TW200821632A - Light reflector and light source having same - Google Patents
Light reflector and light source having same Download PDFInfo
- Publication number
- TW200821632A TW200821632A TW096129963A TW96129963A TW200821632A TW 200821632 A TW200821632 A TW 200821632A TW 096129963 A TW096129963 A TW 096129963A TW 96129963 A TW96129963 A TW 96129963A TW 200821632 A TW200821632 A TW 200821632A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- light source
- reflector
- layer
- led
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006226400 | 2006-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200821632A true TW200821632A (en) | 2008-05-16 |
Family
ID=39106691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096129963A TW200821632A (en) | 2006-08-23 | 2007-08-14 | Light reflector and light source having same |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2008023605A1 (fr) |
TW (1) | TW200821632A (fr) |
WO (1) | WO2008023605A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI398925B (zh) * | 2007-05-23 | 2013-06-11 | Applied Materials Inc | 氮化硼及氮化硼衍生材料之沉積方法 |
TWI513783B (zh) * | 2010-04-13 | 2015-12-21 | Dexerials Corp | A light reflective anisotropic conductive adhesive and a light emitting device |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009276396A (ja) * | 2008-05-12 | 2009-11-26 | Mitsubishi Plastics Inc | 光反射フィルムおよび光反射板 |
CN102047452B (zh) * | 2008-05-30 | 2013-03-20 | 夏普株式会社 | 发光装置、面光源、液晶显示装置和制造发光装置的方法 |
US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
JP2010263165A (ja) * | 2009-05-11 | 2010-11-18 | Mitsubishi Plastics Inc | Led用反射基板及び発光装置 |
JP2011151248A (ja) * | 2010-01-22 | 2011-08-04 | Seiwa Electric Mfg Co Ltd | 発光装置及び発光装置の製造方法 |
JP5557186B2 (ja) * | 2010-01-25 | 2014-07-23 | 株式会社朝日Fr研究所 | 金属箔付き反射シート |
JP5504933B2 (ja) * | 2010-02-03 | 2014-05-28 | 株式会社共立電照 | 街灯用照明器具 |
US9574050B2 (en) * | 2010-03-23 | 2017-02-21 | Asahi Rubber Inc. | Silicone resin reflective substrate, manufacturing method for same, and base material composition used in reflective substrate |
JP5509996B2 (ja) * | 2010-03-31 | 2014-06-04 | カシオ計算機株式会社 | フレキシブルプリント基板、光源装置及び表示装置 |
JP5684511B2 (ja) | 2010-08-11 | 2015-03-11 | 三菱樹脂株式会社 | 金属箔積層体、led搭載用基板及び光源装置 |
JP5551549B2 (ja) * | 2010-09-08 | 2014-07-16 | 帝人デュポンフィルム株式会社 | 実装用回路基板 |
JP2013026416A (ja) * | 2011-07-20 | 2013-02-04 | Toyoda Gosei Co Ltd | 素子搭載基板及びこれを備えた発光装置 |
WO2013061855A1 (fr) * | 2011-10-25 | 2013-05-02 | シャープ株式会社 | Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision |
JP2013145833A (ja) * | 2012-01-16 | 2013-07-25 | Fujifilm Corp | Led発光素子用反射基板およびledパッケージ |
JP2013033976A (ja) * | 2012-09-14 | 2013-02-14 | Stanley Electric Co Ltd | 半導体発光装置、および車両用前照灯 |
WO2017010387A1 (fr) * | 2015-07-13 | 2017-01-19 | シャープ株式会社 | Dispositif d'éclairage et appareil d'affichage |
WO2017059575A1 (fr) * | 2015-10-09 | 2017-04-13 | 魏晓敏 | Diode électroluminescente (led) et module |
JP6540825B2 (ja) * | 2015-11-26 | 2019-07-10 | 日本製鉄株式会社 | 被覆金属板 |
JP2021085808A (ja) * | 2019-11-29 | 2021-06-03 | シーシーエス株式会社 | 光照射装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63174379A (ja) * | 1987-01-14 | 1988-07-18 | Toshiba Corp | 発光表示装置 |
JP2772775B2 (ja) * | 1995-09-29 | 1998-07-09 | 大日本印刷株式会社 | 光拡散シート及びそれを使用したエッジライト型面光源並びに液晶表示装置 |
JP2000321551A (ja) * | 1999-05-13 | 2000-11-24 | Sharp Corp | 液晶表示装置 |
JP2003185813A (ja) * | 2001-12-21 | 2003-07-03 | Mitsui Chemicals Inc | 反射体およびその用途 |
JP4543772B2 (ja) * | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
-
2007
- 2007-08-14 TW TW096129963A patent/TW200821632A/zh unknown
- 2007-08-14 JP JP2008530865A patent/JPWO2008023605A1/ja active Pending
- 2007-08-14 WO PCT/JP2007/065842 patent/WO2008023605A1/fr active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI398925B (zh) * | 2007-05-23 | 2013-06-11 | Applied Materials Inc | 氮化硼及氮化硼衍生材料之沉積方法 |
TWI513783B (zh) * | 2010-04-13 | 2015-12-21 | Dexerials Corp | A light reflective anisotropic conductive adhesive and a light emitting device |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008023605A1 (ja) | 2010-01-07 |
WO2008023605A1 (fr) | 2008-02-28 |
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