JP2001324725A - 液晶表示装置およびその製造方法 - Google Patents
液晶表示装置およびその製造方法Info
- Publication number
- JP2001324725A JP2001324725A JP2000144586A JP2000144586A JP2001324725A JP 2001324725 A JP2001324725 A JP 2001324725A JP 2000144586 A JP2000144586 A JP 2000144586A JP 2000144586 A JP2000144586 A JP 2000144586A JP 2001324725 A JP2001324725 A JP 2001324725A
- Authority
- JP
- Japan
- Prior art keywords
- film
- wiring
- electrode
- liquid crystal
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
- G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Drying Of Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144586A JP2001324725A (ja) | 2000-05-12 | 2000-05-12 | 液晶表示装置およびその製造方法 |
| TW090110435A TWI286257B (en) | 2000-05-12 | 2001-05-01 | Liquid crystal display device |
| US09/851,942 US6762802B2 (en) | 2000-05-12 | 2001-05-10 | Liquid crystal display device and fabrication method thereof |
| KR10-2001-0025886A KR100467993B1 (ko) | 2000-05-12 | 2001-05-11 | 액정 표시 장치 |
| CNB2006100025019A CN100435012C (zh) | 2000-05-12 | 2001-05-12 | 液晶显示装置及其制造方法 |
| CNB011231068A CN1268968C (zh) | 2000-05-12 | 2001-05-12 | 液晶显示装置及其制造方法 |
| CNA2006101011916A CN1920630A (zh) | 2000-05-12 | 2001-05-12 | 液晶显示装置及其制造方法 |
| US10/879,587 US20040232421A1 (en) | 2000-05-12 | 2004-06-30 | Liquid crystal display device and fabrication method thereof |
| US10/879,635 US20050007507A1 (en) | 2000-05-12 | 2004-06-30 | Liquid crystal display device and fabrication method thereof |
| US11/522,466 US20070159568A1 (en) | 2000-05-12 | 2006-09-18 | Liquid crystal display device and fabrication method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144586A JP2001324725A (ja) | 2000-05-12 | 2000-05-12 | 液晶表示装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001324725A true JP2001324725A (ja) | 2001-11-22 |
| JP2001324725A5 JP2001324725A5 (enExample) | 2007-04-26 |
Family
ID=18651224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000144586A Abandoned JP2001324725A (ja) | 2000-05-12 | 2000-05-12 | 液晶表示装置およびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (4) | US6762802B2 (enExample) |
| JP (1) | JP2001324725A (enExample) |
| KR (1) | KR100467993B1 (enExample) |
| CN (3) | CN1268968C (enExample) |
| TW (1) | TWI286257B (enExample) |
Cited By (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003297850A (ja) * | 2002-04-02 | 2003-10-17 | Advanced Display Inc | 薄膜トランジスタアレイ及びその製造方法並びにこれを用いた液晶表示装置 |
| JP2003347555A (ja) * | 2002-05-28 | 2003-12-05 | Chi Mei Electronics Corp | 薄膜トランジスター液晶表示装置及びその薄膜トランジスター製作方法 |
| JP2004038041A (ja) * | 2002-07-05 | 2004-02-05 | Chi Mei Electronics Corp | 画像表示素子及び画像表示装置 |
| JP2004070355A (ja) * | 2002-07-31 | 2004-03-04 | Lg Phillips Lcd Co Ltd | 反射透過型液晶表示装置及びその製造方法 |
| KR20040045598A (ko) * | 2002-11-25 | 2004-06-02 | 삼성전자주식회사 | 박막 트랜지스터 기판 및 그의 제조 방법 |
| JP2004157543A (ja) * | 2002-11-07 | 2004-06-03 | Lg Philips Lcd Co Ltd | 液晶表示装置用アレイ基板及びその製造方法 |
| JP2004178839A (ja) * | 2002-11-25 | 2004-06-24 | Rohm Co Ltd | 補助電極の形成方法 |
| JP2005072135A (ja) * | 2003-08-21 | 2005-03-17 | Nec Lcd Technologies Ltd | 液晶表示装置及び薄膜トランジスタの製造方法 |
| JP2005086090A (ja) * | 2003-09-10 | 2005-03-31 | Advanced Display Inc | Tftアレイ基板の製造方法及び液晶表示装置 |
| KR100494705B1 (ko) * | 2002-01-18 | 2005-06-13 | 비오이 하이디스 테크놀로지 주식회사 | 액정표시소자의 박막트랜지스터 제조방법 |
| JP2005173613A (ja) * | 2003-12-10 | 2005-06-30 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板 |
| JP2005173612A (ja) * | 2003-12-10 | 2005-06-30 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板 |
| JP2005201982A (ja) * | 2004-01-13 | 2005-07-28 | Nec Lcd Technologies Ltd | 液晶表示装置及びその製造方法 |
| JP2005257883A (ja) * | 2004-03-10 | 2005-09-22 | Nec Lcd Technologies Ltd | 液晶表示装置 |
| US6972434B2 (en) | 2003-03-10 | 2005-12-06 | Sharp Kabushiki Kaisha | Substrate for display, method of manufacturing the same and display having the same |
| JP2006080487A (ja) * | 2004-09-09 | 2006-03-23 | Lg Phillips Lcd Co Ltd | 薄膜トランジスタアレイ基板及びその製造方法 |
| JP2006189768A (ja) * | 2004-12-31 | 2006-07-20 | Lg Phillips Lcd Co Ltd | 液晶表示装置およびその製造方法 |
| JP2006330201A (ja) * | 2005-05-24 | 2006-12-07 | Sharp Corp | 液晶表示装置及びその製造方法 |
| JP2006350327A (ja) * | 2005-06-03 | 2006-12-28 | Samsung Electronics Co Ltd | 表示装置、その製造方法、及びその製造方法で使用されるマスク |
| US7161212B2 (en) | 2004-02-10 | 2007-01-09 | Nec Lcd Technologies, Ltd. | Thin film transistor, liquid crystal display using thin film transistor, and method of manufacturing thin film transistor |
| JP2007156442A (ja) * | 2005-12-05 | 2007-06-21 | Toppoly Optoelectronics Corp | 低温ポリシリコン薄膜トランジスタ液晶ディスプレイ装置に用いられる積層蓄積容量構造 |
| WO2007091405A1 (ja) * | 2006-02-09 | 2007-08-16 | Idemitsu Kosan Co., Ltd. | 反射型tft基板及び反射型tft基板の製造方法 |
| JP2007328066A (ja) * | 2006-06-07 | 2007-12-20 | Canon Inc | 表示装置 |
| JP2008003118A (ja) * | 2006-06-20 | 2008-01-10 | Epson Imaging Devices Corp | 電気光学装置、電子機器、および電気光学装置の製造方法 |
| JP2008310367A (ja) * | 2003-06-30 | 2008-12-25 | Hoya Corp | グレートーンマスク及びその製造方法 |
| US7476898B2 (en) | 2004-04-14 | 2009-01-13 | Nec Lcd Technologies, Ltd. | Thin film and manufacturing method of the same |
| KR100891070B1 (ko) * | 2002-12-03 | 2009-03-31 | 엘지디스플레이 주식회사 | 액정표시장치 제조방법 |
| KR100897720B1 (ko) * | 2002-11-27 | 2009-05-15 | 엘지디스플레이 주식회사 | 액정표시장치의 제조방법 |
| JP2009124122A (ja) * | 2007-10-23 | 2009-06-04 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2010028103A (ja) * | 2008-06-17 | 2010-02-04 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ及びその作製方法、並びに表示装置及びその作製方法 |
| JP2011028285A (ja) * | 2010-09-17 | 2011-02-10 | Sharp Corp | 液晶表示装置及びその製造方法 |
| JP2012119659A (ja) * | 2010-11-29 | 2012-06-21 | Samsung Electronics Co Ltd | 薄膜トランジスタ表示板の製造方法 |
| KR101308454B1 (ko) | 2007-02-21 | 2013-09-16 | 엘지디스플레이 주식회사 | 액정 표시 장치 및 이의 제조 방법 |
| KR101319334B1 (ko) | 2007-03-20 | 2013-10-16 | 엘지디스플레이 주식회사 | 액정표시패널 및 그의 제조방법 |
| JP2013238718A (ja) * | 2012-05-15 | 2013-11-28 | Panasonic Corp | 半導体装置及び半導体装置の製造方法 |
| WO2014038501A1 (ja) * | 2012-09-07 | 2014-03-13 | シャープ株式会社 | アクティブマトリクス基板、及び製造方法 |
| JP2014068024A (ja) * | 2007-12-21 | 2014-04-17 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| US8785934B2 (en) | 2005-12-28 | 2014-07-22 | Samsung Display Co., Ltd. | Thin film transistor substrate for display panel |
| WO2014136612A1 (ja) * | 2013-03-07 | 2014-09-12 | シャープ株式会社 | 半導体装置およびその製造方法 |
| US8835928B2 (en) | 2010-09-21 | 2014-09-16 | Sharp Kabushiki Kaisha | Semiconductor device and process for production thereof |
| US8866142B2 (en) | 2011-02-09 | 2014-10-21 | Samsung Display Co., Ltd. | Display device and manufacturing method thereof |
| JP2015029109A (ja) * | 2009-02-25 | 2015-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2015108836A (ja) * | 2008-01-30 | 2015-06-11 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングOSRAM OLED GmbH | カプセル封入ユニットを有する装置 |
| CN104952878A (zh) * | 2014-03-28 | 2015-09-30 | 群创光电股份有限公司 | 显示面板 |
| JP2016192563A (ja) * | 2007-07-27 | 2016-11-10 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP2017022389A (ja) * | 2010-12-01 | 2017-01-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2017168706A (ja) * | 2016-03-17 | 2017-09-21 | 三菱電機株式会社 | 表示装置及びその製造方法 |
| JP2018022907A (ja) * | 2008-07-31 | 2018-02-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR20190038952A (ko) * | 2009-07-31 | 2019-04-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| JP2019071461A (ja) * | 2008-09-01 | 2019-05-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2019208078A (ja) * | 2012-01-26 | 2019-12-05 | 株式会社半導体エネルギー研究所 | 発光装置 |
| JP2020061573A (ja) * | 2007-07-06 | 2020-04-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2020077887A (ja) * | 2013-10-31 | 2020-05-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2020188276A (ja) * | 2008-10-24 | 2020-11-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2021005093A (ja) * | 2008-10-24 | 2021-01-14 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP2021015983A (ja) * | 2009-07-10 | 2021-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置、発光表示装置 |
| JP2021039373A (ja) * | 2012-07-12 | 2021-03-11 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP2021100132A (ja) * | 2008-07-31 | 2021-07-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2024045262A (ja) * | 2011-06-10 | 2024-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Families Citing this family (104)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100632216B1 (ko) * | 1999-12-16 | 2006-10-09 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이 기판 및 그 제조방법 |
| KR100469341B1 (ko) * | 2000-08-30 | 2005-01-31 | 엘지.필립스 엘시디 주식회사 | 횡전계방식 액정표시장치 및 그 제조방법 |
| JP4342711B2 (ja) * | 2000-09-20 | 2009-10-14 | 株式会社日立製作所 | 液晶表示装置の製造方法 |
| TW525216B (en) | 2000-12-11 | 2003-03-21 | Semiconductor Energy Lab | Semiconductor device, and manufacturing method thereof |
| SG111923A1 (en) | 2000-12-21 | 2005-06-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
| KR100704510B1 (ko) * | 2001-02-12 | 2007-04-09 | 엘지.필립스 엘시디 주식회사 | 횡전계형 액정표시장치용 하부 기판 및 그의 제조방법 |
| JP4410951B2 (ja) * | 2001-02-27 | 2010-02-10 | Nec液晶テクノロジー株式会社 | パターン形成方法および液晶表示装置の製造方法 |
| KR100456137B1 (ko) * | 2001-07-07 | 2004-11-08 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 어레이 기판 및 그의 제조방법 |
| KR100685947B1 (ko) * | 2001-09-08 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | 액정표시소자의 제조방법 |
| KR100796795B1 (ko) * | 2001-10-22 | 2008-01-22 | 삼성전자주식회사 | 반도체 소자의 접촉부 및 그 제조 방법과 이를 포함하는표시 장치용 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
| JP2003177417A (ja) * | 2001-12-12 | 2003-06-27 | Hitachi Ltd | 液晶表示装置 |
| US6862052B2 (en) * | 2001-12-14 | 2005-03-01 | Samsung Electronics Co., Ltd. | Liquid crystal display, thin film transistor array panel for liquid crystal display and manufacturing method thereof |
| KR100869112B1 (ko) * | 2002-01-14 | 2008-11-17 | 삼성전자주식회사 | 반사형 액정표시장치 및 그 제조 방법 |
| KR100417917B1 (ko) * | 2002-04-03 | 2004-02-11 | 엘지.필립스 엘시디 주식회사 | 반사투과형 액정표시장치 및 그의 제조방법 |
| KR100476366B1 (ko) * | 2002-04-17 | 2005-03-16 | 엘지.필립스 엘시디 주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
| JP4565799B2 (ja) * | 2002-07-01 | 2010-10-20 | 大林精工株式会社 | 横電界方式液晶表示装置、その製造方法、走査露光装置およびミックス走査露光装置 |
| JP4066731B2 (ja) * | 2002-07-09 | 2008-03-26 | セイコーエプソン株式会社 | カラーフィルタ基板及びその製造方法、電気光学装置並びに電子機器 |
| TWI256732B (en) * | 2002-08-30 | 2006-06-11 | Sharp Kk | Thin film transistor, liquid crystal display apparatus, manufacturing method of thin film transistor, and manufacturing method of liquid crystal display apparatus |
| KR100886241B1 (ko) * | 2002-09-10 | 2009-02-27 | 엘지디스플레이 주식회사 | 액정표시소자의 제조방법 |
| CN1324388C (zh) * | 2003-03-14 | 2007-07-04 | 友达光电股份有限公司 | 低温多晶矽薄膜电晶体液晶显示器的制造方法 |
| KR100652214B1 (ko) * | 2003-04-03 | 2006-11-30 | 엘지.필립스 엘시디 주식회사 | 액정표시장치의 제조방법 |
| CN1322372C (zh) * | 2003-04-08 | 2007-06-20 | 鸿富锦精密工业(深圳)有限公司 | 光罩工艺及薄膜晶体管的制造方法 |
| JP2004341465A (ja) * | 2003-05-14 | 2004-12-02 | Obayashi Seiko Kk | 高品質液晶表示装置とその製造方法 |
| JP2005108912A (ja) * | 2003-09-29 | 2005-04-21 | Quanta Display Japan Inc | 液晶表示装置とその製造方法 |
| JP2005215275A (ja) * | 2004-01-29 | 2005-08-11 | Quanta Display Japan Inc | 液晶表示装置とその製造方法 |
| KR100699988B1 (ko) * | 2004-03-19 | 2007-03-26 | 삼성에스디아이 주식회사 | 평판표시장치 |
| GB0411968D0 (en) * | 2004-05-28 | 2004-06-30 | Koninkl Philips Electronics Nv | Transflective liquid crystal display device |
| KR100626009B1 (ko) * | 2004-06-30 | 2006-09-20 | 삼성에스디아이 주식회사 | 박막 트랜지스터 구조체 및 이를 구비하는 평판디스플레이 장치 |
| TWI379113B (en) * | 2004-07-07 | 2012-12-11 | Samsung Display Co Ltd | Array substrate, manufacturing method thereof and display device having the same |
| KR101112538B1 (ko) * | 2004-07-27 | 2012-03-13 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
| KR101050300B1 (ko) * | 2004-07-30 | 2011-07-19 | 엘지디스플레이 주식회사 | 액정 표시 장치용 어레이 기판 및 그 제조 방법 |
| KR101058458B1 (ko) * | 2004-09-22 | 2011-08-24 | 엘지디스플레이 주식회사 | 저분자 유기 반도체물질을 이용한 액정표시장치용 어레이기판 및 그의 제조 방법 |
| TWI300149B (en) * | 2004-11-05 | 2008-08-21 | Au Optronics Corp | Pixel structure and manufracturing method thereof |
| CN100368910C (zh) * | 2004-12-28 | 2008-02-13 | 中华映管股份有限公司 | 像素结构的制造方法 |
| KR100955382B1 (ko) * | 2004-12-31 | 2010-04-29 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 제조방법 |
| JP4576558B2 (ja) | 2005-03-15 | 2010-11-10 | カシオ計算機株式会社 | 回路基板への半導体装置の実装方法及び液晶表示装置の製造方法 |
| US20080297711A1 (en) * | 2005-03-28 | 2008-12-04 | Au Optronics Corporation | Liquid crystal display device and its manufacturing method |
| KR101127218B1 (ko) | 2005-05-19 | 2012-03-30 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이 기판과 그 제조방법 |
| JP5111742B2 (ja) * | 2005-07-11 | 2013-01-09 | 株式会社ジャパンディスプレイイースト | レジストおよびこれを用いた表示装置の製造方法 |
| KR101298940B1 (ko) * | 2005-08-23 | 2013-08-22 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 및 이를 이용한 박막 트랜지스터기판의 제조방법 |
| TWI339442B (en) * | 2005-12-09 | 2011-03-21 | Samsung Mobile Display Co Ltd | Flat panel display and method of fabricating the same |
| KR20070070718A (ko) * | 2005-12-29 | 2007-07-04 | 엘지.필립스 엘시디 주식회사 | 박막 트랜지스터 기판의 제조방법 |
| KR101192750B1 (ko) * | 2005-12-30 | 2012-10-18 | 엘지디스플레이 주식회사 | Tft 어레이 기판 및 그 제조방법 |
| JP2007220807A (ja) * | 2006-02-15 | 2007-08-30 | Toshiba Corp | 半導体装置及びその製造方法 |
| EP2037319A3 (en) * | 2006-03-15 | 2009-05-13 | Sharp Kabushiki Kaisha | Active matrix substrate, display device and television receiver |
| EP2924498A1 (en) | 2006-04-06 | 2015-09-30 | Semiconductor Energy Laboratory Co, Ltd. | Liquid crystal desplay device, semiconductor device, and electronic appliance |
| NZ546970A (en) | 2006-05-04 | 2009-01-31 | Armorflex Ltd | Improvements in and relating to cable-barriers |
| US20070273803A1 (en) * | 2006-05-25 | 2007-11-29 | Meng-Chi Liou | Active component array substrate and fabricating method thereof |
| KR20080021994A (ko) * | 2006-09-05 | 2008-03-10 | 삼성전자주식회사 | 표시 패널 및 이의 제조 방법 |
| KR101306860B1 (ko) * | 2006-11-07 | 2013-09-10 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| TWI317538B (en) * | 2006-11-16 | 2009-11-21 | Au Optronics Corp | Etching process of metal layer of display panel |
| TWI325638B (en) * | 2007-01-22 | 2010-06-01 | Au Optronics Corp | Method for manufacturing pixel structure |
| NZ555598A (en) * | 2007-06-01 | 2010-02-26 | Armorflex Ltd | Improved Barrier Section Connection System |
| NZ556782A (en) * | 2007-07-27 | 2010-03-26 | Armorflex Ltd | Method of producing a frangible post |
| TWI469223B (zh) | 2007-09-03 | 2015-01-11 | 半導體能源研究所股份有限公司 | 薄膜電晶體和顯示裝置的製造方法 |
| JP5371341B2 (ja) * | 2007-09-21 | 2013-12-18 | 株式会社半導体エネルギー研究所 | 電気泳動方式の表示装置 |
| TW200924107A (en) * | 2007-10-02 | 2009-06-01 | Polymer Vision Ltd | An electronic circuit element with profiled photopatternable dielectric layer |
| CN101435990B (zh) * | 2007-11-15 | 2012-12-26 | 北京京东方光电科技有限公司 | 掩模板及其制造方法 |
| CN101504500B (zh) * | 2008-02-04 | 2011-08-31 | 北京京东方光电科技有限公司 | 薄膜晶体管液晶显示器阵列基板的像素结构 |
| US8424849B2 (en) * | 2008-06-04 | 2013-04-23 | Axip Limited | Guardrail |
| TWI875442B (zh) | 2008-07-31 | 2025-03-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| KR101497425B1 (ko) * | 2008-08-28 | 2015-03-03 | 삼성디스플레이 주식회사 | 액정 표시 장치 및 그 제조 방법 |
| KR101761108B1 (ko) | 2008-10-03 | 2017-07-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP2172804B1 (en) | 2008-10-03 | 2016-05-11 | Semiconductor Energy Laboratory Co, Ltd. | Display device |
| EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP5361651B2 (ja) | 2008-10-22 | 2013-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8741702B2 (en) | 2008-10-24 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR101667909B1 (ko) * | 2008-10-24 | 2016-10-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| US20100224878A1 (en) | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2011010541A1 (en) | 2009-07-18 | 2011-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI596741B (zh) | 2009-08-07 | 2017-08-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| JP5663231B2 (ja) | 2009-08-07 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 発光装置 |
| TWI604594B (zh) * | 2009-08-07 | 2017-11-01 | 半導體能源研究所股份有限公司 | 半導體裝置及包括該半導體裝置之電話、錶、和顯示裝置 |
| US8475872B2 (en) * | 2009-08-19 | 2013-07-02 | Apple Inc. | Patterning of thin film layers |
| US8115883B2 (en) | 2009-08-27 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| WO2011027702A1 (en) | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| AU2011205073B2 (en) | 2010-08-12 | 2015-02-12 | Valmont Highway Technology Limited | Improvements in and Relating to Barriers |
| US9230994B2 (en) * | 2010-09-15 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
| JP5372900B2 (ja) * | 2010-12-15 | 2013-12-18 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
| KR101820365B1 (ko) * | 2011-01-07 | 2018-01-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그의 제조 방법 |
| US8536571B2 (en) * | 2011-01-12 | 2013-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| JP2012248743A (ja) * | 2011-05-30 | 2012-12-13 | Japan Display West Co Ltd | 半導体装置およびその製造方法、表示装置ならびに電子機器 |
| TW201314389A (zh) * | 2011-09-29 | 2013-04-01 | Wistron Corp | 感光性間隙物及液晶顯示器的製作方法與陣列基板 |
| KR101992884B1 (ko) * | 2011-12-21 | 2019-06-26 | 엘지디스플레이 주식회사 | 액정 표시 장치 및 이의 제조 방법 |
| KR102022523B1 (ko) * | 2012-05-21 | 2019-09-18 | 엘지디스플레이 주식회사 | 금속 산화물 반도체를 구비하는 박막 트랜지스터 기판 및 그 제조 방법 |
| JP2014199899A (ja) | 2012-08-10 | 2014-10-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8689149B1 (en) * | 2013-01-11 | 2014-04-01 | Synopsys, Inc. | Multi-patterning for sharp corner printing |
| US9231002B2 (en) | 2013-05-03 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| US9293480B2 (en) * | 2013-07-10 | 2016-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| US9366932B2 (en) * | 2013-09-24 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | TFT-LCD array substrate manufacturing method and LCD panel/device produced by the same |
| CN103474396B (zh) * | 2013-09-24 | 2015-09-02 | 深圳市华星光电技术有限公司 | Tft-lcd阵列基板的制造方法 |
| KR102124025B1 (ko) * | 2013-12-23 | 2020-06-17 | 엘지디스플레이 주식회사 | 유기발광다이오드 표시장치 및 그 제조방법 |
| US10269791B2 (en) | 2015-03-16 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Field-effect transistors having transition metal dichalcogenide channels and methods of manufacture |
| JP6558990B2 (ja) * | 2015-07-17 | 2019-08-14 | 三菱電機株式会社 | 電子装置およびその製造方法とリペア方法 |
| CN105448938B (zh) * | 2016-01-28 | 2019-06-25 | 深圳市华星光电技术有限公司 | 薄膜晶体管基板及其制造方法 |
| CN105589276A (zh) * | 2016-03-14 | 2016-05-18 | 深圳市华星光电技术有限公司 | 阵列基板、液晶显示面板及液晶显示装置 |
| CN106206319A (zh) * | 2016-08-12 | 2016-12-07 | 京东方科技集团股份有限公司 | 薄膜晶体管和显示基板及其制作方法、显示装置 |
| CN106125435A (zh) * | 2016-08-31 | 2016-11-16 | 深圳市华星光电技术有限公司 | 液晶面板及液晶显示器 |
| CN108140646A (zh) * | 2016-12-24 | 2018-06-08 | 深圳市柔宇科技有限公司 | 阵列基板制造方法 |
| US9934977B1 (en) * | 2017-01-27 | 2018-04-03 | International Business Machines Corporation | Salicide bottom contacts |
| JP7083695B2 (ja) * | 2018-05-11 | 2022-06-13 | 株式会社荏原製作所 | バンプ高さ検査装置、基板処理装置、バンプ高さ検査方法、記憶媒体 |
| CN110729197A (zh) * | 2018-06-29 | 2020-01-24 | 中华映管股份有限公司 | 一种半导体薄膜晶体管的制造方法及显示面板 |
| CN112083610A (zh) * | 2019-06-13 | 2020-12-15 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示装置 |
| JP7483359B2 (ja) * | 2019-12-04 | 2024-05-15 | 株式会社ジャパンディスプレイ | 半導体装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0156178B1 (ko) * | 1995-10-20 | 1998-11-16 | 구자홍 | 액정표시 소자의 제조방법 |
| JPH06337436A (ja) * | 1993-05-27 | 1994-12-06 | Fujitsu Ltd | 薄膜トランジスタマトリクスの製造方法 |
| JPH0888368A (ja) | 1994-09-20 | 1996-04-02 | Hitachi Ltd | 薄膜トランジスタ及びこれを用いた液晶表示装置 |
| KR100303134B1 (ko) * | 1995-05-09 | 2002-11-23 | 엘지.필립스 엘시디 주식회사 | 액정표시소자및그제조방법. |
| US5760856A (en) * | 1995-09-08 | 1998-06-02 | Hitachi, Ltd. | In-plane field type liquid crystal display device with light shielding pattern suitable for high aperture ratio |
| JP3625598B2 (ja) * | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| DE19712233C2 (de) * | 1996-03-26 | 2003-12-11 | Lg Philips Lcd Co | Flüssigkristallanzeige und Herstellungsverfahren dafür |
| US6001539A (en) * | 1996-04-08 | 1999-12-14 | Lg Electronics, Inc. | Method for manufacturing liquid crystal display |
| KR100223153B1 (ko) * | 1996-05-23 | 1999-10-15 | 구자홍 | 액티브 매트릭스 액정표시장치의 제조방법 및 액티브매트릭스액정표시장치 |
| KR100241287B1 (ko) * | 1996-09-10 | 2000-02-01 | 구본준 | 액정표시소자 제조방법 |
| CN1148600C (zh) * | 1996-11-26 | 2004-05-05 | 三星电子株式会社 | 薄膜晶体管基片及其制造方法 |
| JP3410617B2 (ja) | 1996-11-29 | 2003-05-26 | シャープ株式会社 | 薄膜のパターニング方法 |
| JP3993263B2 (ja) | 1997-01-23 | 2007-10-17 | エルジー フィリップス エルシーディー カンパニー リミテッド | 液晶表示装置 |
| KR100255592B1 (ko) * | 1997-03-19 | 2000-05-01 | 구본준 | 액정 표시 장치 구조 및 그 제조 방법 |
| KR100262953B1 (ko) * | 1997-06-11 | 2000-08-01 | 구본준 | 액정 표시 장치 및 그 액정 표시 장치의 제조 방법 |
| KR100271037B1 (ko) * | 1997-09-05 | 2000-11-01 | 구본준, 론 위라하디락사 | 액정 표시 장치의 구조 및 그 액정 표시 장치의 제조 방법(liquid crystal display device and the method for manufacturing the same) |
| TW387997B (en) * | 1997-12-29 | 2000-04-21 | Hyundai Electronics Ind | Liquid crystal display and fabrication method |
| JP3230664B2 (ja) * | 1998-04-23 | 2001-11-19 | 日本電気株式会社 | 液晶表示装置とその製造方法 |
| KR100333274B1 (ko) * | 1998-11-24 | 2002-04-24 | 구본준, 론 위라하디락사 | 액정표시장치 및 그 제조방법 |
| KR100590753B1 (ko) * | 1999-02-27 | 2006-06-15 | 삼성전자주식회사 | 액정표시장치용박막트랜지스터기판및그제조방법 |
| KR100623982B1 (ko) * | 1999-07-16 | 2006-09-13 | 삼성전자주식회사 | 액정 표시 장치용 박막 트랜지스터 기판의 제조 방법 |
-
2000
- 2000-05-12 JP JP2000144586A patent/JP2001324725A/ja not_active Abandoned
-
2001
- 2001-05-01 TW TW090110435A patent/TWI286257B/zh not_active IP Right Cessation
- 2001-05-10 US US09/851,942 patent/US6762802B2/en not_active Expired - Lifetime
- 2001-05-11 KR KR10-2001-0025886A patent/KR100467993B1/ko not_active Expired - Fee Related
- 2001-05-12 CN CNB011231068A patent/CN1268968C/zh not_active Expired - Lifetime
- 2001-05-12 CN CNB2006100025019A patent/CN100435012C/zh not_active Expired - Lifetime
- 2001-05-12 CN CNA2006101011916A patent/CN1920630A/zh active Pending
-
2004
- 2004-06-30 US US10/879,635 patent/US20050007507A1/en not_active Abandoned
- 2004-06-30 US US10/879,587 patent/US20040232421A1/en not_active Abandoned
-
2006
- 2006-09-18 US US11/522,466 patent/US20070159568A1/en not_active Abandoned
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| JP2003297850A (ja) * | 2002-04-02 | 2003-10-17 | Advanced Display Inc | 薄膜トランジスタアレイ及びその製造方法並びにこれを用いた液晶表示装置 |
| JP2003347555A (ja) * | 2002-05-28 | 2003-12-05 | Chi Mei Electronics Corp | 薄膜トランジスター液晶表示装置及びその薄膜トランジスター製作方法 |
| JP2004038041A (ja) * | 2002-07-05 | 2004-02-05 | Chi Mei Electronics Corp | 画像表示素子及び画像表示装置 |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI286257B (en) | 2007-09-01 |
| CN1920630A (zh) | 2007-02-28 |
| US20050007507A1 (en) | 2005-01-13 |
| CN100435012C (zh) | 2008-11-19 |
| CN1804709A (zh) | 2006-07-19 |
| CN1333475A (zh) | 2002-01-30 |
| KR100467993B1 (ko) | 2005-01-24 |
| CN1268968C (zh) | 2006-08-09 |
| US20010040648A1 (en) | 2001-11-15 |
| US20070159568A1 (en) | 2007-07-12 |
| KR20010104667A (ko) | 2001-11-26 |
| US20040232421A1 (en) | 2004-11-25 |
| US6762802B2 (en) | 2004-07-13 |
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