TWD197463S - 半導體製造裝置用密封材 - Google Patents

半導體製造裝置用密封材

Info

Publication number
TWD197463S
TWD197463S TW107303320F TW107303320F TWD197463S TW D197463 S TWD197463 S TW D197463S TW 107303320 F TW107303320 F TW 107303320F TW 107303320 F TW107303320 F TW 107303320F TW D197463 S TWD197463 S TW D197463S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
article
manufacturing equipment
seal member
production apparatus
Prior art date
Application number
TW107303320F
Other languages
English (en)
Inventor
Nobuhiro Yoshida
Sangho Kim
Original Assignee
日商華爾卡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商華爾卡股份有限公司 filed Critical 日商華爾卡股份有限公司
Publication of TWD197463S publication Critical patent/TWD197463S/zh

Links

Abstract

【物品用途】;本設計物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如本設計物品之使用狀態參考圖所示，本設計物品之半導體製造裝置用密封材係插入於設置在半導體製造裝置之第1構件的溝槽內使用，以將第1構件與第2構件之間密封。;【設計說明】;右側視圖與左側視圖對稱，故省略之。
TW107303320F 2017-12-19 2018-06-11 半導體製造裝置用密封材 TWD197463S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017028255 2017-12-19

Publications (1)

Publication Number Publication Date
TWD197463S true TWD197463S (zh) 2019-05-11

Family

ID=89028069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107303320F TWD197463S (zh) 2017-12-19 2018-06-11 半導體製造裝置用密封材

Country Status (1)

Country Link
TW (1) TWD197463S (zh)

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