USD989830S1 - Semiconductor substrate transfer apparatus - Google Patents

Semiconductor substrate transfer apparatus Download PDF

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Publication number
USD989830S1
USD989830S1 US29/789,675 US202129789675F USD989830S US D989830 S1 USD989830 S1 US D989830S1 US 202129789675 F US202129789675 F US 202129789675F US D989830 S USD989830 S US D989830S
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United States
Prior art keywords
semiconductor substrate
transfer apparatus
substrate transfer
view
elevational view
Prior art date
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Active
Application number
US29/789,675
Inventor
Masayuki Arakawa
Junpei Hokari
Akira Kojima
Masaki Mizuochi
Tomokazu Kobayashi
Takaaki Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Tech Corp
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Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIKUCHI, TAKAAKI, KOBAYASHI, TOMOKAZU, KOJIMA, AKIRA, ARAKAWA, MASAYUKI, HOKARI, JUNPEI, MIZUOCHI, MASAKI
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FIG. 1 is a front, top, and right side perspective view of a semiconductor substrate transfer apparatus according to the design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2 .
The broken lines illustrate portions of the semiconductor substrate transfer apparatus that form no part of the claimed design. The hatching shown in FIG. 8 represents unclaimed subject matter and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor substrate transfer apparatus, as shown and described.
US29/789,675 2021-05-14 2021-10-13 Semiconductor substrate transfer apparatus Active USD989830S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2021-0023148 2021-05-14
KR20210023148 2021-05-14

Publications (1)

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USD989830S1 true USD989830S1 (en) 2023-06-20

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US29/789,675 Active USD989830S1 (en) 2021-05-14 2021-10-13 Semiconductor substrate transfer apparatus

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US (1) USD989830S1 (en)

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
USD350490S (en) * 1992-10-08 1994-09-13 Tokyo Electron Kabushiki Kaisha Semiconductor wafer testing apparatus
USD352911S (en) * 1992-11-27 1994-11-29 Hitachi, Ltd. Processing machine for electron beam lithography system
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
USD415184S (en) * 1998-01-30 1999-10-12 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD415776S (en) * 1998-01-30 1999-10-26 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD426785S (en) * 1999-07-09 2000-06-20 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD427088S (en) * 1999-07-09 2000-06-27 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD447967S1 (en) * 2000-11-08 2001-09-18 Sysmex Corporation Measuring apparatus for measuring a particle size distribution
US6454472B1 (en) * 1999-12-06 2002-09-24 Dns Korea Co., Ltd. Semiconductor manufacturing apparatus for photolithographic process
US20020150449A1 (en) * 1996-03-26 2002-10-17 Semitool, Inc. Automated semiconductor processing system
US20030136513A1 (en) * 2001-01-22 2003-07-24 Lee Soon Ho Semiconductor manufacturing apparatus
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US20060057799A1 (en) * 2002-09-24 2006-03-16 Tokyo Electron Limited Substrate processing apparatus
USD546354S1 (en) * 2005-07-15 2007-07-10 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20100189880A1 (en) * 2007-04-10 2010-07-29 Fas Holdings Group, Llc Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same
USD637098S1 (en) * 2009-10-30 2011-05-03 Hitachi High-Technologies Corporation Semiconductor testing machine
USD657068S1 (en) * 2010-06-29 2012-04-03 Sysmex Corporation Specimen analyzer
USD730894S1 (en) * 2012-10-18 2015-06-02 Hitachi, Ltd. Magnetic disc storage unit for electronic computer
USD733134S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD733135S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD858590S1 (en) * 2017-02-28 2019-09-03 Mitsubishi Heavy Industries Machine Tool Co., Ltd. Machine tool
USD905139S1 (en) * 2019-02-13 2020-12-15 Agie Charmilles Sa Electrical discharge machine
US20220254665A1 (en) * 2021-02-05 2022-08-11 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing system

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
USD350490S (en) * 1992-10-08 1994-09-13 Tokyo Electron Kabushiki Kaisha Semiconductor wafer testing apparatus
USD352911S (en) * 1992-11-27 1994-11-29 Hitachi, Ltd. Processing machine for electron beam lithography system
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
US20020150449A1 (en) * 1996-03-26 2002-10-17 Semitool, Inc. Automated semiconductor processing system
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
USD415184S (en) * 1998-01-30 1999-10-12 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD415776S (en) * 1998-01-30 1999-10-26 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD426785S (en) * 1999-07-09 2000-06-20 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD427088S (en) * 1999-07-09 2000-06-27 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
US6454472B1 (en) * 1999-12-06 2002-09-24 Dns Korea Co., Ltd. Semiconductor manufacturing apparatus for photolithographic process
USD447967S1 (en) * 2000-11-08 2001-09-18 Sysmex Corporation Measuring apparatus for measuring a particle size distribution
US20030136513A1 (en) * 2001-01-22 2003-07-24 Lee Soon Ho Semiconductor manufacturing apparatus
US20060057799A1 (en) * 2002-09-24 2006-03-16 Tokyo Electron Limited Substrate processing apparatus
USD546354S1 (en) * 2005-07-15 2007-07-10 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20100189880A1 (en) * 2007-04-10 2010-07-29 Fas Holdings Group, Llc Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same
USD637098S1 (en) * 2009-10-30 2011-05-03 Hitachi High-Technologies Corporation Semiconductor testing machine
USD657068S1 (en) * 2010-06-29 2012-04-03 Sysmex Corporation Specimen analyzer
USD730894S1 (en) * 2012-10-18 2015-06-02 Hitachi, Ltd. Magnetic disc storage unit for electronic computer
USD733134S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD733135S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD858590S1 (en) * 2017-02-28 2019-09-03 Mitsubishi Heavy Industries Machine Tool Co., Ltd. Machine tool
USD905139S1 (en) * 2019-02-13 2020-12-15 Agie Charmilles Sa Electrical discharge machine
US20220254665A1 (en) * 2021-02-05 2022-08-11 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing system

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/789,674, filed Oct. 13, 2021.
U.S. Appl. No. 29/789,677, filed Oct. 13, 2021.
United States Notice of Allowance issued in U.S. Appl. No. 29/789,674 dated Mar. 8, 2023 (nine (9) pages).
United States Notice of Allowance issued in U.S. Appl. No. 29/789,677 dated Mar. 8, 2023 (nine (9) pages).

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