WO2008023605A1 - Corps réfléchissant la lumière et source de lumière le comprenant - Google Patents

Corps réfléchissant la lumière et source de lumière le comprenant Download PDF

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Publication number
WO2008023605A1
WO2008023605A1 PCT/JP2007/065842 JP2007065842W WO2008023605A1 WO 2008023605 A1 WO2008023605 A1 WO 2008023605A1 JP 2007065842 W JP2007065842 W JP 2007065842W WO 2008023605 A1 WO2008023605 A1 WO 2008023605A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
light source
layer
reflector
reflectance
Prior art date
Application number
PCT/JP2007/065842
Other languages
English (en)
Japanese (ja)
Inventor
Kimihiko Saitoh
Eiji Hayashishita
Shin Fukuda
Original Assignee
Mitsui Chemicals, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals, Inc. filed Critical Mitsui Chemicals, Inc.
Priority to JP2008530865A priority Critical patent/JPWO2008023605A1/ja
Publication of WO2008023605A1 publication Critical patent/WO2008023605A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Liquid Crystal (AREA)

Abstract

La présente invention concerne un corps réfléchissant la lumière ayant une capacité de courbure et une propriété de réflexion diffuse. Une dissipation thermique suffisante est assurée, même lorsqu'une LED, qui émet de la chaleur, est montée sur une surface réfléchissante. L'invention concerne spécifiquement un corps réfléchissant la lumière qui comprend une base de métal, une couche réfléchissant la lumière formée sur au moins un côté de la base de métal, ayant des propriétés d'isolation électrique et contenant un élastomère contenant au moins un pigment et un matériau de remplissage inorganique, ainsi qu'une couche conductrice formée sur la couche réfléchissant la lumière. Une source de lumière peut être obtenue en montant une diode électroluminescente sur le corps réfléchissant la lumière et un écran à cristaux liquides peut être obtenu en fixant la source lumineuse sur un panneau à cristaux liquides sous forme de dispositif de source de lumière de surface.
PCT/JP2007/065842 2006-08-23 2007-08-14 Corps réfléchissant la lumière et source de lumière le comprenant WO2008023605A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008530865A JPWO2008023605A1 (ja) 2006-08-23 2007-08-14 光反射体、およびそれを含む光源

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-226400 2006-08-23
JP2006226400 2006-08-23

Publications (1)

Publication Number Publication Date
WO2008023605A1 true WO2008023605A1 (fr) 2008-02-28

Family

ID=39106691

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/065842 WO2008023605A1 (fr) 2006-08-23 2007-08-14 Corps réfléchissant la lumière et source de lumière le comprenant

Country Status (3)

Country Link
JP (1) JPWO2008023605A1 (fr)
TW (1) TW200821632A (fr)
WO (1) WO2008023605A1 (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009276396A (ja) * 2008-05-12 2009-11-26 Mitsubishi Plastics Inc 光反射フィルムおよび光反射板
WO2010019459A2 (fr) * 2008-08-11 2010-02-18 E. I. Du Pont De Nemours And Company Boîtier de diode électroluminescente comprenant un fluoropolymère
JP2010263165A (ja) * 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Ｌｅｄ用反射基板及び発光装置
JP2011151248A (ja) * 2010-01-22 2011-08-04 Seiwa Electric Mfg Co Ltd 発光装置及び発光装置の製造方法
JP2011159567A (ja) * 2010-02-03 2011-08-18 Kyoritsu Densho:Kk 街灯用照明器具
WO2011129373A1 (fr) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 Agent adhésif conducteur anisotrope réfléchissant la lumière, et dispositif émetteur de lumière
JP2011216515A (ja) * 2010-03-31 2011-10-27 Casio Computer Co Ltd フレキシブルプリント基板、光源装置及び表示装置
JP2011221518A (ja) * 2010-03-23 2011-11-04 Asahi Rubber Inc 反射材
JP2012059867A (ja) * 2010-09-08 2012-03-22 Teijin Dupont Films Japan Ltd 実装用回路基板
JP2013026416A (ja) * 2011-07-20 2013-02-04 Toyoda Gosei Co Ltd 素子搭載基板及びこれを備えた発光装置
JP2013033976A (ja) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd 半導体発光装置、および車両用前照灯
WO2013061855A1 (fr) * 2011-10-25 2013-05-02 シャープ株式会社 Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision
DE112011102680T5 (de) 2010-08-11 2013-07-04 Mitsubishi Plastics, Inc. Metallfolienlaminat, Substrat zur Befestigung von LED und Lichtquellenvorrichtung
WO2013108547A1 (fr) * 2012-01-16 2013-07-25 富士フイルム株式会社 Substrat réfléchissant destiné à un élément électroluminescent à diodes électroluminescentes et boîtier de diodes électroluminescentes
JP2014064021A (ja) * 2008-05-30 2014-04-10 Sharp Corp 発光装置、面光源および液晶表示装置
WO2017010387A1 (fr) * 2015-07-13 2017-01-19 シャープ株式会社 Dispositif d'éclairage et appareil d'affichage
WO2017059575A1 (fr) * 2015-10-09 2017-04-13 魏晓敏 Diode électroluminescente (led) et module
WO2017090775A1 (fr) * 2015-11-26 2017-06-01 新日鐵住金株式会社 Tôle métallique revêtue
JP2021085808A (ja) * 2019-11-29 2021-06-03 シーシーエス株式会社 光照射装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8084105B2 (en) * 2007-05-23 2011-12-27 Applied Materials, Inc. Method of depositing boron nitride and boron nitride-derived materials
JP5557186B2 (ja) * 2010-01-25 2014-07-23 株式会社朝日Ｆｒ研究所 金属箔付き反射シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174379A (ja) * 1987-01-14 1988-07-18 Toshiba Corp 発光表示装置
JPH0996705A (ja) * 1995-09-29 1997-04-08 Dainippon Printing Co Ltd 光拡散シート及びそれを使用したエッジライト型面光源並びに液晶表示装置
JP2000321551A (ja) * 1999-05-13 2000-11-24 Sharp Corp 液晶表示装置
JP2003185813A (ja) * 2001-12-21 2003-07-03 Mitsui Chemicals Inc 反射体およびその用途
JP2005115337A (ja) * 2003-09-19 2005-04-28 Seiko Epson Corp 電気光学装置、フレキシブル配線基板、電気光学装置の製造方法および電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174379A (ja) * 1987-01-14 1988-07-18 Toshiba Corp 発光表示装置
JPH0996705A (ja) * 1995-09-29 1997-04-08 Dainippon Printing Co Ltd 光拡散シート及びそれを使用したエッジライト型面光源並びに液晶表示装置
JP2000321551A (ja) * 1999-05-13 2000-11-24 Sharp Corp 液晶表示装置
JP2003185813A (ja) * 2001-12-21 2003-07-03 Mitsui Chemicals Inc 反射体およびその用途
JP2005115337A (ja) * 2003-09-19 2005-04-28 Seiko Epson Corp 電気光学装置、フレキシブル配線基板、電気光学装置の製造方法および電子機器

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009276396A (ja) * 2008-05-12 2009-11-26 Mitsubishi Plastics Inc 光反射フィルムおよび光反射板
JP2014064021A (ja) * 2008-05-30 2014-04-10 Sharp Corp 発光装置、面光源および液晶表示装置
US9634203B2 (en) 2008-05-30 2017-04-25 Sharp Kabushiki Kaisha Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device
WO2010019459A2 (fr) * 2008-08-11 2010-02-18 E. I. Du Pont De Nemours And Company Boîtier de diode électroluminescente comprenant un fluoropolymère
WO2010019459A3 (fr) * 2008-08-11 2010-04-22 E. I. Du Pont De Nemours And Company Boîtier de diode électroluminescente comprenant un fluoropolymère
CN102119452A (zh) * 2008-08-11 2011-07-06 纳幕尔杜邦公司 包含含氟聚合物的发光二极管外壳
JP2010263165A (ja) * 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Ｌｅｄ用反射基板及び発光装置
JP2011151248A (ja) * 2010-01-22 2011-08-04 Seiwa Electric Mfg Co Ltd 発光装置及び発光装置の製造方法
JP2011159567A (ja) * 2010-02-03 2011-08-18 Kyoritsu Densho:Kk 街灯用照明器具
JP2011221518A (ja) * 2010-03-23 2011-11-04 Asahi Rubber Inc 反射材
JP2011216515A (ja) * 2010-03-31 2011-10-27 Casio Computer Co Ltd フレキシブルプリント基板、光源装置及び表示装置
US9260634B2 (en) 2010-04-13 2016-02-16 Dexerials Corporation Light-reflective anisotropic conductive adhesive agent, and light emitting device
WO2011129373A1 (fr) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 Agent adhésif conducteur anisotrope réfléchissant la lumière, et dispositif émetteur de lumière
CN102859673A (zh) * 2010-04-13 2013-01-02 索尼化学&信息部件株式会社 光反射性各向异性导电粘接剂及发光装置
JP2011222875A (ja) * 2010-04-13 2011-11-04 Sony Chemical & Information Device Corp 光反射性異方性導電接着剤及び発光装置
US8916894B2 (en) 2010-04-13 2014-12-23 Dexerials Corporation Light-reflective anisotropic conductive adhesive agent, and light emitting device
DE112011102680T5 (de) 2010-08-11 2013-07-04 Mitsubishi Plastics, Inc. Metallfolienlaminat, Substrat zur Befestigung von LED und Lichtquellenvorrichtung
US8710539B2 (en) 2010-08-11 2014-04-29 Mitsubishi Plastics, Inc. Metal foil laminate, substrate for mounting LED, and light source device
JP2012059867A (ja) * 2010-09-08 2012-03-22 Teijin Dupont Films Japan Ltd 実装用回路基板
JP2013026416A (ja) * 2011-07-20 2013-02-04 Toyoda Gosei Co Ltd 素子搭載基板及びこれを備えた発光装置
WO2013061855A1 (fr) * 2011-10-25 2013-05-02 シャープ株式会社 Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision
WO2013108547A1 (fr) * 2012-01-16 2013-07-25 富士フイルム株式会社 Substrat réfléchissant destiné à un élément électroluminescent à diodes électroluminescentes et boîtier de diodes électroluminescentes
JP2013033976A (ja) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd 半導体発光装置、および車両用前照灯
WO2017010387A1 (fr) * 2015-07-13 2017-01-19 シャープ株式会社 Dispositif d'éclairage et appareil d'affichage
WO2017059575A1 (fr) * 2015-10-09 2017-04-13 魏晓敏 Diode électroluminescente (led) et module
WO2017090775A1 (fr) * 2015-11-26 2017-06-01 新日鐵住金株式会社 Tôle métallique revêtue
JPWO2017090775A1 (ja) * 2015-11-26 2018-10-11 新日鐵住金株式会社 被覆金属板
JP2021085808A (ja) * 2019-11-29 2021-06-03 シーシーエス株式会社 光照射装置

Also Published As

Publication number Publication date
JPWO2008023605A1 (ja) 2010-01-07
TW200821632A (en) 2008-05-16

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