TWD197825S - 半導體製造裝置用密封材 - Google Patents

半導體製造裝置用密封材

Info

Publication number
TWD197825S
TWD197825S TW107303318F TW107303318F TWD197825S TW D197825 S TWD197825 S TW D197825S TW 107303318 F TW107303318 F TW 107303318F TW 107303318 F TW107303318 F TW 107303318F TW D197825 S TWD197825 S TW D197825S
Authority
TW
Taiwan
Prior art keywords
view
sectional
semiconductor manufacturing
manufacturing equipment
article
Prior art date
Application number
TW107303318F
Other languages
English (en)
Inventor
Kazuaki Tsuji
Original Assignee
日商華爾卡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商華爾卡股份有限公司 filed Critical 日商華爾卡股份有限公司
Publication of TWD197825S publication Critical patent/TWD197825S/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)

Abstract

【物品用途】;本設計物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如本設計物品之使用狀態參考圖所示，本設計物品之半導體製造裝置用密封材係插入於設置在半導體製造裝置之第1構件的溝槽內使用，以將第1構件與第2構件之間密封。;【設計說明】;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。
TW107303318F 2017-12-19 2018-06-11 半導體製造裝置用密封材 TWD197825S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-28253F JP1605779S (zh) 2017-12-19 2017-12-19

Publications (1)

Publication Number Publication Date
TWD197825S true TWD197825S (zh) 2019-06-01

Family

ID=62239217

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107303318F TWD197825S (zh) 2017-12-19 2018-06-11 半導體製造裝置用密封材

Country Status (3)

Country Link
US (1) USD885443S1 (zh)
JP (1) JP1605779S (zh)
TW (1) TWD197825S (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber

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USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD1062793S1 (en) * 2020-09-30 2025-02-18 Caterpillar Inc. Insert for engine block
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1117359S1 (en) * 2022-05-10 2026-03-10 Caterpillar Inc. Back-up ring
JP1746769S (ja) * 2023-01-31 2023-06-20 複合シール材
USD1083043S1 (en) * 2023-03-28 2025-07-08 Mitsubishi Cable Industries, Ltd. Composite seal member for semiconductor production apparatus

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USD442609S1 (en) * 2000-09-27 2001-05-22 Machine Design Incorporated Seal ring for a nutcracking die assembly
TWM252663U (en) 2004-02-25 2004-12-11 Su-Ching Li Improved structure for seal jar
CA114459S (en) * 2005-08-05 2008-03-11 Faster Spa Fluid seal
JP4663538B2 (ja) * 2006-01-31 2011-04-06 日本バルカー工業株式会社 あり溝用シール材およびあり溝用シール材が装着された真空用ゲート弁
USD582437S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582438S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582440S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582439S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582441S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD582436S1 (en) * 2007-10-15 2008-12-09 Eagle Industry Co., Ltd. Seal for a rotary shaft
KR101260574B1 (ko) * 2008-03-13 2013-05-06 닛폰 바루카 고교 가부시키가이샤 실재
WO2010032722A1 (ja) * 2008-09-18 2010-03-25 日本バルカー工業株式会社 シールプレートおよびシールプレートに用いられるシール部材ならびにこれらの製造方法
USD631066S1 (en) * 2008-11-26 2011-01-18 Eagle Industry Co., Ltd. Seal for a rotary shaft
USD616966S1 (en) * 2009-02-11 2010-06-01 Kmt Waterjet Systems Inc. Outer follower element for a high pressure seal
TWM379164U (en) 2009-12-22 2010-04-21 Ying-Hsiang Chen Sealing ring for the wafer-plating jig
TWD143035S (zh) 2010-03-24 2012-01-01 日本華爾卡工業股份有限公司 閘閥用密封構件之聯合（一）
USD690336S1 (en) * 2011-06-30 2013-09-24 Adp Distributors, Inc. Hydraulic turbocharger pedestal seal
US8608173B2 (en) * 2011-08-25 2013-12-17 Hamilton Sundstrand Corporation Method and apparatus to provide sealing contact between first and second fueldraulic components
USD722621S1 (en) * 2011-11-25 2015-02-17 Salford Group Inc. Seal
TWM428159U (en) 2011-12-28 2012-05-01 Won Hung Industry Co Ltd Sealed container
JP6104927B2 (ja) * 2012-10-09 2017-03-29 日本バルカー工業株式会社 複合シール
TWD168722S (zh) 2014-09-04 2015-07-01 江淑玲 彈性密封圈
TWM499369U (zh) 2014-10-27 2015-04-21 Cheng-Yu Hung 船艉管密封環之結構
TWD181453S (zh) 2015-09-16 2017-02-21 日本華爾卡工業股份有限公司; 密封件
TWD181454S (zh) 2015-11-09 2017-02-21 日本華爾卡工業股份有限公司; 密封件
TWD183422S (zh) 2015-11-09 2017-06-01 日本華爾卡工業股份有限公司; 密封件
USD837685S1 (en) * 2016-12-20 2019-01-08 Morito Co., Ltd. Eyelet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber

Also Published As

Publication number Publication date
USD885443S1 (en) 2020-05-26
JP1605779S (zh) 2018-06-04

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