WO2008023605A1 - Light-reflecting body and light source comprising the same - Google Patents

Light-reflecting body and light source comprising the same Download PDF

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Publication number
WO2008023605A1
WO2008023605A1 PCT/JP2007/065842 JP2007065842W WO2008023605A1 WO 2008023605 A1 WO2008023605 A1 WO 2008023605A1 JP 2007065842 W JP2007065842 W JP 2007065842W WO 2008023605 A1 WO2008023605 A1 WO 2008023605A1
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Prior art keywords
light
light source
surface
layer
led
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PCT/JP2007/065842
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French (fr)
Japanese (ja)
Inventor
Kimihiko Saitoh
Eiji Hayashishita
Shin Fukuda
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Mitsui Chemicals, Inc.
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031Reflecting element, sheet or layer
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086Positioning aspects
    • G02B6/0091Positioning aspects of the light source relative to the light guide
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Disclosed is a light-reflecting body having bending workability and diffuse reflection property, wherein sufficient heat dissipation is assured even when an LED, which emits heat, is mounted on a reflective surface. Specifically disclosed is a light-reflecting body comprising a metal base, a light-reflecting layer formed on at least one side of the metal base, having electrical insulation properties and containing an elastomer containing at least one of a pigment and an inorganic filler, and a conductive layer formed on the light-reflecting layer. A light source can be obtained by mounting a light-emitting diode on the light-reflecting body, and a liquid crystal display can be obtained by fixing the light source onto a liquid crystal panel as a surface light source device.

Description

Specification

Light source including a light reflector, and it

Technical field

[0001] The present invention relates to a light source comprising a light reflector and the light reflector. More specifically the present onset bright, has excellent reflective properties, an optical reflector having a bending property. BACKGROUND

A display for displaying the [0002] The image is the most important machine interface in a multi-media. Liquid crystal display (LCD) is a display that directs the thickness and energy saving. The LCD, mobile phone display and small display, such as a digital camera displays, medium-sized displays such as computer monitors and car navigation for displays, as a large display such as a TV display, are widely available.

[0003] LCD is a non-emissive display that requires a separate light source, you may view the image 認性 low in 喑所. To improve the visibility, Bruno backlight, that is, the surface light source device provided in the rear surface of the liquid crystal panel is indispensable. Conventionally, cold cathode tubes have been used as a light source of a backlight.

[0004] On the other hand, technical progress of GaN-based light-emitting diode (LED) has a lower cost to the alarm device further industrial development. LED can be driven at a lower voltage than the cold cathode tube, its life is 100,000 hours or more. Further, it can be structurally thinner, because it does not use mercury contained in the cold-cathode tube, also realize a reduction in environmental load.

Therefore, and pseudo white LED, 3-color LED development of the backlight source using (red, green, three LED combination of blue), etc. The is activating. The backlight light source using a three-color LED, since that can be high color reproducibility by a single emission spectrum, especially developed television such as a high-definition display for being activated.

[0005] Small and medium-sized LCD has a surface light source device using mainly LED backlight called edge light type. Edge light type LED backlight, a light source disposed on the side of the light guide plate has a light source comprising a LED mounted on a flexible circuit board using a polyimide substrate (FPC). Since light emitted from the LED is directional, in order to prevent luminance unevenness and color unevenness of the display screen and devised to introduce uniform light into the light guide plate white diffuse reflector disposed around the LED made! /, Ru.

For example, heat and FPC, the double-sided tape to fix the light guide plate, to attach the reflection function (see Patent Document 1), a white resin Ji Yubu forming a hole to match the shape of the LED to be mounted an LED or the reflector is deflated (see Patent Document 2), as a light reflecting layer concave inner surface of the concave housing, further by arranging the diffuse reflection sheet on the light reflective layer, LED within the housing the placement or is proposed that (the Patent Document 3 reference) to! /, Ru.

In [0006] addition Medium LCD backlight (edge ​​light type), for homogenizing and moire prevention of luminance, a reflective sheet disposed below the light guide plate may be preferred when a white diffuse reflection sheet. The case of using an edge light type LED backlight, the light guide plate side surface of the FPC to be disposed under the light guide plate provided with a white printing reflective portion, it is proposed that granting the function of the reflection sheet to FPC Te! /, Ru (see Patent Document 4).

[0007] In these proposals, or provide a new white reflective layer on a substrate mounted with LED, to or set up a reflective layer provided enclosure, or is required a separate member increases the manufacturing process there is a problem that or. Moreover, LED backlights for installing a large number of LED has an important challenge to that occur heat must be efficiently dissipated. However, in these proposals, the board mounted with LED, since the fixed heat radiating body such as a metal with double-sided tape or adhesive, its double-sided tape or an adhesive or the like heat resistance is increased heat radiation effect there is a risk of deterioration. When the heat dissipation effect is reduced, lowering of LED luminous efficiency, shortening of element lifetime, further, can lead to device breakdown.

[0008] white glossy paper, or polyethylene terephthalate resin, on a polyester resin, to form a circuit pattern with a conductive ink, reflector mounting the LED is disclosed in the circuit pattern (Patent Document 5 see). The reflector is also fixed to a metal housing with double-sided tape or adhesive, it is necessary to increase the heat dissipation. Only Nag LED implementation it is currently a reduction of environmental impact, "lead-free solder" of SnAg alloy system such as is generally used. Soldering with lead-free solder, since it is necessary 220 ° C~280 ° C about the heating step, the reflector when mounting the LED there was a problem that receives heat damage.

[0009] On the other hand, large LCD backlight used in such television is called backlighting primarily direct type. Direct backlight has a light source disposed in the lower portion of the diffusion sheet and the lighting curtain. The direct type LED backlight, the red, green, often white color is formed by the LED color mixing shall be the basic three colors of blue. Reflector Therefore direct type LED backlight, it is necessary to have a high diffuse reflectivity. Further, the number of mounted LED which definitive direct type LED backlight for very large, high heat resistance and heat dissipation properties of the reflector itself is demanded Me.

[0010] There is also a need to impart the bending property in the reflector. For example, wherein the electrical circuit layer is formed via an insulating layer on the reflective surface, the reflector is disclosed comprising a bending processable substrate (see Patent Document 6). With the bending processable reflector may for example obtain a flexible display.

[0011] Furthermore, by utilizing the properties of aluminum having a high reflectance for light in the visible light region from the ultraviolet region, the circuitry substrate formed with circuit through a transparent insulating layer on an aluminum substrate, the reflection it is proposed to use as a module! /, Ru (see Patent Document 7). Patent Document 1: JP 2005- 321586 JP

Patent Document 2: JP 2005- 123103 JP

Patent Document 3: JP 2005- 135860 JP

Patent Document 4: JP 2001- 133757 JP

Patent Document 5: JP 9 115323 JP

Patent Document 6: JP 2003- 185813 JP

Patent Document 7: JP 2005- 268405 JP

Disclosure of the Invention

Problems that the Invention is to you'll solve

[0012] The present invention is an optical reflector having a bending workability and diffuse reflective, LED also is implemented, and aims to provide a light reflector to sufficiently dissipate the heat emitted from the LED you. The invention further aims to provide a surface light source device for an LED backlight used in a liquid crystal display device. Means for Solving the Problems

[0013] That is the first aspect of the present invention relates to an optical reflector shown below.

[I] a metal substrate; provided on at least one surface of the metal substrate, has electrical insulation properties, light-reflecting layer contains an elastomer one containing at least one of pigments and inorganic fillers; and the light light reflector including a conductive layer formed on the reflective layer.

[2] The elastomeric one comprises a silicone resin or silicone rubber, the light reflector according to [1].

[3], wherein the inorganic filler is a needle-like filler, the light reflector according to [1] or [2].

[4] The total light reflectance of the light reflecting layer is 88% or more, the light reflector according to any one of [1] to [3].

[5] Diffuse reflectance of the light reflecting layer is 80% or more, [1] to light reflector of the mounting serial to any one of [4].

[6] wherein the conductive layer is an electric circuit, [1] light reflector according to any one of to [5].

[7] The electric circuit is formed by removing part of the conductive layer by etching, the light reflector according to [6].

[0014] The second invention relates to a liquid crystal display device comprising a light source, or it is shown below.

[8] [1] - [7] of /, light reflector according to any displacement;! The electric circuit layer implemented light-emitting diodes; !! and light emitting diode is mounted /, Do / electrical a light source having a solder one resist layer covering the circuit.

[9] The total light reflectance at the surface of the solder resist layer is 80% or more, the light source according to [8].

[10] [8] or light source according to [9], and a light guide plate for introducing light thereinto from the light source, an edge light type backlight surface light source device.

[II] [8] or light source according to [9], and a diffusion sheet or lighting curtain arranged on the light emitting side of the light source, the direct-type backlight surface light source device.

[12] The liquid crystal display device having a surface light source device described as backlight [10].

[13] The liquid crystal display device having a surface light source device described as backlight [11].

The Effect [0015] The present invention, bending a processability and diffuse reflective optical reflector having, even when mounting the LED to the reflective surface, provide a light reflector emitted heat is sufficiently dissipated can do. Light reflector of the present invention can be Rukoto force S be produced by a simple process as compared with the conventional optical reflector. It is possible to obtain an LED backlight with further light reflector of the present invention, it can be applied to a liquid crystal display device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] is a sectional view illustrating a stacked state of FIG. 1A] light reflector.

It is a top view seen from the side of the electrically conductive layer [Figure 1B] light reflector.

It is a cross-sectional view of a light source mounting the LED in FIG. 2 light reflector.

Is a cross-sectional view of a light source mounted with side-view type LED in FIG. 3A] light reflector.

[FIG 3B] is a sectional view of a light source mounted with top-view type LED in a concave optical reflector.

It is a cross-sectional view of a light source mounted with top-view type LED to light reflector of FIG. 3C] L-shape.

Is a cross-sectional view of a light source mounted with top-view type LED to light reflector of FIG. 3D]-plate

It is a cross-sectional view of the surface light source equipment for [FIG 4A] edge light type backlight equipped with a light guide plate in the light source of FIG 3A.

It is a cross-sectional view of the surface light source equipment for [FIG 4B] edge light type backlight equipped with a light guide plate in the light source of Figure 3B.

It is a cross-sectional view of the surface light source equipment for FIG 4C] edge light type backlight equipped with a light guide plate in the light source of Figure 3C.

Is a cross-sectional view of a surface light source device for FIG. 4D] direct backlight the diffusion sheet mounted in Figure 3D of the light source.

It is a cross-sectional view of a liquid crystal display device having a surface light source device for FIG 5A] Figure 4A the edge light type backlight.

It is a cross-sectional view of a liquid crystal display device having a surface light source device for FIG 5B] Figure 4B of the edge light type backlight.

It is a cross-sectional view of a liquid crystal display device having a surface light source device for FIG 5C] FIG. 4C of the edge light type backlight. It is a cross-sectional view of a liquid crystal display device having a surface light source device including a direct type backlight FIG 5D] Figure 4D.

A reflector of FIG. 6A] The present invention (Example 2), and heat treatment and a reflection plate of a conventional (Comparative Example 1), a graph comparing the heat resistance, the change in reflectance before and after heating shows.

A reflector of FIG. 6B] present invention (Example 2), and heat treatment and a reflection plate of a conventional (Comparative Example 1), a graph comparing the heat resistance, aging of reflectance with respect to heating time the shows.

[7] a reflector of the present invention (Example 2), and a reflection plate of a conventional (Comparative Example 1) and an ultraviolet irradiation treatment, a graph comparing the 耐紫 outside fountain resistance, reflectivity before and after irradiation It shows the change

A reflector of FIG. 8 the invention (Example 2), the prior art (Comparative Example 1) and a reflection plate with simulated solar irradiation treatment, a graph comparing the light-heat, reflectivity before and after irradiation It shows the change.

BEST MODE FOR CARRYING OUT THE INVENTION

For [0017] 1. The reflected light body

Light reflector of the present invention, 1) a metal substrate, 2) a light reflecting layer provided on a metal substrate, 3) includes a conductive layer provided on the light reflective layer. 1A and 1B show the structure of the light reflector of the present invention. Figure 1 A shows the stacked state of the light reflector, Fig. 1B is a top view of the light reflector from the side of the conductive layer. 10 metal substrate 20 is a light anti picolinimidate having electrical insulation properties, is 30 is a conductive layer.

[0018] For the metal substrate

Examples of suitable materials for the metal substrate is aluminum, aluminum alloy, magnesium alloy, stainless steel, copper, copper-zinc alloy, nickel, nickel alloy, titanium, and titanium alloys. From the viewpoint of weight reduction, aluminum alloy or a magnesium alloy is used properly preferred. The aluminum alloy is generally silicon, magnesium or copper is added Caro. Material of the metal substrate may be stainless steel has both strength and corrosion resistance. Stainless steel, ferritic or containing chromium, Yogu not particularly limited chromium and nickel either such austenitic having free. Preferred stainless or concrete columns ί this Oka (or include such SUS304, SUS316.

[0019] The metal substrate has a function of dissipating the heat generated by the mounted light source (e.g., LED) in the optical reflector. Thus the material of the metal substrate is preferably a heat dissipation highly copper or a copper alloy. Suitable examples of copper alloy include brass.

[0020] light reflector of the present invention is preferably capable of bending. Thus the thickness of the metal substrate, it is preferable that the industrial foldably thickness. The thickness of the bending fold for industrial workable metal substrate, preferably 0. 03mm~; is a 1 mm, more preferably 0. 05mm~0 5mm.. When the metal substrate is too thin rigidity is lowered, when mounting the light source to the obtained light reflector, there is a possibility that "become fixed. On the other hand, there is a possibility that bending the metal substrate is too thick processing becomes difficult.

[0021] For the light-reflecting layer

Light reflector of the present invention includes a light reflecting layer provided on one surface or both surfaces of the metal substrate. Light-reflecting layer is preferably tool normally be composed of electrically insulating material comprises a high content child material electrically insulating. Examples of electrically insulating polymer material, epoxy, polyester, polybutadiene, Anorekido, epoxy ester Honoré, polyamides, silicones, and Teflon (registered trademark), and the material is blended with them. Les, such may be a laminate of a double number either a single-layer light-reflecting layer.

[0022] As described above the light reflector of the present invention, since it is preferred that can be bent, polymeric material contained in the light-reflecting layer preferably has elasticity. The high-molecular material having elasticity, called elastomer scratch. Examples of elastomer scratch, and the like rubber or a thermoplastic elastomer scratch. Elastomer scratch, more preferably a silicone resin or silicone rubber. Elastomeric one and silicone resins include silicone thermoplastic elastomer one

[0023] The light reflecting layer is preferably also functions as an adhesive layer for adhering the metal substrate and the conductive layer. The light reflecting layer, the use of material having adhesive properties, the conductive layer can be easily formed on the light reflective layer, and also functions as a bonding layer of the metal substrate and the conductive layer. Therefore, the polymer material contained in the light-reflecting layer is Le, Shi preferred that adhesion of the conductive layer (e.g., metal layer) is Kore, a polymeric material. Conductive layer adhesion (the metal layer) is Kore, examples of polymeric materials include, but are included, such as epoxy-based adhesive resin and silicone-based adhesive resin, particularly a silicone adhesive resin is preferable.

[0024] More light reflective layer, is also required high heat resistance. Heat resistance required for the light-reflecting layer, in practice, it is also through the "soldering process" to be exposed to high temperatures (e.g. 180 to 280 ° C), no reflection of the light reflecting layer is substantially decrease; light the insulation resistance of the reflective layer is hardly reduced; adhesive strength of the adhesive strength and the light reflecting layer and the electric circuit layers of the substrate and the light reflecting layers means such that hardly lowered. Therefore, the high-molecular material contained in the light-reflecting layer, it is required alteration caused by thermal decomposition is small. For example, it forces Ri preferably is less preferred instrument 5% or less by weight decreases strength of 10% of the polymeric materials by pyrolysis of definitive to 180 to 280 ° C, and more preferably 3% or less. Examples of polymeric materials having heat resistance include silicone resins and silicone rubbers.

[0025] The thickness of the light reflecting layer is appropriately selected depending on the desired light reflectance, generally 10 μ m~500 μ m, and more desirably 30 μ m~200 μ m.

[0026] Furthermore, the polymer material constituting the light-reflecting layer, by including a pigment or an inorganic filler, it is preferable to increase the diffuse reflectivity. Also contain both pigment and inorganic filler may contain one. Polymeric material constituting the light-reflecting layer, a silicone resin or silicone rubber containing a white pigment and inorganic filler are suitably used.

It is preferred pigments are white pigments. On the other hand, inorganic FILLER scratch, force and ceramic also may be selected arbitrary. Preferred ceramic example, diamond powder, aluminum oxide, Kei-containing, zirconium oxide, zinc oxide, titanium oxide, boron nitride, Arumiyuu arm, silicon nitride, and the like titanium nitride. When forming the light reflection layer of a polymeric material containing an inorganic filler, than the case of using a material consisting only of polymer material, in addition to improving the diffusely reflective also improves thermal conductivity. When the thermal conductivity of the light-reflecting layer is increased, the heat generated from the light source provided on the light reflecting layer is transferred efficiently to the metal substrate through a light-reflecting layer is efficiently dissipated.

[0027] pigments and inorganic filler contained in the polymer material constituting the light-reflecting layer type, particle size, shape, and the like content, diffuse reflection performance of the light-reflecting layer, the thermal conductivity performance and adhesion performance and the like in view of it, it is appropriately selected. For example, the shape of the inorganic filler when the needle, it is possible to enhance the function of the adhesive layer of the light-reflecting layer (adhesion to the metal substrate and the conductive layer). The needle-like filler, the average fiber diameter of 0.5 1~1〃111, preferably 0;.! A ~ 0.5 3〃M, average fiber length 0 · 5 to 50 111 of that, preferably 0 . meaning filler is 10 m;. 5 to. Shape such as an average fiber diameter Ya average fiber length of the filler can be measured by observing the cross section of the light reflecting layer by a scanning electron microscope.

[0028] the polymeric material constituting the light-reflecting layer, and an ultraviolet absorbent and the stabilizer, may contain other additive Caro agent.

Reflectance [0029] Light reflecting layer is measured by applying light from the conductive layer side. The total light reflectance of the light reflecting layer is further preferred if the further preferred instrument 90% that it is 80% or more is preferred instrument 85% or more and more preferably fixture 88% or more . The total light reflectance, is a combination of the positive reflectance diffuse reflectance. Here, the specular reflectance, against the amount of incident light, means the ratio of the amount of light reflected by the same angle of incidence reflection angle. If irregularities there Ru on the incident surface of the light, the light reflected at a different angle of incidence and the angle of reflection of the incident light is generated. The diffuse reflectance, relative to the amount of incident light, means the ratio of the amount of light reflected at different reflection angles with the incident angle.

[0030] The total light reflectance was fitted with an integrating sphere can be easily measurement in general visible ultraviolet spectrophotometer. The total light reflectance may be the total light reflectance at a wavelength of 550 nm. The yo Ri practical, may be calculated have use a heavy price factor for calculating the visible light reflectance according to JIS R3106.

[0031] The diffuse reflectance of the light reflecting layer is located and in a member of the reflecting surface, such as by the intended use of the device to which it was EARLY, suitable values ​​are different. For example, the total light reflectance at a wavelength of 550 nm, the diffuse reflectance In some cases preferably about 10-50%, in some cases more than 80% is preferred. Diffuse reflectance, as well as the total light reflectance can be measured by ultraviolet-visible spectrophotometer generally fitted with an integrating sphere.

[0032] Further light reflecting layer of the light reflector of the present invention reflects the light from the light source C, it is preferable to emit the reflected light nearly colorless. The color of light may be represented by Hunter values. The Hunter values, is one of the color system using the uniform color space, Ru is measured according to JIS Z8722. Hunter values ​​a and b of the surface color was illuminated with standard light C is calculated by the following formula. [0033] [Equation 1] a = 17.5 (1.02X 10 -Y, oW Y, 0

b = 7.0 (Y-0.847Z, 0) / V "Y I0

[0034] In the above formulas, X, Y, Z represents a tristimulus value of XYZ color system, 380Nm~7

10 10 10 10 10 10

With respect to light having a wavelength of 80 nm, it is determined by the following equation.

[0035] [number 2]

S (X): spectral distribution of standard light used for display of a color

Χ (Λ δ (Λ), (λ): Χ 10 Υ 10 Ζιο color matching function in the color coordinate system

R (^): spectroscopy (solid angle) reflectance

[0036] Light reflecting layer of the light reflector of the present invention, C the color of the light reflected by the light from the light source, when expressed in the Hunter a and b, a and b! /, The absolute value of the deviation 7 is preferably less, more preferably 5 or less, still more preferably 3 or less.

[0037] conductive layer for

Light reflector of the present invention includes a conductive layer provided on the light reflective layer. The material of the conductive layer Examples of preferred instrument preferred metal to be metal include copper, aluminum, silver, gold, platinum and the like. Foil Ya thin film of these metals is preferred. Furthermore the material of the conductive layer, the electrical resistance and to consider the etching characteristics and copper preferable instrument also tint reflection properties lower small les, aluminum Yuumu also preferred. The "metal foil", a metal thin film which is in sheet form prior to being provided on the light reflecting layer, the term "metal film", printing the light-reflecting layer was formed by vapor deposition or plated method it is a thin film of metal.

[0038] The thickness of the conductive layer is appropriately determined by the LED of the power are implemented. The thickness of the metal foil is preferably a thickness of 1 to 100 mu m preferably fixture metal thin film in the range of in the range of 0 · 5~20 μ m.

[0039] The conductive layer may be an electric circuit. Forming method of the conductive layer and the electrical circuit will be described in detail later.

[0040] light reflector of the present invention, between the light reflecting layer and the metal substrate may have a resin film or adhesive layer. For example optically reflecting member, conductive layer / light reflective layer / resin film / adhesive layer / gold Shokumotozai may have a configuration of. Conductive layer and the thickness of the sum of the member sandwiched between the metal substrate (including a light reflecting layer) is preferably 2 to 200 111. If the thickness of these members is too large, the heat dissipation effect may be deteriorated. Considering also the light reflectance of the above, as the thickness of the light reflecting layer is preferably to be 30~200 H m! / ,.

[0041] surface of the light reflecting layer is covered by only the electric circuit and other necessary conductive layer, as far as possible wide! /, To expose the light-reflecting layer in the region! /, Rukoto force S preferably! / ,. It is to increase the reflectivity of the light reflector.

[0042] light reflector of the present invention is preferably capable bending. Bending processability and is held by a mechanical processing such as press working if example embodiment, even if bending the light reflecting layer side to bending angle 90 ° to the inside without substantially decrease the performance of the components, the shape at the time of bending I can say the Rukoto.

[0043] light reflector of the present invention, a light reflection layer for imparting reflection function does not need to be separately formed on the circuit board can be manufactured by a simple process. Also, possible bending is the light reflecting layer is formed of a resin that having a resilient. Further, by forming the light-reflecting layer with a heat-resistant polymer materials, it is possible to LED mounting at high temperature. Further than that of a metal substrate, the heat dissipation properties of the light reflector is high. Light reflector of the present invention, indoor lighting, indoor lighting, automotive lighting, can be used as various lighting reflectors such as decorative lighting, may be of course used as the light reflector of the surface light source device of the display panel .

[0044] A method for manufacturing 2. light reflector

Light reflector of the present invention can be manufactured by any method as long as it does not impair the effects of the present invention. For example, 1) a light reflecting layer having an electrically insulating the metal substrate is formed by coating, a method of further forming a conductive layer on the light reflecting layer, 2) preparing a light-reflecting layer as the adhesive sheet, both sheets a metal substrate on each surface, a method of attaching the metal foil as a conductive layer, 3) a metal substrate, in both the metal foil as a conductive layer, a polymer material (light reflecting layer having electrical insulation properties materials) by applying, each other! /, and a method of forming a light reflective layer bonded to the coated surface of the. Bonding, depending on the properties of the material, hot bonding, hot bonding, cold crimping, may be performed in such cold joining adhesive.

If the [0045] conductive layer is a metal foil, and this light-reflecting layer which contains an adhesive resin is preferable. This is because to easily bond the metal foil and a light reflecting layer. On the other hand, the light reflecting layer of the portion exposed without contact wear metal foil may not have an adhesive property.

[0046] conductive layer when a metal thin film can be formed of metal thin film deposition method, a printing method and plated method, in a general way. In forming the metal thin film on the light reflective layer is not particularly necessary to include a resin having adhesiveness to the light-reflecting layer, to obtain adhesion, before forming a thin metal film, a light reflection layer surface plasma treatment , due mainly corona treatment or UV ozone treatment, can provide adhesion. Vacuum evaporation method using resistance heating Examples of vapor deposition, vacuum deposition by electron beam heating, sputtering, and various methods such as ion plating. Be formed by one method may be used in combination with a plurality of ways.

[0047] The conductive layer may be an electric circuit. The electrical circuit may be formed by a general method.

For example, 1) Yogu 2 be formed an electric circuit part of the light reflecting layer provided conductive layer is removed by etching) on ​​the light reflective layer, to form an electrical circuit by drawing a conductive material directly it may be. Preferably, to form an electric circuit part of the conductive layer provided on the light reflection layer is removed by etching. When the line width of the electrical circuit is thin, a photosensitive resin coating fabric or bonded to the formed conductive layer; and exposed over a mask having an electrical circuit pattern, removing the unnecessary resin; exposed the conductive layer is removed with a suitable etchant to form an electrical circuit. On the other hand, when the line width of the electrical circuit is not so narrow is formed on the conductive layer by a photosensitive resin is applied to the circuit shape by the printing method; exposed les, Ru conductive layer with a suitable etchant It is removed to form the electrical circuit. Photosensitive resin, Yogu not particularly limited either negative or positive.

[0048] When the conductive layer is copper, or wet etching using such as II, aqueous solution of iron chloride, by dry etching using a plasma can be formed an electric circuit of copper.

[0049] 3. For the light source

Light reflector of the present invention, by being mounted a light emitting diode (LED) on the conductive layer can be used as a light source. Red, green, LED and that the emission of blue, LED of the so-called pseudo-white light emission is preferably used. In FIG. 2, the optical reflector (metal substrate 10 includes a light reflecting layer 20 and the conductive layer 30), how the light-emitting diode 100 is mounted with solder 40 is shown.

[0050] LED may be either of the side-view type and a top view type. FIG 3 A, a light source mounted with side-view type LED110 the light reflector is shown. Saidobi Yu type LED110 is a LED type light-emitting surface is perpendicular to the mounting surface, emits parallel light to the mounting surface from the light emitting unit 130. FIG 3B~ Figure 3D, a light source mounted with a top-view type LED120 the light reflector is shown. Top view type LED120 is an LED type light emitting surface is parallel to the mounting surface, it emits vertical light against the mounting surface from the light emitting unit 130. FIG 3B and 3C, although the top view type LED is shown, is appropriately selected depending on Yogu source design be applied to the LED side-view type. On the other hand, in the FIG. 3D, preferably a child top-view type LED as shown in FIG applies.

[0051] a light source for small liquid crystal display (LCD) is mainly the large LCD light sources such as pseudo-white light emitting LED is used et it is multi-tool for TV applications, red, green, and emission characteristics of the blue it is often used in combination chromatic to LED. In addition, the LCD light source is also a field sequential driving a small and medium-sized LCD, red, green, it is preferable to use those LED combined set saw having a light emission characteristic of the blue! /,.

[0052] Red, green, the ratio of the number of blue LED may be determined according to the intensity of the respective light emitting diodes. For example, the light-emitting efficiency of the blue LED is green or if it is one-third of the light-emitting efficiency of the red LED, a blue LED the other three times density by! / If implemented in ... of the

The bluish LED semiconductor material has GaN-based; blue-green system and the LED of the semiconductor material of whitish have an InGaN-based; the semiconductor material of the red system LED, etc. AlInGaP-based. Of course, not the semiconductor material of the LED is limited to the so as to obtain a respective IroJun degree Nag, it is important to select appropriately.

[0053] on the conductive layer of the desired position of the light reflector, by fixing the LED with solder, can be force S is electrically bonded. Solder material used has a melting point can have use a PbSn alloy solder of approximately 180 ° C, but in view of recent environmental load reduction and environmental regulations, it is desirable to use it alloy solder which does not contain lead there. Therefore, although the melting point is higher than the PbSn alloy solder, mounting in terms of stability and reliability, AuSnCu alloy solder (melting point: about 220 ° C) AuSn alloy solder, such as, SnZnBi alloy solder (melting point: about 200 ° C ) SnZn alloy solder, such as, S NSB-based alloy solder, or the like is preferably used SnCu alloy solder.

[0054] Power may also be implemented LED to light reflector by hand soldering using a soldering iron S, Industrially, using a reflow furnace, batch number of the LED to the light reflector of the continuous and one in that force it S preferable to implement. The reflow method, for example, a light reflector having an LED that is temporarily fixed with solder, or heated to about 220 to 280 ° C in an inert gas such as nitrogen, over a period of several seconds to several tens of seconds in the flow reactor by or passed Te, line 5 of the LED implementation in the solder.

[0055] and LED mounting process, in the bending step, it is important not to damage the reflecting surface. For example, prior to these processing, combined Ri adhered a protective film on the surface of the light reflecting layer may be removed and the protective film after processing. Depending on the type of machining, suitably selecting the protective film having the elongation properties and heat characteristics. Thickness is 10 to 200 111 Ca Konomashii protective film. Adhesion of the protective film is preferably is 0. 01-0. 3 kN / m fixture 0. 03-0. And more preferably 2 kN / m. Adhesion is too and will be protected Fi Lum during processing is peeled weak, extra force is required in order to peel the protective film in order to implement the too strong a LED. The material is polyvinyl chloride Bulle of the protective film, and polyolefin, and the like polyester, as an example of the protective film is, (manufactured by Sanei Kaken) Sanitekuto and P AC, E- MASK series (manufactured by Nitto Denko Corporation), and the like It is. [0056] The LED is a conductive layer mounted light reflector (electrical circuit) can be force S to form the solder resist layer. Since the electrical circuit that is exposed reflectance is low, by covering with the solder resist have a diffuse reflective (eg white solder resist), it is possible to increase the reflectance in the entire surface. Further, by a white solder resist to cover the conductive layer, it is possible to suppress the reflection color of the conductive layer, the reflection unevenness is reduced. The total light reflectance at the surface of the Sorudareji strike layer is preferably 80% or more. The white Sol Zehnder resist, for example, a white pigment, titanium oxide, zinc oxide, basic carbonate, basic lead sulfate, a filler such as lead sulfate, zinc sulfide or antimony oxide, the optical hardening type solder resist a Ya thermosetting type solder resist. Light-curable solder resists, for example, a photo-curable solder one resist containing a photosensitive Pureborima having both a carboxyl group and an ethylenically unsaturated bond in the photopolymerizable monomer or molecule consisting Atari rate and the like. Thermosetting solder resist, for example, polyfunctional epoxy compounds, polyfunctional Okisetan compound is a heat hardening type solder resist containing the polyfunctional phenolic hydroxyl group-containing compound.

For [0057] surface light source device

LED is mounted light reflector may be applied to surface light source device for backlighting a display device (e.g. LCD). LCD backlight is Ru cormorants are classified into a direct type and an edge light type. A light source of the present invention, leaving with this and force S to be applied to the surface light source device for backlighting of any type.

[0058] In the case of the edge light type backlight, a light source is mounted on an end portion of the light guide plate, in the case of the direct type backlight, a light source is attached to the lower portion of the diffusion sheet and the lighting curtain.

[0059] Figure 4A~ Figure 4C, the surface light source device for an edge light type backlight is shown. End of the light guide plate 200 is disposed in the vicinity of the LED light source, LED light is introduced into the side surface of the light guide plate 200.

LED surface light source device shown in FIG. 4A is a side-view type, are mounted on a flat optical reflector. 4B and LED surface light source device shown in FIG. 4C top views a type (good in side-view type les,), and concave (FIG. 4B) or L-shaped bend (FIG. 4B) processing light reflected It is mounted on the body. [0060] In the surface light source device for an edge light type backlight, as shown in FIG. 4C, as part of the light reflector also serves as a reflective sheet under a light guide plate may be processed light reflector . Thereby reducing the number of parts of the surface light source device (e.g., reflector 210 in FIG. 4B is unnecessary) it can, because kill further also arranged under the light guide plate a metal substrate having a heat dissipating function, radiator sex is increased. Means for bending the light reflector is not particularly limited.

[0061] Further examples of the material of the light guide plate used in the surface light source device for an edge light type backlight, an acrylic resin such as polymethyl meth Tari rate, resin made of polycarbonate and polycarbonate 'polystyrene composition , epoxy resins, cyclic polyolefin-based resins (manufactured by Mitsui Chemicals, Inc. Aperu (registered trademark), Nippon Zeon Co., Ltd. Zeonoa (registered trademark), manufactured by JSR Corporation ARTON (registered trademark), etc.) and, glass . However the material of the light guide plate as long as the material showing transparency in a wavelength region of 380 nm to 780 nm, but are not necessarily limited to. The thickness of the light guide plate, the intended use and size may be appropriately selected due the size of the light source. Further, in order to equalize the luminance distribution in the surface may be subjected to such various dots printed on the surface of the light guide plate.

[0062] On the other hand, in the FIG. 4D, the surface light source device for a direct backlight is shown. Diffusing sheet 2 20 is placed on top of the LED light source, LED light is introduced from the bottom of the diffusion sheet 220. LED120 surface light source device shown in FIG. 4D is a top view type, are mounted on a flat optical reflector.

[0063] diffusion sheet or lighting curtain used in a direct type backlight for example, a polyethylene terephthalate (PET) film or PET film coated Atari Norebizu with a binder. The thickness of the diffusion sheet and lighting curtain, intended use and size may be appropriately selected due the size of the light source.

[0064] For the liquid crystal display device

The liquid crystal display device of the present invention can be force obtained by mounting the liquid crystal panel to a surface light source device for backlighting. Figure 5A~ 5C are a surface light source device for an edge light type backlight is a conceptual view of a liquid crystal display device equipped with the liquid crystal panel 300.

On the other hand, FIG. 5D, a surface light source device for direct backlight, is a conceptual view of a liquid crystal display device equipped with the liquid crystal panel 300. [0065] the liquid crystal panel 300, a polarizing film, diffusion film, a prism sheet, providing appropriate etc. retardation film is a category of design matters. The surface light source device can be suitably used for the liquid crystal panel of § click Restorative matrix system color filter and thin film transistor (TFT) array or a thin film diode type (TFD) is equipped. Red as the light source, green, if the light emission time division independently blue LED, without placing a color filter may issue an intermediate color by using the afterimage effect of the switching of the liquid crystal panel. This method and a field sequential system! /, Cormorants.

Example

[0066] The present invention, the scope of the present invention the force will be more specifically described with reference to the following examples not to be construed as being limited by the real 施例.

[0067] [Example 1]

Heat curing type silicone rubber adhesive: the (product name TSE3251H, GE Toshiba Silicone Co., Ltd.), titanium oxide fine particles: by mixing (product name Taipeta R960, Ishihara Sangyo Co., Ltd.), titanium oxide fine particles the content was 25 wt%. The resulting mixture was degassed by holding between 3:00 in vacuum.

[0068] The titanium oxide fine particles of a silicone rubber adhesive mixed, JIS1000 series of Arumiyuu arm plate (thickness: 0 · 2 mm), and a copper foil (thickness: 18 m) to each, was applied with an applicator. An adhesive coated surface of the aluminum plate, Te bonded Align the adhesive coated side of the copper foil was 1 hour heat-pressed at 170 ° C. The thickness of the adhesive layer of the resulting laminate to a thickness of about 50 m.

[0069] by coating a resist by printing on the surface of the copper foil was etched! /, To expose the portions. By wet etching using salt iron solution to form an electrical circuit by removing unnecessary copper. After wet etching, washed with water surface to obtain a light reflector, as shown in FIGS. 1A and 1B to remove the further resist.

[0070] Resin surface exposed by etching the copper is a reflection surface. The total light reflectance of the reflecting surfaces, visible ultraviolet spectrophotometer using an integrating sphere (manufactured by Shimadzu Corporation: UV-2450) was measured in. Standard reflectance measurements, was used filled with barium sulfate powder spectrophotometer manufacturer specified spectrophotometer supplied holder. Standard plate, also the standard plate by solidifying powdered barium sulfate, may be aluminum oxide standard plate, in this embodiment using standard plate hardened barium sulfate powder. The total light reflectance at a wavelength of 550nm was 95%. Diffuse reflectance at a wavelength of 550nm was measured with the same apparatus was 92%. Also, Hunter a value calculated from the total light reflection space Tuttle 1. 6, b value was 0.9.

[0071] Furthermore, was the peel strength between the silicone rubber adhesive layer obtained by mixing titanium oxide fine particles and the copper foil was measured under the following conditions, was 0. 6 kN / m value.

[Peel strength measurement conditions]

Used equipment: Co., Toyo Seiki Seisakusho stroke graph Ml

Measurement conditions: load cell 500 N, the cell moving speed 50mm / min, 90 ° peel

Sample size: 3 · 2mm X 40mm

[0072] The obtained light reflector, was passed through a reflow furnace with a nitrogen atmosphere of 260 ° C over a period of 1 minute. Thereafter, the reflectance of the reflecting surface, and the peel strength between the adhesive layer and the copper foil was measured. Reflow furnace pass before reflectivity than a, and decreases in both peel strength was observed.

[0073] In addition to the conductive layer of the light reflector obtained, white solder resist (Taiyo Ink Ltd. Fotofu Ina one PMR6000) was applied was cured by heating after UV exposure. Was the total light reflectance of the white surface of the white solder one resist measured by the same method, reflectivity definitive a wavelength 550nm was 88%.

[0074] [Example 2]

Example 1 and the titanium oxide fine particles to the same silicone rubber adhesive: mixed (product name Taipeta R 930, Ishihara Sangyo Co., Ltd.), and the content of titanium oxide fine particles and 35 wt%. The resulting mixture was degassed by 3 hours in a vacuum.

[0075] The white silicone rubber adhesive mixed with titanium oxide fine particles, similar Al Miniumu plate as in Example 1 (thickness: 0 · 2 mm), and a copper foil (thickness: 18 m) was applied to each. Overlapping the contact Chakuzainuri Kumen each other, and 1 hour thermally pressed at 170 ° C. The thickness of the adhesive layer of the resulting laminate was about 50 am.

[0076] The copper foil in the same manner as in Example 1 was removed by etching. The total light reflectance of the exposed reflecting surface, visible ultraviolet spectrophotometer using an integrating sphere (manufactured by Hitachi, Ltd.: U- 3010) was measured in. Standard reflectance measurements, aluminum oxide white plate (model number: 210- 0740) was. Reflectance at a wavelength of 550 nm was 95%. Diffuse reflectance at a wavelength of 550nm was measured with the same apparatus was 95%. Also, Hunter a value calculated from the total light reflection spectrum -

1. 9, b value was 0.7.

[0077] Furthermore, the peeling strength between the white silicone rubber adhesive layer and a copper foil, was measured under the same conditions as in Example 1, was 0. 45 kN / m.

[0078] obtained by the light reflector passed 3 times through a reflow furnace of a nitrogen atmosphere of 260 ° C (transit time

1 minute), was the peel strength between the reflectivity and the adhesive layer and the copper foil of the reflective surface is measured, compared with the prior reflow furnace pass, lowering both reflectance and peel strength was observed.

[0079] The resulting light reflector, ambient temperature 60 ° C, after standing 500 hours under a relative humidity of 90% humidity and heat resistance testing environment, was measured reflectance and the peel strength before and after wet heat test decrease in reflectance and peel strength was observed.

[0080] The obtained light reflector, in an aqueous alkali solution or an organic solvent shown in the following 1) to 6), was immersed in Jo Tokoro conditions (temperature and time). The reflectance and peel strength before and after immersion was measured, but no change was observed. Thus, alkali resistance and solvent resistance of the obtained light reflector high! /, It can be seen.

[0081] l) NaOH (3 wt% aqueous solution) 50 ° C, 30 sec No change

2) KOH (3 wt% aqueous solution) 50 ° C, 30 sec No change

3) N a OH (5 wt% aqueous solution) 25 ° C, 15 min no change

4) 1 ^ «(5 wt% aqueous solution) 25 ° C, 15 min no change

5) MEK (methyl E chill ketone) 25 ° C, 15 min no change

6) IPA (isopropyl alcohol) 25 ° C, 15 min no change

[0082] [Example 3] Example 1 and needle-like titanium oxide particles in the same silicone rubber adhesive was mixed (product name Taipeta FTL- ​​110, Ishihara Sangyo Co., Ltd.), the needle-like titanium oxide particles -containing Yuritsu was 35% by weight. The resulting mixture was degassed by 3 hours in a vacuum.

[0083] The needle-like titanium oxide white silicone rubber adhesive microparticles were mixed, Example 1 and the same aluminum plate (thickness: 0 · 2 mm), and a copper foil (thickness: 18 m) coated on each did. Overlapping the coated surface with each other, it was carried out for 1 hour thermally pressed at 170 ° C. The thickness of the adhesive layer of the resulting laminate was about 50 am.

[0084] The copper foil in the same manner as in Example 1 was removed by etching. Ultraviolet-visible spectrophotometric meter using an integrating sphere (manufactured by Hitachi, Ltd.: U- 3010) was measured, the total light reflectance of the exposed reflective surface (measured wavelength as 550 nm) was 95%. The standard of reflectance measurements, aluminum oxide two ©-time whiteboard (model number: 210- 0740) and the. Further, (measured wavelength as 550 nm) diffuse reflectance measured by the apparatus was 95%. Also, Hunter a value calculated from the total light reflection spectrum 1. 7,1 ^ value was 1.7. Moreover, as measured under the same conditions as in Example 1, the peel strength between the white silicone rubber adhesive layer and the copper foil was 0. 88kN / m.

[0085] to produce a white epoxy resin substrate in Comparative Example 1 the following procedure. 5 0 parts by mass of methyl E chill ketone, 50 parts by weight alicyclic epoxy resin, 40 mass parts bisphenol A type epoxy resin was dissolved 10 parts by weight of glycidyl methacrylate copolymer (Varnish A).

Also, dimethylformamide 25 parts by weight, dicyandiamide 3 parts by weight as curing agent, it was dissolved 1 Shianoechiru 2 © down decyl imidazole 0.1 parts by weight hardening accelerator (Varnish B).

[0086] mixing the varnish A and varnishes B, to obtain a white epoxy varnish was further mixed with titanium oxide fine particles and a fluorescent brightening agent 0.3 parts by weight. Ivy Do 35% by weight content of titanium oxide fine particles. The white epoxy varnish obtained, by impregnating glass cloth, and 5 minutes preliminary drying at 0.99 ° C, and below copper foil (thickness: 18 m) superimposed were thermally pressed at 170 ° C. The thickness of the E port carboxymethyl resin layer was about 550 mu m.

[0087] The part of the copper foil in the same manner as in Example 1 was removed by etching to expose the reflecting surface. Ultraviolet-visible spectrophotometer using an integrating sphere (manufactured by Hitachi, Ltd.: U- 3010) was measured at a total light reflectivity of the reflective surface (measured wavelength as 550 nm) was 90%. Diffuse reflectance measured by the apparatus was 90% (measured wavelength as 550 nm). Hunter a value calculated from the total light reflection spectrum one 2 · 2, b value was 2.9.

[0088] 1) Heat Resistance Test

The copper foil of the resulting reflector in Example 2 and Comparative Example 1, in the same manner as in Example 1, was removed by E Tsuchingu, to obtain a sample in which the reflective surface is exposed. The total light ray reflectance of the exposed reflecting surface was measured (untreated sample in FIG. 6A). Further, the sample of the reflecting surface is exposed by heating to 10 hours 180 ° C, to measure the change in the total light reflectance of the reflecting surface (treated sample in Figure 6 A). Results of the measurement are shown in Figure 6A. The reflectance of each sample, for light with a wavelength of 550 nm, shown in FIG. 6B changes with time to the heating time.

As shown in FIG. 6A, the sample of Comparative Example 1, significant deterioration of the reflectance at 10 hours short wavelength region after heating. In contrast, samples from Example 2, samples after 10 hours pressurized heat also, it can be seen that the reflectivity hardly changes. In this way, the sample from Example 2, excellent heat resistance! /, Rukoto force S 's power, Ru.

[0089] 2) UV resistance test

The copper foil of the resulting reflector in Example 2 and Comparative Example 1, in the same manner as in Example 1, was removed by E Tsuchingu, to obtain a sample in which the reflective surface is exposed. The total light ray reflectance of the exposed reflecting surface was measured (untreated sample in FIG. 7). Furthermore a high pressure mercury lamp light (irradiation strength degree = about 90 mW / cm 2), were measured the total light reflectance of the reflecting surface was irradiated with ultraviolet rays for 1 minute (the process in FIG. 7 samples).

Measurement results are shown in Figure 7. Samples from Comparative Example 1 is remarkably reduced reflectance in a short wavelength region by even untreated reflectance Teigu and processing. On the other hand, the sample from Example 2 is less degraded by Kogu and processing the reflectance from an untreated state. Thus, samples from Example 2, see that ultraviolet light resistance is excellent

[0090] 3) Light resistance test

The copper foil of the resulting reflector in Example 2 and Comparative Example 1, in the same manner as in Example 1, was removed by E Tsuchingu, to obtain a sample in which the reflective surface is exposed. The total light ray reflectance of the exposed reflecting surface was measured (untreated sample in FIG. 8). Further samples in a state of holding pressurized heat to 100 ° C, and pseudo sunlight (about 500 mW / cm 2) was irradiated for 150 hours. Air mass in the xenon lamp (A. M) Attach the filter 1.5 to give a pseudo sunlight. Was measured subsequent total light reflectance (processing in FIG. 8 samples).

Measurement results are shown in Figure 8. Samples from Comparative Example 1, the reflectance is lowered by irradiation treatment. On the other hand, almost no deterioration reflectance sample from Example 2. Thus, the sample from Example 2 is seen that superior in light-heat.

[0091] 4) bending property test

A sample was cut out of LOcmX 1 cm from the reflector of Example 2 and Comparative Example 1, by applying a jig in a central portion, it is bent 90 °. Samples from Example 2 was maintained shape without peeling both resin and the copper foil be 90 ° flexion. On the other hand, the sump Honoré from Comparative Example 1, the release between the glass cloth has occurred to break when it is 90 ° flexion resin layer.

[0092] [Example 4]

LED implementation of

A light reflector obtained in Example 1, were cut samples of 19cm X 27cm. A protective film on the sample of the aluminum plate, further dry film resist (Asahi Kasei Co., Ltd.: AQ3058) on the copper foil was laminated. Irradiated with UV in the dry film resist LED mounting circuit pattern via the mask drawing, to cure the resist mounting the circuit pattern part. After resist curing, the sample is immersed in aqueous sodium carbonate solution to remove the resist that has not been cured.

[0093] Thereafter, the sample is immersed in ferric chloride solution, after which the copper foil removed regions of the resist is removed by etching, and washed with water. The sample after washing with water immersed in an aqueous solution of sodium hydroxide, to remove any resist.

[0094] the mounted circuit pattern formed surface-wide and white solder resist (Taiyo Ink Manufacturing Co., Ltd.: Photo Finer PMR-6000 W30 (main agent) and CA-40 G30 (curing agent) and 70: 30 mixture) was coated the proportion of, and heated and dried for 30 minutes 80 ° C, to form the thickness of the film of 20 m. Subsequently, by irradiating UV through a mask, and the soldering area in need of order to implement the LED to cure the source Ruda resist in the area of ​​the copper foil is divided tool mounted circuit pattern. After resist curing, samples were immersed in aqueous sodium carbonate solution, and by removing the solder resist that has not been cured, and further washed with water. Was then further cure the solder resist is heated to 0.99 ° C for 60 minutes.

[0095] The solder resist has been removed area (soldering area in need), and washed pure. Further in that region, by using a screen printing machine Sn- Ag- Cu (Ag3%, CuO. 5%) was printed cream solder. Then, in a region where the solder paste is printed, the LED chip was mounted by a reflow process. Specifically the samples, and the reflow furnace of the maximum at 260 ° C or passed over 10 seconds.

[0096] [Example 5]

In demonstrated in Example 4 approach, the optical reflector obtained in Example 1 to obtain a light source by a white LED side-view type implement as shown in Figure 3A. To the resulting source light guide plate Atari Le resin to obtain a surface light source device by mounting, as shown in Figure 4A.

[0097] [Example 6]

Diffuse reflection surface of the light reflector obtained in Example 1 was bent and so that the concave surface. In the manner shown in real 施例 4, the light reflector was bent, the white LED of the top view type or site de view type, to obtain a light source by implementing, as shown in FIGS. 3B and 3C. The light source shown in obtained 3B and 3C, the light guide plate of an acrylic resin, to obtain a respective surface light source device by mounting, as shown in FIGS. 4B and 4C.

[0098] [Example 7]

In demonstrated in Example 4 Method to obtain a light reflector obtained in Example 1, the top view type of red, green, light sources by implementing to indicate the blue LED in FIG. 3D. To the resulting light source, to obtain a surface light source device by attaching the diffusion sheet of the PET resin as shown in FIG. 4D.

Industrial Applicability

[0099] light reflector of the present invention, including the surface light source device for a liquid crystal display, indoor lighting, indoor lighting, is suitably applied to a light source, such as automotive lighting and decorative lighting. In particular, the light reflector of the present invention, the light source, surface light source device or a liquid crystal display device is applicable to small and medium type, such as portable devices and Konbiyu data monitor to large-sized liquid crystal displays such as television applications.

[0100] This application claims priority based on application number JP2006- 226400, filed Aug. 23, 2006 (Japanese Patent Application No. 2006- 22 6400). Contents described in the application specifications and drawings are, are all incorporated herein.

DESCRIPTION OF SYMBOLS

[0101] Light reflecting layer conductive layer having a 10 metal substrate electrically insulating

Solder

Light emitting diode

Light emitting portion light guide plate of the side view type light emitting diode top view type of light emitting diode light-emitting diodes

Reflective sheeting

Diffusion sheet

The liquid crystal panel

Claims

The scope of the claims
[I] a metal substrate;
Provided on at least one surface of the metal substrate, it has electrical insulation properties, light-reflecting layer contains an elastomer one containing at least one of pigments and inorganic fillers; as well
Conductive layer formed on the light reflective layer;
Light reflector, including.
[2] The elastomeric one comprises a silicone resin or silicone rubber, the light reflector according to claim 1.
[3], wherein the inorganic filler is a needle-like filler, the light reflector according to claim 1.
[4] The total light reflectance of the light reflecting layer is 88% or more, the light reflector according to claim 1.
[5] Diffuse reflectance of the light reflecting layer is 80% or more, the light reflector according to claim 1.
[6] the a conductive layer the electric circuit, the light reflector according to claim 1.
[7] The electric circuit is formed by removing part of the conductive layer by etching, the light reflector according to 請 Motomeko 6.
[8] the light reflector according to claim 1,
The electric circuit layer mounted light emitting diodes, and
Emitting diode is mounted les, it! /, Light sources that have a solder resist layer covering the electrical circuit.
[9] The total light reflectance at the surface of the solder resist layer is 80% or more, claim
Light source according to 8.
[10] The light source of claim 8, and a light guide plate for introducing light thereinto from the light source, an edge light type backlight surface light source device.
[II] The light source of claim 8, and a diffusion sheet or lighting curtain arranged on the light emitting side of the light source, the direct-type backlight surface light source device.
[12] The liquid crystal display device having a surface light source device according as a backlight in claim 10.
[13] The liquid crystal display device having a surface light source device according as a backlight to claim 11.
PCT/JP2007/065842 2006-08-23 2007-08-14 Light-reflecting body and light source comprising the same WO2008023605A1 (en)

Priority Applications (2)

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JP2006-226400 2006-08-23

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WO2010019459A2 (en) * 2008-08-11 2010-02-18 E. I. Du Pont De Nemours And Company Light-emitting diode housing comprising fluoropolymer
JP2010263165A (en) * 2009-05-11 2010-11-18 Mitsubishi Plastics Inc Reflective substrate for led, and light emitting device
JP2011151248A (en) * 2010-01-22 2011-08-04 Seiwa Electric Mfg Co Ltd Light emitting device, and method of manufacturing the same
JP2011159567A (en) * 2010-02-03 2011-08-18 Kyoritsu Densho:Kk Luminaire for streetlight
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