JP2011221518A - 反射材 - Google Patents
反射材 Download PDFInfo
- Publication number
- JP2011221518A JP2011221518A JP2011064492A JP2011064492A JP2011221518A JP 2011221518 A JP2011221518 A JP 2011221518A JP 2011064492 A JP2011064492 A JP 2011064492A JP 2011064492 A JP2011064492 A JP 2011064492A JP 2011221518 A JP2011221518 A JP 2011221518A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- reflective
- fine particles
- film
- soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 198
- 239000000843 powder Substances 0.000 claims abstract description 139
- 239000010408 film Substances 0.000 claims abstract description 105
- 239000010419 fine particle Substances 0.000 claims abstract description 96
- 229920002050 silicone resin Polymers 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 239000011256 inorganic filler Substances 0.000 claims abstract description 67
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 239000010409 thin film Substances 0.000 claims abstract description 52
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 98
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 80
- -1 organic acid salt Chemical class 0.000 claims description 52
- 239000011248 coating agent Substances 0.000 claims description 51
- 238000000576 coating method Methods 0.000 claims description 51
- 239000002245 particle Substances 0.000 claims description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 37
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 22
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 17
- 239000007864 aqueous solution Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 15
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 12
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 10
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 claims description 10
- 108010010803 Gelatin Proteins 0.000 claims description 9
- 239000008273 gelatin Substances 0.000 claims description 9
- 229920000159 gelatin Polymers 0.000 claims description 9
- 235000019322 gelatine Nutrition 0.000 claims description 9
- 235000011852 gelatine desserts Nutrition 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000004090 dissolution Methods 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 239000005995 Aluminium silicate Substances 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 235000012211 aluminium silicate Nutrition 0.000 claims description 6
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 6
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 239000001103 potassium chloride Substances 0.000 claims description 5
- 235000011164 potassium chloride Nutrition 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 229920002472 Starch Polymers 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000011780 sodium chloride Substances 0.000 claims description 4
- 239000008107 starch Substances 0.000 claims description 4
- 235000019698 starch Nutrition 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 229920005862 polyol Polymers 0.000 claims description 3
- 150000003077 polyols Chemical class 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 239000004323 potassium nitrate Substances 0.000 claims description 3
- 235000010333 potassium nitrate Nutrition 0.000 claims description 3
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 3
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 3
- 235000011151 potassium sulphates Nutrition 0.000 claims description 3
- 150000003377 silicon compounds Chemical class 0.000 claims description 3
- 239000004317 sodium nitrate Substances 0.000 claims description 3
- 235000010344 sodium nitrate Nutrition 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- 229920003169 water-soluble polymer Polymers 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 19
- 239000011347 resin Substances 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000004383 yellowing Methods 0.000 abstract description 6
- 230000006866 deterioration Effects 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002585 base Substances 0.000 description 81
- 239000000203 mixture Substances 0.000 description 22
- 239000004205 dimethyl polysiloxane Substances 0.000 description 21
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- 238000001723 curing Methods 0.000 description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 238000005498 polishing Methods 0.000 description 11
- 229920001296 polysiloxane Polymers 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 239000006087 Silane Coupling Agent Substances 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 238000002310 reflectometry Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000013500 performance material Substances 0.000 description 5
- 229920000052 poly(p-xylylene) Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229920005601 base polymer Polymers 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- VRBFTYUMFJWSJY-UHFFFAOYSA-N 28804-46-8 Chemical compound ClC1CC(C=C2)=CC=C2C(Cl)CC2=CC=C1C=C2 VRBFTYUMFJWSJY-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- 239000012463 white pigment Substances 0.000 description 2
- OWEGMIWEEQEYGQ-UHFFFAOYSA-N 100676-05-9 Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC2C(OC(O)C(O)C2O)CO)O1 OWEGMIWEEQEYGQ-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- UNXHWFMMPAWVPI-QWWZWVQMSA-N D-Threitol Natural products OC[C@@H](O)[C@H](O)CO UNXHWFMMPAWVPI-QWWZWVQMSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- GUBGYTABKSRVRQ-PICCSMPSSA-N Maltose Natural products O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@@H](CO)OC(O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-PICCSMPSSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- GUBGYTABKSRVRQ-QUYVBRFLSA-N beta-maltose Chemical compound OC[C@H]1O[C@H](O[C@H]2[C@H](O)[C@@H](O)[C@H](O)O[C@@H]2CO)[C@H](O)[C@@H](O)[C@@H]1O GUBGYTABKSRVRQ-QUYVBRFLSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000002016 disaccharides Chemical class 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004989 laser desorption mass spectroscopy Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002772 monosaccharides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000005080 phosphorescent agent Substances 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/002—Combinations of extrusion moulding with other shaping operations combined with surface shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/36—Compounds of titanium
- C09C1/3607—Titanium dioxide
- C09C1/3684—Treatment with organo-silicon compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/12—Treatment with organosilicon compounds
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- C—CHEMISTRY; METALLURGY
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/004—Reflecting paints; Signal paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/03529—Shape of the potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2793/00—Shaping techniques involving a cutting or machining operation
- B29C2793/0027—Cutting off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/07—Flat, e.g. panels
- B29C48/08—Flat, e.g. panels flexible, e.g. films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/13—Articles with a cross-section varying in the longitudinal direction, e.g. corrugated pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
- B29C48/154—Coating solid articles, i.e. non-hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
- B29C48/154—Coating solid articles, i.e. non-hollow articles
- B29C48/155—Partial coating thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/20—Inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/003—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/005—Layered products coated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/24413—Metal or metal compound
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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Abstract
【解決手段】反射材2は、シリコーン樹脂に、それよりも高屈折率の白色無機フィラー粉末11が分散されつつ含有されている反射基材16の表面で、溶解性微粒子の溶解によって、粗面化した凹凸12aが、形成され、反射基材16の少なくとも一部の上で、凹凸12aに導電性薄膜15a・15bが付されている。
【選択図】図1
Description
初期反射率の比較
(ポリフェニルシロキサン樹脂とポリジメチルシロキサン樹脂との比較)
ポリフェニルシロキサン樹脂(商品名XE14−C2508:モメンティブ・パフォーマンス・マテリアルズ)とポリジメチルシロキサン樹脂(商品名IVSM4500:モメンティブ・パフォーマンス・マテリアルズ)を用いて、アナターゼ型酸化チタン(商品名A−950:堺化学工業株式会社)とルチル型酸化チタン(商品名GTR−100化学工業株式会社)とアルミナ(商品名AES12:住友化学株式会社)を各々200質量部添加し、加熱プレスにて、150℃で10分間の硬化条件によって、縦70mm、横70mm、厚さ0.3mmのシリコーン白色反射板である反射材2の反射基材16を作製した。それぞれの反射率を、分光光度計UV−3150(SHIMADZU製)を用いて測定した。図7の結果よりすべてにおいてポリジメチルシロキサンをベースポリマーとした場合3〜5%の反射率の向上が見られた。
高温での経時後の反射率
ポリフェニルシロキサン樹脂(商品名XE14−C2508:モメンティブ・パフォーマンス・マテリアルズ)とポリジメチルシロキサン樹脂(商品名IVSM4500:モメンティブ・パフォーマンス・マテリアルズ)にアナターゼ型酸化チタン(商品名A−950:堺化学工業株式会社)とルチル型酸化チタン(商品名GTR−100堺化学工業株式会社)をそれぞれ200質量部添加し、加熱プレスにて、150℃で10分間の硬化条件によって、縦70mm、横70mm、厚さ0.3mmのシリコーン白色反射板を作製した。150℃で1000時間経過経時後の反射率を、分光光度計UV−3150(SHIMADZU製)を用いて測定した。図8より、ポリフェニルシロキサン樹脂のシリコーン白色反射板は短波長側で反射率の低下が見られるのに対し、ポリジメチルシロキサン樹脂のシリコーン白色反射板である反射材2の反射基材16は反射率の低下が見られない。
ポリジメチルシロキサン樹脂(商品名IVSM4500:モメンティブ・パフォーマンス・マテリアルズ社製)にアナターゼ型酸化チタン(商品名A−950:堺化学工業株式会社製)とルチル型酸化チタン(商品名GTR−100;化学工業株式会社製)をそれぞれ100質量部添加し、加熱プレスにて、150℃で10分間の硬化条件によって、縦70mm、横70mm、厚さ0.3mmのシリコーン白色反射板を作製した。それぞれの反射率を、分光光度計(商品名UV−3150;株式会社島津製作所製)を用いて初期反射率を測定した後、#1500のサンドペーパーでシリコーン白色反射板である反射材2の反射基材16の表面をそれぞれ研磨し、再度反射率を測定する。図9より、研磨などで表面加工を行うことにより2〜3%反射率が向上した。
図1に示す反射材を、以下のようにして作製した。支持体であるガラスエポキシ樹脂積層板(ガラエポ板)に、調製例3と同様にしてそれと同種・同量の酸化チタン粉末及びポリジメチルシリコーン樹脂を含有する反射基材作製用組成物を調製し、スクリーン印刷により30μmの厚さに塗布し、レべリングしたところで、80℃で10分間加熱して、塗布面を半硬化させ、支持体上に半硬化状の反射基材16を形成した。次に、酸化チタン粉末を20質量%の体積平均粒径5μmの炭酸カルシウム粉末に代えたこと以外は反射基材作製用組成物と同様に被膜作製用組成物を調製し、スクリーン印刷により反射基材16の上に10μmの厚さに塗布し、150℃で10分間の硬化条件によって、反射基材16と被膜17とを完全に硬化させた。被膜17を希塩酸で洗浄させたところ、被膜17の表面に露出していた炭酸カルシウムが溶解・溶出し、窪んだ凹状の凹凸12aが形成された。汎用の銅メッキ条件により、被膜17上に30μmの厚さの銅メッキを施し、導電性被膜15を形成した。汎用のエッチング法により、レジストで回路パターン状にフォトマスクを形成しエッチングしてからフォトマスクを除去すると、導電性被膜15a・15bが形成され、反射材2が得られた。
図3に示す反射材を、以下のようにして作製した。調製例3と同様にしてそれと同量・同種の酸化チタン粉末及びポリジメチルシリコーン樹脂原料と、20質量%の体積平均粒径5μmの炭酸カルシウム粉末とを含んだ反射基材作製用組成物を調製し、金型で150℃で10分間の硬化条件によって、反射基材16を完全に硬化させた。反射基材16を希塩酸で洗浄させたところ、反射基材16の表面に露出していた炭酸カルシウムが溶解・溶出し、窪んだ凹状の凹凸12aが形成された。実施例1と同様にして導電性被膜15a・15bを形成すると、反射材2が得られた。
図5に示す反射材を、以下のようにして作製した。調製例3と同様にしてそれと同種・同量の酸化チタン粉末及びポリジメチルシリコーン樹脂を含有する反射基材作製用組成物を調製し、金型で80℃で10分間加熱する半硬化条件によって、半硬化した反射基材16を得た。非溶解性微粒子である前記粒径範囲内のシリカ粒子のニップシール(東ソー・シリカ株式会社製の商品名)の5質量%とゼラチンの2質量%とを水に懸濁させた被膜形成用組成物を調製し、半硬化した反射基材16の表面に塗布し、30μmのウエットな流出被膜18aを形成した。ゼラチンを含む組成物は粘度があるためにアモルファスシリカのようなシリカ粒子が沈降し難いので、時間をかけて充分に沈降して半硬化した反射基材16の表面にめり込むまで暫く静置した。その後、金型ごと120℃で10分間の硬化条件によって、ウエットな流出被膜18aの乾燥とともに反射基材16の硬化を促進させた。硬化した反射基材16から流出被膜18aを水洗し、余分な非溶解性微粒子をゼラチンと共に洗い流し、150℃で10分間、乾燥と同時に完全に硬化させ、反射基材16の界面にめり込んだ非溶解性微粒子が残存して凹凸12aを形成した反射基材16が得られた。実施例1と同様にして導電性被膜15a・15bを形成すると、反射材2が得られた。
図6に示す反射材を、以下のようにして作製した。調製例3と同様にしてそれと同種・同量の酸化チタン粉末及びポリジメチルシリコーン樹脂を含有する反射基材作製用組成物を調製し、金型で80℃で10分間加熱する半硬化条件によって、半硬化した反射基材16を得た。非溶解性微粒子である乾式シリカ粉末で5〜50nmの一次粒子からなるレオシールQS−40(株式会社トクヤマ製の商品名)の5質量%とメタノールの7質量%とを水に懸濁させた被膜形成用組成物を調製し、半硬化した反射基材16の表面にカーテンコーターで塗布し、20μmのウエットな塗布被膜18bを形成した。その後速やかに150℃で10分間の硬化条件によって、反射基材16を完全に硬化させた。硬化した反射基材16からウエットな塗布被膜18bを水洗し、余分な非溶解性微粒子を洗い流すと、反射基材16の界面にめり込んだ非溶解性微粒子が残存して突起凸部である凹凸12aを形成した反射基材16が得られた。実施例1と同様にして導電性被膜15a・15bを形成すると、反射材2が得られた。
実施例4と同様に反射材を、以下のようにして作製した。調製例3と同様にしてそれと同種・同量の酸化チタン粉末及びポリジメチルシリコーン樹脂を含有する反射基材作製用組成物を調製し、金型で80℃で10分間加熱する半硬化条件によって、半硬化した反射基材16を得た。乾式シリカ粉末で5〜50nmの一次粒子からなるレオシールQS−40(株式会社トクヤマ製の商品名)をエア中に分散させ、二次粒子を除去しながらこのエアーを反射基材16にあてて非溶解性微粒子を表面に付着させた。その後速やかに150℃で10分間の硬化条件によって、反射基材16を完全に硬化させてから、反射基材の表面に高圧のエアシャワーをかけて余分な非溶解性微粒子を洗い流すと、反射基材16の界面にめり込んだ非溶解性微粒子が残存して突起凸部である凹凸12aを形成した反射基材16が得られた。実施例1と同様にして導電性被膜15a・15bを形成すると、反射材2が得られた。同様にして、酸化チタン、炭酸カルシウム、シリカ粒子でも行うことができた。
(実施例6)
実施例3及び4のシリカに代えて、同粒径の酸化チタンを用いたこと以外は、実施例3及び4と同様にして、反射材2を得た。
(比較例1)
支持体であるガラスエポキシ樹脂積層板(ガラエポ板)に、調製例3と同様にしてそれと同種・同量の酸化チタン粉末及びポリジメチルシリコーン樹脂を含有する反射基材作製用組成物を調製し、スクリーン印刷により30μmの厚さに塗布し、静置してレべリング処理した後、150℃で10分間加熱して、組成物を半化させ、支持体上に完全に硬化した反射基材16を形成した。その上に直接、実施例1と同様にして導電性被膜を形成すると、本発明を適用外の反射材が得られた。
Claims (14)
- シリコーン樹脂に、それよりも高屈折率の白色無機フィラー粉末が分散されつつ含有されており可撓性の膜状、又は可撓性若しくは非可撓性の板状若しくは立体形状に形成された反射基材の表面で、溶解性微粒子の溶解によって、及び/又は非溶解性微粒子の露出によって、粗面化した凹凸が、形成され、前記反射基材の少なくとも一部の上で、前記凹凸に導電性薄膜が付されていることを特徴とする反射材。
- 前記溶解性微粒子を含有し前記反射基材上に付された被膜からの前記溶解により、前記反射基材中に含有された前記溶解性微粒子の前記溶解により、及び/又は前記非溶解性微粒子と共存された媒体の流出若しくは揮発による前記非溶解性微粒子の残存に応じた前記露出により、前記凹凸が形成されていることを特徴とする請求項1に記載の反射材。
- 酸性水溶液、アルカリ性水溶液又は水による、炭酸カルシウム粉末、塩化ナトリウム粉末、塩化カリウム粉末、臭化カリウム粉末、硫酸ナトリウム粉末、硫酸カリウム粉末、硝酸ナトリウム粉末、硝酸カリウム粉末、水酸化アルミニウム粉末、酸化アルミニウム粉末、塩化ナトリウム粉末、塩化カリウム粉末、臭化カリウム粉末、水溶性ケイ素化合物、酸化鉄粉末、水溶性有機酸粉末、水溶性有機酸塩粉末、水溶性ポリオール粉末、水溶性糖粉末、水溶性高分子樹脂粉末、尿素誘導体粉末から選ばれる少なくとも何れかの前記溶解性微粒子の前記溶解により、及び/又はゼラチン、セルロース誘導体、デンプン、オレフィン類−無水マレイン酸共重合体、ポリビニールアルコールから選ばれる少なくとも何れかの前記媒体の前記流出、若しくは前記揮発による、シリカゲル粒子、カオリン、タルク、ガラス粉末、ガラスビーズ、酸化チタンから選ばれる少なくとも何れかの前記非溶解性微粒子の前記露出により、前記凹凸が前記形成されていることを特徴とする請求項2に記載の反射材。
- 前記溶解性微粒子及び前記非溶解性微粒子が、平均粒径を3nm〜15μmとすることを特徴とする請求項1〜3の何れかに記載の反射材。
- 前記導電性薄膜が、金属膜であることを特徴とする請求項1〜4の何れかに記載の反射材。
- 前記金属膜が、銅、銀、金、ニッケル、及びパラジウムから選ばれる少なくとも何れかの金属で形成されていることを特徴とする請求項5に記載の反射材。
- 前記金属膜が、メッキ被膜、金属蒸着被膜、金属溶射膜、又は接着された金属箔膜であることを特徴とする請求項6に記載の反射材。
- 前記金属膜が、金属配線となっていることを特徴とする請求項7に記載の反射材。
- 前記シリコーン樹脂が、屈折率を1.35以上、1.55未満とすることを特徴とする請求項1〜8の何れかに記載の反射材。
- 前記白色無機フィラー粉末が、酸化チタン、アルミナ、硫酸バリウム、マグネシア、チッ化アルミニウム、チッ化ホウ素、チタン酸バリウム、カオリン、タルク、炭酸カルシウム、酸化亜鉛、シリカ及び粉末アルミニウムから選ばれる少なくとも1種の光反射剤であることを特徴とする請求項1〜9の何れかに記載の反射材。
- 前記白色無機フィラー粉末が、シランカップリング処理されて前記シリコーン樹脂中に分散されたものであることを特徴とする請求項10に記載の反射材。
- 前記白色無機フィラー粉末が、アナターゼ型若しくはルチル型の前記酸化チタン、前記アルミナ、又は前記硫酸バリウムであることを特徴とする請求項10に記載の反射材。
- 前記酸化チタンが、Al2O3、ZrO2、及び/又はSiO2で表面処理されて被覆されていることを特徴とする請求項12に記載の反射材。
- 前記白色無機フィラー粉末が、平均粒径0.05〜50μmであって、前記シリコーン樹脂中に、2〜80質量%含有されていることを特徴とする請求項10に記載の反射材。
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CN103797587B (zh) * | 2012-03-29 | 2016-08-17 | 大日本印刷株式会社 | 太阳能电池用集电片及使用其的太阳能电池模块 |
KR20130111155A (ko) * | 2012-03-30 | 2013-10-10 | 주식회사 엘지화학 | 유기전자소자용 기판 |
US20130273259A1 (en) | 2012-04-13 | 2013-10-17 | Mélanie Emilie Céline Depardieu | Marking coating |
JP2013226769A (ja) * | 2012-04-27 | 2013-11-07 | Asahi Rubber Inc | 白色反射膜付基材、それを用いた白色反射膜付カバーレイシート及び白色反射膜付回路基板 |
JP5234209B1 (ja) * | 2012-07-20 | 2013-07-10 | 東洋インキScホールディングス株式会社 | 太陽電池封止材用樹脂組成物 |
JP2014053582A (ja) * | 2012-08-07 | 2014-03-20 | Toshiba Lighting & Technology Corp | 発光モジュール及び照明装置 |
US20140043814A1 (en) * | 2012-08-07 | 2014-02-13 | Toshiba Lighting & Technology Corporation | Light emitting module and lighting system |
JP6060578B2 (ja) * | 2012-09-14 | 2017-01-18 | 日亜化学工業株式会社 | 発光装置 |
US9203002B2 (en) * | 2012-10-19 | 2015-12-01 | Osram Sylvania Inc. | Ultraviolet reflective silicone compositions, reflectors, and light sources incorporating the same |
JP2014095038A (ja) * | 2012-11-09 | 2014-05-22 | Idemitsu Kosan Co Ltd | 反射材用組成物及びこれを用いた光半導体発光装置 |
EP2938678B1 (en) | 2012-12-27 | 2018-12-19 | Dow Silicones Corporation | Composition for forming an article having excellent reflectance and flame retardant properties and article formed therefrom |
JPWO2014109293A1 (ja) * | 2013-01-10 | 2017-01-19 | コニカミノルタ株式会社 | Led装置およびその製造に用いられる塗布液 |
JP6105966B2 (ja) * | 2013-02-15 | 2017-03-29 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
TWI616489B (zh) * | 2013-02-18 | 2018-03-01 | 可應用於發光二極體元件之聚矽氧烷組合物、基座配方及其發光二極體元件 | |
CN104955905B (zh) * | 2013-02-27 | 2017-11-28 | 株式会社朝日橡胶 | 白色反射膜用油墨、粉体涂料、白色反射膜及其制造方法、光源支架及照明器具遮光罩 |
US9115870B2 (en) | 2013-03-14 | 2015-08-25 | Cree, Inc. | LED lamp and hybrid reflector |
CN105051113B (zh) * | 2013-03-15 | 2018-08-10 | 美国陶氏有机硅公司 | 包含碱土金属的含有芳基基团的硅氧烷组合物 |
US9695321B2 (en) * | 2013-06-06 | 2017-07-04 | Philips Lighting Holding B.V. | Reflective composition |
EP3016742A4 (en) | 2013-07-05 | 2017-09-06 | Nitto Denko Corporation | Photocatalyst sheet |
JP6301602B2 (ja) * | 2013-07-22 | 2018-03-28 | ローム株式会社 | パワーモジュールおよびその製造方法 |
US9666733B2 (en) | 2013-09-04 | 2017-05-30 | Hyeon Woo AHN | Solar cell using printed circuit board |
EP2846361B1 (en) * | 2013-09-04 | 2020-05-13 | SOFTPV Inc. | Solar cell using printed circuit board |
JP5954295B2 (ja) * | 2013-10-28 | 2016-07-20 | 住友電気工業株式会社 | フラットケーブルとその製造方法 |
CN105705200A (zh) * | 2013-11-12 | 2016-06-22 | 皮奇泰克株式会社 | Led垫、用于制造led垫的方法以及包括led垫的个人用治疗器 |
JP6244857B2 (ja) * | 2013-11-26 | 2017-12-13 | 日亜化学工業株式会社 | 発光装置 |
CN104730606A (zh) * | 2013-12-24 | 2015-06-24 | 鸿富锦精密工业(深圳)有限公司 | 光反射片及其制造方法 |
JP2015138704A (ja) * | 2014-01-23 | 2015-07-30 | スリーエム イノベイティブ プロパティズ カンパニー | 発光素子モジュール |
CN104804660B (zh) * | 2014-01-23 | 2017-03-15 | 台虹科技股份有限公司 | 具耐高温性及高反射率的印刷电路板用覆盖保护胶片 |
JP6332787B2 (ja) * | 2014-02-17 | 2018-05-30 | 住友電工プリントサーキット株式会社 | カバーレイ及びプリント配線板 |
WO2015126431A1 (en) * | 2014-02-24 | 2015-08-27 | Empire Technology Development Llc | Increased interlayer adhesions of three-dimensional printed articles |
US10743412B2 (en) * | 2014-02-27 | 2020-08-11 | Shin-Etsu Chemical Co., Ltd. | Substrate and semiconductor apparatus |
EP2916628A1 (en) * | 2014-03-07 | 2015-09-09 | Taiflex Scientific Co., Ltd. | Cover layer with high thermal resistance and high reflectivity for a printed circuit board |
CN106103094B (zh) * | 2014-03-07 | 2018-11-09 | 富士胶片株式会社 | 带有装饰材料的基板及其制造方法、触控面板、以及信息显示装置 |
US20150257296A1 (en) * | 2014-03-07 | 2015-09-10 | Taiflex Scientific Co., Ltd. | Cover layer with high thermal resistance and high reflectivity for a printed circuit board |
CN103895615A (zh) * | 2014-03-14 | 2014-07-02 | 金少青 | 一种汽车大灯翻新工艺 |
FR3019314B1 (fr) * | 2014-03-28 | 2017-08-11 | Gaggione Sas | Collimateur de lumiere |
TWI651017B (zh) * | 2014-03-28 | 2019-02-11 | 日商日產化學工業股份有限公司 | 表面粗化方法 |
US9671085B2 (en) | 2014-04-22 | 2017-06-06 | Dow Corning Corporation | Reflector for an LED light source |
JP2015216353A (ja) * | 2014-04-23 | 2015-12-03 | 日東電工株式会社 | 波長変換接合部材、波長変換放熱部材および発光装置 |
US9799812B2 (en) | 2014-05-09 | 2017-10-24 | Kyocera Corporation | Light emitting element mounting substrate and light emitting device |
US20170077357A1 (en) * | 2014-05-15 | 2017-03-16 | 3M Innovative Properties Company | Flexible circuit on reflective substrate |
CN105322433B (zh) * | 2014-05-28 | 2020-02-04 | 深圳光峰科技股份有限公司 | 波长转换装置及其相关发光装置 |
JP2016009690A (ja) * | 2014-06-20 | 2016-01-18 | 大日本印刷株式会社 | 実装基板および実装基板の製造方法 |
JP2016009689A (ja) * | 2014-06-20 | 2016-01-18 | 大日本印刷株式会社 | 実装基板の製造方法および実装基板 |
JP6484972B2 (ja) * | 2014-06-20 | 2019-03-20 | 大日本印刷株式会社 | 発光部品が実装された実装基板、および発光部品が実装される配線基板 |
US9356185B2 (en) | 2014-06-20 | 2016-05-31 | Heptagon Micro Optics Pte. Ltd. | Compact light sensing modules including reflective surfaces to enhance light collection and/or emission, and methods of fabricating such modules |
RU2571176C1 (ru) * | 2014-07-14 | 2015-12-20 | Гиа Маргович Гвичия | Светодиодная матрица |
JP6425945B2 (ja) * | 2014-08-21 | 2018-11-21 | 東洋アルミニウム株式会社 | インターコネクタ用光拡散部材及びこれを備える太陽電池用インターコネクタ、並びに太陽電池モジュール |
JP6634668B2 (ja) * | 2014-08-29 | 2020-01-22 | 大日本印刷株式会社 | 実装基板の製造方法および実装基板 |
JP6579419B2 (ja) * | 2014-09-03 | 2019-09-25 | 大日本印刷株式会社 | 配線基板および実装基板 |
JP6590445B2 (ja) * | 2014-09-10 | 2019-10-16 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
JP6378020B2 (ja) * | 2014-09-26 | 2018-08-22 | 株式会社T&K Toka | 積層シート |
KR20160038568A (ko) * | 2014-09-30 | 2016-04-07 | (주)포인트엔지니어링 | 복수의 곡면 캐비티를 포함하는 칩 기판 |
EP3218940A4 (en) * | 2014-10-27 | 2018-08-15 | Henkel AG & Co. KGaA | A method for manufacturing an optical semiconductor device and a silicone resin composition therefor |
CN105732118B (zh) * | 2014-12-11 | 2020-03-24 | 深圳光峰科技股份有限公司 | 漫反射材料、漫反射层、波长转换装置以及光源系统 |
KR101640588B1 (ko) * | 2015-01-13 | 2016-07-19 | 주식회사 베이스 | 광균일도가 우수한 led용 색변환 유리 |
DE102015001902A1 (de) * | 2015-02-18 | 2016-08-18 | Continental Reifen Deutschland Gmbh | Verfahren zur Verbesserung der Haftung zwischen einem Verstärkungselement und einem elastomeren Matrixmaterial |
JP2016171199A (ja) * | 2015-03-12 | 2016-09-23 | イビデン株式会社 | 発光素子搭載基板 |
WO2016157587A1 (ja) * | 2015-03-31 | 2016-10-06 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
WO2016172290A1 (en) * | 2015-04-21 | 2016-10-27 | Salk Institute For Biological Studies | Methods of treating lipodystrophy using fgf-1 compounds |
CN106206904B (zh) * | 2015-04-29 | 2019-05-03 | 深圳光峰科技股份有限公司 | 一种波长转换装置、荧光色轮及发光装置 |
JP6596920B2 (ja) * | 2015-05-21 | 2019-10-30 | コニカミノルタ株式会社 | 音響レンズ、その製造方法、超音波探触子および超音波撮像装置 |
KR101788381B1 (ko) * | 2015-06-18 | 2017-10-20 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
JP7046608B2 (ja) * | 2015-06-18 | 2022-04-04 | ヌシル テクノロジー エルエルシー | 高強度シリコーンエラストマー及びそのための組成物 |
CN106317894B (zh) * | 2015-06-30 | 2019-03-29 | 比亚迪股份有限公司 | 有机硅组合物、反光涂层及其制备方法与包括其的光伏组件 |
CN105086381B (zh) * | 2015-07-31 | 2017-04-26 | 深圳市兴盛迪新材料有限公司 | 聚对苯二甲酸丁二醇酯复合材料及其制备方法 |
JP6237826B2 (ja) * | 2015-09-30 | 2017-11-29 | 日亜化学工業株式会社 | パッケージ及び発光装置、並びにそれらの製造方法 |
JP6718132B2 (ja) * | 2015-11-06 | 2020-07-08 | セイコーエプソン株式会社 | 三次元構造物の製造方法及びその製造装置 |
JP2017088776A (ja) * | 2015-11-13 | 2017-05-25 | 信越化学工業株式会社 | 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光学半導体装置 |
KR102450574B1 (ko) | 2015-11-19 | 2022-10-11 | 삼성전자주식회사 | 반도체 패키지용 본딩 와이어 및 이를 포함하는 반도체 패키지 |
DE102016202103A1 (de) * | 2016-02-11 | 2017-08-17 | Osram Gmbh | Verfahren zum Herstellen eines Leuchtmoduls, Leuchtmodul sowie Verwendung eines Optikelements in einem Leuchtmodul |
WO2017147311A1 (en) * | 2016-02-23 | 2017-08-31 | Advanced Environmental Recycling Technologies, Inc. | Compositions and methods for reducing the surface temperature of composite articles |
JP6089144B1 (ja) * | 2016-03-30 | 2017-03-01 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
JP6566121B2 (ja) * | 2016-03-30 | 2019-08-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法並びに光半導体装置 |
US10644210B2 (en) * | 2016-04-01 | 2020-05-05 | Nichia Corporation | Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member |
JP2017191839A (ja) * | 2016-04-12 | 2017-10-19 | 株式会社カネカ | 赤外led発光装置の半導体パッケージ用熱硬化性樹脂組成物、タブレット、半導体パッケージ、赤外led発光装置。 |
CN107819047B (zh) * | 2016-05-13 | 2019-06-21 | 广东大粤新能源科技股份有限公司 | 一种新型太阳能光伏组件 |
JP6658295B2 (ja) * | 2016-05-19 | 2020-03-04 | 株式会社オートネットワーク技術研究所 | 止水用シリコーンゴム組成物、止水用シリコーンゴム成形体およびワイヤーハーネス |
US10074626B2 (en) * | 2016-06-06 | 2018-09-11 | Shin-Etsu Chemical Co., Ltd. | Wafer laminate and making method |
CN105949998B (zh) * | 2016-06-12 | 2018-12-04 | 上海宜瓷龙新材料股份有限公司 | 用于太阳能背板高反射率的陶瓷涂料及其制备方法 |
CN106085214B (zh) * | 2016-06-12 | 2019-01-11 | 上海宜瓷龙新材料股份有限公司 | 一种用于玻璃基太阳能背板的陶瓷涂料及其制备方法 |
US20200313049A1 (en) * | 2016-06-21 | 2020-10-01 | Soraa, Inc. | Light emitting diode package |
CN107546301B (zh) * | 2016-06-29 | 2019-12-06 | 江西省晶能半导体有限公司 | 一种白胶、led灯珠及其的封装方法 |
JP7065381B2 (ja) * | 2016-07-19 | 2022-05-12 | パナソニックIpマネジメント株式会社 | 光反射体、ベース体、発光装置及びベース体の製造方法 |
KR102543179B1 (ko) * | 2016-08-22 | 2023-06-14 | 삼성전자주식회사 | 발광다이오드 모듈 제조방법 |
WO2018047757A1 (ja) * | 2016-09-07 | 2018-03-15 | 住友化学株式会社 | 波長変換材料含有シリコーン樹脂組成物および波長変換材料含有シート |
US9837390B1 (en) * | 2016-11-07 | 2017-12-05 | Corning Incorporated | Systems and methods for creating fluidic assembly structures on a substrate |
CN106542820A (zh) * | 2016-11-08 | 2017-03-29 | 泰州职业技术学院 | 一种用于降低沥青路面温度的红外热辐射功能降温粉体 |
JP6536560B2 (ja) | 2016-12-27 | 2019-07-03 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
CN106775167B (zh) * | 2017-01-13 | 2020-12-18 | 京东方科技集团股份有限公司 | 触控基板及其制备方法、显示装置 |
DE102017101729A1 (de) * | 2017-01-30 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
JP6867203B2 (ja) * | 2017-03-17 | 2021-04-28 | 旭化成株式会社 | 硬化性組成物 |
CN110573579A (zh) * | 2017-04-19 | 2019-12-13 | 科思创有限公司 | 反射涂层和用于将其施加到聚合物基材上的模内方法 |
US10153416B1 (en) * | 2017-05-23 | 2018-12-11 | Radiant Choice Limited | Package body and light emitting device using same |
EP3637158A4 (en) * | 2017-06-06 | 2020-06-10 | Panasonic Intellectual Property Management Co., Ltd. | WAVELENGTH CONVERTER AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING DEVICE USING THE WAVELENGTH CONVERTER |
JP6965040B2 (ja) | 2017-06-26 | 2021-11-10 | テクノUmg株式会社 | 熱可塑性樹脂組成物並びにその樹脂成形品及び塗装加工品 |
WO2019003775A1 (ja) * | 2017-06-29 | 2019-01-03 | 京セラ株式会社 | 回路基板およびこれを備える発光装置 |
DE102017117150A1 (de) * | 2017-07-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil |
DE102017117441A1 (de) * | 2017-08-01 | 2019-02-07 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements |
TWI633645B (zh) * | 2017-08-04 | 2018-08-21 | 鼎展電子股份有限公司 | 可撓性led元件與可撓性led顯示面板 |
JP6988295B2 (ja) * | 2017-09-14 | 2022-01-05 | 京セラドキュメントソリューションズ株式会社 | 照明装置及び該照明装置を備えた画像読取装置 |
WO2019064590A1 (ja) * | 2017-09-29 | 2019-04-04 | 日立化成株式会社 | 波長変換部材、バックライトユニット、画像表示装置、波長変換用樹脂組成物及び波長変換用樹脂硬化物 |
US10897824B2 (en) * | 2017-10-30 | 2021-01-19 | Baker Hughes, A Ge Company, Llc | Encapsulation of downhole microelectronics and method the same |
KR102542426B1 (ko) * | 2017-12-20 | 2023-06-12 | 삼성전자주식회사 | 파장변환 필름과, 이를 구비한 반도체 발광장치 |
TWI642047B (zh) * | 2018-01-26 | 2018-11-21 | 鼎展電子股份有限公司 | 可撓性微發光二極體顯示模組 |
CN110120623B (zh) * | 2018-02-05 | 2021-06-08 | 深圳光峰科技股份有限公司 | 密封件及发光装置 |
CN110299441A (zh) * | 2018-03-22 | 2019-10-01 | 中国科学院半导体研究所 | 可提高led出光效率的硅基反射圈、制备方法及led器件 |
JP6992654B2 (ja) * | 2018-03-30 | 2022-01-13 | Jnc株式会社 | 積層シート、放熱部品、発光デバイス、発光装置 |
JP6680311B2 (ja) | 2018-06-04 | 2020-04-15 | 日亜化学工業株式会社 | 発光装置および面発光光源 |
KR102567653B1 (ko) * | 2018-06-11 | 2023-08-17 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 표시 장치 |
JP7206746B2 (ja) * | 2018-09-26 | 2023-01-18 | 富士フイルムビジネスイノベーション株式会社 | 定着部材、定着装置、プロセスカートリッジ及び画像形成装置 |
CN111087819A (zh) * | 2018-10-23 | 2020-05-01 | 北京科化新材料科技有限公司 | 一种液体硅材料复合物及其制备方法和应用 |
US20200163209A1 (en) * | 2018-11-20 | 2020-05-21 | Wen Yao Chang | Circuit board with substrate made of silicone |
WO2020111180A1 (ja) * | 2018-11-30 | 2020-06-04 | デンカ株式会社 | 積層体 |
EP3892437B1 (en) * | 2018-12-04 | 2023-08-23 | Harima Chemicals, Incorporated | Hard coating layer-laminated mold resin and method for producing same |
CN113228314A (zh) | 2018-12-27 | 2021-08-06 | 电化株式会社 | 荧光体基板、发光基板以及照明装置 |
JP7425750B2 (ja) | 2018-12-27 | 2024-01-31 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
CN113228313A (zh) | 2018-12-27 | 2021-08-06 | 电化株式会社 | 荧光体基板、发光基板以及照明装置 |
WO2020137763A1 (ja) | 2018-12-27 | 2020-07-02 | デンカ株式会社 | 蛍光体基板、発光基板及び照明装置 |
EP3905347B1 (en) | 2018-12-27 | 2024-02-21 | Denka Company Limited | Light-emitting substrate, and lighting device |
KR102127425B1 (ko) * | 2019-01-10 | 2020-06-26 | 미르텍알앤디 주식회사 | 마이크로 콘택트 핀 조립체 |
CN109825212A (zh) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | Led用高反射性超薄覆盖膜及其制备方法 |
JP7111041B2 (ja) * | 2019-03-25 | 2022-08-02 | 信越化学工業株式会社 | 積層体の製造方法 |
CN113614635A (zh) | 2019-04-19 | 2021-11-05 | 美题隆精密光学(上海)有限公司 | 用于波长转换装置的耐高温反射层 |
KR102149426B1 (ko) * | 2019-05-13 | 2020-08-31 | 주식회사 레다즈 | 엘씨디 모듈 및 그 제조방법 |
US11447659B2 (en) * | 2019-06-24 | 2022-09-20 | The Johns Hopkins University | Low solar absorptance coatings |
CN110469787A (zh) * | 2019-08-19 | 2019-11-19 | 深圳市百柔新材料技术有限公司 | 一种可印制led背光板的制作方法 |
JP7121294B2 (ja) * | 2019-09-10 | 2022-08-18 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN110964323A (zh) * | 2019-10-30 | 2020-04-07 | 安徽康宁油脂科技有限公司 | 一种高性能工业复合甘油及其制备方法 |
JP7503288B2 (ja) * | 2019-11-11 | 2024-06-20 | 株式会社朝日ラバー | シリコーン樹脂製紫外線反射保護基材、その製造方法、及びそれに用いる原材料組成物 |
JPWO2021117400A1 (ja) * | 2019-12-11 | 2021-06-17 | ||
DE102019134728A1 (de) * | 2019-12-17 | 2021-06-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optische komponente, optoelektronisches halbleiterbauteil und verfahren zur herstellung einer optischen komponente |
US11842944B2 (en) * | 2019-12-26 | 2023-12-12 | Intel Corporation | IC assemblies including die perimeter frames suitable for containing thermal interface materials |
JP7343220B2 (ja) * | 2020-01-20 | 2023-09-12 | 岡本硝子株式会社 | レジストインク |
JPWO2021166433A1 (ja) | 2020-02-18 | 2021-08-26 | ||
WO2021166431A1 (ja) | 2020-02-18 | 2021-08-26 | 富士フイルム株式会社 | 光源ユニット、表示装置、及び光源ユニット製造装置 |
CN111552166B (zh) * | 2020-04-03 | 2021-05-25 | 维沃移动通信有限公司 | 电子设备、交互方法及装置 |
JP7337025B2 (ja) * | 2020-05-01 | 2023-09-01 | 株式会社小糸製作所 | 車両用灯具 |
KR20230015314A (ko) * | 2020-05-22 | 2023-01-31 | 도레이 카부시키가이샤 | Led 기판, 적층체, 및 led 기판의 제조 방법 |
US11865200B2 (en) | 2020-10-02 | 2024-01-09 | Michael E. Stein | Chemical composition and related methods |
US20230251477A1 (en) * | 2020-10-05 | 2023-08-10 | Asahi Rubber Inc. | Ultraviolet led optical member |
CN112251088B (zh) * | 2020-10-22 | 2022-03-11 | 重庆建谊祥科技有限公司 | 双氟处理液、制备方法及镁合金建筑模板表面处理方法 |
CN112266571A (zh) * | 2020-10-26 | 2021-01-26 | 东莞市鑫聚光电科技股份有限公司 | 一种pdlc调光膜 |
CN114843253A (zh) * | 2021-02-02 | 2022-08-02 | 光宝科技股份有限公司 | 发光装置 |
CN114958063B (zh) * | 2021-02-25 | 2023-11-17 | 合肥京东方光电科技有限公司 | 组合物、基板及反光层的制备方法 |
CN113443487B (zh) * | 2021-08-30 | 2021-11-23 | 常州欣盛半导体技术股份有限公司 | Fpc烘烤箱用转向调节装置 |
CN115212591B (zh) * | 2021-09-27 | 2023-09-29 | 江门市尚逸家居用品有限公司 | 一种拼图玩具组件 |
CN114023899A (zh) * | 2021-10-25 | 2022-02-08 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制备方法 |
CN115248469B (zh) * | 2022-07-11 | 2023-09-12 | 中国科学院上海技术物理研究所 | 一种长波红外宽波段吸收结构 |
CN115407554A (zh) * | 2022-08-16 | 2022-11-29 | 昆山锦林光电材料有限公司 | 一种小型led背光模组反光白胶封装结构 |
CN115418164B (zh) * | 2022-09-16 | 2024-03-26 | 奥创特新(苏州)科技有限公司 | 一种高温热反射材料及其施工工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06340118A (ja) * | 1993-05-31 | 1994-12-13 | Kyocera Corp | 画像装置及びその製造方法 |
JP2006124600A (ja) * | 2004-11-01 | 2006-05-18 | Teijin Chem Ltd | 光高反射性ポリカーボネート樹脂組成物およびその製造方法 |
WO2008023605A1 (fr) * | 2006-08-23 | 2008-02-28 | Mitsui Chemicals, Inc. | Corps réfléchissant la lumière et source de lumière le comprenant |
JP2009164275A (ja) * | 2007-12-28 | 2009-07-23 | Asahi Rubber:Kk | シリコーン樹脂基材 |
Family Cites Families (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4087585A (en) * | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
JPS61103931A (ja) * | 1984-10-26 | 1986-05-22 | Shin Etsu Polymer Co Ltd | シリコ−ンゴム成形体の製造方法 |
US4544696A (en) * | 1984-10-29 | 1985-10-01 | Sws Silicones Corporation | Silicone elastomers having thermally conductive properties |
JPS62223722A (ja) * | 1986-03-25 | 1987-10-01 | Canon Inc | 光変調素子用材料 |
JP3029680B2 (ja) * | 1991-01-29 | 2000-04-04 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノペンタシロキサンおよびその製造方法 |
JPH05315654A (ja) * | 1992-05-08 | 1993-11-26 | Denki Kagaku Kogyo Kk | 発光ダイオードランプ |
JPH06329803A (ja) * | 1993-05-24 | 1994-11-29 | Shin Etsu Chem Co Ltd | 電気接点障害のないシリコーン製品 |
US5599894A (en) * | 1994-06-07 | 1997-02-04 | Shin-Etsu Chemical Co., Ltd. | Silicone gel compositions |
JP3031184B2 (ja) * | 1994-11-22 | 2000-04-10 | 株式会社コスモテック | シリコーンゴム粘着シート及びその製造方法 |
JPH1077413A (ja) * | 1996-08-30 | 1998-03-24 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性シリコーンゴム組成物 |
US6468638B2 (en) | 1999-03-16 | 2002-10-22 | Alien Technology Corporation | Web process interconnect in electronic assemblies |
JP3704286B2 (ja) | 1999-11-17 | 2005-10-12 | 信越化学工業株式会社 | 酸化チタン充填付加反応硬化型シリコーンゴム組成物及びその硬化物 |
JP4735910B2 (ja) * | 2000-09-28 | 2011-07-27 | Dic株式会社 | 水性インク組成物 |
JP2002258020A (ja) * | 2001-02-19 | 2002-09-11 | Three M Innovative Properties Co | 反射シート及び反射膜 |
JP2002265901A (ja) * | 2001-03-15 | 2002-09-18 | Fujimori Kogyo Co Ltd | 剥離シートの製造方法 |
JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
US6632892B2 (en) * | 2001-08-21 | 2003-10-14 | General Electric Company | Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst |
JP2003185813A (ja) * | 2001-12-21 | 2003-07-03 | Mitsui Chemicals Inc | 反射体およびその用途 |
JP4121874B2 (ja) | 2002-03-13 | 2008-07-23 | 日世株式会社 | 生分解性成形物の製造方法およびそれに用いる成形型 |
JP4180844B2 (ja) | 2002-06-06 | 2008-11-12 | 昭和電工株式会社 | 硬化性難燃組成物、その硬化物及びその製造方法 |
US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
US7445769B2 (en) * | 2002-10-31 | 2008-11-04 | Cadbury Adams Usa Llc | Compositions for removing stains from dental surfaces and methods of making and using the same |
JP4774201B2 (ja) | 2003-10-08 | 2011-09-14 | 日亜化学工業株式会社 | パッケージ成形体及び半導体装置 |
WO2006015379A2 (en) * | 2004-08-02 | 2006-02-09 | Cornell Research Foundation, Inc. | Electron spin resonance microscope for imaging with micron resolution |
JP4803342B2 (ja) * | 2004-10-19 | 2011-10-26 | 信越化学工業株式会社 | 耐擦傷性表面被膜形成用シリコーンコーティング組成物及びそれを用いた被覆物品 |
JP4634810B2 (ja) * | 2005-01-20 | 2011-02-16 | 信越化学工業株式会社 | シリコーン封止型led |
EP1845133B1 (en) * | 2005-01-24 | 2015-10-14 | Momentive Performance Materials Japan LLC | Silicone composition for encapsulating luminescent element and luminescent device |
AT501491B1 (de) * | 2005-02-18 | 2007-03-15 | Knorr Bremse Gmbh | Dichtungsprofil |
JP4371234B2 (ja) | 2005-03-03 | 2009-11-25 | 信越化学工業株式会社 | フレキシブル金属箔ポリイミド積層板 |
TWI400817B (zh) * | 2005-04-08 | 2013-07-01 | Nichia Corp | 具有藉由網版印刷形成之矽酮樹脂層的發光裝置 |
JP4634856B2 (ja) | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
TWI256737B (en) | 2005-05-19 | 2006-06-11 | Pi-Fu Yang | One-block light-emitting device and manufacturing method thereof |
JP2006343445A (ja) | 2005-06-08 | 2006-12-21 | Mitsubishi Engineering Plastics Corp | 光反射材及びその製造法 |
WO2007015426A1 (ja) * | 2005-08-04 | 2007-02-08 | Nichia Corporation | 発光装置及びその製造方法並びに成形体及び封止部材 |
US7928457B2 (en) * | 2005-09-22 | 2011-04-19 | Mitsubishi Chemical Corporation | Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member |
JP5066333B2 (ja) * | 2005-11-02 | 2012-11-07 | シチズン電子株式会社 | Led発光装置。 |
US8017687B2 (en) * | 2005-11-15 | 2011-09-13 | Momentive Performance Materials Inc. | Swollen silicone composition and process of producing same |
US7863361B2 (en) * | 2005-11-15 | 2011-01-04 | Momentive Performance Materials Inc. | Swollen silicone composition, process of producing same and products thereof |
JP4518013B2 (ja) * | 2005-12-14 | 2010-08-04 | Tdk株式会社 | 電子部品 |
WO2007072659A1 (ja) | 2005-12-20 | 2007-06-28 | Toshiba Lighting & Technology Corporation | 発光装置 |
US8263725B2 (en) * | 2005-12-26 | 2012-09-11 | Kaneka Corporation | Curable composition |
WO2007074892A1 (ja) | 2005-12-26 | 2007-07-05 | Teijin Limited | 透明フィルム |
JP5232369B2 (ja) * | 2006-02-03 | 2013-07-10 | 日立化成株式会社 | 光半導体素子搭載用パッケージ基板の製造方法およびこれを用いた光半導体装置の製造方法 |
JP2007270054A (ja) | 2006-03-31 | 2007-10-18 | Jsr Corp | 金属酸化物微粒子含有ポリシロキサン組成物およびその製造方法 |
JP2009540562A (ja) * | 2006-06-05 | 2009-11-19 | ダウ・コーニング・コーポレイション | 電子パッケージ及びその製造方法 |
EP2056364A4 (en) * | 2006-08-11 | 2013-07-24 | Mitsubishi Chem Corp | LIGHTING APPARATUS |
KR101523482B1 (ko) * | 2006-08-22 | 2015-05-28 | 미쓰비시 가가꾸 가부시키가이샤 | 반도체 디바이스용 부재, 그리고 반도체 디바이스용 부재 형성액 및 반도체 디바이스용 부재의 제조 방법, 그리고 그것을 이용한 반도체 디바이스용 부재 형성액, 형광체 조성물, 반도체 발광 디바이스, 조명 장치, 및 화상 표시 장치 |
EP2056277B1 (en) | 2006-08-22 | 2011-10-26 | Konica Minolta Holdings, Inc. | Display element |
EP2066757A1 (en) * | 2006-10-05 | 2009-06-10 | Dow Corning Corporation | Silicone resin film and method of preparing same |
US20080117619A1 (en) | 2006-11-21 | 2008-05-22 | Siew It Pang | Light source utilizing a flexible circuit carrier and flexible reflectors |
JP2008143981A (ja) | 2006-12-07 | 2008-06-26 | Three M Innovative Properties Co | 光反射性樹脂組成物、発光装置及び光学表示装置 |
US20080144322A1 (en) * | 2006-12-15 | 2008-06-19 | Aizar Abdul Karim Norfidathul | LED Light Source Having Flexible Reflectors |
JP2008159713A (ja) | 2006-12-21 | 2008-07-10 | Momentive Performance Materials Japan Kk | 発光装置 |
JP2008187030A (ja) | 2007-01-30 | 2008-08-14 | Stanley Electric Co Ltd | 発光装置 |
JP2008222828A (ja) * | 2007-03-12 | 2008-09-25 | Momentive Performance Materials Japan Kk | 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置 |
JP2008225326A (ja) * | 2007-03-15 | 2008-09-25 | Mitsubishi Plastics Ind Ltd | 反射フィルム及び反射板 |
JP4973279B2 (ja) | 2007-03-29 | 2012-07-11 | 豊田合成株式会社 | 発光装置及びその製造方法 |
JP2008251316A (ja) * | 2007-03-30 | 2008-10-16 | Hitachi Ltd | プラズマディスプレイパネル及びその製造方法 |
JP4771179B2 (ja) * | 2007-05-31 | 2011-09-14 | 東芝ライテック株式会社 | 照明装置 |
JP2009021394A (ja) | 2007-07-12 | 2009-01-29 | Nitto Denko Corp | 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置 |
JP2009046658A (ja) * | 2007-07-23 | 2009-03-05 | Sony Corp | 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置 |
US20090032829A1 (en) | 2007-07-30 | 2009-02-05 | Tong Fatt Chew | LED Light Source with Increased Thermal Conductivity |
US7968899B2 (en) | 2007-08-27 | 2011-06-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED light source having improved resistance to thermal cycling |
JP5315654B2 (ja) | 2007-09-20 | 2013-10-16 | 横浜ゴム株式会社 | 空気入りタイヤ |
JP2009103915A (ja) * | 2007-10-23 | 2009-05-14 | Fuji Xerox Co Ltd | 光導波路フィルム及びその製造方法、並びに、光送受信モジュール |
JP2009135485A (ja) * | 2007-11-07 | 2009-06-18 | Mitsubishi Chemicals Corp | 半導体発光装置及びその製造方法 |
US8017246B2 (en) * | 2007-11-08 | 2011-09-13 | Philips Lumileds Lighting Company, Llc | Silicone resin for protecting a light transmitting surface of an optoelectronic device |
JP2009129801A (ja) * | 2007-11-27 | 2009-06-11 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
JP4623322B2 (ja) * | 2007-12-26 | 2011-02-02 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法 |
JP2009173773A (ja) * | 2008-01-24 | 2009-08-06 | Toshiba Corp | シリコーン樹脂組成物および半導体装置 |
JP5064254B2 (ja) * | 2008-01-30 | 2012-10-31 | 日東電工株式会社 | 光半導体素子封止用樹脂シートおよび光半導体装置 |
JP2009224538A (ja) * | 2008-03-17 | 2009-10-01 | Citizen Holdings Co Ltd | 半導体発光装置 |
JP2009235279A (ja) * | 2008-03-27 | 2009-10-15 | Shin Etsu Chem Co Ltd | 熱伝導性成形体およびその製造方法 |
JP2009244551A (ja) | 2008-03-31 | 2009-10-22 | Konica Minolta Business Technologies Inc | 画像表示装置用表示粒子および画像表示装置 |
JP5355030B2 (ja) * | 2008-04-24 | 2013-11-27 | シチズンホールディングス株式会社 | Led光源及びled光源の色度調整方法 |
JP4966915B2 (ja) * | 2008-05-09 | 2012-07-04 | 株式会社タイカ | 熱伝導性シート、熱伝導性シート積層体及びその製造方法 |
JP2009275196A (ja) * | 2008-05-19 | 2009-11-26 | Sony Corp | 硬化性樹脂材料組成物、光学材料、発光装置及びその製造方法、並びに電子デバイス |
JP2010004035A (ja) * | 2008-05-22 | 2010-01-07 | Mitsubishi Chemicals Corp | 半導体発光装置、照明装置、および画像表示装置 |
JP5289835B2 (ja) | 2008-06-25 | 2013-09-11 | シャープ株式会社 | 発光装置およびその製造方法 |
US9933550B2 (en) | 2008-12-03 | 2018-04-03 | Nippon Steel & Sumitomo Metal Corporation | Coated metal material and method of production of same |
JP2010232252A (ja) | 2009-03-26 | 2010-10-14 | Unon Giken:Kk | 白色反射層を有するカバーレイフィルム |
JP5230532B2 (ja) * | 2009-05-29 | 2013-07-10 | 三菱樹脂株式会社 | 白色フィルム、金属積層体、led搭載用基板及び光源装置 |
JP5332921B2 (ja) * | 2009-06-05 | 2013-11-06 | 三菱化学株式会社 | 半導体発光装置、照明装置、及び画像表示装置 |
CN102473824B (zh) | 2009-06-26 | 2015-08-05 | 株式会社朝日橡胶 | 白色反射材料及其制造方法 |
-
2010
- 2010-12-24 JP JP2012506782A patent/JP6157118B2/ja active Active
- 2010-12-24 KR KR1020177014956A patent/KR101853598B1/ko active IP Right Grant
- 2010-12-24 JP JP2012506781A patent/JP5519774B2/ja active Active
- 2010-12-24 EP EP10848500.4A patent/EP2551929A4/en not_active Ceased
- 2010-12-24 CN CN201080065663.1A patent/CN102893417B/zh active Active
- 2010-12-24 WO PCT/JP2010/073446 patent/WO2011118109A1/ja active Application Filing
- 2010-12-24 US US13/636,963 patent/US9574050B2/en active Active
- 2010-12-24 EP EP19150557.7A patent/EP3490015A1/en active Pending
- 2010-12-24 WO PCT/JP2010/073445 patent/WO2011118108A1/ja active Application Filing
- 2010-12-24 KR KR1020127027662A patent/KR20130038847A/ko not_active Application Discontinuation
- 2010-12-24 CN CN201610312226.4A patent/CN106025053B/zh active Active
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- 2011-03-23 JP JP2011064492A patent/JP5770502B2/ja active Active
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- 2013-05-21 HK HK13106030.4A patent/HK1179048A1/zh unknown
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- 2014-04-03 JP JP2014077292A patent/JP5836420B2/ja active Active
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- 2017-01-05 US US15/399,058 patent/US10533094B2/en active Active
- 2017-03-28 JP JP2017062562A patent/JP6363756B2/ja active Active
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- 2018-06-28 JP JP2018123430A patent/JP6581695B2/ja active Active
-
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- 2019-08-29 JP JP2019156646A patent/JP6717512B2/ja active Active
- 2019-11-25 US US16/693,471 patent/US11326065B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06340118A (ja) * | 1993-05-31 | 1994-12-13 | Kyocera Corp | 画像装置及びその製造方法 |
JP2006124600A (ja) * | 2004-11-01 | 2006-05-18 | Teijin Chem Ltd | 光高反射性ポリカーボネート樹脂組成物およびその製造方法 |
WO2008023605A1 (fr) * | 2006-08-23 | 2008-02-28 | Mitsui Chemicals, Inc. | Corps réfléchissant la lumière et source de lumière le comprenant |
JP2009164275A (ja) * | 2007-12-28 | 2009-07-23 | Asahi Rubber:Kk | シリコーン樹脂基材 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015516891A (ja) * | 2012-02-10 | 2015-06-18 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | 薄膜ブロックコポリマーの配向性の制御のための無水コポリマートップコート |
JP2015082085A (ja) * | 2013-10-24 | 2015-04-27 | 帝人デュポンフィルム株式会社 | 白色反射フィルム |
JP2014146038A (ja) * | 2014-03-05 | 2014-08-14 | Teijin Dupont Films Japan Ltd | 白色反射フィルム |
JP2017216304A (ja) * | 2016-05-30 | 2017-12-07 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US11430928B2 (en) | 2016-05-31 | 2022-08-30 | Nichia Corporation | Light-emitting device with exposed filter particles |
JP2020107910A (ja) * | 2020-04-01 | 2020-07-09 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
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JP6581695B2 (ja) | 2019-09-25 |
JP2014129549A (ja) | 2014-07-10 |
CN102893417B (zh) | 2016-06-15 |
US20130011617A1 (en) | 2013-01-10 |
EP2551929A1 (en) | 2013-01-30 |
JP2017124632A (ja) | 2017-07-20 |
US10533094B2 (en) | 2020-01-14 |
JP2018180551A (ja) | 2018-11-15 |
EP3490015A1 (en) | 2019-05-29 |
CN102893417A (zh) | 2013-01-23 |
JPWO2011118108A1 (ja) | 2013-07-04 |
US20170114226A1 (en) | 2017-04-27 |
CN106025053A (zh) | 2016-10-12 |
JP6157118B2 (ja) | 2017-07-05 |
JP5770502B2 (ja) | 2015-08-26 |
KR101853598B1 (ko) | 2018-04-30 |
JP6363756B2 (ja) | 2018-07-25 |
JP6717512B2 (ja) | 2020-07-01 |
KR20130038847A (ko) | 2013-04-18 |
JPWO2011118109A1 (ja) | 2013-07-04 |
WO2011118109A1 (ja) | 2011-09-29 |
EP2551929A4 (en) | 2013-08-14 |
US11326065B2 (en) | 2022-05-10 |
JP5519774B2 (ja) | 2014-06-11 |
US20200095430A1 (en) | 2020-03-26 |
US9574050B2 (en) | 2017-02-21 |
CN106025053B (zh) | 2020-01-10 |
KR20170066684A (ko) | 2017-06-14 |
WO2011118108A1 (ja) | 2011-09-29 |
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