USD990538S1 - Miniaturized semiconductor manufacturing device - Google Patents

Miniaturized semiconductor manufacturing device Download PDF

Info

Publication number
USD990538S1
USD990538S1 US29/769,489 US202129769489F USD990538S US D990538 S1 USD990538 S1 US D990538S1 US 202129769489 F US202129769489 F US 202129769489F US D990538 S USD990538 S US D990538S
Authority
US
United States
Prior art keywords
semiconductor manufacturing
manufacturing device
miniaturized semiconductor
miniaturized
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/769,489
Inventor
Hsueh-Hsien Wu
Chih-Yuan Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Syskey Technology Co Ltd
Original Assignee
Syskey Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Syskey Technology Co Ltd filed Critical Syskey Technology Co Ltd
Priority to US29/769,489 priority Critical patent/USD990538S1/en
Assigned to SYSKEY TECHNOLOGY CO., LTD. reassignment SYSKEY TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAN, CHIH-YUAN, WU, HSUEH-HSIEN
Application granted granted Critical
Publication of USD990538S1 publication Critical patent/USD990538S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top, front, right perspective view of a miniaturized semiconductor manufacturing device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in the drawings illustrate portions of the miniaturized semiconductor manufacturing device which form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a miniaturized semiconductor manufacturing device, as shown and described.
US29/769,489 2021-02-05 2021-02-05 Miniaturized semiconductor manufacturing device Active USD990538S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/769,489 USD990538S1 (en) 2021-02-05 2021-02-05 Miniaturized semiconductor manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/769,489 USD990538S1 (en) 2021-02-05 2021-02-05 Miniaturized semiconductor manufacturing device

Publications (1)

Publication Number Publication Date
USD990538S1 true USD990538S1 (en) 2023-06-27

Family

ID=86852693

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/769,489 Active USD990538S1 (en) 2021-02-05 2021-02-05 Miniaturized semiconductor manufacturing device

Country Status (1)

Country Link
US (1) USD990538S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1014583S1 (en) * 2021-12-29 2024-02-13 Honeywell Federal Manufacturing & Technologies, Llc Printer enclosure

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD309966S (en) * 1988-02-01 1990-08-14 Bishop Harold B Trash bag funnel
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
USD350490S (en) * 1992-10-08 1994-09-13 Tokyo Electron Kabushiki Kaisha Semiconductor wafer testing apparatus
USD352911S (en) * 1992-11-27 1994-11-29 Hitachi, Ltd. Processing machine for electron beam lithography system
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
USD415184S (en) * 1998-01-30 1999-10-12 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD415776S (en) * 1998-01-30 1999-10-26 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD426785S (en) * 1999-07-09 2000-06-20 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD427088S (en) * 1999-07-09 2000-06-27 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD447967S1 (en) * 2000-11-08 2001-09-18 Sysmex Corporation Measuring apparatus for measuring a particle size distribution
US6454472B1 (en) * 1999-12-06 2002-09-24 Dns Korea Co., Ltd. Semiconductor manufacturing apparatus for photolithographic process
US20020150449A1 (en) * 1996-03-26 2002-10-17 Semitool, Inc. Automated semiconductor processing system
US20030136513A1 (en) * 2001-01-22 2003-07-24 Lee Soon Ho Semiconductor manufacturing apparatus
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US20060057799A1 (en) * 2002-09-24 2006-03-16 Tokyo Electron Limited Substrate processing apparatus
USD546354S1 (en) * 2005-07-15 2007-07-10 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20100189880A1 (en) * 2007-04-10 2010-07-29 Fas Holdings Group, Llc Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same
USD637098S1 (en) * 2009-10-30 2011-05-03 Hitachi High-Technologies Corporation Semiconductor testing machine
USD657068S1 (en) * 2010-06-29 2012-04-03 Sysmex Corporation Specimen analyzer
USD730894S1 (en) * 2012-10-18 2015-06-02 Hitachi, Ltd. Magnetic disc storage unit for electronic computer
USD733134S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD733135S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD858590S1 (en) * 2017-02-28 2019-09-03 Mitsubishi Heavy Industries Machine Tool Co., Ltd. Machine tool
USD905139S1 (en) * 2019-02-13 2020-12-15 Agie Charmilles Sa Electrical discharge machine
US20220254665A1 (en) * 2021-02-05 2022-08-11 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing system

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
USD309966S (en) * 1988-02-01 1990-08-14 Bishop Harold B Trash bag funnel
USD350490S (en) * 1992-10-08 1994-09-13 Tokyo Electron Kabushiki Kaisha Semiconductor wafer testing apparatus
USD352911S (en) * 1992-11-27 1994-11-29 Hitachi, Ltd. Processing machine for electron beam lithography system
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
US20020150449A1 (en) * 1996-03-26 2002-10-17 Semitool, Inc. Automated semiconductor processing system
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
USD415776S (en) * 1998-01-30 1999-10-26 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD415184S (en) * 1998-01-30 1999-10-12 Tokyo Electron Limited Apparatus for manufacturing a semiconductor for a liquid crystal display
USD427088S (en) * 1999-07-09 2000-06-27 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
USD426785S (en) * 1999-07-09 2000-06-20 Matsushita Electric Industrial Co., Ltd. Wafer level burn-in tester
US6454472B1 (en) * 1999-12-06 2002-09-24 Dns Korea Co., Ltd. Semiconductor manufacturing apparatus for photolithographic process
USD447967S1 (en) * 2000-11-08 2001-09-18 Sysmex Corporation Measuring apparatus for measuring a particle size distribution
US20030136513A1 (en) * 2001-01-22 2003-07-24 Lee Soon Ho Semiconductor manufacturing apparatus
US20060057799A1 (en) * 2002-09-24 2006-03-16 Tokyo Electron Limited Substrate processing apparatus
USD546354S1 (en) * 2005-07-15 2007-07-10 Hitachi High-Technologies Corporation Semiconductor manufacturing apparatus
US20100189880A1 (en) * 2007-04-10 2010-07-29 Fas Holdings Group, Llc Method and Apparatus for Extruding a Liquid Onto a Substrate and Inspecting the Same
USD637098S1 (en) * 2009-10-30 2011-05-03 Hitachi High-Technologies Corporation Semiconductor testing machine
USD657068S1 (en) * 2010-06-29 2012-04-03 Sysmex Corporation Specimen analyzer
USD730894S1 (en) * 2012-10-18 2015-06-02 Hitachi, Ltd. Magnetic disc storage unit for electronic computer
USD733134S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD733135S1 (en) * 2013-03-21 2015-06-30 Hitachi, Ltd. Magnetic disk storage unit for electronic computer
USD858590S1 (en) * 2017-02-28 2019-09-03 Mitsubishi Heavy Industries Machine Tool Co., Ltd. Machine tool
USD905139S1 (en) * 2019-02-13 2020-12-15 Agie Charmilles Sa Electrical discharge machine
US20220254665A1 (en) * 2021-02-05 2022-08-11 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1014583S1 (en) * 2021-12-29 2024-02-13 Honeywell Federal Manufacturing & Technologies, Llc Printer enclosure
USD1014584S1 (en) * 2021-12-29 2024-02-13 Honeywell Federal Manufacturing & Technologies, Llc Printer enclosure

Similar Documents

Publication Publication Date Title
USD888691S1 (en) Earphone
USD935772S1 (en) Case
USD912267S1 (en) Massage device
USD950525S1 (en) Earphone
USD954027S1 (en) Earphone
USD960647S1 (en) Self-heating cup
USD977836S1 (en) Earphone case
USD934943S1 (en) Camera
USD954124S1 (en) Camera
USD983172S1 (en) Earphone
USD934821S1 (en) Semiconductor device
USD959438S1 (en) Earphone case
USD990456S1 (en) Wireless earphone
USD963613S1 (en) Earphone
USD937232S1 (en) Semiconductor device
USD971290S1 (en) Camera
USD974334S1 (en) Wireless earphone
USD958756S1 (en) Socket
USD993201S1 (en) Semiconductor module
USD934187S1 (en) Integrated circuit package
USD984099S1 (en) Sandal
USD965878S1 (en) Stamping device
USD1004668S1 (en) Camera
USD960100S1 (en) Socket
USD992624S1 (en) Camera

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY