JP1700781S - - Google Patents

Info

Publication number
JP1700781S
JP1700781S JPD2021-5833F JP2021005833F JP1700781S JP 1700781 S JP1700781 S JP 1700781S JP 2021005833 F JP2021005833 F JP 2021005833F JP 1700781 S JP1700781 S JP 1700781S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2021-5833F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2021-5833F priority Critical patent/JP1700781S/ja
Priority to TW110305062F priority patent/TWD225036S/zh
Priority to US29/808,582 priority patent/USD981972S1/en
Application granted granted Critical
Publication of JP1700781S publication Critical patent/JP1700781S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2021-5833F 2021-03-22 2021-03-22 Active JP1700781S (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2021-5833F JP1700781S (zh) 2021-03-22 2021-03-22
TW110305062F TWD225036S (zh) 2021-03-22 2021-09-17 基板處理裝置用隔熱板
US29/808,582 USD981972S1 (en) 2021-03-22 2021-09-21 Adiabatic plate for substrate processing appratus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2021-5833F JP1700781S (zh) 2021-03-22 2021-03-22

Publications (1)

Publication Number Publication Date
JP1700781S true JP1700781S (zh) 2021-11-29

Family

ID=78766347

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2021-5833F Active JP1700781S (zh) 2021-03-22 2021-03-22

Country Status (3)

Country Link
US (1) USD981972S1 (zh)
JP (1) JP1700781S (zh)
TW (1) TWD225036S (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60226512D1 (de) * 2002-11-26 2008-06-19 Disco Corp Kassette zum speichern mehrerer halbleiterwaferlagen
USD547147S1 (en) * 2006-09-01 2007-07-24 Huy Tran Window tinting tool
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
JP1624334S (zh) * 2018-05-18 2019-02-12
JP1624353S (zh) 2018-07-19 2019-02-12

Also Published As

Publication number Publication date
USD981972S1 (en) 2023-03-28
TWD225036S (zh) 2023-05-01

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