201143151 六、發明說明： 【發明所屬之技術領域】 本發明係關於COB(chip on board，晶片直接貼附於基板)模組 式發光裝置，特別是關於使用新開發的封裝體之COB模組式發光 裝置。 、’ x 【先前技術】 體(led : LightEmittingDiGde) ’ 除了首要應用於顯 3二a 文獻1}_或，光裝置(參照專利文獻2)外，更廣泛利 ;為…、月器具、顯示器、液晶顯示器的背光光源等。 绩之=自取得光，除了f要二極體元件與通電至二極體的導 S3料：使發出的光不致浪費之反射材料、降低光衰減的 ，先材枓、更加上用以使光指向所期望的方向之聚光 用：調節所取得的光之色調的螢光材料，另外不可欠缺者i 為光時對於產生的熱施以傳導、散熱之對策。、 敘述^用LED的發光裝置，根據圖3，專利文獻2舉出一例 搭載於式發光裝置21包含：封裝基板例如裂置基板22 . 树基板數之彻發光元件亦即 含有榮光體的樹脂日二二;严散構件29 ;反射體30。 再者，「* HI亦發揮作為密封構件之功能。」 製的平板所構了^例如合成樹脂 摻人麵粉末的環氧樹鱗形成。」 形， 樹脂之類的透明樹脂，—此:刀政於像矽酉同樹脂或環氧 覆於發— 3 201143151 層，於其上設置包含上述螢光 的樹脂成形為片狀並將其加熱亦可將含有勞光體 通常主要作舰緣材料， 隨著近期的藍色LED的二 j =；^不織布玻璃纖維)，但 外優良。 喊納旨，其絲波長倾巾的透光率格 LED不僅是用於顯示影俊 明㈡，於高功率用品’則習 所以考慮到歧辨，—般均施以。ΓΓ.Γ㈣錢用銅， 用，則其鐘銀的硫化之問題就變得明y。^率用品—旦開始使 鍍銀的硫化，係與來自外部的硫續 考慮]光反射率，—般均施以鎖 、 則其鍍銀的硫化之問題就變得明顯 ’為了避免因介在有黏接辦而阻礙孰 月曰匕ί 段被塡埋。在密封材料為環氧樹脂㈣ί 脂之情形，雖可抑抛铜浸人，但若 ^ s 則硫磺通過_樹腊而滲透，會構成硫化的主_因用。烟樹月曰’ 料二®f 化，從LED造成之發熱關題，成為《寺解 決的，通。在LED中’輪入能量的9成以熱之形式消耗掉 ， 關於δ成細旨的耐熱性，基於在欽LED _使肋填處理 因，而要求須纟有回填溫度(27叱左右)的耐熱性，但若能承受短 時間的回填處理，即使例如麟频軟化，也被認為算是符合 要求。但來自使用巾的LED之發熱，會持續長時間，所以也必須 考慮到由於所使用樹脂變黃、或軟化所造成之隨著時間發生變形 4 201143151 之疑1大家也開始意識到必須強化熱傳導、气勃 [習知技術文獻] 政熱。 [專利文獻] f利文獻1.日本綱平丨。—24252 專利文獻2:日本特開2_—111273號公^ 【發明内容】 [發明所欲解決的問題] 本發明，係解決上述的問題，課題為 熱性與熱料性之LED ，並具有充分之对 裝置。 、 I光一極體顯示面板 [解決問題之技術手段] 並形二:覆電路圖案 體的凹處容納·晶片，其料於元件基^龍體，於該封裝 附力殼宜由職(聚_，所構成，又，可 [發明之功效] 卿本發明，藉由使關持導線㈣（電路圖荦)之圖荦声 包夾覆蓋菩雷政岡安沾耐變色性。又’因為 i Ϊ 雙面之®㈣與罩殼材㈣用同樣的 不mV^』PEEK#金屬有親合性，電路圖案與PEEK之間 曰產生間隙，而不會發生硫磺通過此部分 Γϊϊίΐ黑化。再者’由於圖案層與罩殼材娜用 接層，即可直接互相融接成一體，所以能減少厚 度，而猎由傳熱、散熱發揮其效果。 一除此之外，因為使用將表面鏡面化的「鋁金屬基板」，將LED =鄰接於該「銘金屬基板」配置，所以能同時且有效地發揮將 從led元件發出的光朝上方反射，與將從LED元件發出的埶朝 下方傳熱、散熱之功能。 … 201143151 【實施方式】 以下參照圖示，詳細說明本發明。 本發明的COB模組式發錄置〗，係由裝置基板2 ;作為發 光體的讀基板3上的LED晶片4;作為導電通路的電路圖案5 ; ，持電路圖案的電祕座6 ;電路賴5的電路罩殼7所構成，其 中LED晶片4與電路圖案5以電線8連接。 偏、t將ίΓ月的單位發光裝置放大並顯示之圖2所示，其基本 曰厂《X電路罩殼體7與在其上的反射體9，並設有將 曰曰片4、電路圖案5、電線8包覆之密封材料10。 關於裝置基板2，為了發揮將從發光體發㈣光 功^且亦發縣從發絲發出的财 = 少使用對發光_進行鏡面精加项呂板。㈣《力此且至 電ί圖案5 ’依照往例’為了得到導電性而採用銅合金， 猎由钱刻等方式形成所雜_案。亦可#由轉係 電路基座6，以往幾乎都是著眼於耐熱 ^二 樹脂系的樹脂的例，但在本發日月中 而使用_ 二之=之_(聚“)接=電 月b直接互相藉由熱融接成一體之優點。 疋月b併貝現 將包覆電路圖案5並成一u 其亦稱為縣體。在封裝體設有容納解殼7結合， 之凹處11。 1干丞扳3上的LED晶片4 反射體9，將從發光體發出的光指向 如例圖所示之設成垂直於裝置基板之的方向’並不限於 度傾斜之方式。傾斜面，即使為組人=可採用以適當的角 抛物面等凹面或是凸面之適合的面。口 射=採用球面、旋轉 反射體。 '夂射體9，可使用-般的 密封材料10,係將LED晶片4、電路 冤路圖案5、電線8包覆， 6 201143151 保護其等不受來自外界的干擾，但分 ==可色 但從好的並無特別限定， 在本發明中，將封裝LED晶片4 =基板3所設置，所以在_咖’在生裝置孰基 迅速，傳導至熱的良導體_製的裝置基板2，並妙。I 在以上的就明中，特別是在圖1雖妙 i csr?用之照明器具。但本發明不限於此’亦 ;，自:工成一列或是成三角形狀排列，並作為顯 [產業上利用性] 式』ί ΐ以模組 的情形非常少，所以可以說—咖 【圖式簡單說明】 圖1係顯示本發明的COB模組式笋夯奘罟从 大的::顯示本發明的⑽模組式發光 圖。圖3係顯示習知技術的c〇B模組式發光裝置的構造之說明 【主要元件符號說明】 1 ' 211 COB模組式發光裝置 2'22 :裝置基板 3、23 :元件基板 4 :作為發光體的LED晶片 201143151 .5 :作為導電通路的電路圖案 6:保持電路圖案的電路基座 7:電路圖案的電路罩殼 8 :電線 9、30 :反射體 10 :密封材料 11 :容納LED晶片4的凹處 24 :藍色LED晶片 25 :電路圖案 26 :含有螢光體的樹脂層 27 :反射層 28 :黏接層 29 :光擴散構件201143151 VI. Description of the Invention: [Technical Field] The present invention relates to a COB (chip on board) directly attached to a substrate, and in particular to a COB module using a newly developed package. Light emitting device. , 'x [previous technology] body (led : LightEmittingDiGde) ' In addition to the primary application of the optical device (see Patent Document 2), it is more widely used; for..., monthly appliances, displays, Backlight source of liquid crystal display, etc. Performance = self-acquisition, except for the diode element and the conduction of the diode to the diode S3 material: the reflective material that makes the emitted light not wasted, reduces the light attenuation, the material is used first, and the light is used to make the light For concentrating in a desired direction: a fluorescent material that adjusts the color of the light to be obtained, and in addition, when the light i is light, the heat generated by the heat is applied. According to FIG. 3, Patent Document 2 discloses an example in which the light-emitting device 21 is mounted on a package substrate such as a spliced substrate 22, and a luminescent device containing a glory body. 22; strict member 29; reflector 30. Further, "*HI also functions as a sealing member." The flat plate is formed of, for example, an epoxy resin scale formed of a synthetic resin mixed with a human surface powder. A transparent resin such as a resin, which is formed by a knife or resin coated with a resin or epoxy on a layer of 201143151, on which a resin containing the above-mentioned fluorescent material is formed into a sheet and heated. It is also possible to use a work light body which is usually mainly used as a ship edge material, with the recent blue LED's two j =; ^ non-woven fiberglass), but excellent outside. Shouting the purpose, the light transmittance of the silk wavelength towel is not only used to display the shadow (2), but in the case of high-power supplies, it is considered to be discriminating. ΓΓ.Γ(4) The money is made of copper, and the problem of vulcanization of its silver is made clear. ^ rate supplies - the beginning of the silver-plated vulcanization, and the sulfur from the outside continue to consider] light reflectivity, the general application of the lock, then the problem of silver-plated vulcanization becomes obvious 'to avoid The bonding process hinders the 孰月曰匕ί section being buried. In the case where the sealing material is epoxy resin, it can suppress the intrusion of copper, but if ^ s, the sulfur penetrates through the wax, which will constitute the main cause of vulcanization. The smoke tree 曰 曰 'material II f f, from the LED caused by the fever, became the temple solution, pass. In the LED, 90% of the energy of the wheel is consumed in the form of heat, and the heat resistance of δ is fine, and it is required to have a backfill temperature (about 27 )) based on the processing of the ribs in the LED _ Heat resistance, but if it can withstand short-time backfilling, even if the frequency is softened, for example, it is considered to be satisfactory. However, the heat from the LEDs used in the towel will last for a long time, so it must also be considered that the resin is yellowed or softened due to the deformation of the resin. 4 201143151 doubts 1 people also began to realize that heat conduction must be strengthened, Qi Bo [Practical Technical Literature] Political heat. [Patent Literature] F. Document 1. Japanese Outline. -24252 Patent Document 2: JP-A-2-111273 [Problems to be Solved by the Invention] The present invention solves the above problems, and the subject is a thermal and hot material LED, and has sufficient For the device. , I light one-pole display panel [technical means to solve the problem] and shape two: cover the recessed portion of the circuit pattern body to accommodate the wafer, which is expected to be in the element base ^ dragon body, in the package attached force shell should be employed (poly_ Constituting, and, can [effect of the invention] qing, the invention, by covering the wire (four) (circuit diagram 之) of the picture 荦 包 覆盖 菩 菩 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政 政The ® (4) and the cover material (4) have the same affinity with the same mV^′′ PEEK# metal, and the gap between the circuit pattern and the PEEK creates a gap, and no sulfur will pass through this part Γϊϊίΐ blackening. The layer and the cover material can be directly joined to each other by the joint layer, so that the thickness can be reduced, and the hunting can be effected by heat transfer and heat dissipation. In addition, the aluminum surface is mirror-finished. Since the LED substrate is disposed adjacent to the "Ming metal substrate", it is possible to simultaneously and efficiently reflect the light emitted from the LED element upward, and to transfer heat from the LED element to the lower side and dissipate heat. Function. ... 201143151 [Implementation] The following parameters The present invention will be described in detail with reference to the accompanying drawings. The COB modular type of the present invention is a device substrate 2; an LED chip 4 on a read substrate 3 as an illuminant; and a circuit pattern 5 as a conductive path; The circuit board 6 is composed of a circuit cover 7 of the circuit board 5, wherein the LED chip 4 and the circuit pattern 5 are connected by a wire 8. The partial light-emitting device of the month is enlarged and displayed as shown in FIG. The X-circuit cover case 7 and the reflector 9 thereon are provided, and a sealing material 10 for covering the cymbal 4, the circuit pattern 5, and the electric wire 8 is provided. The light emitted from the illuminator (4) and the light emitted from the hair from the hairline are used. The mirror is used to illuminate the illuminate. (4) "Strive to the electric ί pattern 5 'According to the previous example' Conductive use of copper alloy, hunting by money engraving and other methods to form a miscellaneous _ case. Also # from the conversion circuit pedestal 6, in the past almost always look at the heat-resistant resin resin example, but in the hair In the day and the moon, the use of _ two = _ (poly)) = electricity month b directly by mutual heat and heat into one疋月b和贝 will now cover the circuit pattern 5 and form a y. It is also called the county body. The package is provided with a recess 11 for accommodating the unloading shell 7. The LED wafer 4 on the dry ram 3 reflects The body 9 directs the light emitted from the illuminator to a direction perpendicular to the substrate of the device as shown in the example of the illustration. It is not limited to the degree of inclination. The inclined surface, even for a group of people = can be used with a suitable angle paraboloid A concave surface or a suitable surface of a convex surface. Oral shot = spherical surface, rotating reflector. 'The emitter 9 can be used with a general sealing material 10, which is an LED chip 4, a circuit circuit pattern 5, and a wire 8 package. Cover, 6 201143151 protects them from interference from the outside, but the sub- == color is not particularly limited, in the present invention, the package LED chip 4 = the substrate 3 is set, so in the _ coffee In the raw device, the base of the device is quickly transferred to the device substrate 2 of the good conductor. I In the above, especially in Fig. 1, although the lighting device used for i csr? However, the present invention is not limited to this; also, since: the work is arranged in a column or in a triangular shape, and as a display [industrial use] type ί ΐ 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 咖 咖 咖 咖 咖 咖 咖 咖Brief Description of the Drawings Fig. 1 shows a COB modular type of bamboo shoots of the present invention:: (10) a modular illumination pattern of the present invention. 3 is a view showing the configuration of a conventional c〇B modular light-emitting device [main element symbol description] 1 '211 COB modular light-emitting device 2'22: device substrate 3, 23: element substrate 4: LED chip of the illuminant 201143151 .5: Circuit pattern 6 as a conductive path: Circuit pedestal 7 holding a circuit pattern: Circuit case 8 of circuit pattern: Wire 9, 30: Reflector 10: Sealing material 11: accommodating LED chip Recess 24 of 4: Blue LED wafer 25: circuit pattern 26: resin layer 27 containing phosphor: reflective layer 28: adhesive layer 29: light diffusing member