TWD211584S - Lower shield for a substrate processing chamber - Google Patents

Lower shield for a substrate processing chamber Download PDF

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Publication number
TWD211584S
TWD211584S TW109306129F TW109306129F TWD211584S TW D211584 S TWD211584 S TW D211584S TW 109306129 F TW109306129 F TW 109306129F TW 109306129 F TW109306129 F TW 109306129F TW D211584 S TWD211584 S TW D211584S
Authority
TW
Taiwan
Prior art keywords
processing chamber
substrate processing
lower shield
design
dotted line
Prior art date
Application number
TW109306129F
Other languages
Chinese (zh)
Inventor
薩拉斯 巴布
安恩克斯納 朱普迪
岳生 歐
魏俊琪
泰銘 莫
和田優一
康 張
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD211584S publication Critical patent/TWD211584S/en

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Abstract

【物品用途】;本設計係關於用於基板處理腔室的下屏蔽件之外觀設計。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of article]; This design is about the appearance design of the lower shield used in the substrate processing chamber. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

用於基板處理腔室的下屏蔽件 Lower shield for substrate processing chamber

本設計係關於用於基板處理腔室的下屏蔽件之外觀設計。 This design is about the appearance design of the lower shield used in the substrate processing chamber.

圖式所揭露之虛線部分,為本案不主張設計之部分。 The dotted line exposed in the diagram is a part of this case that does not advocate design.

TW109306129F 2019-08-28 2020-02-20 Lower shield for a substrate processing chamber TWD211584S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/703,658 2019-08-28
US29/703,658 USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

Publications (1)

Publication Number Publication Date
TWD211584S true TWD211584S (en) 2021-05-11

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ID=75378497

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109300802F TWD211387S (en) 2019-08-28 2020-02-20 Lower shield for a substrate processing chamber
TW109306129F TWD211584S (en) 2019-08-28 2020-02-20 Lower shield for a substrate processing chamber

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109300802F TWD211387S (en) 2019-08-28 2020-02-20 Lower shield for a substrate processing chamber

Country Status (3)

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US (2) USD931241S1 (en)
JP (2) JP1683052S (en)
TW (2) TWD211387S (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4217299B2 (en) 1998-03-06 2009-01-28 東京エレクトロン株式会社 Processing equipment
US6974523B2 (en) 2001-05-16 2005-12-13 Lam Research Corporation Hollow anode plasma reactor and method
USD467648S1 (en) * 2002-01-23 2002-12-24 Delva O'neil In-line drain trap
JP4141234B2 (en) 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 Plasma processing equipment
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
JP2006060073A (en) 2004-08-20 2006-03-02 Tokyo Electron Ltd Plasma processing equipment
US7651568B2 (en) 2005-03-28 2010-01-26 Tokyo Electron Limited Plasma enhanced atomic layer deposition system
TWD121115S1 (en) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 Cover ring
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
JP2009088298A (en) 2007-09-29 2009-04-23 Tokyo Electron Ltd Plasma treatment apparatus and plasma treatment method
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
WO2011026127A2 (en) 2009-08-31 2011-03-03 Lam Research Corporation A local plasma confinement and pressure control arrangement and methods thereof
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
CA142624S (en) * 2011-01-20 2012-01-25 Victaulic Co Of America Pipe
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US10170277B2 (en) 2011-05-31 2019-01-01 Applied Materials, Inc. Apparatus and methods for dry etch with edge, side and back protection
US9896769B2 (en) 2012-07-20 2018-02-20 Applied Materials, Inc. Inductively coupled plasma source with multiple dielectric windows and window-supporting structure
US20140124089A1 (en) * 2012-11-07 2014-05-08 Mark C. Schneider Sleeve for loading a dispensing device with bulk viscous material
JP1494712S (en) 2013-05-15 2017-04-03
TWD169790S (en) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 Part of the vaporizer for substrate processing equipment
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD801928S1 (en) * 2014-10-17 2017-11-07 Ebara Corporation Rotor for rotary electrical machine
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
JP1551512S (en) * 2015-06-12 2016-06-13
JP1546799S (en) * 2015-06-12 2016-03-28
JP1546800S (en) * 2015-06-12 2016-03-28
JP1546512S (en) * 2015-09-04 2016-03-22
JP1556433S (en) 2015-10-06 2016-08-15
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
JP1564934S (en) * 2016-02-26 2016-12-05
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
JP6994502B2 (en) 2016-08-26 2022-01-14 アプライド マテリアルズ インコーポレイテッド Plasma screen for plasma processing chamber
JP1584146S (en) * 2017-01-31 2017-08-21
JP1584784S (en) * 2017-01-31 2017-08-28
JP1584906S (en) * 2017-01-31 2017-08-28
JP1584241S (en) * 2017-01-31 2017-08-21
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
JP1591706S (en) * 2017-02-28 2017-11-27
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode
JP1598442S (en) * 2017-08-09 2018-02-26
JP1620194S (en) * 2018-01-22 2018-12-10
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Also Published As

Publication number Publication date
JP1684624S (en) 2021-05-10
USD931241S1 (en) 2021-09-21
USD971167S1 (en) 2022-11-29
TWD211387S (en) 2021-05-11
JP1683052S (en) 2021-04-12

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