USD1016761S1 - Top plate for semiconductor manufacturaing equipment - Google Patents

Top plate for semiconductor manufacturaing equipment Download PDF

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Publication number
USD1016761S1
USD1016761S1 US29/794,124 US202129794124F USD1016761S US D1016761 S1 USD1016761 S1 US D1016761S1 US 202129794124 F US202129794124 F US 202129794124F US D1016761 S USD1016761 S US D1016761S
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US
United States
Prior art keywords
manufacturaing
semiconductor
equipment
top plate
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/794,124
Inventor
Takuto UMETSU
Masayoshi Yajima
Kunihiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuflare Technology Inc
Original Assignee
Nuflare Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2020-26581F external-priority patent/JP1692955S/ja
Priority claimed from JPD2020-26580F external-priority patent/JP1692954S/ja
Priority claimed from JPD2021-11039F external-priority patent/JP1702367S/ja
Application filed by Nuflare Technology Inc filed Critical Nuflare Technology Inc
Assigned to NUFLARE TECHNOLOGY, INC. reassignment NUFLARE TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SUZUKI, KUNIHIKO, UMETSU, TAKUTO, YAJIMA, MASAYOSHI
Application granted granted Critical
Publication of USD1016761S1 publication Critical patent/USD1016761S1/en
Active legal-status Critical Current
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Description

FIG. 1 is a perspective view of a top plate for semiconductor manufacturaing equipment showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being a mirror image thereof;
FIG. 3 is a right-side elevational view thereof, the left-side elevational view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is another perspective view thereof;
FIG. 7 is a cross-sectional view taken along a line 7-7 of FIG. 4 ; and,
FIG. 8 is an enlarged view of portion 8 enclosed by a dot-dot-dash line in FIG. 6 .
The broken lines shown are included for the purpose of illustrating portions of the design which form no part of the claimed design. The dot-dash lines indicate the boundary between the claimed portion and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a top plate for semiconductor manufacturaing equipment, as shown and described.
US29/794,124 2020-12-10 2021-06-10 Top plate for semiconductor manufacturaing equipment Active USD1016761S1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-026580D 2020-12-10
JPD2020-26581F JP1692955S (en) 2020-12-10 2020-12-10
JP2020-026581D 2020-12-10
JPD2020-26580F JP1692954S (en) 2020-12-10 2020-12-10
JP2021-011039D 2021-05-25
JPD2021-11039F JP1702367S (en) 2021-05-25 2021-05-25

Publications (1)

Publication Number Publication Date
USD1016761S1 true USD1016761S1 (en) 2024-03-05

Family

ID=90055128

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/794,124 Active USD1016761S1 (en) 2020-12-10 2021-06-10 Top plate for semiconductor manufacturaing equipment

Country Status (1)

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US (1) USD1016761S1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5855680A (en) * 1994-11-28 1999-01-05 Neste Oy Apparatus for growing thin films
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US8999063B2 (en) * 2008-05-02 2015-04-07 Nuflare Technology, Inc. Susceptor, semiconductor manufacturing apparatus, and semiconductor manufacturing method
JP2016207932A (en) * 2015-04-27 2016-12-08 株式会社Sumco Susceptor and epitaxial growth device
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD208042S (en) 2019-08-20 2020-11-01 南韓商吉佳藍科技股份有限公司 A vessel for plasma processing device
US20210082737A1 (en) * 2019-09-16 2021-03-18 Ap Systems Inc. Edge ring and heat treatment apparatus having the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5855680A (en) * 1994-11-28 1999-01-05 Neste Oy Apparatus for growing thin films
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US8999063B2 (en) * 2008-05-02 2015-04-07 Nuflare Technology, Inc. Susceptor, semiconductor manufacturing apparatus, and semiconductor manufacturing method
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
JP2016207932A (en) * 2015-04-27 2016-12-08 株式会社Sumco Susceptor and epitaxial growth device
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD208042S (en) 2019-08-20 2020-11-01 南韓商吉佳藍科技股份有限公司 A vessel for plasma processing device
US20210082737A1 (en) * 2019-09-16 2021-03-18 Ap Systems Inc. Edge ring and heat treatment apparatus having the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation.

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