TWD119910S1 - 晶舟 - Google Patents

晶舟

Info

Publication number
TWD119910S1
TWD119910S1 TW095305861F TW95305861F TWD119910S1 TW D119910 S1 TWD119910 S1 TW D119910S1 TW 095305861 F TW095305861 F TW 095305861F TW 95305861 F TW95305861 F TW 95305861F TW D119910 S1 TWD119910 S1 TW D119910S1
Authority
TW
Taiwan
Prior art keywords
wafer
comb
view
end plates
tooth structure
Prior art date
Application number
TW095305861F
Other languages
English (en)
Inventor
佐藤泉
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD119910S1 publication Critical patent/TWD119910S1/zh

Links

Abstract

【物品用途】本創作的物品是一種晶舟，主要是為了載置整批晶圓，進行相關處理用的載具。【創作特點】該晶舟，乃如立體圖所示，大體上是由兩片位置互為平行的圓形端板，以及兩個圓形端板間設有三道軸向晶圓支架以及兩支連結桿所組成；如俯視圖或仰視圖所示，該端板的上方各設有一半圓缺口；在前視圖可見該晶圓支架具有密集的梳齒形構造，且其中一的端板的圓心有一延伸的多孔支管；配合B-B剖面圖所示，該三道晶圓支架分別設置在端版的正下方以及兩側邊，其中正下方的晶圓支架，其梳齒形構造的開口朝向正上方；兩側的晶圓支架，其梳齒形構造的開口以向內傾斜的角度朝向內上方；使多數的片狀晶圓得以被放置在三道晶圓支架間，形成多數梳齒形構造；整體觀之，確為一新穎獨特之設計。
TW095305861F 2006-05-01 2006-10-26 晶舟 TWD119910S1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006011364 2006-05-01

Publications (1)

Publication Number Publication Date
TWD119910S1 true TWD119910S1 (zh) 2007-11-11

Family

ID=39466906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095305861F TWD119910S1 (zh) 2006-05-01 2006-10-26 晶舟

Country Status (2)

Country Link
US (1) USD570308S1 (zh)
TW (1) TWD119910S1 (zh)

Families Citing this family (29)

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Publication number Priority date Publication date Assignee Title
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
WO2011008753A1 (en) * 2009-07-13 2011-01-20 Greene, Tweed Of Delaware, Inc. Chimerized wafer boats for use in semiconductor chip processing and related methods
USD693319S1 (en) * 2011-12-22 2013-11-12 Tokyo Electron Limited Holding pad for transferring a wafer
USD691974S1 (en) * 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
JP1537312S (zh) * 2014-11-20 2015-11-09
JP1537313S (zh) * 2014-11-20 2015-11-09
JP1537630S (zh) * 2014-11-20 2015-11-09
JP1537629S (zh) * 2014-11-20 2015-11-09
JP1563649S (zh) * 2016-02-12 2016-11-21
JP1597807S (zh) * 2017-08-21 2018-02-19
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
JP1658652S (zh) * 2019-08-07 2020-04-27
JP1706322S (zh) * 2021-08-27 2022-01-31
JP1731670S (ja) * 2022-03-04 2025-12-15 基板処理装置用基板保持具
JP1741512S (zh) * 2022-09-14 2023-04-11
JP1741513S (zh) * 2022-09-14 2023-04-11

Family Cites Families (12)

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USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
JPH09260364A (ja) * 1996-03-26 1997-10-03 Tokyo Electron Ltd 熱処理方法および熱処理装置
KR100284567B1 (ko) * 1997-04-15 2001-04-02 후지이 아키히로 수직 웨이퍼 보트
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
US6056123A (en) * 1997-12-10 2000-05-02 Novus Corporation Semiconductor wafer carrier having the same composition as the wafers
JP4045689B2 (ja) * 1999-04-14 2008-02-13 東京エレクトロン株式会社 熱処理装置
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KR100410982B1 (ko) * 2001-01-18 2003-12-18 삼성전자주식회사 반도체 제조장치용 보트
JP2002324830A (ja) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers

Also Published As

Publication number Publication date
USD570308S1 (en) 2008-06-03

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