TWD197465S - 半導體製造裝置用密封材 - Google Patents

半導體製造裝置用密封材

Info

Publication number
TWD197465S
TWD197465S TW107304496F TW107304496F TWD197465S TW D197465 S TWD197465 S TW D197465S TW 107304496 F TW107304496 F TW 107304496F TW 107304496 F TW107304496 F TW 107304496F TW D197465 S TWD197465 S TW D197465S
Authority
TW
Taiwan
Prior art keywords
view
sectional
semiconductor manufacturing
manufacturing equipment
article
Prior art date
Application number
TW107304496F
Other languages
English (en)
Inventor
Yong-Gu Kang
Sangho Kim
Original Assignee
日商華爾卡股份有限公司
Valqua Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商華爾卡股份有限公司, Valqua Ltd filed Critical 日商華爾卡股份有限公司
Publication of TWD197465S publication Critical patent/TWD197465S/zh

Links

Abstract

【物品用途】;本設計物品係一種半導體製造裝置用密封材,適合使用於例如化學氣相沈積(CVD)或乾蝕刻裝置等半導體製造裝置。如本設計物品之使用狀態參考圖所示,本設計物品之半導體製造裝置用密封材係插入於設置在半導體製造裝置之第1構件的溝槽內使用,以將第1構件與第2構件之間密封。;【設計說明】;後視圖與前視圖相同,故省略之。左側視圖與右側視圖相同,故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。
TW107304496F 2018-02-08 2018-08-02 半導體製造裝置用密封材 TWD197465S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-2527F JP1612685S (zh) 2018-02-08 2018-02-08

Publications (1)

Publication Number Publication Date
TWD197465S true TWD197465S (zh) 2019-05-11

Family

ID=63369077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107304496F TWD197465S (zh) 2018-02-08 2018-08-02 半導體製造裝置用密封材

Country Status (3)

Country Link
US (1) USD895075S1 (zh)
JP (1) JP1612685S (zh)
TW (1) TWD197465S (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1612685S (zh) 2018-02-08 2018-09-03
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD962904S1 (en) * 2019-09-18 2022-09-06 Shenzhen Chuang Jin Heng Electronic Technology Co., LTD Flat antenna
USD986394S1 (en) * 2021-05-12 2023-05-16 S & B Technical Products, Inc. Pipe sealing gasket

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US2622905A (en) * 1948-12-23 1952-12-23 Auto Diesel Piston Ring Compan Sealing ring
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JP1530148S (zh) * 2015-02-26 2015-08-03
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USD846095S1 (en) * 2017-07-12 2019-04-16 Mcwane, Inc. Restrained gasket
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USD818089S1 (en) * 2016-09-14 2018-05-15 Nippon Valqua Industries, Ltd. Composite seal
JP1581994S (zh) * 2016-11-29 2017-07-24
JP1581995S (zh) * 2016-11-29 2017-07-24
JP1589474S (zh) 2017-03-16 2017-10-30
USD846096S1 (en) * 2017-09-19 2019-04-16 Mcwane, Inc. Restrained gasket
USD846098S1 (en) * 2017-09-19 2019-04-16 Mcwane, Inc. Restrained gasket
USD852935S1 (en) * 2017-09-19 2019-07-02 Mcwane, Inc. Restrained gasket
USD846097S1 (en) * 2017-09-19 2019-04-16 Mcwane, Inc. Restrained gasket
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JP1612685S (zh) 2018-02-08 2018-09-03
JP1612684S (zh) 2018-02-08 2018-09-03

Also Published As

Publication number Publication date
USD895075S1 (en) 2020-09-01
JP1612685S (zh) 2018-09-03

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