TWD200243S - 半導體製造裝置用密封材 - Google Patents
半導體製造裝置用密封材Info
- Publication number
- TWD200243S TWD200243S TW108300135D01F TW108300135D01F TWD200243S TW D200243 S TWD200243 S TW D200243S TW 108300135D01 F TW108300135D01 F TW 108300135D01F TW 108300135D01 F TW108300135D01 F TW 108300135D01F TW D200243 S TWD200243 S TW D200243S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- design
- sectional
- semiconductor manufacturing
- article
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000003566 sealing material Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
Abstract
【物品用途】;本設計物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如本設計物品之使用狀態參考圖所示，本設計物品之半導體製造裝置用密封材係插入於半導體製造裝置的溝槽使用。;【設計說明】;本設計係關於第108300135號專利申請案之衍生設計。;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。仰視圖與俯視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-25717F JP1607736S (zh) | 2017-11-17 | 2017-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD200243S true TWD200243S (zh) | 2019-10-11 |
Family
ID=62622979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108300135D01F TWD200243S (zh) | 2017-11-17 | 2018-05-15 | 半導體製造裝置用密封材 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1607736S (zh) |
| TW (1) | TWD200243S (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1638480S (zh) | 2018-09-11 | 2019-08-05 |
-
2017
- 2017-11-17 JP JPD2017-25717F patent/JP1607736S/ja active Active
-
2018
- 2018-05-15 TW TW108300135D01F patent/TWD200243S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1607736S (zh) | 2018-06-25 |
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