ATE548679T1 - Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung - Google Patents

Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung

Info

Publication number
ATE548679T1
ATE548679T1 AT09159532T AT09159532T ATE548679T1 AT E548679 T1 ATE548679 T1 AT E548679T1 AT 09159532 T AT09159532 T AT 09159532T AT 09159532 T AT09159532 T AT 09159532T AT E548679 T1 ATE548679 T1 AT E548679T1
Authority
AT
Austria
Prior art keywords
immersion
producing
lithographic
drying
metrology
Prior art date
Application number
AT09159532T
Other languages
English (en)
Inventor
Michel Riepen
Nicolaas Kemper
Johannes Vermeulen
Daniel Direcks
Danny Philips
Putten Arnold Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Application granted granted Critical
Publication of ATE548679T1 publication Critical patent/ATE548679T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT09159532T 2008-05-08 2009-05-06 Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung ATE548679T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7162008P 2008-05-08 2008-05-08
US7187608P 2008-05-22 2008-05-22

Publications (1)

Publication Number Publication Date
ATE548679T1 true ATE548679T1 (de) 2012-03-15

Family

ID=41266591

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09159532T ATE548679T1 (de) 2008-05-08 2009-05-06 Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung

Country Status (8)

Country Link
US (1) US8345218B2 (de)
EP (1) EP2249205B1 (de)
JP (1) JP5063641B2 (de)
KR (2) KR101043017B1 (de)
CN (1) CN101576718B (de)
AT (1) ATE548679T1 (de)
SG (1) SG157300A1 (de)
TW (1) TWI408512B (de)

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
EP2131241B1 (de) * 2008-05-08 2019-07-31 ASML Netherlands B.V. Flüssigkeitshandhabungsstruktur, lithografische Vorrichtung und Vorrichtungsherstellungsverfahren
NL2005951A (en) * 2010-02-02 2011-08-03 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2005974A (en) * 2010-02-12 2011-08-15 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006076A (en) * 2010-03-04 2011-09-06 Asml Netherlands Bv A lithographic apparatus and a method of manufacturing a device using a lithographic apparatus.
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
US20120162619A1 (en) * 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
NL2008979A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008980A (en) * 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009139A (en) 2011-08-05 2013-02-06 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009472A (en) 2011-10-24 2013-04-25 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
CN104238277B (zh) * 2013-06-19 2016-12-28 上海微电子装备有限公司 一种浸没式光刻机的流场维持方法
JP6216460B2 (ja) 2013-08-30 2017-10-18 エーエスエムエル ネザーランズ ビー．ブイ． 液浸リソグラフィ装置
CN106507684B (zh) * 2014-06-16 2020-01-10 Asml荷兰有限公司 光刻设备、转移衬底的方法和器件制造方法
KR102154168B1 (ko) 2016-01-13 2020-09-10 에이에스엠엘 네델란즈 비.브이. 유체 핸들링 구조체 및 리소그래피 장치
CN110764368A (zh) * 2018-07-27 2020-02-07 上海微电子装备（集团）股份有限公司 物镜防污染装置

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US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420298B1 (de) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographischer Apparat
KR100585476B1 (ko) 2002-11-12 2006-06-07 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
EP1420300B1 (de) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
AU2003289271A1 (en) * 2002-12-10 2004-06-30 Nikon Corporation Exposure apparatus, exposure method and method for manufacturing device
JP4604452B2 (ja) 2003-02-26 2011-01-05 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
TWI503865B (zh) * 2003-05-23 2015-10-11 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
TW200513805A (en) * 2003-08-26 2005-04-16 Nippon Kogaku Kk Optical device and exposure apparatus
TW200513809A (en) * 2003-09-29 2005-04-16 Nippon Kogaku Kk Liquid-soaked lens system and projecting exposure apparatus as well as component manufacturing method
US6977461B2 (en) * 2003-12-15 2005-12-20 Asml Netherlands B.V. System and method for moving an object employing piezo actuators
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4954444B2 (ja) 2003-12-26 2012-06-13 株式会社ニコン 流路形成部材、露光装置及びデバイス製造方法
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JP4510494B2 (ja) * 2004-03-29 2010-07-21 キヤノン株式会社 露光装置
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US20060147821A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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WO2006101120A1 (ja) 2005-03-23 2006-09-28 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US7924416B2 (en) * 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
JPWO2006137440A1 (ja) 2005-06-22 2009-01-22 株式会社ニコン 計測装置及び露光装置、並びにデバイス製造方法
US7834974B2 (en) * 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) * 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US8144305B2 (en) * 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7675201B2 (en) * 2006-07-25 2010-03-09 Asml Netherlands B.V. Lithographic apparatus with planar motor driven support
US8634053B2 (en) * 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8421993B2 (en) * 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method

Also Published As

Publication number Publication date
KR20090117664A (ko) 2009-11-12
JP5063641B2 (ja) 2012-10-31
TWI408512B (zh) 2013-09-11
US8345218B2 (en) 2013-01-01
CN101576718A (zh) 2009-11-11
CN101576718B (zh) 2013-11-06
US20090279063A1 (en) 2009-11-12
KR101527502B1 (ko) 2015-06-09
KR101043017B1 (ko) 2011-06-21
JP2009272636A (ja) 2009-11-19
KR20110055499A (ko) 2011-05-25
EP2249205B1 (de) 2012-03-07
EP2249205A1 (de) 2010-11-10
SG157300A1 (en) 2009-12-29
TW200951642A (en) 2009-12-16

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