KR101008863B1 - 기판상의 중합체 증착을 감소시키기 위한 디바이스를 구비한 플라즈마 장치 및 중합체 증착을 감소시키는 방법 - Google Patents

기판상의 중합체 증착을 감소시키기 위한 디바이스를 구비한 플라즈마 장치 및 중합체 증착을 감소시키는 방법 Download PDF

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KR101008863B1
KR101008863B1 KR1020057004633A KR20057004633A KR101008863B1 KR 101008863 B1 KR101008863 B1 KR 101008863B1 KR 1020057004633 A KR1020057004633 A KR 1020057004633A KR 20057004633 A KR20057004633 A KR 20057004633A KR 101008863 B1 KR101008863 B1 KR 101008863B1
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ring
substrate
coupling
gap
substrate support
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KR20050057423A (ko
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호세 통
에릭 에이치 렌츠
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR1020057004633A 2002-09-20 2003-08-28 기판상의 중합체 증착을 감소시키기 위한 디바이스를 구비한 플라즈마 장치 및 중합체 증착을 감소시키는 방법 Expired - Fee Related KR101008863B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/251,179 2002-09-20
US10/251,179 US7252738B2 (en) 2002-09-20 2002-09-20 Apparatus for reducing polymer deposition on a substrate and substrate support

Publications (2)

Publication Number Publication Date
KR20050057423A KR20050057423A (ko) 2005-06-16
KR101008863B1 true KR101008863B1 (ko) 2011-01-17

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KR1020057004633A Expired - Fee Related KR101008863B1 (ko) 2002-09-20 2003-08-28 기판상의 중합체 증착을 감소시키기 위한 디바이스를 구비한 플라즈마 장치 및 중합체 증착을 감소시키는 방법

Country Status (9)

Country Link
US (2) US7252738B2 (enExample)
EP (1) EP1543537B1 (enExample)
JP (1) JP4499567B2 (enExample)
KR (1) KR101008863B1 (enExample)
CN (2) CN100351989C (enExample)
AT (1) ATE527679T1 (enExample)
AU (1) AU2003260128A1 (enExample)
TW (1) TWI324804B (enExample)
WO (1) WO2004027815A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210061269A (ko) * 2019-11-18 2021-05-27 어드밴스드 마이크로 패브리케이션 이큅먼트 인코퍼레이티드. 차이나 플라즈마 처리 장치 및 그 조절 방법

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