TWI760096B - 微型化半導體製程系統 - Google Patents

微型化半導體製程系統 Download PDF

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TWI760096B
TWI760096B TW110104405A TW110104405A TWI760096B TW I760096 B TWI760096 B TW I760096B TW 110104405 A TW110104405 A TW 110104405A TW 110104405 A TW110104405 A TW 110104405A TW I760096 B TWI760096 B TW I760096B
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miniaturized semiconductor
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吳學憲
詹志遠
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矽碁科技股份有限公司
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Abstract

本發明關於一種微型化半導體製程系統，包括：一殼體，包括一內部空間及一與該內部空間連通之開口；一升降機構，設於該內部空間且包括一供置放一基板之載台，該載台可沿一第一方向相對該開口移動於一第一位置及一第二位置之間；一處理腔室，設於該內部空間且包括一供置放該基板之承載部；及一取送機構，可沿一第二方向移動地設於該升降機構與該處理腔室之間，供於該載台與該承載部之間取送該基板；其中，該殼體之一長寬比值介於1至6。

Description

微型化半導體製程系統
本發明係與製程系統有關，特別是有關於一種微型化半導體製程系統。
真空技術在半導體工業中扮演重要的角色，例如濺鍍、微影及蝕刻等製程皆需於真空腔體中進行，藉以減少氣體分子對試片加工之影響，有效確保生產品質。
於半導體製程中，為了批量化地製造半導體元件，通常會選用大尺寸的晶圓，並採用機械手臂於多個製程室及存放空間之間進行晶圓的傳遞，以連續地加工製造。然而，為了容納及傳遞前述之大尺寸晶圓，此類真空系統具有體積大、建構成本高等缺點，於小批量生產或研發測試階段中易造成成本之浪費，且製造時間長，生產效益不佳。
因此，有必要提供一種新穎且具有進步性之微型化半導體製程系統，以解決上述之問題。
本發明之主要目的在於提供一種微型化半導體製程系統，體積小且製造成本低。
為達成上述目的，本發明提供一種微型化半導體製程系統，包括：一殼體，包括一內部空間及一與該內部空間連通之開口；一升降機構，設於該內部空間且包括一供置放一基板之載台，該載台可沿一第一方向相對該開口移動於一第一位置及一第二位置之間；一處理腔室，設於該內部空間且包括一供置放該基板之承載部；及一取送機構，可沿一第二方向移動地設於該升降機構與該處理腔室之間，供於該載台與該承載部之間取送該基板；其中，該殼體之一長寬比值介於1至6；當該載台位於該第一位置，該載台至少部分位於該開口中且可供自外部取放該基板；當該載台位於該第二位置時，該取送機構與該載台相對應而可自該載台取放該基板 。
以下僅以實施例說明本發明可能之實施態樣，然並非用以限制本發明所欲保護之範疇，合先敘明。
請參考圖1至12，其顯示本發明之一較佳實施例，本發明之微型化半導體製程系統1，包括：一殼體10，包括一內部空間11及一與該內部空間11連通之開口12；一升降機構20，設於該內部空間11且包括一供置放一基板2之載台21，該載台21可沿一第一方向D1相對該開口12移動於一第一位置及一第二位置之間；一處理腔室30，設於該內部空間11且包括一供置放該基板2之承載部31；及一取送機構40，可沿一第二方向D2移動地設於該升降機構20與該處理腔室30之間，供於該載台21與該承載部31之間取送該基板2；其中，該殼體10之一長寬比值介於1至6；當該載台21位於該第一位置，該載台21至少部分位於該開口12中且可供自外部取放該基板2，如圖3所示；當該載台21位於該第二位置時，該取送機構40與該載台21相對應而可自該載台21取放該基板2，如圖6所示。藉此，該微型化半導體製程系統1體積小且製造成本低，適用於例如研發、測試階段之小批量生產。
較佳地，該微型化半導體製程系統1另包括一可開闔地蓋設於該開口12之封蓋50及至少一連接該封蓋50之致動桿60，各該致動桿60包括一連接該封蓋50之第一端61及一相對於該第一端61且伸入該內部空間11之第二端62；當該載台21朝該第一位置移動時，該升降機構20頂推該第二端62使該至少一致動桿60帶動該封蓋50相對遠離該開口12，藉此該封蓋50可自動開啟。於本實施例中，該至少一致動桿60可相對滑移地穿設於該殼體10；該升降機構20另包括一與該載台21間隔連接之移動平台22及一可驅動該移動平台22之升降驅動單元23，藉由該升降驅動單元23驅動該移動平台22，可帶動該載台21沿該第一方向D1移動，且該移動平台22可頂推該至少一致動桿60之第二端62，作動順暢且穩定性佳。較佳地，各該致動桿60另包括一徑向突出之擋止部63且套設有一彈抵於該殼體10與該擋止部63之間之第一彈性件64，藉此各該致動桿60具有朝遠離該開口12之方向移動之趨勢；當該載台21朝該第二位置移動時，該至少一致動桿60即可帶動該封蓋50自動蓋闔於該開口12，以避免異物進入該內部空間11。於本實施例中，各該擋止部63為一螺母，結構簡單而易於組配；該封蓋50與該開口12之周壁之間較佳設有一密封圈51，封閉效果佳；該載台21設有至少一對應於該至少一致動桿60之導槽211，各該致動桿60可移動地設於一該導槽211，藉以導引該載台21之移動；該開口12之相對二側各設有一該致動桿60，作動穩定而不易相對偏移。然，各該致動桿亦可未設有該第一彈性件，該封蓋可手動封閉該開口；該至少一致動桿之數量及位置可依結構需求改變。
詳細說，該升降機構20另包括複數連接該移動平台22與該載台21之連接桿24及至少一套設於至少一該連接桿24之第二彈性件25，各該第二彈性件25彈抵於該移動平台22與該載台21之間，藉以提供緩衝效果。配合參考圖3及圖4，於操作時，該移動平台22上升帶動該載台21朝該第一位置移動，當該載台21於該第一方向D1上抵接於該殼體10時，該移動平台22持續上升壓縮該至少一第二彈性件25並頂推各該致動桿60之第二端62以使該封蓋50開啟，而允許自外部取放該基板2；接著，該移動平台22下降帶動該載台21朝該第二位置移動，當該移動平台22下降至未抵推各該致動桿60時，各該第一彈性件64伸張帶動該二致動桿60使該封蓋50封閉該開口12，如圖5及圖6所示。
該取送機構40包括一平移模組41及一設於該平移模組41之轉動模組42，該轉動模組42包括一平行於該第一方向D1之轉軸421及一以該轉軸421為軸轉動且供取放該基板2之取料臂422。詳細說，該平移模組41包括一平行於該第二方向D2地設於該殼體10之滑軌411及一可移動地設於該滑軌411之滑座412，該轉動模組42設於該滑座412，藉此該滑座412可帶動該轉動模組42橫向移動，縮短輸送距離。該升降機構20、該平移模組41及該轉動模組42較佳可同步作動，可有效縮短輸送時間並減少該取送機構40所需的配置空間，利於該微型化半導體製程系統1之小型化。較佳地，該取送機構40另包括一設於該平移模組41與該轉動模組42之間之升降模組43，該升降模組43可帶動該取料臂422沿一平行於該第一方向D1之方向移動。於本實施例中，該載台21包括一連接該移動平台22之基座212及二間隔凸設於該基座212之托臂213，該二托臂213供承置該基板2；該取料臂422之一端設有一供容設該基板2之卡凹423；當該載台21位於該第二位置時，該平移模組41帶動該取料臂422平移而使該卡凹423位於該二托臂213之間，如圖6所示，該升降模組43再帶動該取料臂422相對該載台21沿該第一方向D1升降，藉以向上托取該基板2或向下置放該基板2，如圖7所示。
配合參考圖8及圖9，該取料臂取得該基板2後，該滑座412帶動該取料臂422退離該載台21，該轉軸421帶動該取料臂422朝該處理腔室30之一側旋轉，當該卡凹423鄰近於該處理腔室30時，該滑座412帶動該取料臂422朝該載台21移動以允許該取料臂422旋轉至該卡凹423對應於該承載部31，如圖10所示。該處理腔室30另包括一對應於該承載部31之腔門32，當該腔門32開啟時，該取送機構40可伸入該處理腔室30內並自該承載部31取放該基板2，如圖11所示，該基板2放置於該承載部31後，該滑座412帶動該取料臂422自該處理腔室30中退出，該腔門32關閉以允許製程之進行，如圖12所示。該處理腔室30可密閉並依據製程需求減壓至真空狀態，該處理腔室30可依設備功能例如包括濺鍍模組、薄膜沉積模組或熱蒸鍍膜組等相關製程組件。該基板2之尺寸較佳不大於2英吋，可有效降低材料損耗並縮短製程時間。
該微型化半導體製程系統1另包括一電控單元70及一電性連接該電控單元70之操作顯示介面80，該操作顯示介面80可供外部操作地設於該殼體10，該電控單元70電性連接該升降機構20、該處理腔室30及該取送機構40，藉此可由該操作顯示介面80控制該處理腔室30內之各項參數，例如但不限該處理腔室30內之壓力、溫度、光源強度、該腔門32之啟閉等，亦可控制該升降機構20及該取送機構40之作動。
該殼體10之一長度L不大於1.6公尺，該殼體10之一寬度W不大於0.5公尺，限制該微型化半導體製程系統1之長寬尺寸以有效減少佔地面積。進一步說，該殼體10包括一前側板13及一後側板14，該前側板13朝該後側板14延伸凹設有一周向封閉之凹部131，該凹部131之一側壁設有該開口12，避免外物碰撞及異物進入該開口12；較佳地，該凹部131相對於該開口12之一側壁132朝設有該開口12之一側傾斜延伸，以利於取放該基板2。然，該凹部相鄰之二該側壁亦可相互垂直連接。於本實施例中，該殼體10另包括一組接框架15，該前側板13及該後側板14罩設於該組接框架15，該升降機構20、該取送機構40、該處理腔室30及該電控單元70皆組設於該組接框架15，穩定性佳且便於製造及零組件之維修更換；該組接框架15區分該內部空間11為一第一區111及一第二區112，該升降機構20及該取送機構40設於該第一區111，該處理腔室30設於該第二區112；該電控單元70設於該第二區112且位於該處理腔室30之上方，可縮短配線距離。藉由上述配置，該內部空間11可有效利用以使該微型化半導體製程系統1小型化。
1:微型化半導體製程系統 2:基板 10:殼體 11:內部空間 111:第一區 112:第二區 12:開口 13:前側板 131:凹部 132:側壁 14:後側板 15:組接框架 20:升降機構 21:載台 211:導槽 212:基座 213:托臂 22:移動平台 23:升降驅動單元 24:連接桿 25:第二彈性件 30:處理腔室 31:承載部 32:腔門 40:取送機構 41:平移模組 411:滑軌 412:滑座 42:轉動模組 421:轉軸 422:取料臂 423:卡凹 43:升降模組 50:封蓋 51:密封圈 60:致動桿 61:第一端 62:第二端 63:擋止部 64:第一彈性件 70:電控單元 80:操作顯示介面 D1:第一方向 D2:第二方向 L:長度 W:寬度
圖1為本發明一較佳實施例之立體圖。 圖2為本發明一較佳實施例之側視圖。 圖3為本發明一較佳實施例之一載台位於一第一位置時之局部放大圖。 圖4為本發明一較佳實施例之該載台位於該第一位置時之局部側視圖。 圖5為本發明一較佳實施例之該載台位於一第二位置時之局部放大圖。 圖6及圖7為本發明一較佳實施例之一取料臂自該載台取一基板之作動示意圖。 圖8至12為本發明一較佳實施例之作動示意圖。
1:微型化半導體製程系統
10:殼體
13:前側板
131:凹部
50:封蓋
80:操作顯示介面
L:長度
W:寬度

Claims (9)

  1. 一種微型化半導體製程系統，包括：一殼體，包括一內部空間及一與該內部空間連通之開口；一升降機構，設於該內部空間且包括一供置放一基板之載台，該載台可沿一第一方向相對該開口移動於一第一位置及一第二位置之間；一處理腔室，設於該內部空間且包括一供置放該基板之承載部；及一取送機構，可沿一第二方向移動地設於該升降機構與該處理腔室之間，供於該載台與該承載部之間取送該基板；其中，該殼體之一長寬比值介於1至6；當該載台位於該第一位置，該載台至少部分位於該開口中而可供自外部取放該基板；當該載台位於該第二位置時，該取送機構與該載台相對應而可自該載台取放該基板；其中，該微型化半導體製程系統另包括一可開闔地蓋設於該開口之封蓋及至少一連接該封蓋之致動桿，各該致動桿包括一連接該封蓋之第一端及一相對於該第一端且伸入該內部空間之第二端；當該載台朝該第一位置移動時，該升降機構頂推該第二端使該至少一致動桿帶動該封蓋相對遠離該開口。
  2. 如請求項1所述的微型化半導體製程系統，其中該取送機構包括一平移模組及一設於該平移模組之轉動模組，該轉動模組包括一平行於該第一方向之轉軸及一以該轉軸為軸轉動且供取放該基板之取料臂。
  3. 如請求項2所述的微型化半導體製程系統，其中該平移模組包括一平行於該第二方向地設於該殼體之滑軌及一可移動地設於該滑軌之滑座，該轉動模組設於該滑座。
  4. 如請求項2所述的微型化半導體製程系統，其中該取送機構另包括一設於該平移模組與該轉動模組之間之升降模組，該升降模組可帶動該取料臂沿一平行於該第一方向之方向移動。
  5. 如請求項1所述的微型化半導體製程系統，另包括一電控單元及一電性連接該電控單元之操作顯示介面，其中該操作顯示介面可供外部操作地設於該殼體，該電控單元電性連接該升降機構、該處理腔室及該取送機構。
  6. 如請求項1所述的微型化半導體製程系統，其中該殼體包括一前側板及一後側板，該前側板朝該後側板延伸凹設有一周向封閉之凹部，該凹部之一側壁設有該開口。
  7. 如請求項1所述的微型化半導體製程系統，其中該殼體之一長度不大於1.6公尺，該殼體之一寬度不大於0.5公尺。
  8. 如請求項1所述的微型化半導體製程系統，其中各該致動桿另包括一徑向突出之擋止部且套設有一彈抵於該殼體與該擋止部之間之第一彈性件。
  9. 如請求項4所述的微型化半導體製程系統，其中該平移模組包括一平行於該第二方向地設於該殼體之滑軌及一可移動地設於該滑軌之滑座，該轉動模組設於該滑座；該升降機構、該平移模組及該轉動模組可同步作動；該處理腔室另包括一對應於該承載部之腔門；該微型化半導體製程系統另包括一電控單元及一電性連接該電控單元之操作顯示介面，該操作顯示介面可供外部操作地設於該殼體，該電控單元電性連接該升降機構、該處理腔室及該取送機構；該殼體包括一前側板及一後側板，該前側板朝該後側板延伸凹設有一周向封閉之凹部，該凹部之一側壁設有該開口；該凹部相對於該開口之一側壁朝設 有該開口之一側傾斜延伸；該殼體之一長度不大於1.6公尺，該殼體之一寬度不大於0.5公尺；該至少一致動桿可相對滑移地穿設於該殼體；該升降機構另包括一與該載台間隔連接之移動平台及一可驅動該移動平台之升降驅動單元，該移動平台可帶動該載台沿該第一方向移動；當該載台朝該第一位置移動時，該移動平台頂推該第二端使該至少一致動桿帶動該封蓋相對遠離該開口；各該致動桿另包括一徑向突出之擋止部且套設有一彈抵於該殼體與該擋止部之間之第一彈性件；該載台設有至少一對應於該至少一致動桿之導槽，各該致動桿可移動地設於一該導槽；該升降機構另包括複數連接該移動平台與該載台之連接桿及至少一套設於至少一該連接桿之第二彈性件，各該第二彈性件彈抵於該移動平台與該載台之間；該殼體另包括一組接框架，該前側板及該後側板罩設於該組接框架；該組接框架區分該內部空間為一第一區及一第二區，該升降機構及該取送機構設於該第一區，該處理腔室設於該第二區；及該電控單元設於該第二區且位於該處理腔室之上方。
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