JPWO2008023605A1 - 光反射体、およびそれを含む光源 - Google Patents

光反射体、およびそれを含む光源 Download PDF

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Publication number
JPWO2008023605A1
JPWO2008023605A1 JP2008530865A JP2008530865A JPWO2008023605A1 JP WO2008023605 A1 JPWO2008023605 A1 JP WO2008023605A1 JP 2008530865 A JP2008530865 A JP 2008530865A JP 2008530865 A JP2008530865 A JP 2008530865A JP WO2008023605 A1 JPWO2008023605 A1 JP WO2008023605A1
Authority
JP
Japan
Prior art keywords
light
light source
layer
reflector
reflectance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008530865A
Other languages
English (en)
Japanese (ja)
Inventor
齊藤　公彦
公彦 齊藤
英司 林下
英司 林下
福田　伸
福田　　伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of JPWO2008023605A1 publication Critical patent/JPWO2008023605A1/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)
  • Optical Elements Other Than Lenses (AREA)
JP2008530865A 2006-08-23 2007-08-14 光反射体、およびそれを含む光源 Pending JPWO2008023605A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006226400 2006-08-23
JP2006226400 2006-08-23
PCT/JP2007/065842 WO2008023605A1 (fr) 2006-08-23 2007-08-14 Corps réfléchissant la lumière et source de lumière le comprenant

Publications (1)

Publication Number Publication Date
JPWO2008023605A1 true JPWO2008023605A1 (ja) 2010-01-07

Family

ID=39106691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008530865A Pending JPWO2008023605A1 (ja) 2006-08-23 2007-08-14 光反射体、およびそれを含む光源

Country Status (3)

Country Link
JP (1) JPWO2008023605A1 (fr)
TW (1) TW200821632A (fr)
WO (1) WO2008023605A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011148263A (ja) * 2010-01-25 2011-08-04 Fine Rubber Kenkyusho:Kk 金属箔付き反射シート

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8084105B2 (en) * 2007-05-23 2011-12-27 Applied Materials, Inc. Method of depositing boron nitride and boron nitride-derived materials
JP2009276396A (ja) * 2008-05-12 2009-11-26 Mitsubishi Plastics Inc 光反射フィルムおよび光反射板
CN102047452B (zh) * 2008-05-30 2013-03-20 夏普株式会社 发光装置、面光源、液晶显示装置和制造发光装置的方法
US20100032702A1 (en) * 2008-08-11 2010-02-11 E. I. Du Pont De Nemours And Company Light-Emitting Diode Housing Comprising Fluoropolymer
JP2010263165A (ja) * 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Ｌｅｄ用反射基板及び発光装置
JP2011151248A (ja) * 2010-01-22 2011-08-04 Seiwa Electric Mfg Co Ltd 発光装置及び発光装置の製造方法
JP5504933B2 (ja) * 2010-02-03 2014-05-28 株式会社共立電照 街灯用照明器具
US9574050B2 (en) * 2010-03-23 2017-02-21 Asahi Rubber Inc. Silicone resin reflective substrate, manufacturing method for same, and base material composition used in reflective substrate
JP5509996B2 (ja) * 2010-03-31 2014-06-04 カシオ計算機株式会社 フレキシブルプリント基板、光源装置及び表示装置
JP5555038B2 (ja) * 2010-04-13 2014-07-23 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
JP5684511B2 (ja) 2010-08-11 2015-03-11 三菱樹脂株式会社 金属箔積層体、ｌｅｄ搭載用基板及び光源装置
JP5551549B2 (ja) * 2010-09-08 2014-07-16 帝人デュポンフィルム株式会社 実装用回路基板
JP2013026416A (ja) * 2011-07-20 2013-02-04 Toyoda Gosei Co Ltd 素子搭載基板及びこれを備えた発光装置
WO2013061855A1 (fr) * 2011-10-25 2013-05-02 シャープ株式会社 Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision
JP2013145833A (ja) * 2012-01-16 2013-07-25 Fujifilm Corp Ｌｅｄ発光素子用反射基板およびｌｅｄパッケージ
JP2013033976A (ja) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd 半導体発光装置、および車両用前照灯
WO2017010387A1 (fr) * 2015-07-13 2017-01-19 シャープ株式会社 Dispositif d'éclairage et appareil d'affichage
WO2017059575A1 (fr) * 2015-10-09 2017-04-13 魏晓敏 Diode électroluminescente (led) et module
JP6540825B2 (ja) * 2015-11-26 2019-07-10 日本製鉄株式会社 被覆金属板
JP2021085808A (ja) * 2019-11-29 2021-06-03 シーシーエス株式会社 光照射装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174379A (ja) * 1987-01-14 1988-07-18 Toshiba Corp 発光表示装置
JP2772775B2 (ja) * 1995-09-29 1998-07-09 大日本印刷株式会社 光拡散シート及びそれを使用したエッジライト型面光源並びに液晶表示装置
JP2000321551A (ja) * 1999-05-13 2000-11-24 Sharp Corp 液晶表示装置
JP2003185813A (ja) * 2001-12-21 2003-07-03 Mitsui Chemicals Inc 反射体およびその用途
JP4543772B2 (ja) * 2003-09-19 2010-09-15 セイコーエプソン株式会社 電気光学装置および電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011148263A (ja) * 2010-01-25 2011-08-04 Fine Rubber Kenkyusho:Kk 金属箔付き反射シート

Also Published As

Publication number Publication date
WO2008023605A1 (fr) 2008-02-28
TW200821632A (en) 2008-05-16

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