|
USD406852S
(en)
|
1997-11-14 |
1999-03-16 |
Applied Materials, Inc. |
Electrostatic chuck with improved spacing mask and workpiece detection device
|
|
USD490827S1
(en)
*
|
2002-12-20 |
2004-06-01 |
Ngk Spark Plug Co., Ltd. |
Electrostatic chuck
|
|
KR20070017255A
(ko)
|
2005-08-06 |
2007-02-09 |
삼성전자주식회사 |
플라즈마 장치의 반도체 기판 고정 장치
|
|
KR100854500B1
(ko)
|
2007-02-12 |
2008-08-26 |
삼성전자주식회사 |
척 어셈블리 및 이를 구비한 고밀도 플라즈마 설비
|
|
JP5022077B2
(ja)
|
2007-03-27 |
2012-09-12 |
株式会社アルバック |
成膜装置
|
|
US8409995B2
(en)
|
2009-08-07 |
2013-04-02 |
Tokyo Electron Limited |
Substrate processing apparatus, positioning method and focus ring installation method
|
|
USD621804S1
(en)
*
|
2009-08-07 |
2010-08-17 |
Hon Hai Precision Industry Co., Ltd. |
PCB for arranging LED lights
|
|
JP5183659B2
(ja)
|
2010-03-23 |
2013-04-17 |
東京エレクトロン株式会社 |
基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
|
|
USD664249S1
(en)
*
|
2011-07-01 |
2012-07-24 |
Applied Materials, Inc. |
Flow blocker plate
|
|
USD708651S1
(en)
*
|
2011-11-22 |
2014-07-08 |
Applied Materials, Inc. |
Electrostatic chuck
|
|
US9673077B2
(en)
*
|
2012-07-03 |
2017-06-06 |
Watlow Electric Manufacturing Company |
Pedestal construction with low coefficient of thermal expansion top
|
|
US9490150B2
(en)
|
2012-07-03 |
2016-11-08 |
Applied Materials, Inc. |
Substrate support for substrate backside contamination control
|
|
US9478447B2
(en)
|
2012-11-26 |
2016-10-25 |
Applied Materials, Inc. |
Substrate support with wire mesh plasma containment
|
|
US9543186B2
(en)
|
2013-02-01 |
2017-01-10 |
Applied Materials, Inc. |
Substrate support with controlled sealing gap
|
|
TWD163540S
(zh)
|
2013-03-28 |
2014-10-11 |
平田機工股份有限公司 |
晶圓載入／載出腔用蓋
|
|
USD716742S1
(en)
*
|
2013-09-13 |
2014-11-04 |
Asm Ip Holding B.V. |
Substrate supporter for semiconductor deposition apparatus
|
|
USD723077S1
(en)
*
|
2013-12-03 |
2015-02-24 |
Applied Materials, Inc. |
Chuck carrier film
|
|
US9779971B2
(en)
|
2014-04-11 |
2017-10-03 |
Applied Materials, Inc. |
Methods and apparatus for rapidly cooling a substrate
|
|
US20160002778A1
(en)
|
2014-07-03 |
2016-01-07 |
Applied Materials, Inc. |
Substrate support with more uniform edge purge
|
|
JP1528261S
(ja)
|
2014-12-25 |
2016-06-27 |
|
|
|
USD798248S1
(en)
*
|
2015-06-18 |
2017-09-26 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
|
JP1547357S
(ja)
|
2015-07-27 |
2016-04-11 |
|
|
|
USD813181S1
(en)
*
|
2016-07-26 |
2018-03-20 |
Hitachi Kokusai Electric Inc. |
Cover of seal cap for reaction chamber of semiconductor
|
|
US10435784B2
(en)
|
2016-08-10 |
2019-10-08 |
Applied Materials, Inc. |
Thermally optimized rings
|
|
JP1582993S
(ja)
|
2016-12-12 |
2018-07-30 |
|
|
|
USD830981S1
(en)
*
|
2017-04-07 |
2018-10-16 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate processing apparatus
|
|
KR20190015522A
(ko)
*
|
2017-05-25 |
2019-02-13 |
엔지케이 인슐레이터 엘티디 |
웨이퍼용 서셉터
|
|
TWD197827S
(zh)
|
2017-12-19 |
2019-06-01 |
日商荏原製作所股份有限公 |
半導體晶圓研磨用彈性膜
|
|
US20200343120A1
(en)
|
2018-01-19 |
2020-10-29 |
Ulvac, Inc. |
Heater base and processing apparatus
|
|
JP7030006B2
(ja)
*
|
2018-04-12 |
2022-03-04 |
株式会社ディスコ |
拡張方法及び拡張装置
|