TWD189097S - 密封材 - Google Patents

密封材

Info

Publication number
TWD189097S
TWD189097S TW106302850F TW106302850F TWD189097S TW D189097 S TWD189097 S TW D189097S TW 106302850 F TW106302850 F TW 106302850F TW 106302850 F TW106302850 F TW 106302850F TW D189097 S TWD189097 S TW D189097S
Authority
TW
Taiwan
Prior art keywords
article
sealing material
view
design
same
Prior art date
Application number
TW106302850F
Other languages
English (en)
Inventor
中川一平
Original Assignee
日本華爾卡工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本華爾卡工業股份有限公司 filed Critical 日本華爾卡工業股份有限公司
Publication of TWD189097S publication Critical patent/TWD189097S/zh

Links

Abstract

【物品用途】;本物品係例如使用於半導體製造裝置等較佳之密封材，且為安裝於鳩尾形槽之密封材。本物品之密封材係由橡膠等之彈性構件形成。如顯示使用狀態之參考剖視圖所示，於將本物品安裝於形成於第1構件之槽之後，藉由將第2構件抵接於第1構件，而將本物品壓接於第2構件。;【設計說明】;因本物品之後視圖與前視圖相同故而省略。因右側視圖與左側視圖相同故而省略。 本案設計係新穎獨特之樣式，藉由獨特地設計密封材，可顯現出先前技藝所未有之視覺效果。

Description

密封材
本物品係例如使用於半導體製造裝置等較佳之密封材，且為安裝於鳩尾形槽之密封材。本物品之密封材係由橡膠等之彈性構件形成。如顯示使用狀態之參考剖視圖所示，於將本物品安裝於形成於第1構件之槽之後，藉由將第2構件抵接於第1構件，而將本物品壓接於第2構件。
因本物品之後視圖與前視圖相同故而省略。因右側視圖與左側視圖相同故而省略。 本案設計係新穎獨特之樣式，藉由獨特地設計密封材，可顯現出先前技藝所未有之視覺效果。
TW106302850F 2016-11-29 2017-05-26 密封材 TWD189097S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP??2016-025877 2016-11-29
JPD2016-25877F JP1581993S (zh) 2016-11-29 2016-11-29

Publications (1)

Publication Number Publication Date
TWD189097S true TWD189097S (zh) 2018-03-11

Family

ID=59351867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106302850F TWD189097S (zh) 2016-11-29 2017-05-26 密封材

Country Status (3)

Country Link
US (1) USD877865S1 (zh)
JP (1) JP1581993S (zh)
TW (1) TWD189097S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202287S (zh) 2018-07-24 2020-01-21 日商日立全球先端科技股份有限公司 半導體製造裝置用離子遮蔽板保持具

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USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1721756S (ja) 2021-12-23 2022-08-05 シール材

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202287S (zh) 2018-07-24 2020-01-21 日商日立全球先端科技股份有限公司 半導體製造裝置用離子遮蔽板保持具

Also Published As

Publication number Publication date
USD877865S1 (en) 2020-03-10
JP1581993S (zh) 2017-07-24

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