USD1016761S1 - Top plate for semiconductor manufacturaing equipment - Google Patents
Top plate for semiconductor manufacturaing equipment Download PDFInfo
- Publication number
- USD1016761S1 USD1016761S1 US29/794,124 US202129794124F USD1016761S US D1016761 S1 USD1016761 S1 US D1016761S1 US 202129794124 F US202129794124 F US 202129794124F US D1016761 S USD1016761 S US D1016761S
- Authority
- US
- United States
- Prior art keywords
- manufacturaing
- semiconductor
- equipment
- top plate
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
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Description
The broken lines shown are included for the purpose of illustrating portions of the design which form no part of the claimed design. The dot-dash lines indicate the boundary between the claimed portion and forms no part of the claimed design.
Claims (1)
- The ornamental design for a top plate for semiconductor manufacturaing equipment, as shown and described.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-026580D | 2020-12-10 | ||
JPD2020-26581F JP1692955S (en) | 2020-12-10 | 2020-12-10 | |
JP2020-026581D | 2020-12-10 | ||
JPD2020-26580F JP1692954S (en) | 2020-12-10 | 2020-12-10 | |
JP2021-011039D | 2021-05-25 | ||
JPD2021-11039F JP1702367S (en) | 2021-05-25 | 2021-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1016761S1 true USD1016761S1 (en) | 2024-03-05 |
Family
ID=90055128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/794,124 Active USD1016761S1 (en) | 2020-12-10 | 2021-06-10 | Top plate for semiconductor manufacturaing equipment |
Country Status (1)
Country | Link |
---|---|
US (1) | USD1016761S1 (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855680A (en) * | 1994-11-28 | 1999-01-05 | Neste Oy | Apparatus for growing thin films |
USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
US8999063B2 (en) * | 2008-05-02 | 2015-04-07 | Nuflare Technology, Inc. | Susceptor, semiconductor manufacturing apparatus, and semiconductor manufacturing method |
JP2016207932A (en) * | 2015-04-27 | 2016-12-08 | 株式会社Sumco | Susceptor and epitaxial growth device |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
TWD208042S (en) | 2019-08-20 | 2020-11-01 | 南韓商吉佳藍科技股份有限公司 | A vessel for plasma processing device |
US20210082737A1 (en) * | 2019-09-16 | 2021-03-18 | Ap Systems Inc. | Edge ring and heat treatment apparatus having the same |
-
2021
- 2021-06-10 US US29/794,124 patent/USD1016761S1/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855680A (en) * | 1994-11-28 | 1999-01-05 | Neste Oy | Apparatus for growing thin films |
USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
US8999063B2 (en) * | 2008-05-02 | 2015-04-07 | Nuflare Technology, Inc. | Susceptor, semiconductor manufacturing apparatus, and semiconductor manufacturing method |
US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
JP2016207932A (en) * | 2015-04-27 | 2016-12-08 | 株式会社Sumco | Susceptor and epitaxial growth device |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
TWD208042S (en) | 2019-08-20 | 2020-11-01 | 南韓商吉佳藍科技股份有限公司 | A vessel for plasma processing device |
US20210082737A1 (en) * | 2019-09-16 | 2021-03-18 | Ap Systems Inc. | Edge ring and heat treatment apparatus having the same |
Non-Patent Citations (1)
Title |
---|
Taiwanese Office Action (TW OA) dated Feb. 25, 2022 issued in Taiwanese patent application No. 110302988 and its English translation. |
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Legal Events
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FEPP | Fee payment procedure |
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