ATE548679T1 - Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung - Google Patents
Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtungInfo
- Publication number
- ATE548679T1 ATE548679T1 AT09159532T AT09159532T ATE548679T1 AT E548679 T1 ATE548679 T1 AT E548679T1 AT 09159532 T AT09159532 T AT 09159532T AT 09159532 T AT09159532 T AT 09159532T AT E548679 T1 ATE548679 T1 AT E548679T1
- Authority
- AT
- Austria
- Prior art keywords
- immersion
- producing
- lithographic
- drying
- metrology
- Prior art date
Links
- 238000007654 immersion Methods 0.000 title abstract 4
- 238000001035 drying Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000005499 meniscus Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7162008P | 2008-05-08 | 2008-05-08 | |
| US7187608P | 2008-05-22 | 2008-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE548679T1 true ATE548679T1 (de) | 2012-03-15 |
Family
ID=41266591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT09159532T ATE548679T1 (de) | 2008-05-08 | 2009-05-06 | Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8345218B2 (de) |
| EP (1) | EP2249205B1 (de) |
| JP (1) | JP5063641B2 (de) |
| KR (2) | KR101043017B1 (de) |
| CN (1) | CN101576718B (de) |
| AT (1) | ATE548679T1 (de) |
| SG (1) | SG157300A1 (de) |
| TW (1) | TWI408512B (de) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2131241B1 (de) * | 2008-05-08 | 2019-07-31 | ASML Netherlands B.V. | Flüssigkeitshandhabungsstruktur, lithografische Vorrichtung und Vorrichtungsherstellungsverfahren |
| NL2005951A (en) * | 2010-02-02 | 2011-08-03 | Asml Netherlands Bv | Lithographic apparatus and a device manufacturing method. |
| NL2005974A (en) * | 2010-02-12 | 2011-08-15 | Asml Netherlands Bv | Lithographic apparatus and a device manufacturing method. |
| NL2006076A (en) * | 2010-03-04 | 2011-09-06 | Asml Netherlands Bv | A lithographic apparatus and a method of manufacturing a device using a lithographic apparatus. |
| NL2007182A (en) * | 2010-08-23 | 2012-02-27 | Asml Netherlands Bv | Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method. |
| US20120162619A1 (en) * | 2010-12-27 | 2012-06-28 | Nikon Corporation | Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium |
| NL2008979A (en) | 2011-07-11 | 2013-01-14 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2008980A (en) * | 2011-07-11 | 2013-01-14 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2009139A (en) | 2011-08-05 | 2013-02-06 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2009472A (en) * | 2011-10-24 | 2013-04-25 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| CN104238277B (zh) * | 2013-06-19 | 2016-12-28 | 上海微电子装备有限公司 | 一种浸没式光刻机的流场维持方法 |
| WO2015028202A1 (en) | 2013-08-30 | 2015-03-05 | Asml Netherlands B.V. | Immersion lithographic apparatus |
| KR101941596B1 (ko) * | 2014-06-16 | 2019-01-23 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치, 기판을 이송하는 방법 및 디바이스 제조 방법 |
| KR102517296B1 (ko) | 2016-01-13 | 2023-04-03 | 에이에스엠엘 네델란즈 비.브이. | 유체 핸들링 구조체 및 리소그래피 장치 |
| CN110764368A (zh) * | 2018-07-27 | 2020-02-07 | 上海微电子装备(集团)股份有限公司 | 物镜防污染装置 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4509852A (en) | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
| AU2747999A (en) | 1998-03-26 | 1999-10-18 | Nikon Corporation | Projection exposure method and system |
| KR100585476B1 (ko) | 2002-11-12 | 2006-06-07 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조방법 |
| EP1420300B1 (de) | 2002-11-12 | 2015-07-29 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| SG121822A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| EP2495613B1 (de) | 2002-11-12 | 2013-07-31 | ASML Netherlands B.V. | Lithografische Vorrichtung |
| KR101036114B1 (ko) * | 2002-12-10 | 2011-05-23 | 가부시키가이샤 니콘 | 노광장치 및 노광방법, 디바이스 제조방법 |
| JP4604452B2 (ja) | 2003-02-26 | 2011-01-05 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
| WO2004092830A2 (en) | 2003-04-11 | 2004-10-28 | Nikon Corporation | Liquid jet and recovery system for immersion lithography |
| TW200509205A (en) * | 2003-05-23 | 2005-03-01 | Nippon Kogaku Kk | Exposure method and device-manufacturing method |
| JP3862678B2 (ja) * | 2003-06-27 | 2006-12-27 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| TW200513805A (en) * | 2003-08-26 | 2005-04-16 | Nippon Kogaku Kk | Optical device and exposure apparatus |
| SG144907A1 (en) * | 2003-09-29 | 2008-08-28 | Nikon Corp | Liquid immersion type lens system, projection exposure apparatus, and device fabricating method |
| US6977461B2 (en) * | 2003-12-15 | 2005-12-20 | Asml Netherlands B.V. | System and method for moving an object employing piezo actuators |
| US7394521B2 (en) | 2003-12-23 | 2008-07-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4954444B2 (ja) | 2003-12-26 | 2012-06-13 | 株式会社ニコン | 流路形成部材、露光装置及びデバイス製造方法 |
| WO2005081290A1 (ja) | 2004-02-19 | 2005-09-01 | Nikon Corporation | 露光装置及びデバイス製造方法 |
| JP4510494B2 (ja) | 2004-03-29 | 2010-07-21 | キヤノン株式会社 | 露光装置 |
| EP3203321A1 (de) * | 2004-06-10 | 2017-08-09 | Nikon Corporation | Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung einer vorrichtung |
| US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7423720B2 (en) * | 2004-11-12 | 2008-09-09 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7397533B2 (en) | 2004-12-07 | 2008-07-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20060147821A1 (en) * | 2004-12-30 | 2006-07-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8018573B2 (en) | 2005-02-22 | 2011-09-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP5040646B2 (ja) | 2005-03-23 | 2012-10-03 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
| WO2006137440A1 (ja) | 2005-06-22 | 2006-12-28 | Nikon Corporation | 計測装置及び露光装置、並びにデバイス製造方法 |
| US7924416B2 (en) | 2005-06-22 | 2011-04-12 | Nikon Corporation | Measurement apparatus, exposure apparatus, and device manufacturing method |
| US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7411658B2 (en) * | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7839483B2 (en) | 2005-12-28 | 2010-11-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and a control system |
| US8144305B2 (en) | 2006-05-18 | 2012-03-27 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7675201B2 (en) * | 2006-07-25 | 2010-03-09 | Asml Netherlands B.V. | Lithographic apparatus with planar motor driven support |
| US8634053B2 (en) * | 2006-12-07 | 2014-01-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8421993B2 (en) * | 2008-05-08 | 2013-04-16 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
| US20110134400A1 (en) * | 2009-12-04 | 2011-06-09 | Nikon Corporation | Exposure apparatus, liquid immersion member, and device manufacturing method |
-
2009
- 2009-05-06 EP EP09159532A patent/EP2249205B1/de not_active Not-in-force
- 2009-05-06 AT AT09159532T patent/ATE548679T1/de active
- 2009-05-07 US US12/437,466 patent/US8345218B2/en not_active Expired - Fee Related
- 2009-05-07 JP JP2009112621A patent/JP5063641B2/ja not_active Expired - Fee Related
- 2009-05-08 KR KR1020090040484A patent/KR101043017B1/ko not_active Expired - Fee Related
- 2009-05-08 TW TW098115452A patent/TWI408512B/zh active
- 2009-05-08 SG SG200903192-3A patent/SG157300A1/en unknown
- 2009-05-08 CN CN2009101419929A patent/CN101576718B/zh not_active Expired - Fee Related
-
2011
- 2011-04-14 KR KR1020110034653A patent/KR101527502B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR101043017B1 (ko) | 2011-06-21 |
| KR20090117664A (ko) | 2009-11-12 |
| KR20110055499A (ko) | 2011-05-25 |
| KR101527502B1 (ko) | 2015-06-09 |
| TWI408512B (zh) | 2013-09-11 |
| US8345218B2 (en) | 2013-01-01 |
| CN101576718A (zh) | 2009-11-11 |
| EP2249205A1 (de) | 2010-11-10 |
| JP2009272636A (ja) | 2009-11-19 |
| US20090279063A1 (en) | 2009-11-12 |
| TW200951642A (en) | 2009-12-16 |
| EP2249205B1 (de) | 2012-03-07 |
| SG157300A1 (en) | 2009-12-29 |
| CN101576718B (zh) | 2013-11-06 |
| JP5063641B2 (ja) | 2012-10-31 |
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