ATE548679T1 - Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung - Google Patents

Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung

Info

Publication number
ATE548679T1
ATE548679T1 AT09159532T AT09159532T ATE548679T1 AT E548679 T1 ATE548679 T1 AT E548679T1 AT 09159532 T AT09159532 T AT 09159532T AT 09159532 T AT09159532 T AT 09159532T AT E548679 T1 ATE548679 T1 AT E548679T1
Authority
AT
Austria
Prior art keywords
immersion
producing
lithographic
drying
metrology
Prior art date
Application number
AT09159532T
Other languages
English (en)
Inventor
Michel Riepen
Nicolaas Kemper
Johannes Vermeulen
Daniel Direcks
Danny Philips
Putten Arnold Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Application granted granted Critical
Publication of ATE548679T1 publication Critical patent/ATE548679T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
AT09159532T 2008-05-08 2009-05-06 Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung ATE548679T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7162008P 2008-05-08 2008-05-08
US7187608P 2008-05-22 2008-05-22

Publications (1)

Publication Number Publication Date
ATE548679T1 true ATE548679T1 (de) 2012-03-15

Family

ID=41266591

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09159532T ATE548679T1 (de) 2008-05-08 2009-05-06 Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung

Country Status (8)

Country Link
US (1) US8345218B2 (de)
EP (1) EP2249205B1 (de)
JP (1) JP5063641B2 (de)
KR (2) KR101043017B1 (de)
CN (1) CN101576718B (de)
AT (1) ATE548679T1 (de)
SG (1) SG157300A1 (de)
TW (1) TWI408512B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2131241B1 (de) * 2008-05-08 2019-07-31 ASML Netherlands B.V. Flüssigkeitshandhabungsstruktur, lithografische Vorrichtung und Vorrichtungsherstellungsverfahren
NL2005951A (en) * 2010-02-02 2011-08-03 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2005974A (en) * 2010-02-12 2011-08-15 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006076A (en) * 2010-03-04 2011-09-06 Asml Netherlands Bv A lithographic apparatus and a method of manufacturing a device using a lithographic apparatus.
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
US20120162619A1 (en) * 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
NL2008979A (en) * 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008980A (en) * 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009139A (en) 2011-08-05 2013-02-06 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009472A (en) * 2011-10-24 2013-04-25 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
CN104238277B (zh) * 2013-06-19 2016-12-28 上海微电子装备有限公司 一种浸没式光刻机的流场维持方法
US10216095B2 (en) 2013-08-30 2019-02-26 Asml Netherlands B.V. Immersion lithographic apparatus
EP3155482B1 (de) * 2014-06-16 2018-07-04 ASML Netherlands B.V. Lithographische vorrichtung, verfahren zur übertragung eines substrats und vorrichtungsherstellungsverfahren
CN113204178A (zh) 2016-01-13 2021-08-03 Asml荷兰有限公司 流体处理结构及光刻设备
CN110764368A (zh) * 2018-07-27 2020-02-07 上海微电子装备（集团）股份有限公司 物镜防污染装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420300B1 (de) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2495613B1 (de) 2002-11-12 2013-07-31 ASML Netherlands B.V. Lithografische Vorrichtung
EP1571698A4 (de) * 2002-12-10 2006-06-21 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung von bauelementen
JP4604452B2 (ja) 2003-02-26 2011-01-05 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
WO2004092830A2 (en) 2003-04-11 2004-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
TWI616932B (zh) * 2003-05-23 2018-03-01 尼康股份有限公司 Exposure device and component manufacturing method
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
CN100440432C (zh) * 2003-08-26 2008-12-03 株式会社尼康 光学元件和曝光装置
JP4492539B2 (ja) * 2003-09-29 2010-06-30 株式会社ニコン 液浸型光学系及び投影露光装置、並びにデバイス製造方法
US6977461B2 (en) * 2003-12-15 2005-12-20 Asml Netherlands B.V. System and method for moving an object employing piezo actuators
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4954444B2 (ja) 2003-12-26 2012-06-13 株式会社ニコン 流路形成部材、露光装置及びデバイス製造方法
WO2005081290A1 (ja) 2004-02-19 2005-09-01 Nikon Corporation 露光装置及びデバイス製造方法
JP4510494B2 (ja) 2004-03-29 2010-07-21 キヤノン株式会社 露光装置
EP2624282B1 (de) * 2004-06-10 2017-02-08 Nikon Corporation Immersionsbelichtungsvorrichtung und -verfahren, und Verfahren zur Herstellung eines Geräts
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7397533B2 (en) 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060147821A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006101120A1 (ja) * 2005-03-23 2006-09-28 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
KR20080017299A (ko) 2005-06-22 2008-02-26 가부시키가이샤 니콘 계측 장치 및 노광 장치 및 디바이스 제조 방법
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) * 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US8144305B2 (en) 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7675201B2 (en) * 2006-07-25 2010-03-09 Asml Netherlands B.V. Lithographic apparatus with planar motor driven support
US8634053B2 (en) * 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8421993B2 (en) * 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method

Also Published As

Publication number Publication date
JP2009272636A (ja) 2009-11-19
KR101043017B1 (ko) 2011-06-21
TWI408512B (zh) 2013-09-11
KR20110055499A (ko) 2011-05-25
EP2249205A1 (de) 2010-11-10
EP2249205B1 (de) 2012-03-07
JP5063641B2 (ja) 2012-10-31
US20090279063A1 (en) 2009-11-12
TW200951642A (en) 2009-12-16
KR101527502B1 (ko) 2015-06-09
US8345218B2 (en) 2013-01-01
KR20090117664A (ko) 2009-11-12
SG157300A1 (en) 2009-12-29
CN101576718A (zh) 2009-11-11
CN101576718B (zh) 2013-11-06

Similar Documents

Publication Publication Date Title
ATE548679T1 (de) Lithografische immersionsvorrichtung, trocknungsvorrichtung, immersionsmetrologievorrichtung und verfahren zur herstellung einer vorrichtung
DE602006002439D1 (de) Lithografische Vorrichtung, Kontaminantfalle und Verfahren zur Herstellung einer Vorrichtung
ATE509322T1 (de) System und verfahren zum löschen und sperren eines entfernten geräts
DE602005013038D1 (de) Lithographischer Apparat, Verfahren zur Herstellung einer Vorrichtung
DE602007012636D1 (de) Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
DE602006021680D1 (de) Verfahren zur Reinigung eines Elements einer lithografischen Vorrichtung
DE602008005236D1 (de) Verfahren und Vorrichtung zur Herstellung einer vertikalen Beschichtungsmaske
DE602007012095D1 (de) Vorrichtung und verfahren zur biologischen entfernung von selen aus wasser
DE602007012032D1 (de) Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
ATE518018T1 (de) Verfahren zur reinigung von ablagerungskammerteilen mithilfe der selektiven spritzätzung
DE602006004913D1 (de) Verfahren und Vorrichtung zur Herstellung von Halbleitern mittels Laserstrahlung
DE602005012803D1 (de) Tintenstrahlaufzeichnungsvorrichtung, Verfahren zum Entfernen von Luft aus einer Tintenstrahlaufzeichnungsvorrichtung und Vorrichtung zum Entfernen von Luft
DE602006001507D1 (de) Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
DE112007002289A5 (de) Verfahren und Vorrichtung zur Erhöhung von Leistung und Wirkungsgrad eines ORC-Kraftwerkprozesses
EP2112125A4 (de) Verfahren und vorrichtung zur herstellung von reinem wasser
DE602007007161D1 (de) Mittel zur Entfernung von Wasser aus einem Substrat, Verfahren zur Wasserentfernung und Trocknungsverfahren damit
EP4176468C0 (de) Optoelektronische vorrichtung und verfahren zur herstellung einer optoelektronischen vorrichtung
EP4174019A4 (de) Aktivsauerstoffversorgungsvorrichtung, vorrichtung zur durchführung einer behandlung durch aktiven sauerstoff und verfahren zur durchführung einer behandlung durch aktiven sauerstoff
EP4231032C0 (de) Atomare dampfzelle, integrierte atomare/photonische vorrichtung und gerät mit der atomaren dampfzelle und verfahren zur herstellung einer atomaren dampfzelle
DE112022005869A5 (de) Optoelektronisches bauelement, optoelektronische vorrichtung und verfahren zur herstellung eines bauelements
EP2265427A4 (de) Verfahren und vorrichtung zur herstellung einer polyolefin-folie von hoher zähigkeit
DE502005007024D1 (de) Verfahren und Vorrichtung zur Reinigung des Feuchtmittels einer Druckmaschine
DE602005022173D1 (de) Verfahren zur herstellung einer polymer enthaltenden zusammensetzung aus einer eine polymerkomponente enthaltenden flüssigkeit und trocknungsvorrichtung dafür
ATE424966T1 (de) Vorrichtung zum halten eines turbinenblattes und verfahren zur blattbearbeitung unter der verwendung dieser haltevorrichtung
DE602006014123D1 (de) Vorrichtung und Verfahren um eine Schicht anzuhaften