TWD193791S - 密封材 - Google Patents
密封材Info
- Publication number
- TWD193791S TWD193791S TW107300371F TW107300371F TWD193791S TW D193791 S TWD193791 S TW D193791S TW 107300371 F TW107300371 F TW 107300371F TW 107300371 F TW107300371 F TW 107300371F TW D193791 S TWD193791 S TW D193791S
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- sealing material
- case
- wafer cleaning
- article
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 abstract description 4
- 239000003566 sealing material Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Abstract
【物品用途】;本案設計之物品係於要求高氣密性之半導體晶圓洗淨裝置等中，安裝於構件彼此之抵接部位，謀求接合部位之密封，係為了確保半導體晶圓洗淨領域之液密性而使用者。本物品之密封材係由橡膠等之彈性構件形成。;【設計說明】;本案設計係新穎獨特之樣式，藉由獨特地設計密封材，可顯現出先前技藝所未有之視覺效果。
Description
本案設計之物品係於要求高氣密性之半導體晶圓洗淨裝置等中，安裝於構件彼此之抵接部位，謀求接合部位之密封，係為了確保半導體晶圓洗淨領域之液密性而使用者。本物品之密封材係由橡膠等之彈性構件形成。
本案設計係新穎獨特之樣式，藉由獨特地設計密封材，可顯現出先前技藝所未有之視覺效果。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-015764 | 2017-07-21 | ||
| JPD2017-15764F JP1598017S (zh) | 2017-07-21 | 2017-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD193791S true TWD193791S (zh) | 2018-11-01 |
Family
ID=61190057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107300371F TWD193791S (zh) | 2017-07-21 | 2018-01-19 | 密封材 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD864361S1 (zh) |
| JP (1) | JP1598017S (zh) |
| TW (1) | TWD193791S (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD897504S1 (en) | 2017-11-17 | 2020-09-29 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD898170S1 (en) | 2017-12-01 | 2020-10-06 | Valqua, Ltd. | Composite seal member for semiconductor production apparatus |
| USD898171S1 (en) * | 2017-12-19 | 2020-10-06 | Valqua, Ltd. | Seal members for use in semiconductor production apparatuses |
| USD905761S1 (en) | 2018-07-24 | 2020-12-22 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
| USD909322S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD909323S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD1031951S1 (en) * | 2020-07-30 | 2024-06-18 | Valqua, Ltd. | Composite seal |
| CA210024S (en) * | 2022-01-31 | 2023-07-28 | Hamilton Kent Inc | Gasket |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD449621S1 (en) * | 2000-02-15 | 2001-10-23 | Edward W. Hamlin | Securing ring for a flexible bellows of a marine outboard drive |
| USD518885S1 (en) * | 2004-05-14 | 2006-04-11 | Eastern Sheet Metal Llc | Flanged ring |
| TWD150427S (zh) | 2009-08-10 | 2012-11-21 | 日本華爾卡工業股份有限公司 | 複合密封材 |
| USD626208S1 (en) * | 2010-02-08 | 2010-10-26 | iFil USA, LLC | Cartridge filter gasket |
| USD631948S1 (en) * | 2010-07-20 | 2011-02-01 | Wartsila Japan Ltd. | Seal ring for stern tube |
| USD638522S1 (en) * | 2010-07-20 | 2011-05-24 | Wārtsilā Japan Ltd. | Seal ring for stern tube |
| USD638523S1 (en) * | 2010-07-20 | 2011-05-24 | Wärtsilä Japan Ltd. | Seal ring for stern tube |
| TWD149670S (zh) | 2010-08-16 | 2012-10-11 | 荏原製作所股份有限公司 | 密封環 |
| USD649986S1 (en) * | 2010-08-17 | 2011-12-06 | Ebara Corporation | Sealing ring |
| USD754308S1 (en) | 2012-08-07 | 2016-04-19 | Nippon Valqua Industries, Ltd. | Composite sealing material |
| AU2014227705B2 (en) * | 2013-03-15 | 2017-01-12 | WHW Group, Inc. | Seal for a centrifugal pump |
| USD705280S1 (en) | 2013-07-11 | 2014-05-20 | Ebara Corporation | Sealing ring |
| JP1518502S (zh) | 2014-02-04 | 2015-03-02 | ||
| USD743513S1 (en) * | 2014-06-13 | 2015-11-17 | Asm Ip Holding B.V. | Seal ring |
| USD767234S1 (en) * | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
| TWD183422S (zh) | 2015-11-09 | 2017-06-01 | 日本華爾卡工業股份有限公 | 密封件 |
| TWD181454S (zh) | 2015-11-09 | 2017-02-21 | 日本華爾卡工業股份有限公 | 密封件 |
| JP1556538S (zh) | 2015-11-27 | 2016-08-15 | ||
| USD802723S1 (en) * | 2015-11-27 | 2017-11-14 | Ebara Corporation | Sealing ring |
| JP1558440S (zh) | 2015-12-24 | 2016-09-12 | ||
| JP1581994S (zh) * | 2016-11-29 | 2017-07-24 |
-
2017
- 2017-07-21 JP JPD2017-15764F patent/JP1598017S/ja active Active
-
2018
- 2018-01-17 US US29/633,936 patent/USD864361S1/en active Active
- 2018-01-19 TW TW107300371F patent/TWD193791S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1598017S (zh) | 2018-02-19 |
| USD864361S1 (en) | 2019-10-22 |
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