TWD196569S - Seal member for use in semiconductor production apparatus - Google Patents
Seal member for use in semiconductor production apparatusInfo
- Publication number
- TWD196569S TWD196569S TW107302676F TW107302676F TWD196569S TW D196569 S TWD196569 S TW D196569S TW 107302676 F TW107302676 F TW 107302676F TW 107302676 F TW107302676 F TW 107302676F TW D196569 S TWD196569 S TW D196569S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- sectional
- semiconductor manufacturing
- manufacturing equipment
- article
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 5
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000003566 sealing material Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
Abstract
【物品用途】;本設計物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如本設計物品之使用狀態參考圖所示，本設計物品之半導體製造裝置用密封材係插入於半導體製造裝置的溝槽使用。;【設計說明】;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。仰視圖與俯視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。[Use of article] This designed article is a sealing material for semiconductor manufacturing equipment, suitable for use in semiconductor manufacturing equipment such as CVD or dry etching equipment. As shown in the reference drawing of the usage state of this design article, the sealing material for semiconductor manufacturing equipment of this design article is inserted into the trench of the semiconductor manufacturing equipment and used. ;[Design Description];The rear view is the same as the front view, so it is omitted. The left view is the same as the right view, so it is omitted. The bottom view is the same as the top view, so it is omitted. ;A-A cross-sectional view is a cross-sectional view along the A-A line in the top view. ;The B-B enlarged cross-sectional view is a diagram that enlarges the B-B line in the A-A cross-sectional view.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-25715F JP1605767S (en) | 2017-11-17 | 2017-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD196569S true TWD196569S (en) | 2019-03-21 |
Family
ID=62239585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107302676F TWD196569S (en) | 2017-11-17 | 2018-05-14 | Seal member for use in semiconductor production apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1605767S (en) |
| TW (1) | TWD196569S (en) |
-
2017
- 2017-11-17 JP JPD2017-25715F patent/JP1605767S/ja active Active
-
2018
- 2018-05-14 TW TW107302676F patent/TWD196569S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1605767S (en) | 2018-06-04 |
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