|
KR100849929B1
(ko)
*
|
2006-09-16 |
2008-08-26 |
주식회사 피에조닉스 |
반응 기체의 분사 속도를 적극적으로 조절하는 샤워헤드를구비한 화학기상 증착 방법 및 장치
|
|
US8673080B2
(en)
|
2007-10-16 |
2014-03-18 |
Novellus Systems, Inc. |
Temperature controlled showerhead
|
|
US7976631B2
(en)
*
|
2007-10-16 |
2011-07-12 |
Applied Materials, Inc. |
Multi-gas straight channel showerhead
|
|
US20090095221A1
(en)
*
|
2007-10-16 |
2009-04-16 |
Alexander Tam |
Multi-gas concentric injection showerhead
|
|
US8668775B2
(en)
*
|
2007-10-31 |
2014-03-11 |
Toshiba Techno Center Inc. |
Machine CVD shower head
|
|
KR20090078538A
(ko)
*
|
2008-01-15 |
2009-07-20 |
삼성전기주식회사 |
샤워 헤드와 이를 구비하는 화학 기상 증착 장치
|
|
KR101004927B1
(ko)
*
|
2008-04-24 |
2010-12-29 |
삼성엘이디 주식회사 |
Ｃｖｄ용 샤워 헤드 및 이를 구비하는 화학 기상 증착 장치
|
|
US8291857B2
(en)
|
2008-07-03 |
2012-10-23 |
Applied Materials, Inc. |
Apparatuses and methods for atomic layer deposition
|
|
US10378106B2
(en)
|
2008-11-14 |
2019-08-13 |
Asm Ip Holding B.V. |
Method of forming insulation film by modified PEALD
|
|
US8293013B2
(en)
*
|
2008-12-30 |
2012-10-23 |
Intermolecular, Inc. |
Dual path gas distribution device
|
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
|
KR101064210B1
(ko)
*
|
2009-06-01 |
2011-09-14 |
한국생산기술연구원 |
막증착 진공장비용 샤워헤드
|
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
|
US9449859B2
(en)
*
|
2009-10-09 |
2016-09-20 |
Applied Materials, Inc. |
Multi-gas centrally cooled showerhead design
|
|
US20110256692A1
(en)
*
|
2010-04-14 |
2011-10-20 |
Applied Materials, Inc. |
Multiple precursor concentric delivery showerhead
|
|
US8455374B2
(en)
*
|
2010-05-06 |
2013-06-04 |
Applied Materials, Inc. |
Radiation heating efficiency by increasing optical absorption of a silicon containing material
|
|
US20120052216A1
(en)
*
|
2010-08-27 |
2012-03-01 |
Applied Materials, Inc. |
Gas distribution showerhead with high emissivity surface
|
|
US10283321B2
(en)
|
2011-01-18 |
2019-05-07 |
Applied Materials, Inc. |
Semiconductor processing system and methods using capacitively coupled plasma
|
|
KR101904146B1
(ko)
|
2011-03-01 |
2018-10-04 |
어플라이드 머티어리얼스, 인코포레이티드 |
기판 이송 및 라디칼 구속을 위한 방법 및 장치
|
|
US11171008B2
(en)
|
2011-03-01 |
2021-11-09 |
Applied Materials, Inc. |
Abatement and strip process chamber in a dual load lock configuration
|
|
WO2012118897A2
(en)
|
2011-03-01 |
2012-09-07 |
Applied Materials, Inc. |
Abatement and strip process chamber in a dual loadlock configuration
|
|
CN106884157B
(zh)
|
2011-03-04 |
2019-06-21 |
诺发系统公司 |
混合型陶瓷喷淋头
|
|
US9064815B2
(en)
|
2011-03-14 |
2015-06-23 |
Applied Materials, Inc. |
Methods for etch of metal and metal-oxide films
|
|
TWI534291B
(zh)
*
|
2011-03-18 |
2016-05-21 |
應用材料股份有限公司 |
噴淋頭組件
|
|
JP5741921B2
(ja)
*
|
2011-04-08 |
2015-07-01 |
株式会社日立国際電気 |
基板処理装置、基板処理装置に用いられる反応管の表面へのコーティング膜の形成方法、および、太陽電池の製造方法
|
|
JP2012222157A
(ja)
*
|
2011-04-08 |
2012-11-12 |
Hitachi Kokusai Electric Inc |
基板処理装置、及び、太陽電池の製造方法
|
|
US8900403B2
(en)
|
2011-05-10 |
2014-12-02 |
Lam Research Corporation |
Semiconductor processing system having multiple decoupled plasma sources
|
|
TWI593041B
(zh)
*
|
2011-04-11 |
2017-07-21 |
蘭姆研究公司 |
半導體基板處理系統與方法
|
|
US9111728B2
(en)
|
2011-04-11 |
2015-08-18 |
Lam Research Corporation |
E-beam enhanced decoupled source for semiconductor processing
|
|
US8980046B2
(en)
*
|
2011-04-11 |
2015-03-17 |
Lam Research Corporation |
Semiconductor processing system with source for decoupled ion and radical control
|
|
US20120270384A1
(en)
*
|
2011-04-22 |
2012-10-25 |
Applied Materials, Inc. |
Apparatus for deposition of materials on a substrate
|
|
CN103597583B
(zh)
*
|
2011-05-19 |
2016-06-08 |
古河机械金属株式会社 |
半导体制造装置部件的清洗方法、半导体制造装置部件的清洗装置及气相生长装置
|
|
US9312155B2
(en)
|
2011-06-06 |
2016-04-12 |
Asm Japan K.K. |
High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
|
|
US9793148B2
(en)
|
2011-06-22 |
2017-10-17 |
Asm Japan K.K. |
Method for positioning wafers in multiple wafer transport
|
|
US10364496B2
(en)
|
2011-06-27 |
2019-07-30 |
Asm Ip Holding B.V. |
Dual section module having shared and unshared mass flow controllers
|
|
DE102011056589A1
(de)
*
|
2011-07-12 |
2013-01-17 |
Aixtron Se |
Gaseinlassorgan eines CVD-Reaktors
|
|
US10854498B2
(en)
|
2011-07-15 |
2020-12-01 |
Asm Ip Holding B.V. |
Wafer-supporting device and method for producing same
|
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
|
TWI457180B
(zh)
*
|
2011-08-15 |
2014-10-21 |
Hermes Epitek Corp |
氣體噴頭
|
|
JP5710433B2
(ja)
*
|
2011-09-13 |
2015-04-30 |
株式会社東芝 |
成膜装置のクリーニング方法および成膜装置
|
|
CN103031535B
(zh)
*
|
2011-09-28 |
2015-12-09 |
核心能源实业有限公司 |
薄膜工艺设备及其制作方法
|
|
US9303318B2
(en)
*
|
2011-10-20 |
2016-04-05 |
Applied Materials, Inc. |
Multiple complementary gas distribution assemblies
|
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
|
US8945317B2
(en)
*
|
2011-12-07 |
2015-02-03 |
Lam Research Corporation |
System and method for cleaning gas injectors
|
|
KR200485369Y1
(ko)
*
|
2012-01-24 |
2017-12-28 |
어플라이드 머티어리얼스, 인코포레이티드 |
기판 구동 시스템을 위한 알루미늄 코팅된 부품들 또는 세라믹 부품들
|
|
US8784676B2
(en)
*
|
2012-02-03 |
2014-07-22 |
Lam Research Corporation |
Waferless auto conditioning
|
|
US20130220222A1
(en)
*
|
2012-02-23 |
2013-08-29 |
Hermes-Epitek Corporation |
Gas Distribution Apparatus with Heat Exchanging Channels
|
|
JP6545460B2
(ja)
*
|
2012-02-29 |
2019-07-17 |
アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ |
ロードロック構成内の除害・剥離処理チャンバ
|
|
US8946830B2
(en)
|
2012-04-04 |
2015-02-03 |
Asm Ip Holdings B.V. |
Metal oxide protective layer for a semiconductor device
|
|
US9267739B2
(en)
|
2012-07-18 |
2016-02-23 |
Applied Materials, Inc. |
Pedestal with multi-zone temperature control and multiple purge capabilities
|
|
US9631273B2
(en)
*
|
2012-07-25 |
2017-04-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Apparatus for dielectric deposition process
|
|
US9558931B2
(en)
|
2012-07-27 |
2017-01-31 |
Asm Ip Holding B.V. |
System and method for gas-phase sulfur passivation of a semiconductor surface
|
|
US9373517B2
(en)
|
2012-08-02 |
2016-06-21 |
Applied Materials, Inc. |
Semiconductor processing with DC assisted RF power for improved control
|
|
US9659799B2
(en)
|
2012-08-28 |
2017-05-23 |
Asm Ip Holding B.V. |
Systems and methods for dynamic semiconductor process scheduling
|
|
US9121097B2
(en)
*
|
2012-08-31 |
2015-09-01 |
Novellus Systems, Inc. |
Variable showerhead flow by varying internal baffle conductance
|
|
KR102296150B1
(ko)
|
2012-09-07 |
2021-08-30 |
어플라이드 머티어리얼스, 인코포레이티드 |
멀티-챔버 진공 시스템 확인 내에서의 다공성 유전체, 폴리머-코팅된 기판들 및 에폭시의 통합 프로세싱
|
|
US9021985B2
(en)
|
2012-09-12 |
2015-05-05 |
Asm Ip Holdings B.V. |
Process gas management for an inductively-coupled plasma deposition reactor
|
|
US9132436B2
(en)
|
2012-09-21 |
2015-09-15 |
Applied Materials, Inc. |
Chemical control features in wafer process equipment
|
|
US9324811B2
(en)
|
2012-09-26 |
2016-04-26 |
Asm Ip Holding B.V. |
Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same
|
|
CN102899636B
(zh)
*
|
2012-09-26 |
2015-12-09 |
中微半导体设备(上海)有限公司 |
一种原位清洁mocvd反应腔室的方法
|
|
CN102899635B
(zh)
*
|
2012-09-26 |
2015-12-02 |
中微半导体设备(上海)有限公司 |
一种原位清洁mocvd反应腔室的方法
|
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
|
US20140124788A1
(en)
*
|
2012-11-06 |
2014-05-08 |
Intermolecular, Inc. |
Chemical Vapor Deposition System
|
|
US9982343B2
(en)
*
|
2012-12-14 |
2018-05-29 |
Applied Materials, Inc. |
Apparatus for providing plasma to a process chamber
|
|
US10316409B2
(en)
|
2012-12-21 |
2019-06-11 |
Novellus Systems, Inc. |
Radical source design for remote plasma atomic layer deposition
|
|
US9640416B2
(en)
|
2012-12-26 |
2017-05-02 |
Asm Ip Holding B.V. |
Single-and dual-chamber module-attachable wafer-handling chamber
|
|
JP2014127627A
(ja)
*
|
2012-12-27 |
2014-07-07 |
Tokyo Electron Ltd |
薄膜形成装置の洗浄方法、薄膜形成方法、薄膜形成装置、及び、プログラム
|
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
|
US10256079B2
(en)
|
2013-02-08 |
2019-04-09 |
Applied Materials, Inc. |
Semiconductor processing systems having multiple plasma configurations
|
|
TW201437423A
(zh)
*
|
2013-02-21 |
2014-10-01 |
Applied Materials Inc |
用於注射器至基板的空隙控制之裝置及方法
|
|
US9362130B2
(en)
|
2013-03-01 |
2016-06-07 |
Applied Materials, Inc. |
Enhanced etching processes using remote plasma sources
|
|
US9484191B2
(en)
|
2013-03-08 |
2016-11-01 |
Asm Ip Holding B.V. |
Pulsed remote plasma method and system
|
|
US9589770B2
(en)
|
2013-03-08 |
2017-03-07 |
Asm Ip Holding B.V. |
Method and systems for in-situ formation of intermediate reactive species
|
|
TWI591211B
(zh)
*
|
2013-03-13 |
2017-07-11 |
應用材料股份有限公司 |
蝕刻包含過渡金屬的膜之方法
|
|
CN103219227A
(zh)
*
|
2013-04-09 |
2013-07-24 |
上海华力微电子有限公司 |
等离子体清洗方法
|
|
DE102013104105A1
(de)
*
|
2013-04-23 |
2014-10-23 |
Aixtron Se |
MOCVD-Schichtwachstumsverfahren mit nachfolgendem mehrstufigen Reinigungsschritt
|
|
JP6199619B2
(ja)
*
|
2013-06-13 |
2017-09-20 |
株式会社ニューフレアテクノロジー |
気相成長装置
|
|
JP6153401B2
(ja)
*
|
2013-07-02 |
2017-06-28 |
株式会社ニューフレアテクノロジー |
気相成長装置および気相成長方法
|
|
US9490149B2
(en)
*
|
2013-07-03 |
2016-11-08 |
Lam Research Corporation |
Chemical deposition apparatus having conductance control
|
|
US9677176B2
(en)
*
|
2013-07-03 |
2017-06-13 |
Novellus Systems, Inc. |
Multi-plenum, dual-temperature showerhead
|
|
US8993054B2
(en)
|
2013-07-12 |
2015-03-31 |
Asm Ip Holding B.V. |
Method and system to reduce outgassing in a reaction chamber
|
|
US9018111B2
(en)
|
2013-07-22 |
2015-04-28 |
Asm Ip Holding B.V. |
Semiconductor reaction chamber with plasma capabilities
|
|
US9793115B2
(en)
|
2013-08-14 |
2017-10-17 |
Asm Ip Holding B.V. |
Structures and devices including germanium-tin films and methods of forming same
|
|
KR101599108B1
(ko)
|
2013-09-26 |
2016-03-02 |
주식회사 엘지화학 |
경화성 조성물, 이로 제조된 경화막 및 이를 포함하는 디스플레이 장치
|
|
US9240412B2
(en)
|
2013-09-27 |
2016-01-19 |
Asm Ip Holding B.V. |
Semiconductor structure and device and methods of forming same using selective epitaxial process
|
|
US9556516B2
(en)
|
2013-10-09 |
2017-01-31 |
ASM IP Holding B.V |
Method for forming Ti-containing film by PEALD using TDMAT or TDEAT
|
|
JP6406811B2
(ja)
*
|
2013-11-20 |
2018-10-17 |
国立大学法人名古屋大学 |
Ｉｉｉ 族窒化物半導体装置の製造装置および製造方法ならびに半導体ウエハの製造方法
|
|
KR102028478B1
(ko)
*
|
2013-11-20 |
2019-10-04 |
엘지디스플레이 주식회사 |
화학기상 증착장치
|
|
US10179947B2
(en)
|
2013-11-26 |
2019-01-15 |
Asm Ip Holding B.V. |
Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition
|
|
US20150167160A1
(en)
*
|
2013-12-16 |
2015-06-18 |
Applied Materials, Inc. |
Enabling radical-based deposition of dielectric films
|
|
KR102019303B1
(ko)
*
|
2013-12-18 |
2019-09-06 |
엘지디스플레이 주식회사 |
화학기상 증착 시스템
|
|
JP5897617B2
(ja)
|
2014-01-31 |
2016-03-30 |
株式会社日立国際電気 |
基板処理装置及び半導体装置の製造方法
|
|
CN106104775B
(zh)
*
|
2014-01-31 |
2019-05-21 |
应用材料公司 |
腔室涂层
|
|
US10683571B2
(en)
|
2014-02-25 |
2020-06-16 |
Asm Ip Holding B.V. |
Gas supply manifold and method of supplying gases to chamber using same
|
|
US9447498B2
(en)
|
2014-03-18 |
2016-09-20 |
Asm Ip Holding B.V. |
Method for performing uniform processing in gas system-sharing multiple reaction chambers
|
|
US10167557B2
(en)
|
2014-03-18 |
2019-01-01 |
Asm Ip Holding B.V. |
Gas distribution system, reactor including the system, and methods of using the same
|
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
|
US9404587B2
(en)
|
2014-04-24 |
2016-08-02 |
ASM IP Holding B.V |
Lockout tagout for semiconductor vacuum valve
|
|
JP2015211156A
(ja)
*
|
2014-04-28 |
2015-11-24 |
東京エレクトロン株式会社 |
ドライクリーニング方法及びプラズマ処理装置
|
|
US10741365B2
(en)
|
2014-05-05 |
2020-08-11 |
Lam Research Corporation |
Low volume showerhead with porous baffle
|
|
US20150332942A1
(en)
*
|
2014-05-16 |
2015-11-19 |
Eng Sheng Peh |
Pedestal fluid-based thermal control
|
|
CN103981663B
(zh)
*
|
2014-05-29 |
2016-05-11 |
浙江辰鸿纺织品科技有限公司 |
遮光布布面浆料整理装置
|
|
US9840777B2
(en)
|
2014-06-27 |
2017-12-12 |
Applied Materials, Inc. |
Apparatus for radical-based deposition of dielectric films
|
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
|
US9543180B2
(en)
|
2014-08-01 |
2017-01-10 |
Asm Ip Holding B.V. |
Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
|
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
|
US9657845B2
(en)
|
2014-10-07 |
2017-05-23 |
Asm Ip Holding B.V. |
Variable conductance gas distribution apparatus and method
|
|
US9355922B2
(en)
|
2014-10-14 |
2016-05-31 |
Applied Materials, Inc. |
Systems and methods for internal surface conditioning in plasma processing equipment
|
|
US9966240B2
(en)
|
2014-10-14 |
2018-05-08 |
Applied Materials, Inc. |
Systems and methods for internal surface conditioning assessment in plasma processing equipment
|
|
US20160138161A1
(en)
*
|
2014-11-19 |
2016-05-19 |
Applied Materials, Inc. |
Radical assisted cure of dielectric films
|
|
KR102300403B1
(ko)
|
2014-11-19 |
2021-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
|
US11637002B2
(en)
|
2014-11-26 |
2023-04-25 |
Applied Materials, Inc. |
Methods and systems to enhance process uniformity
|
|
US10573496B2
(en)
|
2014-12-09 |
2020-02-25 |
Applied Materials, Inc. |
Direct outlet toroidal plasma source
|
|
US10224210B2
(en)
|
2014-12-09 |
2019-03-05 |
Applied Materials, Inc. |
Plasma processing system with direct outlet toroidal plasma source
|
|
US9613908B2
(en)
*
|
2014-12-15 |
2017-04-04 |
Applied Materials, Inc. |
Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications
|
|
KR102263121B1
(ko)
|
2014-12-22 |
2021-06-09 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 및 그 제조 방법
|
|
CN104498904B
(zh)
*
|
2014-12-29 |
2017-04-26 |
华中科技大学 |
一种用于mocvd设备的喷淋头
|
|
US11257693B2
(en)
|
2015-01-09 |
2022-02-22 |
Applied Materials, Inc. |
Methods and systems to improve pedestal temperature control
|
|
DE102015101462A1
(de)
*
|
2015-02-02 |
2016-08-04 |
Aixtron Se |
Verfahren und Vorrichtung zum Abscheiden einer III-V-Halbleiterschicht
|
|
US20160225652A1
(en)
|
2015-02-03 |
2016-08-04 |
Applied Materials, Inc. |
Low temperature chuck for plasma processing systems
|
|
US10388820B2
(en)
|
2015-02-03 |
2019-08-20 |
Lg Electronics Inc. |
Metal organic chemical vapor deposition apparatus for solar cell
|
|
US9728437B2
(en)
|
2015-02-03 |
2017-08-08 |
Applied Materials, Inc. |
High temperature chuck for plasma processing systems
|
|
US9478415B2
(en)
|
2015-02-13 |
2016-10-25 |
Asm Ip Holding B.V. |
Method for forming film having low resistance and shallow junction depth
|
|
CN105986245A
(zh)
*
|
2015-02-16 |
2016-10-05 |
中微半导体设备(上海)有限公司 |
改善mocvd反应工艺的部件及改善方法
|
|
US9881805B2
(en)
|
2015-03-02 |
2018-01-30 |
Applied Materials, Inc. |
Silicon selective removal
|
|
US10529542B2
(en)
|
2015-03-11 |
2020-01-07 |
Asm Ip Holdings B.V. |
Cross-flow reactor and method
|
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
|
KR101870649B1
(ko)
*
|
2015-03-31 |
2018-06-27 |
세메스 주식회사 |
기판 처리 장치 및 방법
|
|
US9397011B1
(en)
*
|
2015-04-13 |
2016-07-19 |
Lam Research Corporation |
Systems and methods for reducing copper contamination due to substrate processing chambers with components made of alloys including copper
|
|
US20160305009A1
(en)
*
|
2015-04-16 |
2016-10-20 |
China Triumph International Engineering Co., Ltd. |
Aperture with Optimized Thermal Emission Behavior
|
|
FR3035122B1
(fr)
*
|
2015-04-20 |
2017-04-28 |
Coating Plasma Ind |
Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede
|
|
KR102573207B1
(ko)
|
2015-05-19 |
2023-08-31 |
코닝 인코포레이티드 |
시트와 캐리어의 결합을 위한 물품 및 방법
|
|
US10378107B2
(en)
|
2015-05-22 |
2019-08-13 |
Lam Research Corporation |
Low volume showerhead with faceplate holes for improved flow uniformity
|
|
US10023959B2
(en)
|
2015-05-26 |
2018-07-17 |
Lam Research Corporation |
Anti-transient showerhead
|
|
CN107710386B
(zh)
*
|
2015-06-05 |
2021-12-21 |
应用材料公司 |
工艺腔室
|
|
US12281385B2
(en)
*
|
2015-06-15 |
2025-04-22 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Gas dispenser and deposition apparatus using the same
|
|
CN107683347B
(zh)
*
|
2015-06-18 |
2020-05-15 |
东芝三菱电机产业系统株式会社 |
金属氧化膜的成膜方法
|
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
|
US20160375515A1
(en)
*
|
2015-06-29 |
2016-12-29 |
Lam Research Corporation |
Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing
|
|
JP6607716B2
(ja)
*
|
2015-07-03 |
2019-11-20 |
昭和電工株式会社 |
成膜装置
|
|
US10600673B2
(en)
|
2015-07-07 |
2020-03-24 |
Asm Ip Holding B.V. |
Magnetic susceptor to baseplate seal
|
|
US9899291B2
(en)
|
2015-07-13 |
2018-02-20 |
Asm Ip Holding B.V. |
Method for protecting layer by forming hydrocarbon-based extremely thin film
|
|
US10043661B2
(en)
|
2015-07-13 |
2018-08-07 |
Asm Ip Holding B.V. |
Method for protecting layer by forming hydrocarbon-based extremely thin film
|
|
US10083836B2
(en)
|
2015-07-24 |
2018-09-25 |
Asm Ip Holding B.V. |
Formation of boron-doped titanium metal films with high work function
|
|
US10087525B2
(en)
|
2015-08-04 |
2018-10-02 |
Asm Ip Holding B.V. |
Variable gap hard stop design
|
|
US9741593B2
(en)
|
2015-08-06 |
2017-08-22 |
Applied Materials, Inc. |
Thermal management systems and methods for wafer processing systems
|
|
US9691645B2
(en)
|
2015-08-06 |
2017-06-27 |
Applied Materials, Inc. |
Bolted wafer chuck thermal management systems and methods for wafer processing systems
|
|
US9349605B1
(en)
|
2015-08-07 |
2016-05-24 |
Applied Materials, Inc. |
Oxide etch selectivity systems and methods
|
|
US9647114B2
(en)
|
2015-08-14 |
2017-05-09 |
Asm Ip Holding B.V. |
Methods of forming highly p-type doped germanium tin films and structures and devices including the films
|
|
US9711345B2
(en)
|
2015-08-25 |
2017-07-18 |
Asm Ip Holding B.V. |
Method for forming aluminum nitride-based film by PEALD
|
|
US10504700B2
(en)
|
2015-08-27 |
2019-12-10 |
Applied Materials, Inc. |
Plasma etching systems and methods with secondary plasma injection
|
|
US9960072B2
(en)
|
2015-09-29 |
2018-05-01 |
Asm Ip Holding B.V. |
Variable adjustment for precise matching of multiple chamber cavity housings
|
|
CN108140550B
(zh)
|
2015-10-08 |
2022-10-14 |
应用材料公司 |
具有减少的背侧等离子体点火的喷淋头
|
|
US9909214B2
(en)
|
2015-10-15 |
2018-03-06 |
Asm Ip Holding B.V. |
Method for depositing dielectric film in trenches by PEALD
|
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
|
KR102481166B1
(ko)
|
2015-10-30 |
2022-12-27 |
삼성전자주식회사 |
식각 후처리 방법
|
|
US10322384B2
(en)
|
2015-11-09 |
2019-06-18 |
Asm Ip Holding B.V. |
Counter flow mixer for process chamber
|
|
US9455138B1
(en)
|
2015-11-10 |
2016-09-27 |
Asm Ip Holding B.V. |
Method for forming dielectric film in trenches by PEALD using H-containing gas
|
|
US9905420B2
(en)
|
2015-12-01 |
2018-02-27 |
Asm Ip Holding B.V. |
Methods of forming silicon germanium tin films and structures and devices including the films
|
|
US10208380B2
(en)
*
|
2015-12-04 |
2019-02-19 |
Applied Materials, Inc. |
Advanced coating method and materials to prevent HDP-CVD chamber arcing
|
|
US20170178758A1
(en)
*
|
2015-12-18 |
2017-06-22 |
Applied Materials, Inc. |
Uniform wafer temperature achievement in unsymmetric chamber environment
|
|
US9607837B1
(en)
|
2015-12-21 |
2017-03-28 |
Asm Ip Holding B.V. |
Method for forming silicon oxide cap layer for solid state diffusion process
|
|
US9735024B2
(en)
|
2015-12-28 |
2017-08-15 |
Asm Ip Holding B.V. |
Method of atomic layer etching using functional group-containing fluorocarbon
|
|
US9627221B1
(en)
|
2015-12-28 |
2017-04-18 |
Asm Ip Holding B.V. |
Continuous process incorporating atomic layer etching
|
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
|
US10468251B2
(en)
|
2016-02-19 |
2019-11-05 |
Asm Ip Holding B.V. |
Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
|
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US9754779B1
(en)
|
2016-02-19 |
2017-09-05 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US10501866B2
(en)
|
2016-03-09 |
2019-12-10 |
Asm Ip Holding B.V. |
Gas distribution apparatus for improved film uniformity in an epitaxial system
|
|
JP6527482B2
(ja)
*
|
2016-03-14 |
2019-06-05 |
東芝デバイス＆ストレージ株式会社 |
半導体製造装置
|
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
|
US9892913B2
(en)
|
2016-03-24 |
2018-02-13 |
Asm Ip Holding B.V. |
Radial and thickness control via biased multi-port injection settings
|
|
US10770272B2
(en)
*
|
2016-04-11 |
2020-09-08 |
Applied Materials, Inc. |
Plasma-enhanced anneal chamber for wafer outgassing
|
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
|
US10087522B2
(en)
|
2016-04-21 |
2018-10-02 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
|
US11326253B2
(en)
|
2016-04-27 |
2022-05-10 |
Applied Materials, Inc. |
Atomic layer deposition of protective coatings for semiconductor process chamber components
|
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
|
US10032628B2
(en)
|
2016-05-02 |
2018-07-24 |
Asm Ip Holding B.V. |
Source/drain performance through conformal solid state doping
|
|
KR102592471B1
(ko)
|
2016-05-17 |
2023-10-20 |
에이에스엠 아이피 홀딩 비.브이. |
금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
|
|
US10504754B2
(en)
|
2016-05-19 |
2019-12-10 |
Applied Materials, Inc. |
Systems and methods for improved semiconductor etching and component protection
|
|
US10522371B2
(en)
|
2016-05-19 |
2019-12-31 |
Applied Materials, Inc. |
Systems and methods for improved semiconductor etching and component protection
|
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
|
US10388509B2
(en)
|
2016-06-28 |
2019-08-20 |
Asm Ip Holding B.V. |
Formation of epitaxial layers via dislocation filtering
|
|
US9865484B1
(en)
|
2016-06-29 |
2018-01-09 |
Applied Materials, Inc. |
Selective etch using material modification and RF pulsing
|
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
|
US9793135B1
(en)
|
2016-07-14 |
2017-10-17 |
ASM IP Holding B.V |
Method of cyclic dry etching using etchant film
|
|
US10714385B2
(en)
|
2016-07-19 |
2020-07-14 |
Asm Ip Holding B.V. |
Selective deposition of tungsten
|
|
KR102354490B1
(ko)
|
2016-07-27 |
2022-01-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
US10177025B2
(en)
|
2016-07-28 |
2019-01-08 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US10395919B2
(en)
|
2016-07-28 |
2019-08-27 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
TW201825623A
(zh)
|
2016-08-30 |
2018-07-16 |
美商康寧公司 |
用於片材接合的矽氧烷電漿聚合物
|
|
TWI821867B
(zh)
|
2016-08-31 |
2023-11-11 |
美商康寧公司 |
具以可控制式黏結的薄片之製品及製作其之方法
|
|
US10090316B2
(en)
|
2016-09-01 |
2018-10-02 |
Asm Ip Holding B.V. |
3D stacked multilayer semiconductor memory using doped select transistor channel
|
|
US10629473B2
(en)
|
2016-09-09 |
2020-04-21 |
Applied Materials, Inc. |
Footing removal for nitride spacer
|
|
US10062575B2
(en)
|
2016-09-09 |
2018-08-28 |
Applied Materials, Inc. |
Poly directional etch by oxidation
|
|
US9934942B1
(en)
|
2016-10-04 |
2018-04-03 |
Applied Materials, Inc. |
Chamber with flow-through source
|
|
US10546729B2
(en)
|
2016-10-04 |
2020-01-28 |
Applied Materials, Inc. |
Dual-channel showerhead with improved profile
|
|
US10062585B2
(en)
|
2016-10-04 |
2018-08-28 |
Applied Materials, Inc. |
Oxygen compatible plasma source
|
|
US10062579B2
(en)
|
2016-10-07 |
2018-08-28 |
Applied Materials, Inc. |
Selective SiN lateral recess
|
|
US9947549B1
(en)
|
2016-10-10 |
2018-04-17 |
Applied Materials, Inc. |
Cobalt-containing material removal
|
|
US10410943B2
(en)
|
2016-10-13 |
2019-09-10 |
Asm Ip Holding B.V. |
Method for passivating a surface of a semiconductor and related systems
|
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
US10643904B2
(en)
|
2016-11-01 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for forming a semiconductor device and related semiconductor device structures
|
|
US10435790B2
(en)
|
2016-11-01 |
2019-10-08 |
Asm Ip Holding B.V. |
Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
|
|
US10134757B2
(en)
|
2016-11-07 |
2018-11-20 |
Asm Ip Holding B.V. |
Method of processing a substrate and a device manufactured by using the method
|
|
US10403476B2
(en)
|
2016-11-09 |
2019-09-03 |
Lam Research Corporation |
Active showerhead
|
|
US10163696B2
(en)
|
2016-11-11 |
2018-12-25 |
Applied Materials, Inc. |
Selective cobalt removal for bottom up gapfill
|
|
US9768034B1
(en)
|
2016-11-11 |
2017-09-19 |
Applied Materials, Inc. |
Removal methods for high aspect ratio structures
|
|
US10026621B2
(en)
|
2016-11-14 |
2018-07-17 |
Applied Materials, Inc. |
SiN spacer profile patterning
|
|
US10242908B2
(en)
|
2016-11-14 |
2019-03-26 |
Applied Materials, Inc. |
Airgap formation with damage-free copper
|
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
|
US10340135B2
(en)
|
2016-11-28 |
2019-07-02 |
Asm Ip Holding B.V. |
Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
|
|
US10954596B2
(en)
*
|
2016-12-08 |
2021-03-23 |
Applied Materials, Inc. |
Temporal atomic layer deposition process chamber
|
|
KR102762543B1
(ko)
|
2016-12-14 |
2025-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US10604841B2
(en)
|
2016-12-14 |
2020-03-31 |
Lam Research Corporation |
Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
|
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
|
US9916980B1
(en)
|
2016-12-15 |
2018-03-13 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
KR102700194B1
(ko)
|
2016-12-19 |
2024-08-28 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
US10566206B2
(en)
|
2016-12-27 |
2020-02-18 |
Applied Materials, Inc. |
Systems and methods for anisotropic material breakthrough
|
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
JP6899217B2
(ja)
*
|
2016-12-28 |
2021-07-07 |
株式会社Ｓｃｒｅｅｎホールディングス |
基板処理装置、基板処理方法および基板処理システム
|
|
US10573498B2
(en)
*
|
2017-01-09 |
2020-02-25 |
Applied Materials, Inc. |
Substrate processing apparatus including annular lamp assembly
|
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
|
US10431429B2
(en)
|
2017-02-03 |
2019-10-01 |
Applied Materials, Inc. |
Systems and methods for radial and azimuthal control of plasma uniformity
|
|
US10403507B2
(en)
|
2017-02-03 |
2019-09-03 |
Applied Materials, Inc. |
Shaped etch profile with oxidation
|
|
US10043684B1
(en)
|
2017-02-06 |
2018-08-07 |
Applied Materials, Inc. |
Self-limiting atomic thermal etching systems and methods
|
|
US10319739B2
(en)
|
2017-02-08 |
2019-06-11 |
Applied Materials, Inc. |
Accommodating imperfectly aligned memory holes
|
|
US10655221B2
(en)
|
2017-02-09 |
2020-05-19 |
Asm Ip Holding B.V. |
Method for depositing oxide film by thermal ALD and PEALD
|
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10943834B2
(en)
|
2017-03-13 |
2021-03-09 |
Applied Materials, Inc. |
Replacement contact process
|
|
US10283353B2
(en)
|
2017-03-29 |
2019-05-07 |
Asm Ip Holding B.V. |
Method of reforming insulating film deposited on substrate with recess pattern
|
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10103040B1
(en)
|
2017-03-31 |
2018-10-16 |
Asm Ip Holding B.V. |
Apparatus and method for manufacturing a semiconductor device
|
|
USD830981S1
(en)
|
2017-04-07 |
2018-10-16 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate processing apparatus
|
|
US10319649B2
(en)
|
2017-04-11 |
2019-06-11 |
Applied Materials, Inc. |
Optical emission spectroscopy (OES) for remote plasma monitoring
|
|
CN106967961A
(zh)
*
|
2017-04-14 |
2017-07-21 |
王宏兴 |
一种去除cvd反应腔体内壁沉积膜的方法
|
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
CN118979237A
(zh)
*
|
2017-04-28 |
2024-11-19 |
应用材料公司 |
用于清洁在制造oled装置中使用的真空系统的方法、用于在基板上真空沉积来制造oled装置的方法及设备
|
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10446393B2
(en)
|
2017-05-08 |
2019-10-15 |
Asm Ip Holding B.V. |
Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
|
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
JP7176860B6
(ja)
|
2017-05-17 |
2022-12-16 |
アプライド マテリアルズ インコーポレイテッド |
前駆体の流れを改善する半導体処理チャンバ
|
|
US11276590B2
(en)
|
2017-05-17 |
2022-03-15 |
Applied Materials, Inc. |
Multi-zone semiconductor substrate supports
|
|
US11276559B2
(en)
|
2017-05-17 |
2022-03-15 |
Applied Materials, Inc. |
Semiconductor processing chamber for multiple precursor flow
|
|
US10049891B1
(en)
|
2017-05-31 |
2018-08-14 |
Applied Materials, Inc. |
Selective in situ cobalt residue removal
|
|
US10497579B2
(en)
|
2017-05-31 |
2019-12-03 |
Applied Materials, Inc. |
Water-free etching methods
|
|
US10504742B2
(en)
|
2017-05-31 |
2019-12-10 |
Asm Ip Holding B.V. |
Method of atomic layer etching using hydrogen plasma
|
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
|
US12076763B2
(en)
|
2017-06-05 |
2024-09-03 |
Applied Materials, Inc. |
Selective in-situ cleaning of high-k films from processing chamber using reactive gas precursor
|
|
US11380557B2
(en)
*
|
2017-06-05 |
2022-07-05 |
Applied Materials, Inc. |
Apparatus and method for gas delivery in semiconductor process chambers
|
|
US20180347037A1
(en)
*
|
2017-06-05 |
2018-12-06 |
Applied Materials, Inc. |
Selective in-situ cleaning of high-k films from processing chamber using reactive gas precursor
|
|
US10920320B2
(en)
|
2017-06-16 |
2021-02-16 |
Applied Materials, Inc. |
Plasma health determination in semiconductor substrate processing reactors
|
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
|
US10541246B2
(en)
|
2017-06-26 |
2020-01-21 |
Applied Materials, Inc. |
3D flash memory cells which discourage cross-cell electrical tunneling
|
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
|
US10685834B2
(en)
|
2017-07-05 |
2020-06-16 |
Asm Ip Holdings B.V. |
Methods for forming a silicon germanium tin layer and related semiconductor device structures
|
|
US10177017B1
(en)
*
|
2017-07-05 |
2019-01-08 |
Applied Materials, Inc. |
Method for conditioning a processing chamber for steady etching rate control
|
|
US10727080B2
(en)
|
2017-07-07 |
2020-07-28 |
Applied Materials, Inc. |
Tantalum-containing material removal
|
|
US10541184B2
(en)
|
2017-07-11 |
2020-01-21 |
Applied Materials, Inc. |
Optical emission spectroscopic techniques for monitoring etching
|
|
US10354889B2
(en)
|
2017-07-17 |
2019-07-16 |
Applied Materials, Inc. |
Non-halogen etching of silicon-containing materials
|
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
|
US10312055B2
(en)
|
2017-07-26 |
2019-06-04 |
Asm Ip Holding B.V. |
Method of depositing film by PEALD using negative bias
|
|
US10605530B2
(en)
|
2017-07-26 |
2020-03-31 |
Asm Ip Holding B.V. |
Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
|
|
US10043674B1
(en)
|
2017-08-04 |
2018-08-07 |
Applied Materials, Inc. |
Germanium etching systems and methods
|
|
TWI815813B
(zh)
|
2017-08-04 |
2023-09-21 |
荷蘭商Ａｓｍ智慧財產控股公司 |
用於分配反應腔內氣體的噴頭總成
|
|
US10297458B2
(en)
|
2017-08-07 |
2019-05-21 |
Applied Materials, Inc. |
Process window widening using coated parts in plasma etch processes
|
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US10249524B2
(en)
|
2017-08-09 |
2019-04-02 |
Asm Ip Holding B.V. |
Cassette holder assembly for a substrate cassette and holding member for use in such assembly
|
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
KR102659516B1
(ko)
|
2017-08-18 |
2024-04-23 |
코닝 인코포레이티드 |
유리 적층체
|
|
US10236177B1
(en)
|
2017-08-22 |
2019-03-19 |
ASM IP Holding B.V.. |
Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
|
|
USD900036S1
(en)
|
2017-08-24 |
2020-10-27 |
Asm Ip Holding B.V. |
Heater electrical connector and adapter
|
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
|
KR102401446B1
(ko)
|
2017-08-31 |
2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
KR20200039827A
(ko)
*
|
2017-09-11 |
2020-04-16 |
어플라이드 머티어리얼스, 인코포레이티드 |
반응성 가스 전구체를 사용한 프로세싱 챔버로부터의 하이-k 막들의 선택적 인-시튜 세정
|
|
US10607895B2
(en)
|
2017-09-18 |
2020-03-31 |
Asm Ip Holdings B.V. |
Method for forming a semiconductor device structure comprising a gate fill metal
|
|
KR102630301B1
(ko)
|
2017-09-21 |
2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
|
US10319588B2
(en)
|
2017-10-10 |
2019-06-11 |
Asm Ip Holding B.V. |
Method for depositing a metal chalcogenide on a substrate by cyclical deposition
|
|
US10283324B1
(en)
|
2017-10-24 |
2019-05-07 |
Applied Materials, Inc. |
Oxygen treatment for nitride etching
|
|
US10128086B1
(en)
|
2017-10-24 |
2018-11-13 |
Applied Materials, Inc. |
Silicon pretreatment for nitride removal
|
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
|
KR102443047B1
(ko)
|
2017-11-16 |
2022-09-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 방법 및 그에 의해 제조된 장치
|
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
|
TWI791689B
(zh)
|
2017-11-27 |
2023-02-11 |
荷蘭商Ａｓｍ智慧財產控股私人有限公司 |
包括潔淨迷你環境之裝置
|
|
CN111316417B
(zh)
|
2017-11-27 |
2023-12-22 |
阿斯莫Ip控股公司 |
与批式炉偕同使用的用于储存晶圆匣的储存装置
|
|
US10290508B1
(en)
|
2017-12-05 |
2019-05-14 |
Asm Ip Holding B.V. |
Method for forming vertical spacers for spacer-defined patterning
|
|
WO2019113478A1
(en)
|
2017-12-08 |
2019-06-13 |
Lam Research Corporation |
Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
|
|
US10256112B1
(en)
|
2017-12-08 |
2019-04-09 |
Applied Materials, Inc. |
Selective tungsten removal
|
|
WO2019118660A1
(en)
*
|
2017-12-15 |
2019-06-20 |
Corning Incorporated |
Method for treating a substrate and method for making articles comprising bonded sheets
|
|
US10903054B2
(en)
|
2017-12-19 |
2021-01-26 |
Applied Materials, Inc. |
Multi-zone gas distribution systems and methods
|
|
US11328909B2
(en)
|
2017-12-22 |
2022-05-10 |
Applied Materials, Inc. |
Chamber conditioning and removal processes
|
|
US10854426B2
(en)
|
2018-01-08 |
2020-12-01 |
Applied Materials, Inc. |
Metal recess for semiconductor structures
|
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
|
TWI852426B
(zh)
|
2018-01-19 |
2024-08-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
沈積方法
|
|
CN111630203A
(zh)
|
2018-01-19 |
2020-09-04 |
Asm Ip私人控股有限公司 |
通过等离子体辅助沉积来沉积间隙填充层的方法
|
|
USD903477S1
(en)
|
2018-01-24 |
2020-12-01 |
Asm Ip Holdings B.V. |
Metal clamp
|
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
|
US10535516B2
(en)
|
2018-02-01 |
2020-01-14 |
Asm Ip Holdings B.V. |
Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
|
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
|
CN116732497B
(zh)
|
2018-02-14 |
2025-06-17 |
Asmip私人控股有限公司 |
通过循环沉积工艺在衬底上沉积含钌膜的方法
|
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10679870B2
(en)
|
2018-02-15 |
2020-06-09 |
Applied Materials, Inc. |
Semiconductor processing chamber multistage mixing apparatus
|
|
US10964512B2
(en)
|
2018-02-15 |
2021-03-30 |
Applied Materials, Inc. |
Semiconductor processing chamber multistage mixing apparatus and methods
|
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
|
US10658181B2
(en)
|
2018-02-20 |
2020-05-19 |
Asm Ip Holding B.V. |
Method of spacer-defined direct patterning in semiconductor fabrication
|
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
|
TWI716818B
(zh)
|
2018-02-28 |
2021-01-21 |
美商應用材料股份有限公司 |
形成氣隙的系統及方法
|
|
US10593560B2
(en)
|
2018-03-01 |
2020-03-17 |
Applied Materials, Inc. |
Magnetic induction plasma source for semiconductor processes and equipment
|
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
|
US10319600B1
(en)
|
2018-03-12 |
2019-06-11 |
Applied Materials, Inc. |
Thermal silicon etch
|
|
US10497573B2
(en)
|
2018-03-13 |
2019-12-03 |
Applied Materials, Inc. |
Selective atomic layer etching of semiconductor materials
|
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
|
US10510536B2
(en)
|
2018-03-29 |
2019-12-17 |
Asm Ip Holding B.V. |
Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
|
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
|
KR102501472B1
(ko)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
US10573527B2
(en)
|
2018-04-06 |
2020-02-25 |
Applied Materials, Inc. |
Gas-phase selective etching systems and methods
|
|
KR102600229B1
(ko)
|
2018-04-09 |
2023-11-10 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 장치, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
|
|
US10490406B2
(en)
|
2018-04-10 |
2019-11-26 |
Appled Materials, Inc. |
Systems and methods for material breakthrough
|
|
US10699879B2
(en)
|
2018-04-17 |
2020-06-30 |
Applied Materials, Inc. |
Two piece electrode assembly with gap for plasma control
|
|
US10886137B2
(en)
|
2018-04-30 |
2021-01-05 |
Applied Materials, Inc. |
Selective nitride removal
|
|
US12025484B2
(en)
|
2018-05-08 |
2024-07-02 |
Asm Ip Holding B.V. |
Thin film forming method
|
|
TWI811348B
(zh)
|
2018-05-08 |
2023-08-11 |
荷蘭商Ａｓｍ 智慧財產控股公司 |
藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構
|
|
US12272527B2
(en)
|
2018-05-09 |
2025-04-08 |
Asm Ip Holding B.V. |
Apparatus for use with hydrogen radicals and method of using same
|
|
KR20190129718A
(ko)
|
2018-05-11 |
2019-11-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 피도핑 금속 탄화물 막을 형성하는 방법 및 관련 반도체 소자 구조
|
|
JP7126381B2
(ja)
*
|
2018-05-21 |
2022-08-26 |
東京エレクトロン株式会社 |
成膜装置および成膜方法
|
|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
|
TWI840362B
(zh)
|
2018-06-04 |
2024-05-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
水氣降低的晶圓處置腔室
|
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
|
CN120591748A
(zh)
|
2018-06-27 |
2025-09-05 |
Asm Ip私人控股有限公司 |
用于形成含金属的材料的循环沉积方法及膜和结构
|
|
CN112292478A
(zh)
|
2018-06-27 |
2021-01-29 |
Asm Ip私人控股有限公司 |
用于形成含金属的材料的循环沉积方法及包含含金属的材料的膜和结构
|
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
|
KR102686758B1
(ko)
|
2018-06-29 |
2024-07-18 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US10872778B2
(en)
|
2018-07-06 |
2020-12-22 |
Applied Materials, Inc. |
Systems and methods utilizing solid-phase etchants
|
|
US10755941B2
(en)
|
2018-07-06 |
2020-08-25 |
Applied Materials, Inc. |
Self-limiting selective etching systems and methods
|
|
US10767789B2
(en)
|
2018-07-16 |
2020-09-08 |
Asm Ip Holding B.V. |
Diaphragm valves, valve components, and methods for forming valve components
|
|
US10672642B2
(en)
|
2018-07-24 |
2020-06-02 |
Applied Materials, Inc. |
Systems and methods for pedestal configuration
|
|
US10483099B1
(en)
|
2018-07-26 |
2019-11-19 |
Asm Ip Holding B.V. |
Method for forming thermally stable organosilicon polymer film
|
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
|
JP7225599B2
(ja)
*
|
2018-08-10 |
2023-02-21 |
東京エレクトロン株式会社 |
成膜装置
|
|
US10829852B2
(en)
|
2018-08-16 |
2020-11-10 |
Asm Ip Holding B.V. |
Gas distribution device for a wafer processing apparatus
|
|
KR102700279B1
(ko)
*
|
2018-08-22 |
2024-08-28 |
도쿄엘렉트론가부시키가이샤 |
기판 처리 방법 및 기판 처리 장치
|
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
JP2020033625A
(ja)
|
2018-08-31 |
2020-03-05 |
東京エレクトロン株式会社 |
成膜装置及び成膜方法
|
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102707956B1
(ko)
|
2018-09-11 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
|
US11049755B2
(en)
|
2018-09-14 |
2021-06-29 |
Applied Materials, Inc. |
Semiconductor substrate supports with embedded RF shield
|
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
|
US11834743B2
(en)
*
|
2018-09-14 |
2023-12-05 |
Applied Materials, Inc. |
Segmented showerhead for uniform delivery of multiple precursors
|
|
US10892198B2
(en)
|
2018-09-14 |
2021-01-12 |
Applied Materials, Inc. |
Systems and methods for improved performance in semiconductor processing
|
|
US11062887B2
(en)
|
2018-09-17 |
2021-07-13 |
Applied Materials, Inc. |
High temperature RF heater pedestals
|
|
US11417534B2
(en)
|
2018-09-21 |
2022-08-16 |
Applied Materials, Inc. |
Selective material removal
|
|
CN110970344B
(zh)
|
2018-10-01 |
2024-10-25 |
Asmip控股有限公司 |
衬底保持设备、包含所述设备的系统及其使用方法
|
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
|
US11682560B2
(en)
|
2018-10-11 |
2023-06-20 |
Applied Materials, Inc. |
Systems and methods for hafnium-containing film removal
|
|
US10847365B2
(en)
|
2018-10-11 |
2020-11-24 |
Asm Ip Holding B.V. |
Method of forming conformal silicon carbide film by cyclic CVD
|
|
US10811256B2
(en)
|
2018-10-16 |
2020-10-20 |
Asm Ip Holding B.V. |
Method for etching a carbon-containing feature
|
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
|
KR102605121B1
(ko)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
|
US11121002B2
(en)
|
2018-10-24 |
2021-09-14 |
Applied Materials, Inc. |
Systems and methods for etching metals and metal derivatives
|
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
|
US10381219B1
(en)
|
2018-10-25 |
2019-08-13 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film
|
|
US12378665B2
(en)
|
2018-10-26 |
2025-08-05 |
Asm Ip Holding B.V. |
High temperature coatings for a preclean and etch apparatus and related methods
|
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
|
KR102748291B1
(ko)
|
2018-11-02 |
2024-12-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
|
JP6852040B2
(ja)
*
|
2018-11-16 |
2021-03-31 |
大陽日酸株式会社 |
半導体製造装置部品の洗浄装置、半導体製造装置部品の洗浄方法、及び半導体製造装置部品の洗浄システム
|
|
US10559458B1
(en)
|
2018-11-26 |
2020-02-11 |
Asm Ip Holding B.V. |
Method of forming oxynitride film
|
|
US11437242B2
(en)
|
2018-11-27 |
2022-09-06 |
Applied Materials, Inc. |
Selective removal of silicon-containing materials
|
|
US12040199B2
(en)
|
2018-11-28 |
2024-07-16 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
|
KR20210092837A
(ko)
*
|
2018-12-13 |
2021-07-26 |
램 리써치 코포레이션 |
워크피스 프로세싱 챔버를 위한 컴포넌트 부품들의 다층 코팅들
|
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
|
TWI874340B
(zh)
|
2018-12-14 |
2025-03-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成裝置結構之方法、其所形成之結構及施行其之系統
|
|
US11721527B2
(en)
|
2019-01-07 |
2023-08-08 |
Applied Materials, Inc. |
Processing chamber mixing systems
|
|
US10920319B2
(en)
|
2019-01-11 |
2021-02-16 |
Applied Materials, Inc. |
Ceramic showerheads with conductive electrodes
|
|
TWI819180B
(zh)
|
2019-01-17 |
2023-10-21 |
荷蘭商Ａｓｍ 智慧財產控股公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
|
KR102727227B1
(ko)
|
2019-01-22 |
2024-11-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
|
JP7603377B2
(ja)
|
2019-02-20 |
2024-12-20 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための方法および装置
|
|
TWI838458B
(zh)
|
2019-02-20 |
2024-04-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於3d nand應用中之插塞填充沉積之設備及方法
|
|
JP7509548B2
(ja)
|
2019-02-20 |
2024-07-02 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基材表面内に形成された凹部を充填するための周期的堆積方法および装置
|
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
|
TWI842826B
(zh)
|
2019-02-22 |
2024-05-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基材處理設備及處理基材之方法
|
|
KR102198929B1
(ko)
*
|
2019-02-28 |
2021-01-06 |
세메스 주식회사 |
기판 처리 장치의 가스 공급 유닛
|
|
KR102782593B1
(ko)
|
2019-03-08 |
2025-03-14 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 층을 포함한 구조체 및 이의 형성 방법
|
|
US11742198B2
(en)
|
2019-03-08 |
2023-08-29 |
Asm Ip Holding B.V. |
Structure including SiOCN layer and method of forming same
|
|
KR102858005B1
(ko)
|
2019-03-08 |
2025-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
|
|
JP2020167398A
(ja)
|
2019-03-28 |
2020-10-08 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ドアオープナーおよびドアオープナーが提供される基材処理装置
|
|
KR102809999B1
(ko)
|
2019-04-01 |
2025-05-19 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자를 제조하는 방법
|
|
US11447864B2
(en)
|
2019-04-19 |
2022-09-20 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
|
KR20200125453A
(ko)
|
2019-04-24 |
2020-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
기상 반응기 시스템 및 이를 사용하는 방법
|
|
CN110117779A
(zh)
*
|
2019-04-30 |
2019-08-13 |
信利(仁寿)高端显示科技有限公司 |
一种真空镀膜装置内部件的再生方法及装置
|
|
KR20200130121A
(ko)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
딥 튜브가 있는 화학물질 공급원 용기
|
|
KR102869364B1
(ko)
|
2019-05-07 |
2025-10-10 |
에이에스엠 아이피 홀딩 비.브이. |
비정질 탄소 중합체 막을 개질하는 방법
|
|
KR20200130652A
(ko)
|
2019-05-10 |
2020-11-19 |
에이에스엠 아이피 홀딩 비.브이. |
표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
|
|
US11798803B2
(en)
*
|
2019-05-15 |
2023-10-24 |
Applied Materials, Inc. |
Dynamic multi zone flow control for a processing system
|
|
JP7612342B2
(ja)
|
2019-05-16 |
2025-01-14 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
|
JP7598201B2
(ja)
|
2019-05-16 |
2024-12-11 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
ウェハボートハンドリング装置、縦型バッチ炉および方法
|
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
Asm Ip Holding B.V. |
Susceptor shaft
|
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
Asm Ip Holding B.V. |
Susceptor shaft
|
|
USD935572S1
(en)
|
2019-05-24 |
2021-11-09 |
Asm Ip Holding B.V. |
Gas channel plate
|
|
USD922229S1
(en)
|
2019-06-05 |
2021-06-15 |
Asm Ip Holding B.V. |
Device for controlling a temperature of a gas supply unit
|
|
KR20200141003A
(ko)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
가스 감지기를 포함하는 기상 반응기 시스템
|
|
KR20200141931A
(ko)
*
|
2019-06-10 |
2020-12-21 |
에이에스엠 아이피 홀딩 비.브이. |
석영 에피택셜 챔버를 세정하는 방법
|
|
KR20200143254A
(ko)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
|
|
USD944946S1
(en)
|
2019-06-14 |
2022-03-01 |
Asm Ip Holding B.V. |
Shower plate
|
|
USD931978S1
(en)
|
2019-06-27 |
2021-09-28 |
Asm Ip Holding B.V. |
Showerhead vacuum transport
|
|
KR20210005515A
(ko)
|
2019-07-03 |
2021-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
|
|
JP7499079B2
(ja)
|
2019-07-09 |
2024-06-13 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
同軸導波管を用いたプラズマ装置、基板処理方法
|
|
CN112216646A
(zh)
|
2019-07-10 |
2021-01-12 |
Asm Ip私人控股有限公司 |
基板支撑组件及包括其的基板处理装置
|
|
CN112242318A
(zh)
|
2019-07-16 |
2021-01-19 |
Asm Ip私人控股有限公司 |
基板处理装置
|
|
KR102860110B1
(ko)
|
2019-07-17 |
2025-09-16 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 게르마늄 구조를 형성하는 방법
|
|
KR20210010816A
(ko)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
라디칼 보조 점화 플라즈마 시스템 및 방법
|
|
US11643724B2
(en)
|
2019-07-18 |
2023-05-09 |
Asm Ip Holding B.V. |
Method of forming structures using a neutral beam
|
|
TWI839544B
(zh)
|
2019-07-19 |
2024-04-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成形貌受控的非晶碳聚合物膜之方法
|
|
CN112242295B
(zh)
|
2019-07-19 |
2025-12-09 |
Asmip私人控股有限公司 |
形成拓扑受控的无定形碳聚合物膜的方法
|
|
CN112309843A
(zh)
|
2019-07-29 |
2021-02-02 |
Asm Ip私人控股有限公司 |
实现高掺杂剂掺入的选择性沉积方法
|
|
KR20210015655A
(ko)
|
2019-07-30 |
2021-02-10 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 방법
|
|
CN112309899B
(zh)
|
2019-07-30 |
2025-11-14 |
Asmip私人控股有限公司 |
基板处理设备
|
|
CN112309900B
(zh)
|
2019-07-30 |
2025-11-04 |
Asmip私人控股有限公司 |
基板处理设备
|
|
US11227782B2
(en)
|
2019-07-31 |
2022-01-18 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
|
US11587815B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
|
US12359313B2
(en)
*
|
2019-07-31 |
2025-07-15 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Deposition apparatus and method of forming metal oxide layer using the same
|
|
US11587814B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
|
CN118422165A
(zh)
|
2019-08-05 |
2024-08-02 |
Asm Ip私人控股有限公司 |
用于化学源容器的液位传感器
|
|
CN112342526A
(zh)
|
2019-08-09 |
2021-02-09 |
Asm Ip私人控股有限公司 |
包括冷却装置的加热器组件及其使用方法
|
|
US11348784B2
(en)
|
2019-08-12 |
2022-05-31 |
Beijing E-Town Semiconductor Technology Co., Ltd |
Enhanced ignition in inductively coupled plasmas for workpiece processing
|
|
USD965524S1
(en)
|
2019-08-19 |
2022-10-04 |
Asm Ip Holding B.V. |
Susceptor support
|
|
USD965044S1
(en)
|
2019-08-19 |
2022-09-27 |
Asm Ip Holding B.V. |
Susceptor shaft
|
|
JP2021031769A
(ja)
|
2019-08-21 |
2021-03-01 |
エーエスエム アイピー ホールディング ビー．ブイ． |
成膜原料混合ガス生成装置及び成膜装置
|
|
KR20210024423A
(ko)
|
2019-08-22 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
홀을 구비한 구조체를 형성하기 위한 방법
|
|
USD979506S1
(en)
|
2019-08-22 |
2023-02-28 |
Asm Ip Holding B.V. |
Insulator
|
|
USD949319S1
(en)
|
2019-08-22 |
2022-04-19 |
Asm Ip Holding B.V. |
Exhaust duct
|
|
USD930782S1
(en)
|
2019-08-22 |
2021-09-14 |
Asm Ip Holding B.V. |
Gas distributor
|
|
USD940837S1
(en)
|
2019-08-22 |
2022-01-11 |
Asm Ip Holding B.V. |
Electrode
|
|
KR20210024420A
(ko)
|
2019-08-23 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법
|
|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
|
WO2021042116A1
(en)
|
2019-08-23 |
2021-03-04 |
Lam Research Corporation |
Thermally controlled chandelier showerhead
|
|
JP2022546404A
(ja)
|
2019-08-28 |
2022-11-04 |
ラム リサーチ コーポレーション |
金属の堆積
|
|
KR102806450B1
(ko)
|
2019-09-04 |
2025-05-12 |
에이에스엠 아이피 홀딩 비.브이. |
희생 캡핑 층을 이용한 선택적 증착 방법
|
|
KR102733104B1
(ko)
|
2019-09-05 |
2024-11-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US12469693B2
(en)
|
2019-09-17 |
2025-11-11 |
Asm Ip Holding B.V. |
Method of forming a carbon-containing layer and structure including the layer
|
|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
Substrate processing method
|
|
CN112593212B
(zh)
|
2019-10-02 |
2023-12-22 |
Asm Ip私人控股有限公司 |
通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法
|
|
TWI846953B
(zh)
|
2019-10-08 |
2024-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理裝置
|
|
KR20210042810A
(ko)
|
2019-10-08 |
2021-04-20 |
에이에스엠 아이피 홀딩 비.브이. |
활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법
|
|
TW202128273A
(zh)
|
2019-10-08 |
2021-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
氣體注入系統、及將材料沉積於反應室內之基板表面上的方法
|
|
TWI846966B
(zh)
|
2019-10-10 |
2024-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成光阻底層之方法及包括光阻底層之結構
|
|
US12009241B2
(en)
|
2019-10-14 |
2024-06-11 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly with detector to detect cassette
|
|
TWI834919B
(zh)
|
2019-10-16 |
2024-03-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
氧化矽之拓撲選擇性膜形成之方法
|
|
US11637014B2
(en)
|
2019-10-17 |
2023-04-25 |
Asm Ip Holding B.V. |
Methods for selective deposition of doped semiconductor material
|
|
KR102845724B1
(ko)
|
2019-10-21 |
2025-08-13 |
에이에스엠 아이피 홀딩 비.브이. |
막을 선택적으로 에칭하기 위한 장치 및 방법
|
|
KR20210050453A
(ko)
|
2019-10-25 |
2021-05-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조
|
|
US11646205B2
(en)
|
2019-10-29 |
2023-05-09 |
Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
|
US12080528B2
(en)
*
|
2019-11-01 |
2024-09-03 |
Lam Research Corporation |
Systems and methods for cleaning a showerhead
|
|
KR102890638B1
(ko)
|
2019-11-05 |
2025-11-25 |
에이에스엠 아이피 홀딩 비.브이. |
도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
|
|
US11501968B2
(en)
|
2019-11-15 |
2022-11-15 |
Asm Ip Holding B.V. |
Method for providing a semiconductor device with silicon filled gaps
|
|
KR102861314B1
(ko)
|
2019-11-20 |
2025-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
|
|
CN112951697B
(zh)
|
2019-11-26 |
2025-07-29 |
Asmip私人控股有限公司 |
基板处理设备
|
|
KR20210065848A
(ko)
|
2019-11-26 |
2021-06-04 |
에이에스엠 아이피 홀딩 비.브이. |
제1 유전체 표면과 제2 금속성 표면을 포함한 기판 상에 타겟 막을 선택적으로 형성하기 위한 방법
|
|
CN112885693B
(zh)
|
2019-11-29 |
2025-06-10 |
Asmip私人控股有限公司 |
基板处理设备
|
|
CN120998766A
(zh)
|
2019-11-29 |
2025-11-21 |
Asm Ip私人控股有限公司 |
基板处理设备
|
|
JP7527928B2
(ja)
|
2019-12-02 |
2024-08-05 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基板処理装置、基板処理方法
|
|
KR20210070898A
(ko)
|
2019-12-04 |
2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
JP7703317B2
(ja)
|
2019-12-17 |
2025-07-07 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化バナジウム層および窒化バナジウム層を含む構造体を形成する方法
|
|
US11527403B2
(en)
|
2019-12-19 |
2022-12-13 |
Asm Ip Holding B.V. |
Methods for filling a gap feature on a substrate surface and related semiconductor structures
|
|
KR20210089079A
(ko)
|
2020-01-06 |
2021-07-15 |
에이에스엠 아이피 홀딩 비.브이. |
채널형 리프트 핀
|
|
KR20210089077A
(ko)
|
2020-01-06 |
2021-07-15 |
에이에스엠 아이피 홀딩 비.브이. |
가스 공급 어셈블리, 이의 구성 요소, 및 이를 포함하는 반응기 시스템
|
|
US11993847B2
(en)
|
2020-01-08 |
2024-05-28 |
Asm Ip Holding B.V. |
Injector
|
|
IL294275B2
(en)
|
2020-01-10 |
2024-08-01 |
Kimberly Clark Co |
Method for preparing non-woven nets of uniform impregnated filament
|
|
KR102882467B1
(ko)
|
2020-01-16 |
2025-11-05 |
에이에스엠 아이피 홀딩 비.브이. |
고 종횡비 피처를 형성하는 방법
|
|
KR102675856B1
(ko)
|
2020-01-20 |
2024-06-17 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법 및 박막 표면 개질 방법
|
|
TWI889744B
(zh)
|
2020-01-29 |
2025-07-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
污染物捕集系統、及擋板堆疊
|
|
TWI871421B
(zh)
|
2020-02-03 |
2025-02-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
包括釩或銦層的裝置、結構及其形成方法、系統
|
|
KR20210100010A
(ko)
|
2020-02-04 |
2021-08-13 |
에이에스엠 아이피 홀딩 비.브이. |
대형 물품의 투과율 측정을 위한 방법 및 장치
|
|
US11776846B2
(en)
|
2020-02-07 |
2023-10-03 |
Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
|
JP7434973B2
(ja)
*
|
2020-02-07 |
2024-02-21 |
東京エレクトロン株式会社 |
シャワーヘッド及び基板処理装置
|
|
TW202146691A
(zh)
|
2020-02-13 |
2021-12-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
氣體分配總成、噴淋板總成、及調整至反應室之氣體的傳導率之方法
|
|
KR20210103956A
(ko)
|
2020-02-13 |
2021-08-24 |
에이에스엠 아이피 홀딩 비.브이. |
수광 장치를 포함하는 기판 처리 장치 및 수광 장치의 교정 방법
|
|
US11781243B2
(en)
|
2020-02-17 |
2023-10-10 |
Asm Ip Holding B.V. |
Method for depositing low temperature phosphorous-doped silicon
|
|
TWI895326B
(zh)
|
2020-02-28 |
2025-09-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
專用於零件清潔的系統
|
|
KR20210113043A
(ko)
|
2020-03-04 |
2021-09-15 |
에이에스엠 아이피 홀딩 비.브이. |
반응기 시스템용 정렬 고정구
|
|
KR20210116240A
(ko)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
조절성 접합부를 갖는 기판 핸들링 장치
|
|
KR20210116249A
(ko)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법
|
|
CN113394086A
(zh)
|
2020-03-12 |
2021-09-14 |
Asm Ip私人控股有限公司 |
用于制造具有目标拓扑轮廓的层结构的方法
|
|
US12173404B2
(en)
|
2020-03-17 |
2024-12-24 |
Asm Ip Holding B.V. |
Method of depositing epitaxial material, structure formed using the method, and system for performing the method
|
|
KR102755229B1
(ko)
|
2020-04-02 |
2025-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법
|
|
TWI887376B
(zh)
|
2020-04-03 |
2025-06-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
半導體裝置的製造方法
|
|
TWI888525B
(zh)
|
2020-04-08 |
2025-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於選擇性蝕刻氧化矽膜之設備及方法
|
|
KR20210127620A
(ko)
|
2020-04-13 |
2021-10-22 |
에이에스엠 아이피 홀딩 비.브이. |
질소 함유 탄소 막을 형성하는 방법 및 이를 수행하기 위한 시스템
|
|
US11821078B2
(en)
|
2020-04-15 |
2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
|
KR20210128343A
(ko)
|
2020-04-15 |
2021-10-26 |
에이에스엠 아이피 홀딩 비.브이. |
크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조
|
|
US11996289B2
(en)
|
2020-04-16 |
2024-05-28 |
Asm Ip Holding B.V. |
Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
|
|
TW202143328A
(zh)
|
2020-04-21 |
2021-11-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於調整膜應力之方法
|
|
TW202208671A
(zh)
|
2020-04-24 |
2022-03-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成包括硼化釩及磷化釩層的結構之方法
|
|
KR20210132600A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템
|
|
KR102866804B1
(ko)
|
2020-04-24 |
2025-09-30 |
에이에스엠 아이피 홀딩 비.브이. |
냉각 가스 공급부를 포함한 수직형 배치 퍼니스 어셈블리
|
|
KR20210132612A
(ko)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐 화합물들을 안정화하기 위한 방법들 및 장치
|
|
JP2021172884A
(ja)
|
2020-04-24 |
2021-11-01 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体
|
|
KR102783898B1
(ko)
|
2020-04-29 |
2025-03-18 |
에이에스엠 아이피 홀딩 비.브이. |
고체 소스 전구체 용기
|
|
KR20210134869A
(ko)
|
2020-05-01 |
2021-11-11 |
에이에스엠 아이피 홀딩 비.브이. |
Foup 핸들러를 이용한 foup의 빠른 교환
|
|
JP7726664B2
(ja)
|
2020-05-04 |
2025-08-20 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
基板を処理するための基板処理システム
|
|
KR20210137395A
(ko)
|
2020-05-07 |
2021-11-17 |
에이에스엠 아이피 홀딩 비.브이. |
불소계 라디칼을 이용하여 반응 챔버의 인시츄 식각을 수행하기 위한 장치 및 방법
|
|
JP7736446B2
(ja)
|
2020-05-07 |
2025-09-09 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
同調回路を備える反応器システム
|
|
CN111501024A
(zh)
*
|
2020-05-08 |
2020-08-07 |
Tcl华星光电技术有限公司 |
气相沉积装置
|
|
KR102788543B1
(ko)
|
2020-05-13 |
2025-03-27 |
에이에스엠 아이피 홀딩 비.브이. |
반응기 시스템용 레이저 정렬 고정구
|
|
TW202146699A
(zh)
|
2020-05-15 |
2021-12-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統
|
|
TW202147383A
(zh)
|
2020-05-19 |
2021-12-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基材處理設備
|
|
KR20210145079A
(ko)
|
2020-05-21 |
2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
기판을 처리하기 위한 플랜지 및 장치
|
|
KR102795476B1
(ko)
|
2020-05-21 |
2025-04-11 |
에이에스엠 아이피 홀딩 비.브이. |
다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
|
|
TWI873343B
(zh)
|
2020-05-22 |
2025-02-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於在基材上形成薄膜之反應系統
|
|
TW202212650A
(zh)
|
2020-05-26 |
2022-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
沉積含硼及鎵的矽鍺層之方法
|
|
TWI876048B
(zh)
|
2020-05-29 |
2025-03-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
TW202212620A
(zh)
|
2020-06-02 |
2022-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法
|
|
US11373845B2
(en)
*
|
2020-06-05 |
2022-06-28 |
Applied Materials, Inc. |
Methods and apparatus for symmetrical hollow cathode electrode and discharge mode for remote plasma processes
|
|
KR20210156219A
(ko)
|
2020-06-16 |
2021-12-24 |
에이에스엠 아이피 홀딩 비.브이. |
붕소를 함유한 실리콘 게르마늄 층을 증착하는 방법
|
|
US11646204B2
(en)
|
2020-06-24 |
2023-05-09 |
Asm Ip Holding B.V. |
Method for forming a layer provided with silicon
|
|
TWI873359B
(zh)
|
2020-06-30 |
2025-02-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
TWI896694B
(zh)
|
2020-07-01 |
2025-09-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
沉積方法、半導體結構、及沉積系統
|
|
KR102707957B1
(ko)
|
2020-07-08 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
TWI864307B
(zh)
|
2020-07-17 |
2024-12-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於光微影之結構、方法與系統
|
|
TWI878570B
(zh)
|
2020-07-20 |
2025-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於沉積鉬層之方法及系統
|
|
KR20220011092A
(ko)
|
2020-07-20 |
2022-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
전이 금속층을 포함하는 구조체를 형성하기 위한 방법 및 시스템
|
|
JP7475232B2
(ja)
*
|
2020-07-22 |
2024-04-26 |
株式会社ディスコ |
保護部材形成装置
|
|
US12322591B2
(en)
|
2020-07-27 |
2025-06-03 |
Asm Ip Holding B.V. |
Thin film deposition process
|
|
KR20220021863A
(ko)
|
2020-08-14 |
2022-02-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
US12040177B2
(en)
|
2020-08-18 |
2024-07-16 |
Asm Ip Holding B.V. |
Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
|
|
TW202228863A
(zh)
|
2020-08-25 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
清潔基板的方法、選擇性沉積的方法、及反應器系統
|
|
KR102855073B1
(ko)
|
2020-08-26 |
2025-09-03 |
에이에스엠 아이피 홀딩 비.브이. |
금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템
|
|
TW202229601A
(zh)
|
2020-08-27 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統
|
|
KR20220033997A
(ko)
|
2020-09-10 |
2022-03-17 |
에이에스엠 아이피 홀딩 비.브이. |
갭 충진 유체를 증착하기 위한 방법 그리고 이와 관련된 시스템 및 장치
|
|
USD990534S1
(en)
|
2020-09-11 |
2023-06-27 |
Asm Ip Holding B.V. |
Weighted lift pin
|
|
KR20220036866A
(ko)
|
2020-09-16 |
2022-03-23 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 산화물 증착 방법
|
|
USD1012873S1
(en)
|
2020-09-24 |
2024-01-30 |
Asm Ip Holding B.V. |
Electrode for semiconductor processing apparatus
|
|
TWI889903B
(zh)
|
2020-09-25 |
2025-07-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
US12009224B2
(en)
|
2020-09-29 |
2024-06-11 |
Asm Ip Holding B.V. |
Apparatus and method for etching metal nitrides
|
|
CN112317196A
(zh)
*
|
2020-09-30 |
2021-02-05 |
中国科学院长春光学精密机械与物理研究所 |
一种喷淋头清洁装置
|
|
KR20220045900A
(ko)
|
2020-10-06 |
2022-04-13 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 함유 재료를 증착하기 위한 증착 방법 및 장치
|
|
CN114293174A
(zh)
|
2020-10-07 |
2022-04-08 |
Asm Ip私人控股有限公司 |
气体供应单元和包括气体供应单元的衬底处理设备
|
|
TW202229613A
(zh)
|
2020-10-14 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
於階梯式結構上沉積材料的方法
|
|
KR102873665B1
(ko)
|
2020-10-15 |
2025-10-17 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자의 제조 방법, 및 ether-cat을 사용하는 기판 처리 장치
|
|
KR20220053482A
(ko)
|
2020-10-22 |
2022-04-29 |
에이에스엠 아이피 홀딩 비.브이. |
바나듐 금속을 증착하는 방법, 구조체, 소자 및 증착 어셈블리
|
|
TW202223136A
(zh)
|
2020-10-28 |
2022-06-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於在基板上形成層之方法、及半導體處理系統
|
|
JP7499678B2
(ja)
*
|
2020-11-02 |
2024-06-14 |
東京応化工業株式会社 |
半導体製造用プロセスチャンバのコンポーネントの洗浄用組成物及び洗浄方法
|
|
TW202229620A
(zh)
|
2020-11-12 |
2022-08-01 |
特文特大學 |
沉積系統、用於控制反應條件之方法、沉積方法
|
|
TW202229795A
(zh)
|
2020-11-23 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
具注入器之基板處理設備
|
|
TW202235649A
(zh)
|
2020-11-24 |
2022-09-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
填充間隙之方法與相關之系統及裝置
|
|
CN112626496B
(zh)
*
|
2020-11-24 |
2022-04-05 |
鑫天虹(厦门)科技有限公司 |
喷头组件与原子层沉积设备
|
|
US12488981B2
(en)
*
|
2020-11-25 |
2025-12-02 |
Applied Materials, Inc. |
Systems and methods for deposition residue control
|
|
KR20220076343A
(ko)
|
2020-11-30 |
2022-06-08 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치의 반응 챔버 내에 배열되도록 구성된 인젝터
|
|
US12255053B2
(en)
|
2020-12-10 |
2025-03-18 |
Asm Ip Holding B.V. |
Methods and systems for depositing a layer
|
|
TW202233884A
(zh)
|
2020-12-14 |
2022-09-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成臨限電壓控制用之結構的方法
|
|
CN114639631A
(zh)
|
2020-12-16 |
2022-06-17 |
Asm Ip私人控股有限公司 |
跳动和摆动测量固定装置
|
|
TW202232639A
(zh)
|
2020-12-18 |
2022-08-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
具有可旋轉台的晶圓處理設備
|
|
TW202242184A
(zh)
|
2020-12-22 |
2022-11-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
前驅物膠囊、前驅物容器、氣相沉積總成、及將固態前驅物裝載至前驅物容器中之方法
|
|
TW202226899A
(zh)
|
2020-12-22 |
2022-07-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
具匹配器的電漿處理裝置
|
|
TW202231903A
(zh)
|
2020-12-22 |
2022-08-16 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成
|
|
CN116724385A
(zh)
|
2020-12-28 |
2023-09-08 |
玛特森技术公司 |
具有热处理系统的工件处理装置
|
|
US11898245B2
(en)
|
2021-02-26 |
2024-02-13 |
Applied Materials, Inc. |
High throughput and metal contamination control oven for chamber component cleaning process
|
|
USD980813S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas flow control plate for substrate processing apparatus
|
|
USD1023959S1
(en)
|
2021-05-11 |
2024-04-23 |
Asm Ip Holding B.V. |
Electrode for substrate processing apparatus
|
|
USD981973S1
(en)
|
2021-05-11 |
2023-03-28 |
Asm Ip Holding B.V. |
Reactor wall for substrate processing apparatus
|
|
USD980814S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas distributor for substrate processing apparatus
|
|
KR20230032924A
(ko)
*
|
2021-08-31 |
2023-03-07 |
에이에스엠 아이피 홀딩 비.브이. |
억제제를 사용하는 갭 증착용 방법 및 시스템
|
|
USD990441S1
(en)
|
2021-09-07 |
2023-06-27 |
Asm Ip Holding B.V. |
Gas flow control plate
|
|
KR102647683B1
(ko)
|
2021-11-25 |
2024-03-13 |
세메스 주식회사 |
기판 처리 장치 및 이를 이용한 기판 처리 방법
|
|
USD1099184S1
(en)
|
2021-11-29 |
2025-10-21 |
Asm Ip Holding B.V. |
Weighted lift pin
|
|
USD1060598S1
(en)
|
2021-12-03 |
2025-02-04 |
Asm Ip Holding B.V. |
Split showerhead cover
|
|
US11961716B2
(en)
|
2021-12-09 |
2024-04-16 |
Industrial Technology Research Institute |
Atomic layer deposition method
|
|
TWI790028B
(zh)
*
|
2021-12-09 |
2023-01-11 |
財團法人工業技術研究院 |
沉積設備及沉積方法
|
|
CN114196998A
(zh)
*
|
2021-12-13 |
2022-03-18 |
拓荆科技股份有限公司 |
半导体反应腔中部件的处理方法以及半导体反应腔
|
|
TW202340522A
(zh)
*
|
2021-12-17 |
2023-10-16 |
美商蘭姆研究公司 |
具有錐狀表面的遠端電漿清潔(rpc)輸送入口配接器
|
|
CN114481089A
(zh)
*
|
2021-12-28 |
2022-05-13 |
长江存储科技有限责任公司 |
原子层沉积方法及设备
|
|
KR102757084B1
(ko)
|
2022-01-20 |
2025-01-22 |
주식회사 원익큐엔씨 |
반도체 증착공정 장비의 알루미늄계 부품용 세정물 및 이를 이용한 반도체 증착공정 장비의 알루미늄계 부품 세정 방법
|
|
CN115354305B
(zh)
*
|
2022-08-29 |
2024-04-19 |
西北大学 |
一种金属有机化学气相沉淀反应器喷淋装置
|
|
CN115537781B
(zh)
*
|
2022-10-27 |
2024-10-22 |
上海埃延半导体有限公司 |
一种弥漫层流反应腔体及控制方法
|
|
KR20250102057A
(ko)
*
|
2022-11-01 |
2025-07-04 |
램 리써치 코포레이션 |
프로세싱 챔버들 내 입자 축적 (particle buildup) 감소
|
|
US20240234627A1
(en)
*
|
2023-01-09 |
2024-07-11 |
Applied Materials, Inc. |
Chambers, methods, and apparatus for generating atomic radicals using uv light
|
|
KR20250159726A
(ko)
*
|
2023-03-20 |
2025-11-11 |
램 리써치 코포레이션 |
다단계 열 챔버 세정
|
|
CN118788663A
(zh)
*
|
2024-07-03 |
2024-10-18 |
无锡金源半导体科技有限公司 |
喷淋头清洗装置
|