DE602006001507D1 - Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung - Google Patents

Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung

Info

Publication number
DE602006001507D1
DE602006001507D1 DE602006001507T DE602006001507T DE602006001507D1 DE 602006001507 D1 DE602006001507 D1 DE 602006001507D1 DE 602006001507 T DE602006001507 T DE 602006001507T DE 602006001507 T DE602006001507 T DE 602006001507T DE 602006001507 D1 DE602006001507 D1 DE 602006001507D1
Authority
DE
Germany
Prior art keywords
making
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006001507T
Other languages
English (en)
Inventor
Huibert Visser
David William Callan
Schmidt Robert-Han Munnig
Roberto Wiener
De Ven Johannes T G Van
George Howard Robbins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
ASML Netherlands BV
Original Assignee
ASML Holding NV
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV, ASML Netherlands BV filed Critical ASML Holding NV
Publication of DE602006001507D1 publication Critical patent/DE602006001507D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70041Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
DE602006001507T 2005-12-09 2006-11-28 Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung Active DE602006001507D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/297,641 US7626181B2 (en) 2005-12-09 2005-12-09 Lithographic apparatus and device manufacturing method
US11/371,232 US7714305B2 (en) 2005-12-09 2006-03-09 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
DE602006001507D1 true DE602006001507D1 (de) 2008-07-31

Family

ID=37814290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006001507T Active DE602006001507D1 (de) 2005-12-09 2006-11-28 Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung

Country Status (8)

Country Link
US (3) US7626181B2 (de)
EP (2) EP1847877A3 (de)
JP (1) JP4482551B2 (de)
KR (2) KR100830662B1 (de)
CN (1) CN1996149B (de)
DE (1) DE602006001507D1 (de)
SG (1) SG133510A1 (de)
TW (1) TWI381251B (de)

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JP5089205B2 (ja) * 2007-03-19 2012-12-05 キヤノン株式会社 画像形成装置、及びその制御方法
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TWI572434B (zh) * 2013-12-04 2017-03-01 Metal Ind Res And Dev Centre Laser processing device with high speed vibration unit
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DE102014203040A1 (de) * 2014-02-19 2015-08-20 Carl Zeiss Smt Gmbh Beleuchtungssystem einer mikrolithographischen Projektionsbelichtungsanlage und Verfahren zum Betreiben eines solchen
EP3444674A1 (de) * 2017-08-14 2019-02-20 ASML Netherlands B.V. Verfahren und vorrichtung zur bestimmung eines strukturierungsverfahrensparameters
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CN111580346B (zh) * 2020-05-21 2021-06-25 吉林大学 Dmd光刻系统中倾角及放大倍率的测量和校正方法

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Also Published As

Publication number Publication date
KR100830662B1 (ko) 2008-05-19
CN1996149A (zh) 2007-07-11
US20070162781A1 (en) 2007-07-12
KR20070061461A (ko) 2007-06-13
US7626181B2 (en) 2009-12-01
EP1795966B1 (de) 2008-06-18
US20070150779A1 (en) 2007-06-28
EP1795966A1 (de) 2007-06-13
EP1847877A3 (de) 2009-02-11
US20070150778A1 (en) 2007-06-28
TW200732856A (en) 2007-09-01
EP1847877A2 (de) 2007-10-24
KR20080015038A (ko) 2008-02-15
SG133510A1 (en) 2007-07-30
CN1996149B (zh) 2010-12-08
TWI381251B (zh) 2013-01-01
KR100841425B1 (ko) 2008-06-25
JP4482551B2 (ja) 2010-06-16
JP2007165885A (ja) 2007-06-28
US7714305B2 (en) 2010-05-11

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