TWD195971S - 半導體製造裝置用密封材料 - Google Patents

半導體製造裝置用密封材料

Info

Publication number
TWD195971S
TWD195971S TW107302077F TW107302077F TWD195971S TW D195971 S TWD195971 S TW D195971S TW 107302077 F TW107302077 F TW 107302077F TW 107302077 F TW107302077 F TW 107302077F TW D195971 S TWD195971 S TW D195971S
Authority
TW
Taiwan
Prior art keywords
view
article
semiconductor manufacturing
seal member
production apparatus
Prior art date
Application number
TW107302077F
Other languages
English (en)
Inventor
Kazuaki Tsuji
Takafumi Sakurai
Original Assignee
日商華爾卡股份有限公司
Valqua Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商華爾卡股份有限公司, Valqua Ltd filed Critical 日商華爾卡股份有限公司
Publication of TWD195971S publication Critical patent/TWD195971S/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
    • F16J15/12—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing with metal reinforcement or covering
    • F16J15/128—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing with metal reinforcement or covering with metal covering

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Abstract

【物品用途】;本物品為一種半導體製造裝置用密封材料，適於使用在例如乾式蝕刻(dry etching)裝置等半導體製造裝置。如說明本物品的使用狀態之參考圖所示，本物品之半導體製造裝置用密封材料係於內部插入導入端子，並且插入於設在第1空間與第2空間之間的端子插入孔來使用。;【設計說明】;後視圖與前視圖相同，故省略後視圖。;左側視圖與右側視圖相同，故省略左側視圖。;A-A線剖面圖係在俯視圖中之A-A線的剖面圖。
TW107302077F 2017-10-26 2018-04-13 半導體製造裝置用密封材料 TWD195971S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-23801F JP1605760S (zh) 2017-10-26 2017-10-26

Publications (1)

Publication Number Publication Date
TWD195971S true TWD195971S (zh) 2019-02-11

Family

ID=62239140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107302077F TWD195971S (zh) 2017-10-26 2018-04-13 半導體製造裝置用密封材料

Country Status (3)

Country Link
US (1) USD884746S1 (zh)
JP (1) JP1605760S (zh)
TW (1) TWD195971S (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD796014S1 (en) * 2006-05-18 2017-08-29 Lake Products Limited Sealing gland
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD982638S1 (en) * 2021-12-30 2023-04-04 Cloudminds Robotics Co., Ltd. Harmonic actuator

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD442609S1 (en) * 2000-09-27 2001-05-22 Machine Design Incorporated Seal ring for a nutcracking die assembly
CA114459S (en) * 2005-08-05 2008-03-11 Faster Spa Fluid seal
JP4663538B2 (ja) * 2006-01-31 2011-04-06 日本バルカー工業株式会社 あり溝用シール材およびあり溝用シール材が装着された真空用ゲート弁
USD582437S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582439S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582440S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582436S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582441S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582438S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
US9447881B2 (en) * 2008-03-13 2016-09-20 Nippon Valqua Industries, Ltd. Seal material
US8888106B2 (en) * 2008-09-18 2014-11-18 Nippon Valqua Industries, Ltd. Seal plate, seal member that is used in seal plate, and method for manufacturing the same
USD631066S1 (en) * 2008-11-26 2011-01-18 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD616966S1 (en) * 2009-02-11 2010-06-01 Kmt Waterjet Systems Inc. Outer follower element for a high pressure seal
USD690336S1 (en) * 2011-06-30 2013-09-24 Adp Distributors, Inc. Hydraulic turbocharger pedestal seal
US8608173B2 (en) * 2011-08-25 2013-12-17 Hamilton Sundstrand Corporation Method and apparatus to provide sealing contact between first and second fueldraulic components
USD722621S1 (en) * 2011-11-25 2015-02-17 Salford Group Inc. Seal
US9892945B2 (en) * 2012-10-09 2018-02-13 Nippon Valqua Industries, Ltd. Composite seal
TWM447442U (zh) 2012-10-19 2013-02-21 Sch Electronic Co Ltd 密封環裝置
TWD181453S (zh) 2015-09-16 2017-02-21 日本華爾卡工業股份有限公&#x5 密封件
USD837685S1 (en) * 2016-12-20 2019-01-08 Morito Co., Ltd. Eyelet

Also Published As

Publication number Publication date
JP1605760S (zh) 2018-06-04
USD884746S1 (en) 2020-05-19

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