plate for a substrate processing chamber
US29/728,616 2020-03-19

Publications (1)

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TWD220838S true TWD220838S (zh) 2022-09-01

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TW109305190F TWD216905S (zh) 2020-03-19 2020-09-16 用於基板處理腔室的限制板

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TW109305190F TWD216905S (zh) 2020-03-19 2020-09-16 用於基板處理腔室的限制板

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US (2) USD943539S1 (zh)
JP (2) JP1698489S (zh)
TW (2) TWD220838S (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD883035S1 (en) * 2018-08-07 2020-05-05 Frontline Advance Llc Eating dish with a removable handle
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1012873S1 (en) * 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
JP1684468S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0821395A3 (en) 1996-07-19 1998-03-25 Tokyo Electron Limited Plasma processing apparatus
US6464843B1 (en) 1998-03-31 2002-10-15 Lam Research Corporation Contamination controlling method and apparatus for a plasma processing chamber
US6129808A (en) 1998-03-31 2000-10-10 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US6178919B1 (en) 1998-12-28 2001-01-30 Lam Research Corporation Perforated plasma confinement ring in plasma reactors
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6506254B1 (en) 2000-06-30 2003-01-14 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US6890861B1 (en) 2000-06-30 2005-05-10 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US20030092278A1 (en) 2001-11-13 2003-05-15 Fink Steven T. Plasma baffle assembly
US20040075036A1 (en) * 2002-10-04 2004-04-22 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20040118344A1 (en) 2002-12-20 2004-06-24 Lam Research Corporation System and method for controlling plasma with an adjustable coupling to ground circuit
US7972467B2 (en) 2003-04-17 2011-07-05 Applied Materials Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor
US7267741B2 (en) 2003-11-14 2007-09-11 Lam Research Corporation Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7364623B2 (en) * 2005-01-27 2008-04-29 Lam Research Corporation Confinement ring drive
KR100621778B1 (ko) * 2005-06-17 2006-09-11 삼성전자주식회사 플라즈마 처리 장치
US7837826B2 (en) 2006-07-18 2010-11-23 Lam Research Corporation Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
US20080110567A1 (en) 2006-11-15 2008-05-15 Miller Matthew L Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution
JP5567486B2 (ja) 2007-10-31 2014-08-06 ラム リサーチ コーポレーション 窒化シリコン−二酸化シリコン高寿命消耗プラズマ処理構成部品
WO2009078923A2 (en) 2007-12-19 2009-06-25 Lam Research Corporation Film adhesive for semiconductor vacuum processing apparatus
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
JP5432629B2 (ja) 2009-08-07 2014-03-05 東京エレクトロン株式会社 バッフル板及びプラズマ処理装置
KR102240849B1 (ko) 2009-08-31 2021-04-14 램 리써치 코포레이션 무선 주파수 (rf) 접지 복귀 장치들
US20110100553A1 (en) 2009-08-31 2011-05-05 Rajinder Dhindsa multi-peripheral ring arrangement for performing plasma confinement
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
US20110226739A1 (en) 2010-03-19 2011-09-22 Varian Semiconductor Equipment Associates, Inc. Process chamber liner with apertures for particle containment
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
US8826855B2 (en) * 2010-06-30 2014-09-09 Lam Research Corporation C-shaped confinement ring for a plasma processing chamber
US9490106B2 (en) 2011-04-28 2016-11-08 Lam Research Corporation Internal Faraday shield having distributed chevron patterns and correlated positioning relative to external inner and outer TCP coil
JP1438745S (zh) * 2011-09-20 2015-04-06
JP1438320S (zh) * 2011-09-20 2015-04-06
JP1438319S (zh) * 2011-09-20 2015-04-06
USD709537S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
WO2013078434A1 (en) 2011-11-24 2013-05-30 Lam Research Corporation Plasma processing chamber with flexible symmetric rf return strap
US20140113453A1 (en) 2012-10-24 2014-04-24 Lam Research Corporation Tungsten carbide coated metal component of a plasma reactor chamber and method of coating
CN103794460B (zh) 2012-10-29 2016-12-21 中微半导体设备(上海)有限公司 用于半导体装置性能改善的涂层
US8893702B2 (en) 2013-02-20 2014-11-25 Lam Research Corporation Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
FR3002242B1 (fr) * 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD729730S1 (en) * 2013-06-06 2015-05-19 Jon Simon Gillespie-Brown Power charging ring
KR101455311B1 (ko) * 2013-07-11 2014-10-27 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링
US9123661B2 (en) 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9330927B2 (en) 2013-08-28 2016-05-03 Lam Research Corporation System, method and apparatus for generating pressure pulses in small volume confined process reactor
US9184029B2 (en) 2013-09-03 2015-11-10 Lam Research Corporation System, method and apparatus for coordinating pressure pulses and RF modulation in a small volume confined process reactor
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core
US10196728B2 (en) 2014-05-16 2019-02-05 Applied Materials, Inc. Plasma spray coating design using phase and stress control
JP1546800S (zh) * 2015-06-12 2016-03-28
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
CN106898534B (zh) 2015-12-21 2019-08-06 中微半导体设备(上海)股份有限公司 等离子体约束环、等离子体处理装置与基片处理方法
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
KR102641441B1 (ko) * 2016-09-28 2024-02-29 삼성전자주식회사 링 어셈블리 및 이를 포함하는 척 어셈블리
JP1584784S (zh) * 2017-01-31 2017-08-28
JP1584906S (zh) * 2017-01-31 2017-08-28
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
JP1598997S (zh) * 2017-08-31 2018-03-05
USD895777S1 (en) * 2017-09-20 2020-09-08 Gardner Denver Petroleum Pumps Llc Header ring
KR102040281B1 (ko) 2018-04-26 2019-11-04 주식회사 건테크 CVD-SiC 소재를 이용한 반도체 플라즈마 에칭 공정용 한정 링
TWD195951S (zh) 2018-05-29 2019-02-11 中國探針股份有限公司 探針測試頭
JP1640255S (zh) * 2018-10-25 2019-09-02
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD947914S1 (en) * 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support

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Publication number Publication date
JP1686348S (zh) 2021-05-31
JP1698489S (zh) 2021-11-01
USD986190S1 (en) 2023-05-16
USD943539S1 (en) 2022-02-15
TWD216905S (zh) 2022-02-01

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