TWD165429S - Wafer boats for semiconductor manufacturing equipment - Google Patents

Wafer boats for semiconductor manufacturing equipment

Info

Publication number
TWD165429S
TWD165429S TW103300470F TW103300470F TWD165429S TW D165429 S TWD165429 S TW D165429S TW 103300470 F TW103300470 F TW 103300470F TW 103300470 F TW103300470 F TW 103300470F TW D165429 S TWD165429 S TW D165429S
Authority
TW
Taiwan
Prior art keywords
manufacturing equipment
semiconductor manufacturing
wafer
semiconductor wafer
wafer boats
Prior art date
Application number
TW103300470F
Other languages
Chinese (zh)
Inventor
Hidenari Yoshida
Tomoshi Taniyama
Original Assignee
日立國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司 filed Critical 日立國際電氣股份有限公司
Publication of TWD165429S publication Critical patent/TWD165429S/en

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置用晶舟,為一種半導體晶圓施行成膜時,用以將半導體晶圓水平地保持在反應室內的晶舟。;【設計說明】;如B-B放大剖面圖所示,將半導體晶圓載置於形成在前方左右及後方左右的梳子狀保持部。本物品是由碳化矽(SiC:Silicon Carbide)製成。[Use of article] The article of this design is a wafer boat for semiconductor manufacturing equipment. It is a wafer boat used to hold the semiconductor wafer horizontally in the reaction chamber when the semiconductor wafer is film-formed. ;[Design Description];As shown in the B-B enlarged cross-sectional view, the semiconductor wafer is placed on the comb-shaped holding portions formed on the front left and right and the rear left and right. This item is made of silicon carbide (SiC: Silicon Carbide).

TW103300470F 2013-07-29 2014-01-24 Wafer boats for semiconductor manufacturing equipment TWD165429S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013017235 2013-07-29

Publications (1)

Publication Number Publication Date
TWD165429S true TWD165429S (en) 2015-01-11

Family

ID=53939267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103300470F TWD165429S (en) 2013-07-29 2014-01-24 Wafer boats for semiconductor manufacturing equipment

Country Status (2)

Country Link
US (1) USD737785S1 (en)
TW (1) TWD165429S (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD764423S1 (en) * 2014-03-05 2016-08-23 Hzo, Inc. Corrugated elements for defining longitudinal channels in a boat for a deposition apparatus
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
JP1537630S (en) * 2014-11-20 2015-11-09
JP1537313S (en) * 2014-11-20 2015-11-09
JP1537312S (en) * 2014-11-20 2015-11-09
JP1537629S (en) * 2014-11-20 2015-11-09
JP1563649S (en) * 2016-02-12 2016-11-21
JP1597807S (en) * 2017-08-21 2018-02-19
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP1638282S (en) * 2018-09-20 2019-08-05
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP1658652S (en) * 2019-08-07 2020-04-27
JP1678278S (en) * 2020-03-19 2021-02-01 Boat for substrate processing equipment

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USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
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USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
JP3218164B2 (en) * 1995-05-31 2001-10-15 東京エレクトロン株式会社 Support boat for object to be processed, heat treatment apparatus and heat treatment method
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USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
KR20000002833A (en) * 1998-06-23 2000-01-15 윤종용 Semiconductor wafer boat
JP3487497B2 (en) * 1998-06-24 2004-01-19 岩手東芝エレクトロニクス株式会社 Object to be processed accommodation jig and heat treatment apparatus using the same
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US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
JP4506125B2 (en) * 2003-07-16 2010-07-21 信越半導体株式会社 Vertical boat for heat treatment and manufacturing method thereof
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
USD570309S1 (en) * 2006-10-25 2008-06-03 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
TWD133942S1 (en) * 2008-03-28 2010-03-21 東京威力科創股份有限公司 Crystal Boat
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) * 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus

Also Published As

Publication number Publication date
USD737785S1 (en) 2015-09-01

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