TW200821632A - Light reflector and light source having same - Google Patents
Light reflector and light source having same Download PDFInfo
- Publication number
- TW200821632A TW200821632A TW096129963A TW96129963A TW200821632A TW 200821632 A TW200821632 A TW 200821632A TW 096129963 A TW096129963 A TW 096129963A TW 96129963 A TW96129963 A TW 96129963A TW 200821632 A TW200821632 A TW 200821632A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- light source
- reflector
- layer
- led
- Prior art date
Links
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
Description
200821632 九、發明說明： 【發明所屬之技衡領域】 …雕而於光反射體及含該光反射體之光源，更差 版而δ ’本舍明係關於具有優異之及射特性，: 二 加工性之光反射體。 I〜有，穹曲 【先前技術】 、夜曰t f像下之，示器係在多媒體中最重要之機器界命。 (LCD)係以薄型化及省能源化為方針之•一 :。 敍被利用作為行動電話顯示器位用= 哭等中,干哭+ 用—及》'車衛星導航用顯示 f視關示轉大型顯示器。 LCD係需要個別電源之非 -κ ^ 另一方面，G aN系夢氺一 1 令人驚異，更由於產業^進（LED)之技術之進展 冷陰極管相比，可利用較低二，向於低成本，。LED與 萬小時以上。又，在構、生上二墼加以驅動，其壽命也在1〇 管所含之汞，故也可實現m咖，㈣不使用冷陰極 因此，使用仿白色lEd、〜、fi辰境負荷之目的。 之3種LED之組合）等之背弁、3色LED (紅色、綠色、藍色 色LED之背光光源可藉由V j源之開發極為活絡。使甩3 性.，故在適合電視等^品發光光譜而實現高的色重現 " ’、属示裔之領域上，其開發極為 200821632 匕小型及中型LCD主要具有使用所謂端面照光型之哪 为先之面光源裝置。端面照光型LED背光係配置於導光板 侧面之·絲—，-具有含安裝於使甩聚醯亞胺基板之繞性電路 基板（FPC)之LED之光源。LED之發光具有指向性，故 為防賴示時社亮度科聽不均，通常設法在聊 週邊设置白色的擴散反射板’以便將均勻之光導入導光板。200821632 IX. Description of invention: [Technical field of technology to which the invention belongs] ... carved in the light reflector and the light source containing the light reflector, the version is worse and δ 'Ben Sheming is excellent in the characteristics of the radiation,: Processable light reflector. I ~ Yes, distortion [Previous technology], night 曰 t f like, the display is the most important machine life in multimedia. (LCD) is based on the principle of thinning and energy saving. It is used as a mobile phone display position = crying, etc., dry crying + use - and "the car satellite navigation display f turn off the display. LCD system requires non-κ of individual power supply. On the other hand, G aN is amazed by the nightmare. Moreover, due to the advancement of technology in the industry, the cold cathode tube can be used in comparison with the lower cathode. At low cost. LED with more than 10,000 hours. In addition, in the structure and the production of the second 墼 drive, its life is also in the mercury contained in the tube, so it can also achieve m coffee, (4) do not use cold cathode, therefore, using imitation white lEd, ~, fi Chen load purpose. The combination of the three kinds of LEDs, etc., and the three-color LED (the red, green, and blue LED backlight sources can be extremely active by the development of the V j source. Therefore, it is suitable for TVs, etc. Light-emitting spectroscopy to achieve high color reproduction " ', in the field of the genus, its development is extremely 200821632 匕 small and medium-sized LCD mainly has the so-called end-illuminated type which is the first surface light source device. End-illuminated LED backlight It is a light source disposed on the side of the light guide plate, and has a light source including an LED mounted on a flexible circuit substrate (FPC) of the yttrium polyimide substrate. The light emission of the LED has directivity, so The brightness department is not uniform, and it is usually managed to set a white diffuse reflector around the chat to introduce uniform light into the light guide.
例如，曾有下列提案對固定安裝LEIX^Fpc與導光 板之雙巧膠帶賦予反射功能（參照專利文獻1}，或使配合 led之形狀而形成孔之白色樹脂管熱收縮而成為反射體 (參照專利文獻.2 )、或以凹型框體之凹内面作為光反射 層，再於光反射層上配置擴散反射板，而在其框體内部配置 LED (參照專利文獻3)。 另外，在中型LCD用背光（端面照光型）中，為了亮 度之均勻化及防止莫阿干涉條紋，有認為將配置於導光= 下之反射板形成為白色擴散反射板時較為理想之情形。使 用端面照光型LED背光之情形也有人提案在配置於導光板 下之FPC之導光板側表面設置白色印刷反射部而對FPC賦 予反射板之功能（參照專利文獻4)。 . 在此等提案中，由於在安裝LED之基板設置新的白色 反射層，或設置設有反射層之框體，故有需要另外之構件， 或增加製程之問題。又，設置多數LED之LED背光具有必 須有效地將所產生之熱放熱之重要之課題。然而，在此等 提案中，由於將安裝LED之基板，利用雙面膠帶或接著劑 »if 200821632 等固定在金屬等之放熱體上，故有熱電阻會因雙面膠帶或 接著劑等而上升，導致放熱效果降低之虞。放熱效果降低 %’有LED發光效率之降低及元件壽命之縮短，甚至於導 …致元件被破壞之虞-— 有人揭示在白色而有光澤之紙、聚對苯二甲酸乙二醇 醋樹脂、及聚酯系樹脂上，以導電性墨水形成電路圖案， 將LED安裝於該電路圖案之反射體（參照專利文獻：5)。此 反射體亦係利用雙面膠帶或接著劑等固定在金屬框體等， 而有必要提高散熱性。不僅如此，LED之安裝由於目前為 ~低環保負荷，一般使用SnAg合金系等之r無鉛焊料」。 由於利用無錯焊料之焊接需要22〇。〇〜28〇°C左右之加熱製 程，故有安裝LED時反射體會受到熱的傷害之問題。 、另—方面，使用於電視等之大型LCD之背光主要係稱 2下方型之.背光。正下方㈣光具有配置於擴散板或照 多、、ΐ了部之光源。在正下方型LEDf光中，多半利用紅 Τ Ά、監色之3色為基本之LED之混色而形成白色。因 性。’ί下=LED，光之反射體有必要具有高的擴散反射 性又，因正下方型led背光之led之安裝數非c 射體本身也被m具締的耐齡及放触。夕’ 再者’反射體也被要求賦予f曲加工性。例如，右 在反射面侧形成電路物 i構成之反射體（參照專利文獻6)。使用 口工之反射断，例如可獲得撓性顯示器。 弓 另外，有人揭示利射袖紫外線區域至可見光區域之 200821632 光具有南的反射率之叙夕息把而办基4# 0ΕΪ a 板上形成電路之電路 射核組（參照專利文獻7)。For example, there has been a proposal to impart a reflection function to a double-tape tape in which a LEIX^Fpc and a light guide plate are fixedly mounted (see Patent Document 1), or to heat-shrink a white resin tube forming a hole in a shape of a led to become a reflector (refer to Patent Document 2) or a concave inner surface of a concave frame as a light reflection layer, and a diffuse reflection plate is disposed on the light reflection layer, and an LED is disposed inside the frame (see Patent Document 3). In the backlight (end-illuminated type), it is preferable that the polarizing plate disposed under the light guide = is formed as a white diffuse reflection plate in order to uniformize the brightness and prevent the moire interference fringe. In the case of the backlight, it is proposed to provide a white printed reflection portion on the light guide plate side surface of the FPC disposed under the light guide plate and to provide a reflector to the FPC (see Patent Document 4). In these proposals, since the LED is mounted The substrate is provided with a new white reflective layer, or a frame provided with a reflective layer is provided, so that additional components are required, or the process is increased. Further, the LED back of most LEDs is provided. There is a problem that it is necessary to effectively dissipate the generated heat. However, in these proposals, the substrate on which the LED is mounted is fixed to a heat medium such as a metal by a double-sided tape or an adhesive such as *if 200821632. Therefore, the thermal resistance rises due to the double-sided tape or the adhesive, which causes the heat release effect to be lowered. The heat release effect is reduced by %, the LED luminous efficiency is lowered, the component life is shortened, and even the component is destroyed. - It has been revealed that a white, glossy paper, polyethylene terephthalate resin, and polyester resin are used to form a circuit pattern with conductive ink, and an LED is mounted on the reflector of the circuit pattern (see Patent Document: 5) The reflector is also fixed to a metal frame or the like by a double-sided tape or an adhesive, and it is necessary to improve heat dissipation. Moreover, the installation of the LED is generally low-environmental load, and SnAg is generally used. R-free solders such as alloys. Because welding with error-free solder requires 22〇. 加热~28〇°C heating process, so the reflector will be heated when LEDs are installed. The problem of harm. On the other hand, the backlight of a large LCD used in TVs is mainly called the lower type backlight. The light below the (four) light has a light source disposed on the diffuser or the light, and the light source. Most of the lower-type LEDf light uses the three colors of red Ά Ά and the color of the monitor as the basic color mixture of the LED to form white. ί下=LED, the light reflector needs to have high diffuse reflectivity, Because the number of LEDs installed directly under the LED backlight is not the c-body itself, it is also resistant to ageing and touching. The eve of the 'reflector' is also required to impart f-machineability. For example, the right-side reflective surface A reflector formed of the circuit i is formed on the side (see Patent Document 6). For example, a flexible display can be obtained by using the reflection of the mouth. In addition, it is revealed that the light-emitting area of the UV-ray sleeve to the visible light region of the 200821632 light has a south reflectivity, and the base 4# 0ΕΪ a circuit for forming a circuit on the board is a nuclear core group (refer to Patent Document 7).
• ΐ專利文獻士]…日本特開2⑽孓^ [專利文獻2]日本特開2〇〇5-123〗〇3號公報 [專刮文獻3]日本特開wot】3586〇號公報 [專利文獻4]曰本特開2〇〇K133757號公報 [專利文獻5]日本特開平^115323號公報 [專利文獻6]日本特開2003-185813號公報 [專利文獻7]曰本特開2〇〇5_2684〇5號公報 【發明内容】 (發明所欲解決之問題） 本發日狀目的在於提供具有料加卫性及擴散反射 性’且即使安裝LED，也可充分排放LED所發出之熱之光 反射體。另外，本發明之目的在於提供可使用於液’晶顯 裝置之LED背光用之面光源裝置。 〜 | (解決問題之技術手段) 即，本發明之第一發明係關於以下所示之光反射體。 [1] -種光反射體，其係包含：金屬基材；光反射層， 其係設於前述金屬基材之至少單方之表面，具有電絕緣 … 性，含有包含顏料及無機填充料之至少其中一方之彈性 . 體；及導電層，其係形成於前述光反射層上。 P]如[1]之光反射體’其中前述彈性體係包含石夕酮樹脂 或矽酮橡膠。 200821632 [3] 如[1]或[2]之光反射體，其中前述無機充料 狀無機填充料。 戌”兄抖係金 [4] 如[1]〜[3]中任一項之光反射體，並中十 層之全光線反射率為路％以上-。 … '、、丄心光反鲁 [5] 如[1]〜[4]中任一項之光反射體，其 1 層之擴散反射率為80%以上。 、1处光反射 係電路。 刖述導電層 之光反射體，其中前述電路係藉颠 層之一部分所形成。 于、云％^電 争本發明之第二發明係關於以下所示之今 之液晶顯示裴置。 [及3該先 會[8] —種光源，其倍句各· 「 …丄 射體；安裝於前述電路芦於 〜中任—項之光 光二極體之電路之抗焊層。 及⑧風未文t [9]如[8]之光源，其中前面 率為80%以上。*展心衣®之王先線瓦 [1 〇] 一種端面照光型背先 I / [哪]之光源、及導人來 \置，其係包含， ηιΊ一播τ 卞入不自刖述光源之光之導光板。 幕。 置於刚述光源之發光側之擴散板或照 作為[背i源種夜曰曰續不震置，其係具有如[1〇]之面光源聚 if 200821632 [13]—種液晶顯示裝置，其係具有如[n]之面光源裝 作為背光源厂^ ^ ^ ^ ^ ^ (發明之效果） 依據本發明，可提供具有彎曲ϋ性及擴散反射佺， 且即使在反射面安裝LED，也可充分排放LED所發出之裁 之光反射體。本發明之光反射體與以往之光反射體相比“、、 可利用較簡便之製程製造。另外，使用本發明之光反射體， 可獲得LED背光’可將其適用於液晶顯示裝置。 【實施方式】 1·關於光反射體 甘本發明之光反射體係包含r)金屬基材、2)設於金 反n、3)設於光反射層上之導電層。_ ^帅衣不本發明之光反射體之構成。圖1A係表示光及 積層狀態，圖1赠、表示光反射體由導電層側所見之 Si電:為金屬基材，20為具㈣ ⑩關於金屬基材 、金f基材之合適之材料例中，包含合金、鎮人 :::錄：、銅、銅鋅合金、鎳、鎳系合金、鈦、鈦合: •紹合^里3觀點’以使用銘合金及鎮合金較為理想。 - 絲具強度及耐谢生之不銹鋼。不錄】;也可使 定。理相之’…、、氏版糸荨任何一種，不受特別限 不_之具體财’包含SUS3G4、SUS316等。 10 200821632 jLJJjypif 又’金屬基材具有排放安裝於光反射體之光源（例如 LEf)所產生之熱之功能。因此，金屬基材之材料以放熱 性尚之銅及銅合金較為理想。銅合金之合適例中，包含普 …菌.。·· — ..............................................................................…… 产、 本龟明之光反射體最好可施行彎曲加工。因此，金屬 基材之厚度表好為工業上可彎曲之厚度。所謂工業上可彎 曲之金屬基材之厚度較好為0.03mm〜1mm，更好為 (h05mi^〜〇,5mm。金屬基材過薄時，剛性較低，將光源安 裝於所得之光反射體時，有難以固定之虞。另一方面，金 屬基材過厚時，有難以施行彎曲加工之虞。 關於光反射層 、,本發明之光反射體含有設於金屬基材之單面或雙面之 光反射層。光反射層以由電絕緣性材料構成為宜，通常由 電絕緣性之高分子材料所構成。電絕緣性之高分子材料之 例中’包含環氧、聚酯、聚丁二烯、醇酸、環氧酯、聚醯 胺、砍酮、及鐵氟隆（註冊商糅）、以及此等之混合材料。 光反射層為單層或複數層之積層體均無妨。 如前所述，本發明之光反射體最好可施行彎曲加工， 故光反射層所含之高分子材料最好具有彈性。具有彈性之 南分子材料稱為彈性體。彈性體之例中，包含橡膠及熱塑 ^生彈性肢專。彈性體更理想者為；g夕酮樹脂或石夕酮橡膠。所 謂矽酮樹脂之彈性體，包含矽酮熱塑性彈性體。 又·，光反射層最好也具有作為接著金屬基材與導電層 之接著層之功能。若在光反射層使用具有接著性之材料: 200821632 則較容易在光反射層上形成導電層，且也具有作為金屬基 材與導電層之接合層之功能。因此，光反射層所含之高分 子材料最好為與導電層（例如金屬層）之接著性較高之高 分子材料。在與導電層(金屬層T之接著性較高乏| f料之例中，包含環氧系接著牲樹脂、矽酮系接著性樹脂 等’尤其以矽酮系接著性樹脂較為理想。 另外，在光反射層中，也被要求高的耐熱性。在光反 射層中被要叙耐熱性實際上意味辆餘_露於高溫 (例如18〇c〜280〇C )之「焊接製程」，光反射層之反射率 也不會降低；光反射層之絕緣電阻值幾乎不降低；基材與 ，，射層間之接著強度及光反射層與電路層間之接著強度 幾乎不降低V因此，在光反射層所含之高分子材料中，^ 要求熱分解引起之變質較少。例如，在18(rc〜280t之熱 分解引起之高分子材料之重量降低較好為10%以下，更好 為5%以下，最好為3%以下。具有耐熱性之高分子材料之 例中，含有矽酮樹脂及矽酮橡膠。 光反射層之厚度依照期望之光反射库等適宜地加以選 擇，通常為ΙΟμιη〜500μηι，更理想為3〇μιη〜2〇〇jLim。 、>另外，構成光反射層之高分子材料最好藉由含有顏料 或热機填充料而提高擴散反射性。含有顏料與無機填充料 =雙方或含有其中之-方皆可。構成光反射層之高分子材 料適合個含有自色顏料及錢填充料之销獅及石夕 橡膠。 顏料最好為白色顏料。另一方面，無機填充料可由陶 12 200821632 T仗思加‘以選擇。理 氧化銘、氧切m、氧之例中’包含金剛石粉 氮化鋁、氮化矽剩、梦風化鋅、氧化鈦、氫化硼、 —背料形成光層時^與使用機填充料之高分号 之情形相比，除可提古與阿分子材料構成之材调 率。光反射層之二性f外，也可提高熱傳導 所產生之财她上之先源 以排放…^ ^ ^ ^ ^ ^寻至孟屬基材而有效地加 之種類、、粒子徑、形所含之顏料及無機填充料 射性能反射叙擴散反 無機填充料之形狀呈現=士寻適t地加以選擇。例如， 声之劫r 、 、~’可提高光反射層作為接宴 層之功能（金屬基材與導之 以卞马接者 π 〇 纖、幕徑為ο·1〜ΐμπι，較妊兔η】 _ ’ /、平均纖維長為〇 5〜5 ’^ . 填充料。拮亡士, a 了 & 平乂灯^ϋ.5〜1〇_之 用户> 充孙之平均纖維徑及平均纖雉長等之形狀可*丨 用知描型電子顯微鏡觀察光反射層之剖面。狀了利 劑及反射層之高分子材射，也可包含㈣線吸收 剞及女疋劑、以及其他添加劑。次收 定。Ϊίί層之反射率係使光由導電層側人射而加以測 、 射層之全光線反射率較好為80%以上，更好Α 特好為88%以上，若為90%以上，更為理想’:、所 I月王光線反射率，係指正反射率與擴散反射率之合計。在 此，所謂正反射率，係指對入射光量，以相等於入射角之 13 200821632 ^ Jh-ΆΧ 反射角所反射之光量之比率。光之入射面有凹凸之情形， 會產生以相異於入射光之入射角之反射角所反射之光。所 ，謂擴散反射率，係指對入射光量，以異於此入射角之反射 …角所反射之先量之比率。…:. I . ..... ................. ......·.--“····· - 全光線反射率可利用安裝積分球之一般之可見紫外分 • 光光度計而容祕加簡定。又，全光狀料也可為在 波長550nm之全光線反射率。更實際而言，也可利用計算 JISR3106所記載之可見光反射率之重價係數加以算出。 光反射層之擴散反射率之適當值因在反射面之構件中 之位置、及將其裝機之裝置之使用目㈣㈣。例如既有 相對於波長55Gnm之全光線反射率，擴散反射率以1〇〜5〇 %左右較為理想之情形，也有在8〇%以上較為理想之情 形。擴散反射率與全光線反射率同樣地，可利用 球之一般之可見紫外分光光度計加以測定。 乂 另外，本發明之光反射體之光反射層最好反射來自c 光源之光而發出接近於無色之反射光。光色有時以漢特值 • 表示。所謂漢特值，係使用均等色空間之顯色系之一'，依 攄JIS Z8722所測定。以標準之光〇照明時表自色之漢特值& 及b可由下式求出： ' 【數1】 - a=17.5(l.〇2Xi0-Y10)xVi- - b = 7.0 (Y.〇.847Z10) 1上述數式中’ Χια、Y1G、z!。表示XiqYi()Zi。顯色系之 三刺激値，對38〇nm〜780nm波長之光可由下式长出· 14 200821632 上 【數2】 'r 780ΐ ΐ ΐ ΐ 日本 日本 日本 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 [ [ 专利 [ 专利 专利 专利 [ [ [ [ [ [ [ [ [ [Patent Document 5] Japanese Patent Laid-Open Publication No. 2003-185813 (Patent Document 7) 曰本特开2〇〇5_2684 〇 公报 公报 【 发明 发明 发明 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本body. Further, it is an object of the present invention to provide a surface light source device which can be used for an LED backlight of a liquid crystal display device. 〜 (Technical means for solving the problem) That is, the first invention of the present invention relates to a light reflector shown below. [1] A light reflector comprising: a metal substrate; a light reflecting layer disposed on at least one surface of the metal substrate, having electrical insulation, containing at least a pigment and an inorganic filler. One of the elastic bodies; and a conductive layer formed on the light reflecting layer. P] The light reflector of [1] wherein the aforementioned elastic system comprises a linaloyl resin or an anthrone rubber. 200821632 [3] The light reflector of [1] or [2], wherein the inorganic filler-like inorganic filler.戌" brother shakes gold [4] such as [1] ~ [3] any of the light reflectors, and the total light reflectance of the ten layers is more than the road -. ...,, 丄心光反鲁[5] The light reflector of any one of [1] to [4], wherein the diffusion reflectance of the first layer is 80% or more. One light reflection system circuit. The light reflector of the conductive layer is described. The foregoing circuit is formed by one of the layers. The second invention of the present invention relates to the liquid crystal display device shown below. [And 3, the first meeting [8] is a kind of light source, The multiple sentences of "...the projectile; the solder resist layer of the circuit mounted on the circuit of the light-emitting diode of the above-mentioned circuit--------------------------------------------------------------- The front rate is 80% or more. *The king of the heart of the brand is the first line of the tile [1 〇] An end-illuminated type of the first I / [Which] light source, and the guide to the \, the system contains, ηιΊ broadcast τ Into the light guide plate that does not self-report the light of the light source. Curtain. The diffuser plate placed on the light-emitting side of the light source or the photo is used as the [back i source]. ] face light source poly if 2008 21632 [13] - A liquid crystal display device having a surface light source such as [n] as a backlight source ^ ^ ^ ^ ^ ^ (Effect of the invention) According to the present invention, it is possible to provide a curved 及 and a diffuse reflection 佺Moreover, even if the LED is mounted on the reflecting surface, the cut light reflector emitted by the LED can be sufficiently discharged. The light reflector of the present invention can be manufactured by a relatively simple process as compared with the conventional light reflector. Further, by using the light reflector of the present invention, an LED backlight can be obtained, which can be applied to a liquid crystal display device. [Embodiment] 1. Light-reflecting body The light-reflecting system of the present invention comprises r) a metal substrate, 2) a gold-based n, and 3) a conductive layer provided on the light-reflecting layer. _ ^Shuai is not the composition of the light reflector of the present invention. Fig. 1A shows the state of light and lamination, and Fig. 1 shows the Si electric energy seen from the side of the conductive layer of the light reflector: a metal substrate, 20 is a suitable material for the metal substrate and the gold f substrate. Including alloys, town people::: Record: copper, copper-zinc alloy, nickel, nickel-based alloy, titanium, titanium: • Shaohe ^ 3 views 'is ideal to use Ming alloy and town alloy. - Silk strength and stainless steel resistant to Xiesheng. Not recorded]; can also be determined. Any of the '..., and the version of the syllabary, is not subject to special restrictions. ‘Specific wealth’ includes SUS3G4, SUS316, etc. 10 200821632 jLJJjypif Further, the metal substrate has a function of discharging heat generated by a light source (for example, LEf) mounted on a light reflector. Therefore, the material of the metal substrate is preferably a copper or copper alloy which is exothermic. A suitable example of the copper alloy includes a bacterium. ·· — ............................................... ..................................... The light reflector of the turtle, which is produced, is preferably bent. Therefore, the thickness of the metal substrate is preferably an industrially bendable thickness. The thickness of the industrially bendable metal substrate is preferably 0.03 mm to 1 mm, more preferably (h05mi^~〇, 5 mm. When the metal substrate is too thin, the rigidity is low, and the light source is mounted on the obtained light reflector. On the other hand, when the metal substrate is too thick, it is difficult to perform the bending process. Regarding the light-reflecting layer, the light reflector of the present invention contains one or both of the metal substrates. The light-reflecting layer is preferably made of an electrically insulating material, and is usually made of an electrically insulating polymer material. In the case of an electrically insulating polymer material, 'containing epoxy, polyester, and poly Butadiene, alkyd, epoxy ester, polyamine, chopping ketone, and Teflon (registered 糅), and a mixture of these materials. The light-reflecting layer is a single layer or a plurality of layers. As described above, the light reflector of the present invention is preferably subjected to bending processing, so that the polymer material contained in the light reflection layer preferably has elasticity. The elastic molecular material is called an elastomer. In the case of an elastomer, Contains rubber and thermoplastic elastomers. Elastomers are more An ideal one is a ketone ketone resin or a ruthenium ketone rubber. The elastomer of the fluorenone resin contains an fluorenone thermoplastic elastomer. Further, the light reflecting layer preferably also has an adhesive layer as a metal substrate and a conductive layer. Function: If a material having adhesion is used in the light reflection layer: 200821632, it is easier to form a conductive layer on the light reflection layer, and also has a function as a bonding layer between the metal substrate and the conductive layer. Therefore, the light reflection layer The polymer material to be contained is preferably a polymer material having a higher adhesion to a conductive layer (for example, a metal layer). In the case of a conductive layer (the metal layer T is highly deficient), the epoxy layer is contained. It is preferable to use a resin, an anthrone-based adhesive resin, etc., especially an anthrone-based adhesive resin. Further, in the light-reflecting layer, high heat resistance is required. In the light-reflecting layer, heat resistance is required. In fact, it means that the remaining time is exposed to high temperature (for example, 18〇c~280〇C). The reflectivity of the light reflection layer is not reduced; the insulation resistance of the light reflection layer is hardly reduced; , the next layer between shots The strength and the adhesion strength between the light-reflecting layer and the circuit layer are hardly lowered. Therefore, in the polymer material contained in the light-reflecting layer, the deterioration caused by thermal decomposition is required to be less. For example, thermal decomposition at 18 (rc~280t) The weight loss of the polymer material is preferably 10% or less, more preferably 5% or less, and most preferably 3% or less. Examples of the polymer material having heat resistance include an anthrone resin and an anthrone rubber. The thickness of the reflective layer is appropriately selected in accordance with a desired light reflection library or the like, and is usually ΙΟμηη~500μηι, more preferably 3〇μιη~2〇〇jLim. Further, the polymer material constituting the light reflection layer is preferably borrowed. It is made of pigment or thermal filler to improve the diffuse reflectivity. It contains both pigment and inorganic filler = either or both. The polymer material constituting the light-reflecting layer is suitable for containing self-color pigments and money fillers. Pin lion and Shi Xi rubber. The pigment is preferably a white pigment. On the other hand, the inorganic filler can be selected by Tao 12 200821632 T仗思加. In the case of Oxidation, Oxygen, M, and Oxygen, 'containing diamond powder, aluminum nitride, niobium nitride, dream zinc, titanium oxide, boron hydride, and the backing material to form a light layer ^ and the use of machine filler Compared with the situation of the semicolon, in addition to the material adjustment rate of the ancient and the Arab molecular materials. In addition to the dimorphism f of the light-reflecting layer, it can also increase the wealth generated by heat conduction. The source of the energy is discharged... ^ ^ ^ ^ ^ ^ to find the material of the genus and effectively add the species, particle diameter, shape The pigment and inorganic fillers have a reflective property that reflects the shape of the anti-inorganic filler and is selected. For example, the sound robbery r, , ~ ' can improve the function of the light reflection layer as a banquet layer (metal substrate and guide to the 卞 接 π π 、 、 幕 幕 幕 幕 幕 幕 幕 幕 幕 幕 幕 幕 幕 幕 , , 较 较 较 较 较 , , 】 _ ' /, the average fiber length is 〇5~5 '^ . Filler. Abandoned, a & flat light ^ϋ.5~1〇_ user> The average fiber diameter and average of the sun The shape of the fiber length can be observed by using a scanning electron microscope to observe the cross section of the light reflecting layer. The polymer material of the coating agent and the reflective layer can also contain (4) line absorption 疋 and 疋 疋, and other additives. The reflection rate of the layer is measured by directing the light from the side of the conductive layer, and the total light reflectance of the shot layer is preferably 80% or more, more preferably 88% or more, if 90 More than %, more ideal ':, the light reflectivity of the moon, refers to the sum of the regular reflectance and the diffuse reflectance. Here, the so-called regular reflectance refers to the amount of incident light, equal to the angle of incidence of 13 200821632 ^ Jh-ΆΧ The ratio of the amount of light reflected by the reflection angle. If the incident surface of the light has irregularities, it will produce a difference The light reflected by the angle of reflection of the incident angle of the light. The diffuse reflectance is the ratio of the amount of incident light that is reflected by the angle of reflection of the angle of incidence....:. I . . . .............................--"····· - The total light reflectance can be seen by the general visibility of the installed integrating sphere Ultraviolet light • Photometer is more sensitive and simple. In addition, the all-light material can also be the total light reflectance at a wavelength of 550 nm. More practically, the calculation of the visible light reflectance of JISR3106 can also be used. The coefficient is calculated. The appropriate value of the diffuse reflectance of the light-reflecting layer is due to the position in the member of the reflecting surface and the use of the device for mounting it. (4) (4) For example, the total light reflectance with respect to the wavelength of 55 Gnm, diffuse reflection The ratio is preferably about 1 〇 to 5 〇%, and more preferably 8% or more. The diffuse reflectance is similar to the total light reflectance, and can be measured by a general visible ultraviolet spectrophotometer of a ball. In addition, the light reflecting layer of the light reflector of the present invention preferably reflects light from the c light source. It emits light that is close to colorless. Light color is sometimes expressed as a Hanter value. The so-called Hante value is one of the color systems used in the uniform color space, as measured by JIS Z8722. The Hanter value & b of the time table self-color can be obtained by the following formula: ' [Number 1] - a=17.5 (l.〇2Xi0-Y10)xVi- - b = 7.0 (Y.〇.847Z10) 1 In the formula, ' Χια, Y1G, z!, which means XiqYi()Zi. The three stimuli of the color system, the light of the wavelength of 38〇nm~780nm can be grown by the following formula. 14 200821632 [2] 'r 780
Xio^K pa> χ(λ)Κ(λ)άλ 380 x r 780Xio^K pa> χ(λ)Κ(λ)άλ 380 x r 780
Yi o^K jsa) γ(λ)Κ(Χ)άλ -380----------------、. ........ 780 … ▽ Θ㈧一Yi o^K jsa) γ(λ)Κ(Χ)άλ -380----------------,. ........ 780 ... ▽ Θ (eight) one
Zi 〇=K 38〇 ζ(χ)Κ(λ)άλ 780Zi 〇=K 38〇 ζ(χ)Κ(λ)άλ 780
K-100/J5a) y(x)R(X)dX 380 s(x):色之顯示所使用之標準之光之分光分布 χ(λ)、γ(λ)、ζ(λ) : XwYwZio顧色系之等色函數 R(x):分光（立體角）反射率 以漢特值a及b表現反射來自C光源之光之光色時，本 發明之光反射體之光反射層較好為a及b之任一絕對值均在 7以下，更好在5以下，特好在3以下。 二 關於導電層 帝本發明之光反射體含有設於光反射層上之導電層。」 電層之材質以金屬較為理想。理想之金屬之例中，包^鋼 紹、銀、金、-等。以此等金屬之箱及薄膜較為理 外，導電層之材質若考慮電阻與侧特性時，以鋼&為3 想，又反射特性低而色性少之鋁也較為理想。所謂 2」「，係在設於先反射層之前形成薄片狀之金屬之‘膜〜 謂「金屬薄膜」，係利用印刷法、蒸鍍法或電鍍 、 反射層之金屬之薄膜。 〜战在; …導電層之厚度依被安裝之LED之電力適宜地加以、 疋。曰金屬箱之厚度以！〜；!〇〇_之範圍較為理想。金屬薄; 之厚度以0.5〜2〇μηι之範圍較為理想。 Α， 15 200821632 又，導電層也可為電路 後再詳加說明。 導電層及電路之形成方法容 樹賴/箱/爾材爾。i 基材之間讀件厚叙合計（含紅 。此等構件厚度太大時，放 右上，好為2〜K-100/J5a) y(x)R(X)dX 380 s(x): The light distribution of the standard light used in the display of color χ(λ), γ(λ), ζ(λ) : XwYwZio顾Color system of the color system R(x): Spectroscopic (solid angle) reflectance When the Hantel values a and b represent the light color of the light from the C light source, the light reflecting layer of the light reflector of the present invention is preferably The absolute value of any of a and b is 7 or less, more preferably 5 or less, particularly preferably 3 or less. 2. About Conductive Layer The light reflector of the present invention contains a conductive layer provided on the light reflecting layer. The material of the electric layer is ideal for metal. In the case of an ideal metal, it is made of steel, silver, gold, and the like. In addition to the metal case and the film, the material of the conductive layer is preferably made of steel & The "film" to "metal film" which forms a sheet-like metal before the first reflection layer is a film of a metal such as a printing method, a vapor deposition method or a plating or reflection layer. ~ War in; ... The thickness of the conductive layer is appropriately applied according to the power of the LED to be mounted. The thickness of the metal box is! ~;! 〇〇 _ the range is ideal. The metal is thin; the thickness is preferably in the range of 0.5 to 2 〇μηι. Α, 15 200821632 Again, the conductive layer can also be explained in detail after the circuit. The formation method of the conductive layer and the circuit is the capacity of the tree / box / Ergeer. i The total thickness of the readings between the substrates (including red. When the thickness of these components is too large, put the upper right, preferably 2~
前述之光反射率也列入考严士从4低之虞。連 為30〜·,。 考慮寸’作為光反射層之厚度較好 反射層之表面僅被電路及其他必要之導電層所覆 =朿好儘《出較寬_之歧射層。此係為了提高光 反射體之反射性之故。 本發明之光反射體最好可施行彎曲加工。所謂彎曲加 工，例如係指利用賊加卫等機械加玉而加工成即使以光 反射層侧作為内侧以彎曲角度9()。彎曲時，構成構件之性能 也幾乎不會降低而可保持彎曲加工時之形狀而言。 、本發明之光反射體由於不必在電路基板個別地形成用 於賦予反射功能之光反射層，故可利用簡便之製程製造。 又因光反射體可利用具有彈性之樹脂形成，故可施行彎 曲加工。另外，若以耐熱性高分子材料形成光反射層，則 可施行在高溫下之led安裝。又因使用金屬基材.，故光反 射體之放熱性也高。本發明之光反射體可使用作為室内照 明、屋内照明、汽車用照明、裝飾用照明等各種照明用之 反射體，當然也可使用作為顯示面板之面光源裝置之光反 16 200821632 射體。 2·關於光反射體之製造方法 气光反射層，再:歧射層上形成 備光反射層作為接著薄月而在薄矣、 ）导 基材、與作為導電層之金屬蕩之方法“金屬 作為導電狀金屬叙雙錢佈 基材、與 料（光反射層之材料），貼合彼此之==分子材 之方法等。依照材料的特性，貼合只要射層 crimping) . ^ # ^ (heat ^ 將i雷：f ( hesi〇n)等施行即可。 、’ &為金屬箔之情形，光反射 著性之。此係 ^靖層取好含有具有接 故。另-方面，不接荖f，光反射層容易接著之 可不具有接著^接者金屬_露出之部份之歧射層也 法、金屬薄膜可利用蒸链 之樹脂，但^L ΐ反射層並無必要_含具有接著性 光反射層表面d:: ’可在金屬薄膜形成前’預先對 而賦予接著性。=水處理、電暈處理及UV臭氧處理等， 空蒸鍍法、利用齋祕法之例中，包含利用電阻加熱之真 噴鍍法等_2子束加熱之真空級法、贿法、離子 / 。可利用一種方法形成，也可併用複數 17 200821632 種方法。 如’1)既可在Ξ匕:::法：:丨 成電路。f ft 射層之導電層之—部分而形 佈或貼合感:性樹: 旨見::::【二:所形成之導電層塗The aforementioned light reflectivity is also included in the test of the four from the lowest. Connected to 30~·,. Considering the inch as the thickness of the light-reflecting layer, the surface of the reflective layer is only covered by the circuit and other necessary conductive layers. This is to improve the reflectivity of the light reflector. Preferably, the light reflector of the present invention can be subjected to bending processing. The bending process is, for example, a process in which a jade is added to a jade and the like, and the jade is processed so that the light reflection layer side is inside as a bending angle 9 (). When bent, the performance of the constituent members is hardly lowered and the shape at the time of bending processing can be maintained. According to the light reflector of the present invention, since it is not necessary to separately form the light reflecting layer for imparting a reflection function on the circuit board, it can be manufactured by a simple process. Further, since the light reflecting body can be formed using a resin having elasticity, bending processing can be performed. Further, when the light-reflecting layer is formed of a heat-resistant polymer material, it is possible to perform LED mounting at a high temperature. Further, since the metal substrate is used, the heat radiation of the light reflector is also high. The light reflector of the present invention can be used as a reflector for various illuminations such as indoor illumination, indoor illumination, automotive illumination, and decorative illumination. Of course, it is also possible to use a light source as a surface light source device of a display panel. 2. Method for Producing Light Reflector The vapor-reflecting layer is further formed by forming a light-reflecting layer on the surface of the polarizing layer as a thin film, a substrate, and a metal as a conductive layer. As a conductive metal, the material of the double-knit fabric, the material (the material of the light-reflecting layer), the method of bonding the == molecular material, etc. According to the characteristics of the material, the bonding is as long as the film is crimping. ^ # ^ ( Heat ^ I will use i: f (hesi〇n), etc., '& for the case of metal foil, the light reflects the nature. This system ^ well layer contains good with the attachment. Another - aspect, no荖f, the light-reflecting layer is easy to follow, and there is no need to have a portion of the metal that is exposed to the exposed layer. The metal film can use the resin of the evaporation chain, but the reflective layer is not necessary. The surface of the light-reflecting layer d:: 'Before the formation of the metal thin film' can be imparted in advance to provide adhesion. = Water treatment, corona treatment, UV ozone treatment, etc., in the case of the air vapor deposition method and the use of the sacred method, A vacuum level method including a true sputtering method using electric resistance heating, and a sub-beam heating method, a bribe method, Sub / can be formed by a method, or a combination of 17 200821632 methods. For example, '1) can be used in the Ξ匕::: method:: 丨 into a circuit. Or a sense of fit: sex tree: purpose:::: [two: the formation of the conductive layer coating
==樹脂;以適當之餘刻材料除去露出之導電 方面’在電路之線寬不那麼細小之情 路狀.^ 印刷法將感紐樹脂塗佈成電 威純二^之㈣材料除去露出之導電層而形成電路。 ❹正型或負型中任何—種，不受特別限制。 W料銅之,_，藉制第2|u峨水紐等之濕式 姓刻或使用電料之乾絲刻等形成銅之電路。 3·關於光源 =明之光反射體可在導電層上安裝發光二極體 而使用作為光源。最好使用施行紅色、綠色、藍 2之發光之LED及所謂仿白色發光之LED。圖2係在光反射 體（含金屬基材10、光反射層2〇及導電層3〇)轉料4〇安 裝發光二極體1〇〇之情形。 LED可使用侧視型及頂視型中任何一種、圖3A係表示 在光反射體安襄側視型LED110之光源。御j視型LED11〇係 2光面垂直於安裝面之型式之LED，由光出射部13()發射對 安裝面平行之光。圖3B〜圖3D係表示在光反射體安裝頂視 18 200821632 型發光二極體120之光源。頂視型發光二極體120係發光面 平行於安裝面之型式之LED，由光出射部130發射對安裝面 垂直之光。圖3B及圖3C中雖表示頂視型之LED，但也可適 用侧視型之LED，可依光源之設計適、宜·地加-以選擇..。·另一 方面’在圖3D中，如圖所示，最好適用頂視型之led。 在中小型液晶顯示器（LCD)之光源中，多半係以使 用仿白色發光之LED為主，在電視用途等大—LCD之光源== Resin; remove the exposed conductive aspect with appropriate remnant material'. The line width of the circuit is not so small. ^ The printing method applies the sensitizing resin to the electric weichun two (4) material to remove the exposed conductive The layers form a circuit. Any of the positive or negative types is not particularly limited. W material copper, _, by the second | u 峨 water button, etc. Wet type or use the dry wire of electric material to form a copper circuit. 3. Regarding the light source = the light reflector of the light can be used as a light source by mounting a light-emitting diode on the conductive layer. It is preferable to use LEDs that emit red, green, and blue light, and LEDs that are so-called white light. Fig. 2 shows a case where the light-emitting body (including the metal substrate 10, the light-reflecting layer 2, and the conductive layer 3) is transferred 4 发光 to mount the light-emitting diode. The LED can be used in any of a side view type and a top view type, and Fig. 3A shows a light source in which the side reflector LED 110 is mounted on the light reflector. j 视 视 LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED 3B to 3D show the light source in which the top reflector 18 200821632 type light emitting diode 120 is mounted on the light reflector. The top view type light emitting diode 120 is an LED having a light emitting surface parallel to the mounting surface, and the light emitting portion 130 emits light perpendicular to the mounting surface. Although FIG. 3B and FIG. 3C show a top view type LED, a side view type LED can also be used, which can be selected according to the design of the light source. • Another aspect' In Fig. 3D, as shown, it is preferable to apply a top view type led. In the light source of small and medium-sized liquid crystal displays (LCDs), most of them are mainly made of LEDs that emit white light, and are used in television applications.
中，多半組合使用具有紅色、綠色、藍色之發光特性之 LED。又，即使是中小型LCD，在場順序驅動之lcd之光 源中’最好組合使用具有紅色、綠色、藍色之發光特性之 LED。 紅色、綠色、藍色之LED數之比率只要依各發光二極 體之強度加卩歧即可。例如，藍色之LED之發光效率若 為綠色及紅色之LED之發光效率之3分之i，則只要以盆他 色之3倍密度安裝藍色之LED即可。 、 /在監色系之LED之半導體材科中，#髓系；在藍-綠 ^及白色系之LED之半導體材料中，有Ιη(^系；在紅 色f之LED之半導體材料中，有施 之半導體材料並不限定於吐笙…、 L 疋於此荨，以可獲得各自之色純度之 方式適宜地加以選擇相當重要。 LED在之希望之位置之導電層上以焊料固定 ⑽。焊料雖可使用溶點約 環保管制之無，細使年來之鄕負荷降低及 使用不含鉛之合金焊料。因此，最 19 200821632 好使用溶點雖高於PbSn合金焊料，但在安裝安定性及可靠 性之觀點上更理想之AuSnCu^金焊料（熔點··約22〇。〇 ，之AuSn系合金焊料、SnZnBi合金焊料（熔點：約·。c ) 等之SnZn系合金焊料、SnSb系合金焊料rSnCu系合金焊料 等。 雖也可以使用烙鐵之手工焊接將LED安裝於於光反射 體，但最好在工業上，使用迴焊爐連續且在—個光反射體 上整批地安裝多數LED。在此迴焊法中，例如，將具有以 焊料暫固定之LED之光反射體，在氮等之惰性氣财，加 熱至220〜2赋左右，或使其峨秒至數十秒崎間通過 迴焊爐，藉以施行在焊料之LED之安裝。 在LED之安裝製程及彎曲加工製程中，防止反射面 =傷害相當重要。例如’也可在此等加工前，將保護膜貼 5在光反射層之表面而在加工後除去該保護膜。依照加工 之H適且地選擇具有延伸特性及耐熱特性之保護膜。 =膜之厚度較好__。保護狀附著力較政為 〇.〇l^〇.3kN/m ^ ^^^〇.〇3^〇.2kN/m 〇 Alfaf , 二ΪΪ護^易剝離，太強時，為安裝LED而剝離保護 二寸而要用，餘之力量。保護膜之材f絲氯乙稀、聚 、至及聚料’健狀财，含有SUNYTECT及PAC (般 :有限公司SUNA.化研製）、㈣ASK系列工= 有限公司製）等。 Λ177 ϋ在安裝LED後之光反射體之導電層（電路）中，可步 、抗焊層。突出之電路因反射率較低，故以具有擴散反射 20 200821632 性之抗鋪（例如白色抗兹劑）加以覆蓋時，可提整 =之反射率。又，以白色抗_覆蓋導電層時，可抑制 笔層之反射色，故可降紐射不均。祕層表面之全光線 枓及3有乳化欽、氡化鋅、驗性碳酸鹽、驗性硫酸金l、 ，酸錯、硫化鋅或氧化銻等之填充料之光硬化型抗^及 …硬化型抗焊劑。光硬化型抗焊劑例如為丙烯酸醋構 性單體及分子中含有兼具絲與乙稀性不^ 之^性預聚物之光硬化型抗焊劑。熱硬化型抗焊劑例如 ΪΙΪί官能環氧化合物、多官能氧雜環丁烧化合物、多 s柄<氧赋氫氧基含有化合物等之熱硬化型抗焊劑。 關於面光源裝置 ,b安裝LED後之光反射體可適用於顯示裝置（例如LCD) 之月光用之面光源裝置。LCD用背光可分類為端面照光型 與正下方型。本發明之光源可適用於其中任一方 用之面光源裝置' ^ ^ ^ ^ ^ ^ ^ % 端面照光型背光之情形將光源安裝於導光板之端部， 正下方型之情形將光源安裝於擴散板或照明幕之下部。 =4A〜圖4C中，表示端面照光型背光用之面光源裝 罝、。、V光板200之端部配置於光源之LED附近，將LED光導 入導光板200之侧面。 、 圖4A所示之面光源裝置之LED為側視型，被安裝於平 板狀之光反射體。圖4B及圖4C所示之面光源裝置之LEDg 頂視型（也可為侧視型），被安裝於彎曲加工成凹型（圖4B) 21 200821632 ▲上 或L字型（圖4C)之光反射體。 在端面照光型背光用之面光源裝置中，如H4C所示， 也可將光反射體加工成使光反射體之一部分兼作光板 -需要圖狀反射板加），另外，也可在導光板下配置具有 -熱排放功能之金屬基材，故可提高放熱性。彎曲加工光反 射體之手段不受特別限定。 Φ ^另外，在使用於端面照光型背光用之面光源裝置之導 光板之材質之例中，包含聚甲基丙烯酸曱醋等丙稀酸系樹 脂、？長碳酸醋及聚碳酸醋•聚苯乙烯組成物構成之樹脂、 壞氧緖脂、·聚烯⑽、樹脂（三井化學股份有限公司 製APEL (註冊商標））、日本ΖΕΟΝ股份有限公司製 ZEONOR (註冊商標乃、JSR股份有限公司製art〇n (註 冊商標）等）、及玻璃。但，若導光板之材質係在 380nm〜78〇nm之波長區域中顯示透明性之材料時，則未必 限定於鱗。導光板之厚度只要依制目的及尺寸、光源 籲之大士等適宜選擇即可。又，為使面内之亮度均勾化，也 可在導光板表面施以各種點式印刷。 Θ-方面’在圖4D中，表示正下方型背光用之面光源 . 裝，。擴散板220配置於光源之LED上部，由擴散板22〇之 下導入LED光。圖4D所示之面光源裝置之££；]〇12〇係頂視 型，被安裝於平板狀之光反射體。 使用於正下方型背光之擴散板或照明幕例如係使用以 黏合劑塗佈丙烯酸細珠之聚對苯二甲酸乙二醇酯（ΡΕτ) 22 200821632 目的及 膜或PET膜荨。擴散板或照明幕之厚度只要依使用 尺寸、光源之大小等適宜選擇即可。 關於液晶顯示装置 …本發明之液晶顯示裝置可將液晶面板安裝於會光用〜之 面光源裝置。圖5A〜圖5C係將液晶面板300安裝於端面照 光型背光用之面光源裝置之液晶顯示裝置之概念圖。4In general, LEDs having red, green, and blue light-emitting characteristics are used in combination. Further, even in the case of a small-to-medium-sized LCD, it is preferable to use an LED having red, green, and blue light-emitting characteristics in the light source of the lcd which is sequentially driven. The ratio of the number of LEDs of red, green, and blue may be increased by the intensity of each of the light-emitting diodes. For example, if the luminous efficiency of the blue LED is 3/min of the luminous efficiency of the green and red LED, the blue LED can be mounted at a density of 3 times the pot color. / In the semiconductor material section of the LED of the color system, # marrow system; among the semiconductor materials of the blue-green^ and white-based LEDs, there are Ιη(^ series; among the semiconductor materials of the red f LED, The semiconductor material is not limited to spitting..., L 疋, and it is important to appropriately select the manner in which the respective color purity can be obtained. The LED is fixed by solder on the conductive layer at the desired position (10). Although it is possible to use the melting point to be environmentally friendly, it has reduced the load of the year and used lead-free alloy solder. Therefore, the most used 1910221632 is better than the PbSn alloy solder, but it is stable and reliable in installation. From the viewpoint of the nature, AuSnCu^ gold solder (melting point · about 22 〇. A, AuSn-based alloy solder, SnZnBi alloy solder (melting point: about · c), SnZn-based alloy solder, SnSb-based alloy solder rSnCu Alloy solder, etc. Although it is also possible to mount the LED on the light reflector by hand soldering using a soldering iron, it is preferable to industrially use a reflow oven to continuously mount a plurality of LEDs in a batch on a light reflector. In this reflow method For example, a light reflector having an LED temporarily fixed by solder is heated to 220 to 2 in an inert gas such as nitrogen, or it is passed through a reflow furnace for a leap second to several tens of seconds, thereby being applied to the solder. LED installation. In the LED mounting process and bending process, it is very important to prevent the reflection surface = damage. For example, 'The protective film can also be attached to the surface of the light reflection layer before processing. The protective film is selected according to the processing H and has a protective film having elongation characteristics and heat resistance characteristics. = The thickness of the film is better __. The protective adhesion is better than that of the government. 〇l^〇.3kN/m ^ ^ ^^〇.〇3^〇.2kN/m 〇Alfaf, two ΪΪ ^ ^ easy to peel off, too strong, in order to install the LED and peel off protection two inches to use, the power of the remaining. protective film material f silk Dilute, poly, and aggregate materials 'Jian Cai Cai, including SUNYTECT and PAC (General: SUNA. Chemical Co., Ltd.), (4) ASK Series = Co., Ltd.), etc. Λ177 导电 Conductivity of light reflector after LED installation In the layer (circuit), the step and solder resist layer. The protruding circuit has a low reflectivity, so it has an expansion When the anti-spray 20 200821632 anti-paste (such as white anti-stretching agent) is covered, it can be adjusted to reflect the reflectivity. Moreover, when the white anti-coating is used to cover the conductive layer, the reflective color of the pen layer can be suppressed, so Irregularity of the shot. The total light of the surface of the secret layer and the photohardening resistance of 3 fillers such as emulsified zinc, zinc telluride, test carbonate, test sulfate, l, acid, zinc sulfide or antimony oxide. ^ and ... hardened solder resist. The photocurable solder resist is, for example, an acrylic acrylate-based monomer and a photocurable solder which contains both a silk and an ethylene-based prepolymer. The thermosetting type solder resist is a thermosetting type solder resist such as a ruthenium-functional epoxy compound, a polyfunctional oxetane compound, a multi-sole <oxygen-oxygen-containing compound. Regarding the surface light source device, b the light reflector after the LED is mounted can be applied to a surface light source device for a moonlight of a display device (for example, an LCD). The backlight for LCD can be classified into an end-illuminated type and a direct-back type. The light source of the present invention can be applied to the surface light source device of any one of the components. ^ ^ ^ ^ ^ ^ ^ ^ % The light source is mounted on the end of the light guide plate in the case of the end-illuminated backlight, and the light source is mounted on the diffusion under the condition of the direct type. The bottom of the board or lighting screen. =4A to 4C show the surface light source mounting for the end-illuminated backlight. The end of the V-plate 200 is disposed near the LED of the light source to guide the LED light to the side of the light guide plate 200. The LED of the surface light source device shown in Fig. 4A is of a side view type and is attached to a flat plate-shaped light reflector. The LEDg top view type (also side view type) of the surface light source device shown in Fig. 4B and Fig. 4C is mounted on a light which is bent into a concave shape (Fig. 4B) 21 200821632 ▲ or an L shape (Fig. 4C). Reflector. In the surface light source device for an end-illuminated backlight, as shown by H4C, the light reflector may be processed such that one portion of the light reflector doubles as a light plate (requires a pattern-shaped reflector), and may also be under the light guide plate. The metal substrate having the heat-discharging function is disposed, so that the heat dissipation property can be improved. The means for bending the processed light reflector is not particularly limited. Φ ^ In addition, in the example of the material of the light guide plate used for the surface light source device for an end face illumination type backlight, an acrylic resin such as polymethyl methacrylate vinegar is used. Resin composed of long carbonic acid vinegar, polycarbonate, and polystyrene, oxyxime, polyene (10), resin (APEL (registered trademark) manufactured by Mitsui Chemicals, Inc.), and ZEONOR (manufactured by Nippon Co., Ltd.) The registered trademark is ART〇n (registered trademark), etc. manufactured by JSR Co., Ltd., and glass. However, when the material of the light guide plate is a material exhibiting transparency in a wavelength region of 380 nm to 78 〇 nm, it is not necessarily limited to a scale. The thickness of the light guide plate may be appropriately selected according to the purpose and size, and the source of the light source. Further, in order to make the brightness in the plane uniform, various dot printing can be applied to the surface of the light guide plate. In the case of Fig. 4D, a surface light source for a backlight type under right is shown. The diffusion plate 220 is disposed on the upper portion of the LED of the light source, and the LED light is introduced from below the diffusion plate 22. The surface light source device shown in Fig. 4D is a top view type, and is mounted on a flat light reflector. The diffusing plate or the lighting curtain used for the direct type backlight is, for example, a polyethylene terephthalate (ΡΕτ) 22 200821632 coated with acrylic beads with a binder and a film or PET film. The thickness of the diffuser or the illumination screen may be appropriately selected depending on the size of use, the size of the light source, and the like. Liquid crystal display device The liquid crystal display device of the present invention can mount a liquid crystal panel to a surface light source device for use in a light source. 5A to 5C are conceptual views of a liquid crystal display device in which a liquid crystal panel 300 is mounted on a surface light source device for an end face illumination type backlight. 4
另一方面，圖5D係將液晶面板300安裝於正下方型背 光用之面光源裝置之液晶顯示裝置之概念圖。 在液晶面板300,適宜地設置偏光膜、擴散膜、稜鏡片、 相位差膜等係設計事項之範疇。面光源裝置可適合使用於 裝備有濾色器與薄膜電晶體（TFT)陣列或薄膜二極體型 (TFD )之主動矩陣方式之液晶面板。作為光源，若使紅 色、綠色、藍色之LED獨立地以時間分隔方式發光，則不 必配置濾色态，也可利用液晶面板之轉接之殘影效果而顯 示出中間色。此方式稱為場順序方式。 、 [實施例] 茲參照以下之實施例更具體地說明本發明，但本發明 之範圍不因實施例而限定地被解釋。 [實施例1] 將氧化鈦微粒子（製品名：TIPAQUE R960、石原產 業（股）製）混合於加熱硬化型之矽酮橡膠接著劑（製品 名· TSE3251H、GE東芝矽酮（股）製）中而將氧化鈦微 粒子之含有率設定為25重量％。將所得之混合物保持於真 空中3小時，使其消泡。 23 200821632 將混合氧化鈦微粒子之矽酮橡膠接著劑，利 分別塗佈塗佈於腿_號之銘板（厚：Q.2mm)^: (厚：18μη〇。貼合絲之接著劑塗佈面與_之_ •塗佈面而货峨 約50μιη。 ^与度 以印刷法在銅面㈣抗_而㈣希望糊之邻 份。驗鐵紐之濕式_法除去不要之編形電 路。濕式伽m，沖洗表面’再除去抗侧而獲得如圖认 及圖1B所示之光反射體。 _銅而露出之樹脂面為反射面。以利用積分球之可 見紫外分絲度計（^賴作所：UK2·)败此反射 面之全光歧料。反射糊定之鮮係使祕分光光产 計廠商指定之魏鋇粉末裝人分光光度計附屬之保持哭^ 之，準。標準板既可為使硫酸_末固化之標準板，也可 為乳標準板’在本實補巾，係使用使硫酸鋇粉末固 化之2準板。波長55〇nm之全光線反射率為95%。同裝置 所測定之波長550nm之擴散反射率為92%。又，由全光線 反射光譜算出之漢特值a為-1.6，漢特值b為-〇.9。 、 +另外，以下列條件測定混合氧化鈦微粒子之石夕酮橡膠 接著劑與銅箔之剝離強度之結果，為0.6kN/m值。 [剝離強度測定條件] 使用機器：股份有限公司東洋精機製作所Strogroph Ml 測定條件：測力傳感器500N、傳感器移動速度 24 200821632 50mm/min、90°剝離 試樣大小：3.2mm><40mm 使所得之光反射體以1分鐘之時間通過260°C之含氮氣 體環境之迴焊爐.。其後.，計測反射面之反射率、·及接著層 ， 與銅箱之剝離強度。與通過迴焊爐前相比，確認反射率、 . 及剝離強度均未降低。 再將所得之光反射體之導電層塗佈白色抗蝕劑（太陽 • 墨汁製造股份有限公司製：Ph〇tofmer-PMR6000 )，經]^ 曝光後加熱使其硬化。以同樣方法測定白色抗蝕劑之白色 面之全光線反射率之結果，在波長550nm之反射率為88%。 [實施例2] 將氧化鈦微粒子（製品名TIPAQUE R930、石原產 業（股）製）混合於與實施例1同樣之矽酮橡膠接著劑中而 將氧化鈦微粒子之含有率設定為35重量％。將所得之混合 物保持於真空中3小時，使其消泡。 口 將混合氧化鈦微粒子之白色矽朋橡膠接著劑，分別塗 _ 佈於與實施例1同樣之銘板（厚：〇.2_)及銅荡（厚了 18μιη)。使兩接著劑塗佈面重疊而以17〇。〇熱壓1小時。所 得之積層物之接著層厚度約50μιη。 與實施例1同樣地，利用蝕刻除去銅箔。以利用積分球 之可見紫外分光光度計（日立製作所製：UJMO)測定霖 . 出之反射面之全光線反射率。測定反射率之標準係使用^ 化鋁白板（型號：210-0740 )。波長550nm之反射率為。 同裝置所測定之波長550nm之擴散反射率為95%。又，〇由 25 200821632 全光線反射光譜算出之漢特值a為-1·9，值b為〇 7。 另外，以與實施例1同樣條件測定白色矽s同橡膠接著劑 與銅箔之剝離強度之結果，為〇.45kN/m值。 " Θ …使所得之光反射體、通過細亡之含氮氣體環境之迴..焊. 爐3次（通過時間1分鐘），計測反射面之反射率、及接著声 與銅箔之剝離強度之結果，與通過迴焊爐前相比，確認^ 射率、及剝離強度均未降低。 再將所得之光反射體，於氣體環境溫度6〇ΐ、相對濕 度90%之耐濕熱試驗環境下放置5〇〇小時後，測定反射单及 剝離強度之結果，確認在耐濕熱試驗前後，反 爲專 離強度均未降低。 ^ 及剝 將所得之光反射體以特定條件（溫度及時間）、、君:主 以下之1)〜6)所示之鹼性水溶液或有機溶劑， 後測定反射率及祕強度，均未發現變化。可知如 之光反射層之耐驗性及耐溶劑性相當高。 、On the other hand, Fig. 5D is a conceptual diagram of a liquid crystal display device in which a liquid crystal panel 300 is mounted on a surface light source device for a direct type backlight. In the liquid crystal panel 300, a design item such as a polarizing film, a diffusion film, a ruthenium film, or a retardation film is suitably provided. The surface light source device can be suitably used for an active matrix type liquid crystal panel equipped with a color filter and a thin film transistor (TFT) array or a thin film diode type (TFD). As the light source, if the red, green, and blue LEDs are independently illuminated in a time-separated manner, the color filter state is not necessarily required, and the intermediate color can be displayed by the effect of the image sticking of the liquid crystal panel. This method is called the field sequential mode. [Examples] The present invention will be specifically described with reference to the following examples, but the scope of the present invention is not construed as limited by the examples. [Example 1] Titanium oxide fine particles (product name: TIPAQUE R960, manufactured by Ishihara Sangyo Co., Ltd.) were mixed in a heat-curable ketone rubber adhesive (product name: TSE3251H, GE Toshiba ketone) The content of the titanium oxide fine particles was set to 25% by weight. The resulting mixture was kept in the air for 3 hours to defoam it. 23 200821632 The bismuth ketone rubber adhesive of titanium oxide fine particles is mixed and applied to the nameplate of the leg _ No. (thickness: Q.2mm) ^: (thickness: 18μη〇. Adhesive coated surface of the bonding wire) _ _ _ • coated surface and about μ about 50μιη. ^ and degrees by printing method in the copper surface (four) anti- _ and (four) hope that the paste is adjacent. The iron method of the iron _ method to remove the unwanted circuit. Wet The gamma m, the rinsing surface 'removs the anti-side to obtain the light reflector as shown in Fig. 1B. _ The exposed resin surface of the copper is the reflecting surface. The visible ultraviolet filament meter using the integrating sphere (^ Lai Zuo: UK2·) Loss of the all-light viscous of this reflective surface. The freshness of the reflection paste makes the Wei Wei powder-coated spectrophotometer specified by the secret light and light meter manufacturer to keep crying. The standard plate for curing sulfuric acid or the standard plate for milk can be used as the standard plate for curing the barium sulfate powder. The total light reflectance at a wavelength of 55 〇 nm is 95%. The diffuse reflectance at a wavelength of 550 nm measured by the same device was 92%. Further, the Hantel value a calculated from the total light reflectance spectrum was -1.6. The Hantel value b is -〇.9. Further, the peel strength of the oxysulfonate rubber-bonding agent and the copper foil of the mixed titanium oxide fine particles is measured under the following conditions, and is 0.6 kN/m. Conditions] Machine: Co., Ltd. Toyo Seiki Co., Ltd. Strogroph Ml Measurement conditions: load cell 500N, sensor moving speed 24 200821632 50 mm/min, 90° peeling sample size: 3.2 mm > 40 mm The resulting light reflector was After 1 minute, it passes through a reflow oven containing a nitrogen gas atmosphere at 260 ° C. Thereafter, the reflectance of the reflecting surface, and the peeling strength of the adhesive layer and the copper box are measured. Compared with before the reflow furnace It was confirmed that the reflectance, and the peeling strength were not lowered. The conductive layer of the obtained light reflector was coated with a white resist (Ph〇tofmer-PMR6000, manufactured by Sun • Ink Manufacturing Co., Ltd.), and exposed by ^^ After heating, it was hardened. The total light reflectance of the white surface of the white resist was measured in the same manner, and the reflectance at a wavelength of 550 nm was 88%. [Example 2] Titanium oxide fine particles (product name TIPAQUE R930, stone The original product (manufactured by the company) was mixed in the same oxime rubber adhesive as in Example 1 to set the content of the titanium oxide fine particles to 35% by weight. The obtained mixture was kept in a vacuum for 3 hours to defoam. The mouth was mixed with titanium oxide fine particles of a white rubber adhesive, and coated on the same nameplate (thickness: 〇.2_) and copper slab (thickness of 18 μm) as in Example 1. The two adhesive coated surfaces were coated. The laminate was laminated under heat for 1 hour, and the thickness of the laminate of the obtained laminate was about 50 μm. The copper foil was removed by etching in the same manner as in Example 1. The total light reflectance of the reflecting surface was measured by a visible ultraviolet spectrophotometer (manufactured by Hitachi, Ltd.: UJMO) using an integrating sphere. The standard for measuring reflectance is to use an aluminum white plate (model: 210-0740). The reflectance at a wavelength of 550 nm. The diffuse reflectance at a wavelength of 550 nm measured by the same apparatus was 95%. Moreover, the Hantel value a calculated from the total light reflection spectrum of 25 200821632 is -1·9, and the value b is 〇 7. Further, as a result of measuring the peel strength of the white crucible s with the rubber adhesive and the copper foil under the same conditions as in Example 1, it was a value of 〇45 kN/m. " Θ ...to make the resulting light reflector, through the fine nitrogenous environment back.. welding. The furnace 3 times (passing time 1 minute), measuring the reflectivity of the reflective surface, and the peeling of the sound and copper foil As a result of the strength, the confirmation rate and the peel strength were not lowered as compared with those before the reflow furnace. The obtained light reflector was placed in a humidity-resistant test environment at a gas atmosphere temperature of 6 Torr and a relative humidity of 90% for 5 hours, and the results of the reflection sheet and the peel strength were measured, and it was confirmed that before and after the heat-resistant heat test, The intensity of the separation is not reduced. ^ And peeling off the obtained light reflector under specific conditions (temperature and time), and the basic aqueous solution or organic solvent shown in 1) to 6), and then measuring the reflectance and the secret strength, none of which was found. Variety. It is understood that the durability and solvent resistance of the light reflecting layer are relatively high. ,
無變价 無變化 無變价 無變化 無變价 無變A 1) NaOH (3重量％水溶液）50。〇、30秒 2) KOH (3重量％水溶液）50°C、30秒 3) NaOH (5重量％水溶液）25°C、15秒 4) KOH (5重量％水溶液）25。〇15秒 5) MEK (曱乙酮） 25〇C > 15f/ 6) IPA(異丙醇） 25ΐ、15 秒 [實施例3] 石；錢倾微粒子（製品名：ΤΙΡΑ(咖m_110 ”產業（股）製）混合於與實施w同樣之石夕綱橡勝接： 26 200821632 劑中而將針狀氧化鈦微粒子之含 定$旦％ 所得，物保持於真空中3小=以重4 狀氧化獻微粒子之白色石夕嗣橡膠接著劑，八 s 1 w 佈豐而以17〇。〇熱遷1小時。所得之并 層物之接著層厚度⑽,。 了崎之積 例1同樣地，侧除去鋪 玫 紫外分光光度計（日立製作所製：_: = 路出之反射面之全光線反射率為95% (將波長 550·而測定）。測定反射率之標準係使用氧化銘白板（= 長Μ為55Gnm而败）。又’由全光線反射光譜算出之= 特值1-L7,值_.7。另外，以與實施例！同樣條件測^ 之白色矽酮橡膠接著劑層與銅箔之剝離之 0.88kN/m 值。 馬 [比較例1] 利用以下之程序製作白色環氧樹脂基板：使脂環式澤 氧樹脂50質量份、雙酚A型環氧樹脂4〇質量份、縮水甘^ 曱基丙烯酸酯共聚物10質量份溶解於曱乙酮5〇質量份主 漆 A)。 /n 又，使作為硬化劑之雙氰胺3f量份、作為硬化促進劑 之1-氰基乙基-2-十一烧咪唾(U質量份溶解於二甲美萨 胺25赁量份（清漆B)。 混合清漆A與清漆B，再混合氧化鈦微粒子及營光增白 27 200821632No change No change No change No change No change No change No change A 1) NaOH (3 wt% aqueous solution) 50. 〇, 30 seconds 2) KOH (3 wt% aqueous solution) 50 ° C, 30 seconds 3) NaOH (5 wt% aqueous solution) 25 ° C, 15 seconds 4) KOH (5 wt% aqueous solution) 25. 〇15 seconds 5) MEK (曱乙酮) 25〇C > 15f/ 6) IPA (isopropyl alcohol) 25ΐ, 15 seconds [Example 3] Stone; money dumping microparticles (product name: ΤΙΡΑ (咖m_110 ” industry (share) system) mixed with the same as the implementation of w Shi Xigang rubber wins: 26 200821632 in the agent and the needle-shaped titanium oxide microparticles are set to a value of $ dan%, the object is kept in vacuum 3 small = weight 4 Oxidation of micro-particles of white stone scorpion rubber adhesive, eight s 1 w Buffon and 17 〇. 〇 heat for 1 hour. The resulting layer thickness of the stratified layer (10), the same as the case of Saki The side is removed from the UV spectrophotometer (made by Hitachi, Ltd.: _: = the total light reflectance of the reflective surface of the road is 95% (measured by the wavelength 550·). The standard for measuring the reflectance is to use the Oxide Whiteboard (= The long Μ is 55Gnm and loses.) It is calculated from the total light reflection spectrum = the specific value 1-L7, the value _.7. In addition, the white fluorenone rubber adhesive layer and copper are measured under the same conditions as in the examples! The peeling of the foil was 0.88 kN/m. Ma [Comparative Example 1] A white epoxy substrate was prepared by the following procedure: alicyclic oxygen 50 parts by mass of the resin, 4 parts by mass of the bisphenol A type epoxy resin, and 10 parts by mass of the glycidyl methacrylate copolymer are dissolved in 5 parts by mass of the ruthenium ketone, the main lacquer A). a 3 dl portion of dicyandiamide as a hardening accelerator, 1-cyanoethyl-2-iodopyrene saliva (U mass parts dissolved in dimethyl mesalamine 25 parts (varnish B). Mixed varnish A and varnish B, and then mixed with titanium oxide particles and Yingguang whitening 27 200821632
^ ^ 1.X 劑〇·3質量份而得白色環氡清漆。氧化鈦微粒子之含有率為 35重量％。使^璃布浸漬於所得之白色環氧清漆而以15〇七 使其預備乾燥5分鐘，在其上下疊上銅箔（厚度：〗·叫磁） 而以:ΐ7〇υ熱壓_。環氧樹脂層之厚度約550陣_ - 利用與只施例1同樣之方法，以蝕刻除去銅箔而使反射 . 面露出。以利用積分球之可見紫外分光光度計（日立製作 所製：υ-3010)測粟之全光線反射率為9〇% (將波長設定 為550nm而測定）。同裝置所測定之擴散反射率為9〇%將 波長設定為550nm而測定）。由全光線反射光譜算出之漢特 值a為-2.2，值b為2.9 〇 、 1)耐熱性試驗 利用與實施例1同樣之方法，以姓刻除去在實施例2及 比較例1所得之反射體之銅箔而得露出反射面之試樣。測突 露出之反射面之全光線反射率（圖6八之未處理試樣）。另 夕卜，將露出反射面之試樣以Wc加熱1〇小時而測定反射面 之全光線反射率之變化（圖6A之處理試樣）。測定結果如 ，6A所不。又，各試樣之反辦對波長55()_之光之加熱 %間之隨時間的變化如圖所示。 如，6A_ ’可知：來自比較例丨之試樣妇。小時加 :後，波長區域之反料之劣化相# 之試樣在10小時加熱後之試樣之反射率幾乎 4如此’可知來自實施例_式樣之耐熱性較優里。 2)耐紫外線性試驗 八 利用與實施例1同樣之方法，以侧除去在實施例2及 28 200821632 比較例1所得之反射體之銅II而得露出反射面之紗目卜 露出之反射面之全光線反射率（圖7之未處理“ 疋 測定以高壓汞燈光（照射強度二約90mw/cm2 昭^= 線1分鐘之反射面之全光線反射率.（圖:7之處理試'。"、卜 測定結果如圖7所示。來自比較例k試樣即&未。處理 時，反射率也較低，㈣過處理後，在短波長區域之=射 率，著地下降。另-方面’來自實施例2之試樣由未處理之 狀態’其反射率就較高’且通過處理後，劣化也較少。如 此，可知來自實施例2之試樣之耐紫外線較優異。 3)耐光熱性試驗 利用與實施例1同樣之方法，以蝕刻除去在實施例2及 2較例1所得之反射體之銅箱而得露出反射面之試樣。測定 露出之反射面之全光線反射率（圖s之未處理試樣）。另外， 將试樣以加熱保持於10〇艺之狀態，照射仿太陽光（約 550mW/cm2) 150小時。在氙燈安裝空氣質量（Α·Μ)過濾 裔1.5而獲得仿太陽光。測定其後之全光線反射率（圖8之 處理試樣）。 測定結果如圖8所示。來自比較例丨之試樣之反射率因 照射處理而降低。另一方面，在來自實施例2之試樣中，反 射率幾乎無變化。如此，可知來自實施例2之試樣之耐光熱 性較優異。 4)彎曲加工性試驗 由貝施例2及比較例1之反射體切下i〇cnlx 1cm之試 樣’將夾具抵在中央部使其彎曲9〇。。來自實施例2之試樣 29 200821632 即使背，曲90。，其樹脂及銅荡均未剝離而能維持其形狀。另 一方面，來自比較例1之試樣彎曲9〇時，則發生樹脂層破杂 而在玻璃布間發生剝離。 乂 …f實施例4] ............. · — … ................一-….，·...〜 LED之安裝 由實施例1所得之光反射體切下19cmx27cm之試樣，在 试樣之鋁板上層壓接合保護膜，再於銅箔上層壓接合乾膜 抗蝕劑（旭化成股份有限公司製·· AQ3〇58)。經由描繪有 LED之安裝電路圖案之光罩，#uv照射域膜抗韻劑，使 安裝電路圖案部之抗侧硬化。抗飿劑硬化後，將試樣浸 潰於碳酸鈉水溶液而除去未硬化之抗蝕劑。入 其後，將試樣浸潰於氯化鐵溶液而以蝕刻徐去被除去 抗後，區域之銅箔後，沖水清洗。將沖水清洗後之試 1/叉/貝於鼠氧化鈉水溶液而除去所有之抗飯劑。 1在形成安裝電路圖案之面全區域塗饰白色抗焊劑（太 陽墨汁製造股份有限公司製：photoflner_PMR6000 W3^ 劑）與CA-40 G30 (硬化劑）之7〇 : 30比率之混合物）而 以8〇°〇加_分鐘使其麵，形成2()_厚度之膜。接著， 經由光罩照射UV而使排除需要安裝LED用之焊接之區域 以外之有女裝電路圖案之鋼箔之區域之抗焊劑硬化。抗焊 ，硬化後，賴樣浸漬於碳_水溶液樣去未硬化之抗 焊背]再用水沖洗。其後H5〇〇C加熱6〇分鐘而進一步使 抗焊劑硬化。 純粹洗淨被除去抗焊劑之區域（需要焊接之區域），再 30 200821632 於1J ^利用絲網印刷機印刷Sn-Ag-Cu( Ag3%、Cu0.5% ) ^，料貧。其次，利用迴焊處理將1£1)晶片安裝於印上焊 料广之II域。頻上，使試樣以卿鐘料騎過最高溫 ‘之迴焊爐1„ [實施例5] 以實施例4所示之方法，在實施例1所得之光反射體， ^圖3A所示安裝侧視型之白色LED，藉以獲得光源。在所 得之光源’如圖4A所示安裝丙烯酸樹脂之導光板而獲得面 光源裝置。 [實施例6]^ ^ 1.X Agent 〇·3 parts by mass of white ring enamel. The content of the titanium oxide fine particles was 35 wt%. The glass cloth was immersed in the obtained white epoxy varnish and preliminarily dried for 5 minutes at 15 ,, and a copper foil (thickness: 〗 〖called magnetic) was placed on top of it and 〇υ7〇υ hot pressed _. The thickness of the epoxy resin layer was about 550 Å - in the same manner as in Example 1, the copper foil was removed by etching to reflect it. The total light reflectance of the millet was measured by a visible ultraviolet spectrophotometer (manufactured by Hitachi, Ltd.: υ-3010) using an integrating sphere (measured by setting the wavelength to 550 nm). The diffuse reflectance measured by the same apparatus was measured by setting the wavelength to 550 nm. The Hantel value a calculated from the total light reflection spectrum was -2.2, and the value b was 2.9 〇. 1) Heat resistance test The reflection obtained in Example 2 and Comparative Example 1 was removed by the same method as in Example 1 by the surname. A copper foil of the body is used to expose a sample of the reflecting surface. The total light reflectance of the exposed reflective surface is measured (Fig. 6 untreated sample). Further, the sample having the reflecting surface exposed thereto was heated by Wc for 1 hour to measure the change in the total light reflectance of the reflecting surface (the treated sample of Fig. 6A). The measurement results are as shown in Fig. 6A. Further, the change with time between the heating of the light of the wavelength of 55 () _ of each sample as shown in the figure is as shown. For example, 6A_ ’ knows: the sample from the comparative example. After the hourly addition: the reflectance of the sample of the deteriorated phase # in the wavelength region after the heating for 10 hours was almost the same as that of the sample of the Example _. 2) UV resistance test 8 In the same manner as in Example 1, the copper II of the reflector obtained in Comparative Example 1 of Examples 2 and 28 200821632 was removed side by side to obtain a reflecting surface from which the surface of the reflecting surface was exposed. Total light reflectance (unprocessed in Figure 7) 疋 Measured with high-pressure mercury light (irradiation intensity of about 90mw/cm2 ^^= 1 minute of total reflection of the reflective surface of the line. (Figure: 7 treatment test '." The measurement results are shown in Fig. 7. The sample from the comparative example k is & not. The reflectance is also low during the treatment, and (4) after the overtreatment, the radiation rate in the short wavelength region is lowered. On the other hand, the sample from Example 2 had a higher reflectance from the untreated state, and the deterioration was also small after the treatment. Thus, it was found that the sample from Example 2 was excellent in ultraviolet resistance. The photothermal resistance test was carried out in the same manner as in Example 1 except that the copper boxes of the reflectors obtained in Comparative Examples 2 and 2 were removed by etching to obtain a sample having a reflecting surface. The total light reflection of the exposed reflecting surface was measured. Rate (unprocessed sample of Figure s). In addition, the sample is The heat is maintained at 10 〇, and the sunlight is irradiated (about 550 mW/cm 2 ) for 150 hours. The air quality (Α·Μ) is installed in the xenon lamp to filter the genus 1.5 to obtain the sunlight. The total light reflectance is measured. The measurement result of Fig. 8 is shown in Fig. 8. The reflectance of the sample from the comparative example was lowered by the irradiation treatment. On the other hand, in the sample from Example 2, the reflectance was almost no. Thus, it can be seen that the sample from Example 2 is excellent in heat resistance. 4) Bending workability test A sample of i〇cnlx 1 cm was cut out from the reflectors of Example 2 and Comparative Example 1 The center portion was bent by 9 〇. From the sample 29 of the second embodiment, 200821632, even if the back, the curve 90, the resin and the copper swarf were not peeled off to maintain the shape. On the other hand, the sample from the comparative example 1 When the bending is 9 ,, the resin layer is broken and peeling occurs between the glass cloths. 实施...f Example 4] ..................................... ........一-....,·...~ LED installation The light reflector obtained in Example 1 was cut into a 19 cm x 27 cm sample. A laminate-bonding protective film was laminated on the board, and a dry film resist (AQ3〇58 manufactured by Asahi Kasei Co., Ltd.) was laminated and laminated on the copper foil. The mask was mounted with a pattern of the LED mounted circuit pattern. The rhyme agent hardens the side of the mounted circuit pattern portion. After the anti-caries agent is hardened, the sample is immersed in an aqueous solution of sodium carbonate to remove the uncured resist. Thereafter, the sample is immersed in ferric chloride. After the solution was removed by etching, the copper foil in the area was washed with water, and the 1/fork/bee was treated with a sodium hydroxide aqueous solution to remove all the anti-rice agents after washing with water. 1 Apply white solder resist (made by Sun Ink Manufacturing Co., Ltd.: photoflner_PMR6000 W3^) to CA-40 G30 (hardener) in a total area of the surface on which the circuit pattern is formed. 〇°〇Add _min to make it face, forming a film of 2()_thickness. Next, the UV is irradiated through the reticle to harden the solder resist in the region of the steel foil having the female circuit pattern other than the area where the solder for mounting the LED is to be mounted. After soldering and hardening, the sample is immersed in a carbon-water solution to the unhardened anti-weld back] and rinsed with water. Thereafter, H5〇〇C was heated for 6 minutes to further harden the solder resist. The area where the solder resist is removed (the area to be soldered) is purely washed, and then 30-216216 is used to print Sn-Ag-Cu (Ag3%, Cu0.5%) ^ by screen printing machine, which is lean. Next, a 1 £1) wafer was mounted on the printed II field by solder reflow. In the frequency, the sample is allowed to ride through the highest temperature 'reflow furnace 1' with the bell material. [Example 5] The light reflector obtained in Example 1 was obtained by the method shown in Example 4, as shown in Fig. 3A. A side view type white LED is attached to obtain a light source. The surface light source device is obtained by mounting an acrylic resin light guide plate as shown in Fig. 4A. [Embodiment 6]
、將在實施例1所得之光反射體之擴散反射面彎曲加工 成凹面。以實施例4所示之方法，在彎曲加工後之光反射 ，却圖3B及圖3C所示安裝頂視型或側視型之白色LED， 错以獲得光源。在所得之圖3B及圖3c所示之光源，如圖4B f圖4C所讀縣裝_ _脂之導紐而獲得面光源 衣置。 [實施例7] 以貫施例4所示之方法，在實施例丨所得之光反射體， 圖3D所tf安裝頂視型之紅色、綠色、藍色之LED，藉^ ，得光源。在所得之光源，如圖41)所示安裝pET樹脂之 政板而獲得面光源裝置。 ‘ [產業上之可利用性] 人本發明之光反射伽液晶顯调之面舰裝置為首， 。°適地剌於室内照明、屋内照明、汽車用照明、裝脅 31 200821632 用照明等各種照明等之光源。尤其，本發明之光反射體、 光源、面絲裝置或液晶顯示裝置可_於域帶式機界 及電腦監視器等中小型至電視用途等之大型液晶顯示器。 —. '本申請案主張依據2伽6年8月23日提出―申讀之廿本.專 利申請案號號JP2006-226400 (特願2〇〇6_2264〇〇)之優先 權。其專利說明書及圖式所記載之内容全部援用於本。 【圖式簡單說明】 η 圖1Α係表示光反射體之積層狀態之剖面圖。 圖1Β係表示光反射體由導電層側所見之上視圖。 圖2係在光反射體安裝LED之光源之剖面圖。 圖3A係在光反射體安裝側視型咖之光源之剖面圖。 圖3B係在凹型光反射體安裝頂視型Led之光源之剖 面圖。 圖3C係在L字型光反射體安裝頂視型咖之之The diffuse reflection surface of the light reflector obtained in Example 1 was bent into a concave surface. In the method shown in Embodiment 4, the light reflection after the bending process was carried out, but the white LED of the top view type or the side view type was mounted as shown in Figs. 3B and 3C, and the light source was obtained by mistake. In the obtained light source shown in Fig. 3B and Fig. 3c, the surface light source is obtained as shown in Fig. 4B f Fig. 4C. [Example 7] In the method shown in Example 4, in the light reflector obtained in the example, the red, green, and blue LEDs of the top view type were mounted on the tf of Fig. 3D, and the light source was obtained. The surface light source device was obtained by mounting the pET resin panel as shown in Fig. 41). ‘ [Industrial Applicability] The light-reflecting gamma liquid crystal display of the surface ship device of the present invention is the first. ° Suitable for indoor lighting, indoor lighting, automotive lighting, and installation. 31 200821632 Light sources such as lighting. In particular, the light reflector, the light source, the wire feeder, or the liquid crystal display device of the present invention can be used for a large-sized liquid crystal display such as a medium-sized belt and a computer monitor, such as a medium-sized to television application. —. 'This application is based on the priority of the application for the application of the patent application No. JP2006-226400 (Special Wish 2〇〇6_2264〇〇) on August 23, 2006. The contents described in the patent specifications and drawings are all used in this document. BRIEF DESCRIPTION OF THE DRAWINGS η Figure 1 shows a cross-sectional view of a laminated state of a light reflector. Figure 1 is a top view showing the light reflector from the side of the conductive layer. Figure 2 is a cross-sectional view of a light source in which an LED is mounted on a light reflector. Fig. 3A is a cross-sectional view showing a light source of a side view type of a light reflector. Fig. 3B is a cross-sectional view showing a light source in which a concave light reflector is mounted on a top view type Led. Figure 3C is a top view type of coffee in the L-shaped light reflector
面圖。 广 W 圖3D係在平板型光反射體安裝頂視型咖之光 剖面圖。 乂 圖仏係供在雇之錢安料域之端面日 光用之面光源裝置之剖面圖。 …、尤^月 圖犯係供在圆之光源安裝導光板之端㈣ 光用之面光源裝置之剖面圖。 …ϋ月 圖4C係供在圖3C之光源安裝導来虹+ ^ 光用之面光源裝置之剖面圖。桃之端面照光型背 圖4D係供在圖3D之光源安裝擴散板之正下方型背光 32 200821632 用之面光源裝置之剖面圖。 圖5 A係具有圖4A之端面照光型背光用之面光源裝置 之液晶顯示裝置之剖面圖。 .................^ ^^ . 之液晶顯示裝置之剖面圖。 „ 圖5C係具有圖4C之端面照光型背光用之面光源裝置 之液晶顯示裝置之剖面圖。 圖5D係具有含圖4D之正下方型背光用之面光源裝置 參 之液晶顧示裝置之剖面圖。 圖6A係加熱處理本發明（實施例2)之反射板、與以 往（比較例1)之反射板而比較其耐熱性之曲線圖，表示加 熱前後之反射卑之變化。 圖6B係加熱處理本發明（實施例2)之反射板、與以 往（比較例1)之反射板而比較其耐熱性之曲線圖，表示對 加熱時間之反射率之隨時間的變化。 圖7係紫外線照射處理本發明（實施例2 )之反射板、 ⑩ 與以往（比較例1)之反射板而比較其耐紫外線性之曲線 圖，表示照射前後之反射率之變化。 圖8係仿太陽光照射處理本發明（實施例2)之反射 板、與以往（比較例1)之反射板而比較其耐光熱性之曲 - 線圖’表示照射前後之反射率之變化。 — 【主要元件符號說明】 10金屬基材 20具有電絕緣性之光反射層 33 200821632 30導電層 4Θ焊料 100發光二極體 J J Q 則4見型4虽 120頂視型發光二極體 130發光二極體之光出射部 200導光板 210反射板 220擴散板 300液晶面板Surface map. Wide Fig. 3D is a cross-sectional view of a top view type of coffee mounted on a flat type light reflector.乂 Figure 剖面 is a sectional view of the surface light source device for the end face of the employed money source. ..., especially ^月 Figure is a cross-sectional view of the light source device for the light source installed at the end of the light source. Fig. 4C is a cross-sectional view of a surface light source device for a light source mounted in Fig. 3C. Fig. 4D is a cross-sectional view of the surface light source device used for the light source mounting diffuser plate of Fig. 3D. Fig. 5A is a cross-sectional view showing a liquid crystal display device having the surface light source device for the end face illumination type backlight of Fig. 4A. .................^ ^^ . A cross-sectional view of a liquid crystal display device. Fig. 5C is a cross-sectional view of a liquid crystal display device having the surface light source device for the end face illumination type backlight of Fig. 4C. Fig. 5D is a cross section of the liquid crystal display device having the surface light source device for the backlight of Fig. 4D. Fig. 6A is a graph showing heat resistance of a reflecting plate of the present invention (Example 2) and a reflecting plate of the conventional (Comparative Example 1), showing changes in reflection before and after heating. Fig. 6B is heating The graph of the heat resistance of the reflecting plate of the present invention (Example 2) and the reflecting plate of the conventional (Comparative Example 1) is shown as a change with respect to the reflectance with respect to the heating time. Fig. 7 is an ultraviolet irradiation treatment. The reflection plate of the present invention (Example 2) and the graph of the ultraviolet resistance of the reflection plate of the conventional (Comparative Example 1) show the change in the reflectance before and after the irradiation. Fig. 8 is a simulation of the sunlight irradiation treatment. The reflection plate of the invention (Example 2) and the curve of the heat resistance of the conventional (Comparative Example 1) reflection sheet show the change in reflectance before and after the irradiation. - [Description of main component symbols] 10 gold The substrate 20 has an electrically insulating light reflecting layer 33 200821632 30 conductive layer 4 Θ solder 100 light emitting diode JJQ 4 see type 4 although 120 top view type light emitting diode 130 light emitting diode light emitting portion 200 light guide plate 210 reflection plate 220 diffusion plate 300 liquid crystal panel
3434
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2006226400 | 2006-08-23 |
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| TW096129963A TW200821632A (en) | 2006-08-23 | 2007-08-14 | Light reflector and light source having same |
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| JP (1) | JPWO2008023605A1 (en) |
| TW (1) | TW200821632A (en) |
| WO (1) | WO2008023605A1 (en) |
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|---|---|---|---|---|
| TWI398925B (en) * | 2007-05-23 | 2013-06-11 | Applied Materials Inc | Boron nitride and boron nitride-derived materials deposition method |
| TWI513783B (en) * | 2010-04-13 | 2015-12-21 | Dexerials Corp | A light reflective anisotropic conductive adhesive and a light emitting device |
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| JP2009276396A (en) * | 2008-05-12 | 2009-11-26 | Mitsubishi Plastics Inc | Light-reflective film and light-eflective plate |
| US9634203B2 (en) | 2008-05-30 | 2017-04-25 | Sharp Kabushiki Kaisha | Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device |
| US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
| JP2010263165A (en) * | 2009-05-11 | 2010-11-18 | Mitsubishi Plastics Inc | Reflective substrate for led, and light emitting device |
| JP2011151248A (en) * | 2010-01-22 | 2011-08-04 | Seiwa Electric Mfg Co Ltd | Light emitting device, and method of manufacturing the same |
| JP5557186B2 (en) * | 2010-01-25 | 2014-07-23 | 株式会社朝日Ｆｒ研究所 | Reflective sheet with metal foil |
| JP5504933B2 (en) * | 2010-02-03 | 2014-05-28 | 株式会社共立電照 | Street lighting fixtures |
| WO2011118109A1 (en) * | 2010-03-23 | 2011-09-29 | 株式会社朝日ラバー | Flexible reflective substrate, manufacturing method for same, and base material composition for use in reflective substrate |
| JP5509996B2 (en) * | 2010-03-31 | 2014-06-04 | カシオ計算機株式会社 | Flexible printed circuit board, light source device and display device |
| JP5684511B2 (en) | 2010-08-11 | 2015-03-11 | 三菱樹脂株式会社 | Metal foil laminate, LED mounting substrate and light source device |
| JP5551549B2 (en) * | 2010-09-08 | 2014-07-16 | 帝人デュポンフィルム株式会社 | Circuit board for mounting |
| JP2013026416A (en) * | 2011-07-20 | 2013-02-04 | Toyoda Gosei Co Ltd | Element mounting substrate and light emitting device including the same |
| WO2013061855A1 (en) * | 2011-10-25 | 2013-05-02 | シャープ株式会社 | Illumination device, display device, and television reception device |
| JP2013145833A (en) * | 2012-01-16 | 2013-07-25 | Fujifilm Corp | Reflection substrate for led light-emitting element and led package |
| JP2013033976A (en) * | 2012-09-14 | 2013-02-14 | Stanley Electric Co Ltd | Semiconductor light-emitting device and vehicle headlight |
| WO2017010387A1 (en) * | 2015-07-13 | 2017-01-19 | シャープ株式会社 | Illumination device and display apparatus |
| WO2017059575A1 (en) * | 2015-10-09 | 2017-04-13 | 魏晓敏 | Led light emitting unit and module |
| WO2017090775A1 (en) * | 2015-11-26 | 2017-06-01 | 新日鐵住金株式会社 | Coated metal sheet |
| JP2021085808A (en) * | 2019-11-29 | 2021-06-03 | シーシーエス株式会社 | Light irradiation device |
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| JPS63174379A (en) * | 1987-01-14 | 1988-07-18 | Toshiba Corp | Luminous display device |
| JP2772775B2 (en) * | 1995-09-29 | 1998-07-09 | 大日本印刷株式会社 | Light diffusion sheet, edge light type surface light source using the same, and liquid crystal display device |
| JP2000321551A (en) * | 1999-05-13 | 2000-11-24 | Sharp Corp | Liquid crystal display device |
| JP2003185813A (en) * | 2001-12-21 | 2003-07-03 | Mitsui Chemicals Inc | Reflector and its use |
| JP4543772B2 (en) * | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
-
2007
- 2007-08-14 TW TW096129963A patent/TW200821632A/en unknown
- 2007-08-14 WO PCT/JP2007/065842 patent/WO2008023605A1/en active Application Filing
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398925B (en) * | 2007-05-23 | 2013-06-11 | Applied Materials Inc | Boron nitride and boron nitride-derived materials deposition method |
| TWI513783B (en) * | 2010-04-13 | 2015-12-21 | Dexerials Corp | A light reflective anisotropic conductive adhesive and a light emitting device |
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| WO2008023605A1 (en) | 2008-02-28 |
| JPWO2008023605A1 (en) | 2010-01-07 |
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