USD326273S - Heat insulating cylinder for thermal treatment of semiconductor wafers - Google Patents
Heat insulating cylinder for thermal treatment of semiconductor wafers Download PDFInfo
- Publication number
- USD326273S USD326273S US07/301,997 US30199789F USD326273S US D326273 S USD326273 S US D326273S US 30199789 F US30199789 F US 30199789F US D326273 S USD326273 S US D326273S
- Authority
- US
- United States
- Prior art keywords
- heat insulating
- thermal treatment
- semiconductor wafers
- insulating cylinder
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front elevational view of a heat insulating cylinder for thermal treatment of semiconductor wafers showing our new design;
FIG. 2 is a right side elevational view, the left side elevational view being a mirror image;
FIG. 3 is a top plan view;
FIG. 4 is a bottom plan view; and,
FIG. 5 is a rear elevational view thereof.
Claims (1)
- The ornamental design for a heat insulating cylinder for thermal treatment of semiconductor wafers, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63-29832 | 1988-02-10 | ||
| JP2983288 | 1988-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD326273S true USD326273S (en) | 1992-05-19 |
Family
ID=70477582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/301,997 Expired - Lifetime USD326273S (en) | 1988-07-25 | 1989-01-25 | Heat insulating cylinder for thermal treatment of semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD326273S (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD901564S1 (en) * | 2019-01-28 | 2020-11-10 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
| USD952126S1 (en) * | 2017-01-06 | 2022-05-17 | Minka Lighting, Inc. | Ceiling fan housing |
| USD958929S1 (en) * | 2018-11-21 | 2022-07-26 | Inter-Med, Inc. | Minimal waste dispensing tip |
-
1989
- 1989-01-25 US US07/301,997 patent/USD326273S/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD952126S1 (en) * | 2017-01-06 | 2022-05-17 | Minka Lighting, Inc. | Ceiling fan housing |
| USD958929S1 (en) * | 2018-11-21 | 2022-07-26 | Inter-Med, Inc. | Minimal waste dispensing tip |
| US11590517B2 (en) | 2018-11-21 | 2023-02-28 | Inter-Med, Inc. | Universal minimal waste dispensing tip |
| USD901564S1 (en) * | 2019-01-28 | 2020-11-10 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
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