TWD196569S - 半導體製造裝置用密封材 - Google Patents

半導體製造裝置用密封材

Info

Publication number
TWD196569S
TWD196569S TW107302676F TW107302676F TWD196569S TW D196569 S TWD196569 S TW D196569S TW 107302676 F TW107302676 F TW 107302676F TW 107302676 F TW107302676 F TW 107302676F TW D196569 S TWD196569 S TW D196569S
Authority
TW
Taiwan
Prior art keywords
view
sectional
semiconductor manufacturing
manufacturing equipment
article
Prior art date
Application number
TW107302676F
Other languages
English (en)
Inventor
Yong-Gu Kang
Nobuhiro Yoshida
Original Assignee
日商華爾卡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商華爾卡股份有限公司 filed Critical 日商華爾卡股份有限公司
Publication of TWD196569S publication Critical patent/TWD196569S/zh

Links

Abstract

【物品用途】;本設計物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如本設計物品之使用狀態參考圖所示，本設計物品之半導體製造裝置用密封材係插入於半導體製造裝置的溝槽使用。;【設計說明】;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。仰視圖與俯視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。
TW107302676F 2017-11-17 2018-05-14 半導體製造裝置用密封材 TWD196569S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-25715F JP1605767S (zh) 2017-11-17 2017-11-17

Publications (1)

Publication Number Publication Date
TWD196569S true TWD196569S (zh) 2019-03-21

Family

ID=62239585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107302676F TWD196569S (zh) 2017-11-17 2018-05-14 半導體製造裝置用密封材

Country Status (2)

Country Link
JP (1) JP1605767S (zh)
TW (1) TWD196569S (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1721756S (ja) 2021-12-23 2022-08-05 シール材

Also Published As

Publication number Publication date
JP1605767S (zh) 2018-06-04

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