TWD169790S - Part of the vaporizer for substrate processing equipment - Google Patents
Part of the vaporizer for substrate processing equipmentInfo
- Publication number
- TWD169790S TWD169790S TW103300031F TW103300031F TWD169790S TW D169790 S TWD169790 S TW D169790S TW 103300031 F TW103300031 F TW 103300031F TW 103300031 F TW103300031 F TW 103300031F TW D169790 S TWD169790 S TW D169790S
- Authority
- TW
- Taiwan
- Prior art keywords
- vaporizer
- design
- substrate processing
- view
- wafer boat
- Prior art date
Links
- 239000006200 vaporizer Substances 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 4
- 235000012431 wafers Nutrition 0.000 abstract 4
- 239000007788 liquid Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板處理裝置用氣化器,在處理晶圓之基板處理裝置中,使處理液氣化的氣化器,是以石英製作。;【設計說明】;本設計的物品,如使用狀態參考圖所示,是配置在支撐基板的晶舟上;再者,本物品所主張設計的部分,是以突出部(實線部分)表示;比該突出部更下側,是插入到形成在晶舟之上部的孔;藉由突出部,將氣化器保持在所希望的位置;而且,當晶舟移動時,可防止氣化器的位置偏移或脫落。;後視圖與前視圖相同,後視圖省略。;右側視圖與左側視圖相對稱,右側視圖省略。;圖式中以實線所示為「主張設計之部分」,以虛線所示為「不主張設計之部分」。[Use of article] The article of this design is a vaporizer for a substrate processing device. In a substrate processing device that processes wafers, the vaporizer that vaporizes the processing liquid is made of quartz. ;[Design Description];The item of this design, as shown in the reference picture of the use state, is arranged on the wafer boat that supports the substrate; Furthermore, the part of the proposed design of this item is represented by the protruding part (the solid line part) ; Lower than the protrusion, it is inserted into a hole formed in the upper part of the wafer boat; the protrusion holds the vaporizer at a desired position; and when the wafer boat moves, the vaporizer can be prevented from moving. The position shifts or falls off. ;The rear view is the same as the front view, and the rear view is omitted. ;The right view is symmetrical to the left view, and the right view is omitted. ; In the drawing, the solid lines indicate the "parts intended for design" and the dotted lines indicate the "parts not intended for design".
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013015793 | 2013-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD169790S true TWD169790S (en) | 2015-08-11 |
Family
ID=54328593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103300031F TWD169790S (en) | 2013-07-10 | 2014-01-03 | Part of the vaporizer for substrate processing equipment |
Country Status (2)
Country | Link |
---|---|
US (1) | USD741823S1 (en) |
TW (1) | TWD169790S (en) |
Cited By (6)
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USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD859333S1 (en) | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1038901S1 (en) | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
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USD795315S1 (en) * | 2014-12-12 | 2017-08-22 | Ebara Corporation | Dresser disk |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
JP1546801S (en) * | 2015-06-12 | 2016-03-28 | ||
JP1545406S (en) * | 2015-06-16 | 2016-03-14 | ||
JP1545407S (en) * | 2015-06-16 | 2016-03-14 | ||
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD836572S1 (en) | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD923241S1 (en) * | 2018-05-29 | 2021-06-22 | Pax Labs, Inc. | Vaporizer cartridge container |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD936187S1 (en) * | 2020-02-12 | 2021-11-16 | Applied Materials, Inc. | Gas distribution assembly lid |
USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
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USD1037778S1 (en) | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
Family Cites Families (26)
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US3026587A (en) * | 1955-06-28 | 1962-03-27 | Spencer William Robert | Magnetic rubber tobacco priming bands |
JPS62166624U (en) * | 1986-04-14 | 1987-10-22 | ||
US4906207A (en) * | 1989-04-24 | 1990-03-06 | W. L. Gore & Associates, Inc. | Dielectric restrainer |
USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
JP3551867B2 (en) * | 1999-11-09 | 2004-08-11 | 信越化学工業株式会社 | Silicon focus ring and manufacturing method thereof |
JP2003100713A (en) * | 2001-09-26 | 2003-04-04 | Kawasaki Microelectronics Kk | Cover for plasma electrode |
US6746240B2 (en) * | 2002-03-15 | 2004-06-08 | Asm International N.V. | Process tube support sleeve with circumferential channels |
USD559993S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559994S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US8617672B2 (en) * | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
USD588078S1 (en) * | 2006-06-16 | 2009-03-10 | Tokyo Electron Limited | Heat dissipation deterrence link for semiconductor manufacture |
USD600722S1 (en) * | 2008-05-07 | 2009-09-22 | Komatsu Ltd. | Fan shroud for construction machinery |
USD605206S1 (en) * | 2008-05-07 | 2009-12-01 | Komatsu Ltd. | Fan shroud for construction machinery |
USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
USD709539S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD709537S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD711331S1 (en) * | 2013-11-07 | 2014-08-19 | Applied Materials, Inc. | Upper chamber liner |
USD713363S1 (en) * | 2013-12-31 | 2014-09-16 | Celadon Systems, Inc. | Support for a probe test core |
-
2014
- 2014-01-03 TW TW103300031F patent/TWD169790S/en unknown
- 2014-01-09 US US29/478,836 patent/USD741823S1/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD858468S1 (en) | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD859333S1 (en) | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1038901S1 (en) | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
Also Published As
Publication number | Publication date |
---|---|
USD741823S1 (en) | 2015-10-27 |
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