JP2012114478A - リソグラフィ装置およびデバイス製造方法 - Google Patents
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Abstract
【解決手段】不均一な流れを均一にするために、浸漬リソグラフィ投影装置の液体除去システムで、多孔性部材を使用する。多孔性部材の両端の圧力差は、多孔性部材の泡立ち点以下に維持することができ、そのため一相の液体の流れを得ることができる。これに代えて、多孔性部材を、二相流内の不均一を低減するために使用することもできる。
【選択図】図1
Description
液体を含んでいる容積に隣接する開放端部を有するコンジット(導管)と、
コンジットの端部と容積との間の多孔性部材と、
孔性部材の両端に圧力差を生じるように配置される吸込装置と
を含む。
投影システムを用いて液体を通して基板上にパターン化した放射線のビームを投影する段階と、
容積に少なくとも一部が隣接している多孔性部材の両端に圧力差を供給することにより上記容積から液体を除去する段階とを含む。
1.ステップ・モードの場合には、マスク・テーブルMTおよび基板テーブルWTは本質的に固定されていて、一方、投影ビームに与えられた全パターンが、1回で(すなわち、1回の静的露光で)目標部分C上に投影される。基板テーブルWTは、次に、Xおよび/またはY方向に動かされ、そのため異なる目標部分Cを露光することができる。ステップ・モードの場合には、露光フィールドの最大サイズにより1回の静的露光で画像形成される目標部分Cのサイズが制限される。
を発生しない。
IL 照明システム(照明装置)
MA パターニング機器
PM 第1の位置決め装置
MT 支持構造
W 基板
PW 第2の位置決め装置
WT 基板テーブル
C 目標部分
PL 投影システム
SO 放射線源
BD ビーム供給システム
AM 調整手段
IN インテグレータ
CO コンデンサ
IH 浸漬フード
IF 位置センサ
M1,M2 マスク・アラインメント・マーク
P1,P2 基板アラインメント・マーク
10 リザーバ
12 シール部材
14 第1の出口
15 入り口
20 液体除去装置
21 有孔板
22 メニスカス
30 多孔板
31 チャンバ
32 ガス抽出リング
33 ガス供給リング
34 ガス・ナイフ
35 コーナー
36 液体軸受
37 液体供給チャンバ
38 二相抽出チャンバ
40 ドレン
41 多孔板
50 マニフォールド
50a 内部タンク
50b 外部タンク
51 二相流
52 ガス出口
53 液体除去パイプ
54 多孔板
55 入り口
56 出口
57 バッフル
60 液体供給システム
61 浸漬液源
62 定流制限器
63 可変流制限器
64 圧力調整器
65 可変流制限器
66 定流制限器
67 順方向圧力調整器
68 逆方向圧力調整器
69a,69b 圧力計
70 液体抽出チャネル
73 メニスカス
80 ガス抽出チャネル
81 毛細管
82 壁部
83 メニスカス
Claims (24)
- 投影システムを使用し、該投影システムと基板との間の空間に液体を供給するように配置される液体供給システムを有する、前記基板上にパターニング機器からのパターンを投影するように配置されるリソグラフィ投影装置であって、液体除去システムを備え、該液体除去システムが、
液体が存在する容積に隣接する開放端部を有するコンジットと、
前記コンジットの前記端部と前記容積との間の多孔性部材と、
前記多孔性部材の両端に圧力差を生じるように配置される吸込装置とを含む装置。 - 前記液体除去システムが、前記空間に隣接する容積から液体を除去するように配置される、請求項1に記載の装置。
- 前記空間の少なくとも一部を囲んでいる部材をさらに含み、前記コンジットが前記基板に面している前記部材の表面上に凹部を備え、前記多孔性部材が前記凹部を閉ざしている、請求項2に記載の装置。
- 前記部材が、前記空間の周囲に閉じたループを形成し、前記凹部が前記部材の全体の周囲を延びる、請求項3に記載の装置。
- 前記部材が、前記基板に面している表面に出口を有するガス供給回路をさらに備えていて、そのため前記基板の表面から残留液体を除去するためのガス・ナイフを形成し、前記ガス・ナイフが前記凹部の半径方向に外側を向いて位置する、請求項3に記載の装置。
- 前記部材が、前記凹部と前記ガス・ナイフとの間に位置する入り口を有するガス抽出回路をさらに備える、請求項5に記載の装置。
- 前記部材が、前記ガス・ナイフの半径方向に外側を向いて位置する入り口を有するガス抽出回路をさらに備える、請求項5に記載の装置。
- 前記部材が、前記基板に面している表面に出口を有する液体供給回路をさらに備えていて、そのため前記部材の重量の少なくとも一部を支持するための流体軸受を形成し、該流体軸受が前記凹部の半径方向に内側を向いて位置する、請求項3に記載の装置。
- 使用中、前記部材が前記基板の上50〜300μmの範囲の高さに支持される、請求項3に記載の装置。
- 前記空間の少なくとも一部を囲んでいる部材をさらに備え、前記コンジットが、前記基板に背を向けている前記部材の表面に凹部を備え、前記多孔性部材が前記凹部を閉ざしている、請求項1に記載の装置。
- 前記液体除去システムが液体/ガス分離マニフォールドを備え、前記コンジットが前記マニフォールドの下部に延びるパイプを備える、請求項1に記載の装置。
- 前記多孔性部材が5〜50μmの範囲の直径を有する孔部を有する、請求項1に記載の装置。
- 前記多孔性部材が親水性である、請求項1に記載の装置。
- デバイス製造方法であって、
投影システムを用いて液体を通して基板上に放射線のパターン化したビームを投影する段階と、
少なくとも一部が容積に接している多孔性部材の両端に圧力差を供給することにより前記容積から液体を除去する段階とを含む方法。 - 前記容積が、前記のパターン化されたビームが投影される前記液体を含む空間に隣接している、請求項14に記載の方法。
- 前記空間の少なくとも一部を囲んでいる部材の前記基板の方を向いている表面の凹部を用いて、前記容積から前記液体を除去する段階を含み、前記多孔性部材が前記凹部を閉ざしている、請求項15に記載の方法。
- 前記部材が、前記空間の周囲に閉じたループを形成し、前記凹部が前記部材の全体の周囲を延びる、請求項16に記載の方法。
- 前記基板の方を向いている表面からガスを供給する段階をさらに含み、そのため前記基板の表面から残留液体を除去するためのガス・ナイフを形成し、前記ガスが前記凹部の半径方向に外側を向いている位置に供給される、請求項16に記載の方法。
- 前記凹部と前記ガスが供給される位置との間の位置からガスを除去する段階をさらに含む、請求項18に記載の方法。
- ガスを供給する位置の半径方向に外側に位置する位置からガスを除去する段階をさらに含む、請求項18に記載の方法。
- 前記基板の方を向いている基板から液体を供給する段階をさらに含み、そのため前記部材の重量の少なくとも一部を支持するための流体軸受を形成し、前記液体が前記凹部の半径方向に内側の位置に供給される、請求項16に記載の方法。
- 前記部材を基板の上50〜300μmの範囲の高さに支持する段階を含む、請求項16に記載の方法。
- 前記空間の少なくとも一部を囲んでいる部材の前記基板に背を向けている表面の凹部を用いて前記容積から前記液体を除去する段階を含み、前記多孔性部材が前記凹部を閉ざしている、請求項14に記載の装置。
- 前記容積を含む液体/ガス・マニフォールドの下部に延びるパイプを通して前記容積から前記液体を除去する段階を含む、請求項14に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US10/921,348 US7701550B2 (en) | 2004-08-19 | 2004-08-19 | Lithographic apparatus and device manufacturing method |
US10/921,348 | 2004-08-19 |
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JP2010116393A Division JP5023187B2 (ja) | 2004-08-19 | 2010-05-20 | リソグラフィ装置 |
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JP2014216375A Division JP5763255B2 (ja) | 2004-08-19 | 2014-10-23 | リソグラフィ装置およびデバイス製造方法 |
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JP2009007038A Active JP4718619B2 (ja) | 2004-08-19 | 2009-01-15 | リソグラフィ装置およびデバイス製造方法 |
JP2010116393A Active JP5023187B2 (ja) | 2004-08-19 | 2010-05-20 | リソグラフィ装置 |
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