DE68907659T2 - Warmhärtende Organosiloxanzusammensetzung. - Google Patents

Warmhärtende Organosiloxanzusammensetzung.

Info

Publication number
DE68907659T2
DE68907659T2 DE89111841T DE68907659T DE68907659T2 DE 68907659 T2 DE68907659 T2 DE 68907659T2 DE 89111841 T DE89111841 T DE 89111841T DE 68907659 T DE68907659 T DE 68907659T DE 68907659 T2 DE68907659 T2 DE 68907659T2
Authority
DE
Germany
Prior art keywords
component
weight
catalyst
parts
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE89111841T
Other languages
German (de)
English (en)
Other versions
DE68907659D1 (de
Inventor
Toshio Saruyama
Atsushi Togashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Application granted granted Critical
Publication of DE68907659D1 publication Critical patent/DE68907659D1/de
Publication of DE68907659T2 publication Critical patent/DE68907659T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE89111841T 1988-06-30 1989-06-29 Warmhärtende Organosiloxanzusammensetzung. Expired - Lifetime DE68907659T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63163877A JPH0214244A (ja) 1988-06-30 1988-06-30 加熱硬化性オルガノポリシロキサン組成物

Publications (2)

Publication Number Publication Date
DE68907659D1 DE68907659D1 (de) 1993-08-26
DE68907659T2 true DE68907659T2 (de) 1993-12-02

Family

ID=15782483

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89111841T Expired - Lifetime DE68907659T2 (de) 1988-06-30 1989-06-29 Warmhärtende Organosiloxanzusammensetzung.

Country Status (6)

Country Link
US (1) US5017654A (OSRAM)
EP (1) EP0352493B1 (OSRAM)
JP (1) JPH0214244A (OSRAM)
AU (1) AU621904B2 (OSRAM)
CA (1) CA1339328C (OSRAM)
DE (1) DE68907659T2 (OSRAM)

Families Citing this family (289)

* Cited by examiner, † Cited by third party
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JP2665941B2 (ja) * 1988-06-29 1997-10-22 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用白金系触媒含有粒状物
US5015691A (en) * 1989-05-22 1991-05-14 General Electric Company One part heat curable organopolysiloxane compositions
JP3088011B2 (ja) * 1990-01-30 2000-09-18 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性オルガノポリシロキサン組成物
JPH03250052A (ja) * 1990-01-31 1991-11-07 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US5142035A (en) * 1990-02-26 1992-08-25 General Electric Company Encapsulated palladium complexes and one part heat curable organopolysiloxane compositions
US5089582A (en) * 1990-02-26 1992-02-18 General Electric Company Encapsulated palladium complexes and one part heat curable organopolysiloxane compositions
JP3119481B2 (ja) * 1990-03-26 2000-12-18 東レ・ダウコーニング・シリコーン株式会社 １液型加熱硬化性オルガノポリシロキサン組成物
JP2608484B2 (ja) * 1990-05-24 1997-05-07 東レ・ダウコーニング・シリコーン株式会社 ヒドロシリル化反応用触媒含有熱可塑性樹脂微粒子の製造方法
JP3178827B2 (ja) * 1990-05-31 2001-06-25 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性オルガノポリシロキサン組成物
JPH0436355A (ja) * 1990-05-31 1992-02-06 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
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JP3040143B2 (ja) * 1990-08-08 2000-05-08 鐘淵化学工業株式会社 貯蔵安定性の優れた硬化性組成物
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US5231158A (en) * 1990-10-01 1993-07-27 General Electric Company One part heat curable organopolysiloxane compositions and method
JP2948942B2 (ja) * 1990-10-30 1999-09-13 東レ・ダウコーニング・シリコーン株式会社 シリコーンゴムスポンジ形成性組成物
JPH055062A (ja) * 1990-11-30 1993-01-14 Toray Dow Corning Silicone Co Ltd 電線被覆用シリコーンゴム組成物
JP2511342B2 (ja) * 1991-04-22 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 複合成形用液状シリコ―ンゴム組成物
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JP3607441B2 (ja) * 1996-11-28 2005-01-05 東レ・ダウコーニング・シリコーン株式会社 剥離性硬化皮膜形成性オルガノポリシロキサン組成物
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EP0352493A1 (en) 1990-01-31
CA1339328C (en) 1997-08-19
AU3717189A (en) 1990-01-04
JPH0558458B2 (OSRAM) 1993-08-26
AU621904B2 (en) 1992-03-26
EP0352493B1 (en) 1993-07-21
US5017654A (en) 1991-05-21
DE68907659D1 (de) 1993-08-26
JPH0214244A (ja) 1990-01-18

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