AU4160096A - Probe card assembly and kit, and methods of using same - Google Patents

Probe card assembly and kit, and methods of using same

Info

Publication number
AU4160096A
AU4160096A AU41600/96A AU4160096A AU4160096A AU 4160096 A AU4160096 A AU 4160096A AU 41600/96 A AU41600/96 A AU 41600/96A AU 4160096 A AU4160096 A AU 4160096A AU 4160096 A AU4160096 A AU 4160096A
Authority
AU
Australia
Prior art keywords
kit
methods
same
probe card
card assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU41600/96A
Other languages
English (en)
Inventor
Benjamin N Eldridge
Gary W Grube
Igor Y. Khandros
Gaetan L Mathieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32686436&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU4160096(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/340,144 external-priority patent/US5917707A/en
Priority claimed from US08/452,255 external-priority patent/US6336269B1/en
Priority claimed from US08/457,479 external-priority patent/US6049976A/en
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Priority claimed from US08/554,902 external-priority patent/US5974662A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU4160096A publication Critical patent/AU4160096A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
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    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01R13/02—Contact members
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    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
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    • G01R1/06—Measuring leads; Measuring probes
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Fuses (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Wire Bonding (AREA)
AU41600/96A 1994-11-15 1995-11-13 Probe card assembly and kit, and methods of using same Abandoned AU4160096A (en)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US08/340,144 US5917707A (en) 1993-11-16 1994-11-15 Flexible contact structure with an electrically conductive shell
US340144 1994-11-15
PCT/US1994/013373 WO1995014314A1 (en) 1993-11-16 1994-11-16 Contact structure for interconnections, interposer, semiconductor assembly and method
WOUS9413373 1994-11-16
US452255 1995-05-26
US08/452,255 US6336269B1 (en) 1993-11-16 1995-05-26 Method of fabricating an interconnection element
US457479 1995-06-01
US08/457,479 US6049976A (en) 1993-11-16 1995-06-01 Method of mounting free-standing resilient electrical contact structures to electronic components
US52624695A 1995-09-21 1995-09-21
US526246 1995-09-21
US08/533,584 US5772451A (en) 1993-11-16 1995-10-18 Sockets for electronic components and methods of connecting to electronic components
US533584 1995-10-18
US08/554,902 US5974662A (en) 1993-11-16 1995-11-09 Method of planarizing tips of probe elements of a probe card assembly
US554902 1995-11-09
PCT/US1995/014844 WO1996015458A1 (en) 1994-11-15 1995-11-13 Probe card assembly and kit, and methods of using same

Publications (1)

Publication Number Publication Date
AU4160096A true AU4160096A (en) 1996-06-06

Family

ID=32686436

Family Applications (4)

Application Number Title Priority Date Filing Date
AU41599/96A Abandoned AU4159996A (en) 1994-11-15 1995-11-13 Interconnection elements for microelectronic components
AU42839/96A Abandoned AU4283996A (en) 1994-11-15 1995-11-13 Electrical contact structures from flexible wire
AU41598/96A Abandoned AU4159896A (en) 1994-11-15 1995-11-13 Mounting electronic components to a circuit board
AU41600/96A Abandoned AU4160096A (en) 1994-11-15 1995-11-13 Probe card assembly and kit, and methods of using same

Family Applications Before (3)

Application Number Title Priority Date Filing Date
AU41599/96A Abandoned AU4159996A (en) 1994-11-15 1995-11-13 Interconnection elements for microelectronic components
AU42839/96A Abandoned AU4283996A (en) 1994-11-15 1995-11-13 Electrical contact structures from flexible wire
AU41598/96A Abandoned AU4159896A (en) 1994-11-15 1995-11-13 Mounting electronic components to a circuit board

Country Status (7)

Country Link
EP (4) EP1198001A3 (ja)
JP (14) JP2892505B2 (ja)
KR (7) KR100394205B1 (ja)
CN (2) CN1251319C (ja)
AU (4) AU4159996A (ja)
DE (4) DE69533336T2 (ja)
WO (4) WO1996017378A1 (ja)

Families Citing this family (206)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043563A (en) * 1997-05-06 2000-03-28 Formfactor, Inc. Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US7368924B2 (en) 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6741085B1 (en) 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6685817B1 (en) 1995-05-26 2004-02-03 Formfactor, Inc. Method and apparatus for controlling plating over a face of a substrate
EP1610375A3 (en) * 1995-05-26 2008-11-05 FormFactor, Inc. Contact carriers for populating substrates with spring contacts
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
EP0839322B1 (en) 1996-05-17 2005-08-10 Formfactor, Inc. Microelectronic contact structure and method of making same
JP2940475B2 (ja) * 1996-06-24 1999-08-25 日本電気株式会社 Ｉｃのパッケージ、ｉｃのプローバ及びそれらの製造方法
WO1998001906A1 (en) * 1996-07-05 1998-01-15 Formfactor, Inc. Floating lateral support for ends of elongate interconnection elements
US7282945B1 (en) 1996-09-13 2007-10-16 International Business Machines Corporation Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
JP2000502810A (ja) 1996-09-13 2000-03-07 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 支持面から突出した複数の個別絶縁プローブ・チップを有するプローブ構造、それを使用するための装置および製造方法
WO1998011446A1 (en) 1996-09-13 1998-03-19 International Business Machines Corporation Integrated compliant probe for wafer level test and burn-in
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US5921786A (en) * 1997-04-03 1999-07-13 Kinetrix, Inc. Flexible shielded laminated beam for electrical contacts and the like and method of contact operation
WO1999000844A2 (en) * 1997-06-30 1999-01-07 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
KR20010024022A (ko) * 1997-09-17 2001-03-26 이고르 와이. 칸드로스 금속 침전물의 적절한 열처리에 의해 개선된 재료 특성을갖는 구조물을 제조하기 위한 방법
US6724203B1 (en) 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
US5973394A (en) * 1998-01-23 1999-10-26 Kinetrix, Inc. Small contactor for test probes, chip packaging and the like
US6497581B2 (en) 1998-01-23 2002-12-24 Teradyne, Inc. Robust, small scale electrical contactor
US6078500A (en) * 1998-05-12 2000-06-20 International Business Machines Inc. Pluggable chip scale package
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
JP4490978B2 (ja) * 1998-08-12 2010-06-30 東京エレクトロン株式会社 コンタクタ
US6208225B1 (en) 1999-02-25 2001-03-27 Formfactor, Inc. Filter structures for integrated circuit interfaces
US6459343B1 (en) 1999-02-25 2002-10-01 Formfactor, Inc. Integrated circuit interconnect system forming a multi-pole filter
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
US6448865B1 (en) 1999-02-25 2002-09-10 Formfactor, Inc. Integrated circuit interconnect system
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
EP1183604A2 (en) * 1999-05-27 2002-03-06 Nanonexus, Inc. Test interface for electronic circuirts
AU5156300A (en) * 1999-05-27 2000-12-18 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US6888362B2 (en) 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6939474B2 (en) 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6780001B2 (en) 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6398558B1 (en) * 1999-08-04 2002-06-04 Fci Americas Technology, Inc. Electrical connector and contact therefor
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
WO2001018553A1 (fr) * 1999-09-09 2001-03-15 Nhk Spring Co., Ltd. Contact conducteur
US6657455B2 (en) * 2000-01-18 2003-12-02 Formfactor, Inc. Predictive, adaptive power supply for an integrated circuit under test
US6509751B1 (en) 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
EP1266230B1 (en) * 2000-03-17 2010-05-05 FormFactor, Inc. Method and apparatus for planarizing a semiconductor substrate in a probe card assembly
JP4088015B2 (ja) 2000-03-24 2008-05-21 株式会社新川 湾曲状ワイヤの形成方法
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP2002267687A (ja) * 2001-03-12 2002-09-18 Advantest Corp プローブカード及び試験装置
JP2002343478A (ja) * 2001-05-16 2002-11-29 Tyco Electronics Amp Kk 電気コンタクトおよびそれを用いた電気接続部材
US6747469B2 (en) 2001-11-08 2004-06-08 Koninklijke Philips Electronics N.V. Preconditioning integrated circuit for integrated circuit testing
US6817052B2 (en) 2001-11-09 2004-11-16 Formfactor, Inc. Apparatuses and methods for cleaning test probes
US20030115517A1 (en) * 2001-12-18 2003-06-19 Rutten Ivo Wilhelmus Johaooes Marie Microprocessor-based probe for integrated circuit testing
US7064953B2 (en) 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
WO2003058264A1 (en) * 2001-12-27 2003-07-17 Formfactor, Inc. Cooling assembly with direct cooling of active electronic components
US6840374B2 (en) 2002-01-18 2005-01-11 Igor Y. Khandros Apparatus and method for cleaning test probes
DE10220194A1 (de) * 2002-05-06 2003-11-27 Infineon Technologies Ag Kontaktierung von Nanoröhren
US20030211139A1 (en) * 2002-05-07 2003-11-13 Thierry Legon Dispersions of lipid particles for use as therapeutic and cosmetic agents and intracellular delivery vehicles
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
DE60304390T2 (de) 2002-05-15 2007-02-01 Tyco Electronics Amp Gmbh Elektronikmodul
EP1367643B1 (en) * 2002-05-15 2006-04-05 Tyco Electronics AMP GmbH Electronic module
US7122760B2 (en) * 2002-11-25 2006-10-17 Formfactor, Inc. Using electric discharge machining to manufacture probes
US6920689B2 (en) 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits
JP4003230B2 (ja) 2003-01-23 2007-11-07 船井電機株式会社 ボールグリッドアレイ型ｉｃの実装構造
JP2004259530A (ja) 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
DE10317276A1 (de) * 2003-04-11 2004-10-21 E.G.O. Elektrogerätebau GmbH Anordnung von Schalteinrichtungen
US7066751B2 (en) * 2003-04-23 2006-06-27 Asustek Computer Inc. Adjustable connector module
US6958670B2 (en) * 2003-08-01 2005-10-25 Raytheon Company Offset connector with compressible conductor
DE10345377B4 (de) * 2003-09-30 2009-07-30 Qimonda Ag Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls
JP2005127952A (ja) * 2003-10-27 2005-05-19 Sumitomo Electric Ind Ltd コンタクトプローブおよびその製造方法
DE10355921B4 (de) * 2003-11-29 2005-12-22 Festo Ag & Co. Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers
JP2005201813A (ja) 2004-01-16 2005-07-28 Shinko Electric Ind Co Ltd 半導体検査装置及びコンタクトの製造方法
TW200525675A (en) * 2004-01-20 2005-08-01 Tokyo Electron Ltd Probe guard
DE102004003275B4 (de) * 2004-01-21 2007-04-19 Infineon Technologies Ag Halbleiterbauteil mit Verbindungselementen auf Halbleiterchips und Verfahren zur Herstellung derselben
US7251884B2 (en) * 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
EP1742073A1 (en) 2004-04-27 2007-01-10 Kabushiki Kaisha Nihon Micronics Electric connecting device
CN1316508C (zh) * 2004-05-11 2007-05-16 番禺得意精密电子工业有限公司 一种电连接器
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
DE102004061853A1 (de) * 2004-12-22 2006-03-02 Infineon Technologies Ag Trägervorrichtung zum Aufnehmen von Halbleiterbauelementen und Verfahren zur Herstellung einer entsprechenden Trägervorrichtung
KR100788208B1 (ko) 2005-03-08 2007-12-26 동경 엘렉트론 주식회사 접속핀의 형성 방법, 프로브, 접속핀, 프로브 카드 및프로브의 제조 방법
DE102005013323A1 (de) * 2005-03-22 2006-10-05 Infineon Technologies Ag Kontaktierungsvorrichtung zum Kontaktieren einer integrierten Schaltung, insbesondere eines Chips oder eines Wafers, mit einer Testervorrichtung, entsprechendes Testverfahren und entsprechendes Herstellungsverfahren
US7371676B2 (en) 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
US7393770B2 (en) 2005-05-19 2008-07-01 Micron Technology, Inc. Backside method for fabricating semiconductor components with conductive interconnects
DE112005003580B4 (de) * 2005-05-23 2013-05-16 Kabushiki Kaisha Nihon Micronics Sondenanordnung, Verfahren zu ihrer Herstellung und elektrische Verbindungsvorrichtung
JP4472593B2 (ja) 2005-07-12 2010-06-02 東京エレクトロン株式会社 プローブカード
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
JP4860242B2 (ja) 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
JP4823667B2 (ja) 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
EP1959260B1 (en) * 2005-12-05 2019-05-29 NHK Spring Company Limited Probe card
US7307348B2 (en) 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
JP2007165383A (ja) 2005-12-09 2007-06-28 Ibiden Co Ltd 部品実装用ピンを形成したプリント基板
JP4654897B2 (ja) 2005-12-09 2011-03-23 イビデン株式会社 部品実装用ピンを有するプリント配線板の製造方法
JP2007165747A (ja) * 2005-12-16 2007-06-28 Unitechno Inc システムインパッケージ（ＳｉＰ）用半導体チップ接触機構
JP2007183194A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
WO2007114790A1 (en) * 2006-03-31 2007-10-11 Agency For Science, Technology And Research Method of fabricating an interconnection for electrically connecting an electrical component to a substrate
US7659612B2 (en) 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
KR101025895B1 (ko) 2006-06-08 2011-03-30 니혼 하츠쵸 가부시키가이샤 프로브 카드
KR100771476B1 (ko) * 2006-06-16 2007-10-30 가부시키가이샤 니혼 마이크로닉스 전기적 접속장치
FR2905520A1 (fr) * 2006-09-04 2008-03-07 St Microelectronics Sa Boitier semi-conducteur a composants inverses et procede de fabrication d'un tel boitier
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
JP2008145208A (ja) * 2006-12-08 2008-06-26 Hitachi High-Technologies Corp 半導体検査装置
US20100190387A1 (en) * 2007-01-31 2010-07-29 Gigaset Communications Gmbh Contact System
US7764076B2 (en) 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
US7955158B2 (en) * 2007-03-26 2011-06-07 Mattel, Inc. Toy vehicle booster and track set
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8149008B2 (en) 2007-07-19 2012-04-03 Nhk Spring Co., Ltd. Probe card electrically connectable with a semiconductor wafer
KR100950446B1 (ko) * 2007-09-11 2010-04-02 윌테크놀러지(주) Ｐｃｂ를 구비하는 스페이스 트랜스포머 및 이를 포함하는프로브 카드
KR100920790B1 (ko) 2007-10-22 2009-10-08 가부시키가이샤 니혼 마이크로닉스 프로브 조립체, 그 제조방법 및 전기적 접속장치
DE102007054709B4 (de) * 2007-11-16 2014-11-13 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung
US8378705B2 (en) 2008-02-29 2013-02-19 Nhk Spring Co., Ltd. Wiring substrate and probe card
KR100951344B1 (ko) * 2008-03-25 2010-04-08 주식회사 아이엠텍 프로브 카드, 프로브 카드용 스페이스 트랜스포머 및스페이스 트랜스포머 제조 방법
JP5511155B2 (ja) * 2008-06-25 2014-06-04 パナソニック株式会社 インターポーザ基板とその製造方法
DE102008034918B4 (de) * 2008-07-26 2012-09-27 Feinmetall Gmbh Elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings sowie elektrisches Prüfverfahren
EP2322943A4 (en) * 2008-08-08 2014-06-25 Nhk Spring Co Ltd ELECTRICAL CONTACT ELEMENT AND CONTACT PROBE
EP2159580B1 (en) * 2008-08-26 2015-10-07 Lake Shore Cryotronics, Inc. Probe tip
DE102008059314A1 (de) * 2008-11-27 2010-06-02 Conti Temic Microelectronic Gmbh Gehäuse mit einem toleranzbehafteten elektronischen Bauteil
KR101067497B1 (ko) * 2008-12-20 2011-09-27 주식회사 바른전자 반도체 패키지
US8901950B2 (en) 2009-02-19 2014-12-02 Advantest America, Inc Probe head for a microelectronic contactor assembly, and methods of making same
US8047856B2 (en) 2010-02-24 2011-11-01 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Array connector for optical transceiver module
JP5556316B2 (ja) * 2010-04-02 2014-07-23 株式会社デンソー 表面実装型電子部品及び表面実装型電子部品の実装構造
US8414309B2 (en) * 2010-05-03 2013-04-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Receptacle for an optical transceiver module for protecting the module from airborne particles
JP5564328B2 (ja) * 2010-05-19 2014-07-30 新光電気工業株式会社 ソケット
JP2011258364A (ja) 2010-06-08 2011-12-22 Shinko Electric Ind Co Ltd ソケット
JP2012004464A (ja) * 2010-06-18 2012-01-05 Toshiba Corp 半導体装置、半導体装置の製造方法及び半導体装置の製造装置
CN103038094B (zh) 2010-06-24 2015-08-05 约翰逊控制技术公司 机电推压按钮式车辆座椅致动机构
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
JP5713598B2 (ja) * 2010-07-20 2015-05-07 新光電気工業株式会社 ソケット及びその製造方法
JP5788166B2 (ja) 2010-11-02 2015-09-30 新光電気工業株式会社 接続端子構造及びその製造方法、並びにソケット
JP5582995B2 (ja) 2010-12-14 2014-09-03 新光電気工業株式会社 ソケット
KR101118836B1 (ko) 2011-02-11 2012-03-16 에프컴 코포레이션 전극패턴 검사장치
JP5798435B2 (ja) 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5777997B2 (ja) * 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
KR101649521B1 (ko) * 2011-05-13 2016-08-22 리노공업주식회사 프로브 및 그 제조방법
CN102305880A (zh) * 2011-09-08 2012-01-04 高德（无锡）电子有限公司 防止印刷电路板电镀软金电性测试扎伤转接板
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
US9229029B2 (en) * 2011-11-29 2016-01-05 Formfactor, Inc. Hybrid electrical contactor
WO2013095628A1 (en) * 2011-12-23 2013-06-27 Intel Corpporation High bandwidth connector for internal and external io interfaces
US20130269173A1 (en) * 2011-12-30 2013-10-17 Todd P. Albertson Apparatus and method for automated sort probe assembly and repair
WO2013108759A1 (ja) 2012-01-18 2013-07-25 日本発條株式会社 スペーストランスフォーマおよびプローブカード
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US8796132B2 (en) * 2012-06-29 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for forming uniform rigid interconnect structures
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
CN103682725A (zh) * 2012-09-24 2014-03-26 富士康(昆山)电脑接插件有限公司 电连接器及其导电端子
US9134343B2 (en) 2012-09-28 2015-09-15 Intel Corporation Sort probe gripper
US9106027B2 (en) 2012-12-21 2015-08-11 Avago Technologies General Ip (Singapore) Pte. Ltd. Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards
DE102013200308A1 (de) * 2013-01-11 2014-07-17 Infineon Technologies Ag Bonddraht und Verfahren zur Herstellung einer Bondverbindung
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
TWI481876B (zh) * 2013-12-13 2015-04-21 Mpi Corp Probe module (3)
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
CN105588957B (zh) * 2014-11-12 2019-03-22 致伸科技股份有限公司 测试座
JP6407672B2 (ja) * 2014-11-18 2018-10-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2018503805A (ja) * 2014-12-04 2018-02-08 テクノプローベ エス．ピー．エー． 垂直プローブを含むテストヘッド
KR102502965B1 (ko) * 2014-12-30 2023-02-23 테크노프로브 에스.피.에이. 테스트 헤드용 접촉 프로브
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
WO2016195766A1 (en) * 2015-05-29 2016-12-08 R&D Circuits, Inc. Improved power supply transient performance (power integrity) for a probe card assembly in an integrated circuit test environment
CN106449581A (zh) * 2015-08-04 2017-02-22 三垦电气株式会社 半导体装置
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
CN105682356B (zh) * 2016-03-11 2018-07-27 广东欧珀移动通信有限公司 柔性电路板组件及电子设备
CN105912788B (zh) * 2016-04-14 2019-03-12 中车长春轨道客车股份有限公司 端部接触式少片抛物线型主副簧的副簧刚度设计方法
US20170330677A1 (en) * 2016-05-11 2017-11-16 Cascade Microtech, Inc. Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers
US10263352B2 (en) * 2016-06-10 2019-04-16 Te Connectivity Corporation Electrical contact pad for electrically contacting a connector
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
CN106271010A (zh) * 2016-08-29 2017-01-04 苏州倍声声学技术有限公司 微细线储能冲击焊接工艺
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
DE102017211619A1 (de) * 2017-02-08 2018-08-09 Siemens Aktiengesellschaft Verfahren zur elektrischen Kontaktierung und Leistungsmodul
US10109490B1 (en) 2017-06-20 2018-10-23 Globalfoundries Inc. Cobalt interconnects formed by selective bottom-up fill
KR101977473B1 (ko) * 2017-07-27 2019-05-10 주식회사 기가레인 플럭스 확산이 개선된 프로브핀 및 이의 제조 방법
CN111913019A (zh) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 探针卡装置的圆形探针
CN107622978A (zh) * 2017-10-13 2018-01-23 中国电子科技集团公司第十三研究所 一种陶瓷封装外壳
CN107978578B (zh) * 2017-11-23 2020-02-21 中国科学院力学研究所 一种变线宽的柔性可拉伸导线及其制备方法
CN108188521B (zh) * 2018-01-25 2020-10-02 山东建筑大学 一种钼铼合金箔材的高频感应加热钎焊方法
CN111052510B (zh) * 2018-03-16 2021-05-25 富士电机株式会社 半导体装置
CN108666308B (zh) * 2018-06-19 2019-06-18 清华大学 柔性集成封装系统
TWI668457B (zh) * 2018-08-27 2019-08-11 創意電子股份有限公司 檢測裝置
TWI672764B (zh) * 2018-11-07 2019-09-21 國立成功大學 晶片封裝裝置及其對位壓合方法
KR102168622B1 (ko) * 2018-12-05 2020-10-21 경북대학교 산학협력단 국부 항복 전류를 이용한 선택적 열처리 방법 및 국부 항복 전류를 이용한 선택적 열처리용 프로브카드
KR102163321B1 (ko) * 2019-02-08 2020-10-21 화인인스트루먼트 (주) 프로브 카드 및 그 제조 방법
KR102139584B1 (ko) * 2019-03-07 2020-07-30 (주)티에스이 반도체 소자 테스트용 소켓 장치
JP7206140B2 (ja) * 2019-03-22 2023-01-17 株式会社ヨコオ 検査装置
EP3719466A1 (de) * 2019-04-01 2020-10-07 Heraeus Nexensos GmbH 3d-verbinderstruktur, verfahren zur herstellung einer 3d-verbinderstruktur und temperatursensor
JP7370055B2 (ja) * 2020-02-12 2023-10-27 株式会社新川 半導体装置の製造方法及びワイヤボンディング装置
KR102179457B1 (ko) 2020-03-25 2020-11-16 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
CN114930645B (zh) * 2020-03-31 2023-07-07 积水保力马科技株式会社 导电构件
KR102410156B1 (ko) * 2020-06-02 2022-06-17 (주)티에스이 반도체 패키지의 테스트 장치
KR20220003902A (ko) * 2020-07-02 2022-01-11 주식회사 케이엠더블유 솔더 기판 조립체
TWI745197B (zh) * 2020-12-18 2021-11-01 鴻勁精密股份有限公司 定位機構、作業機、測試機及測試設備
CN112757161B (zh) * 2020-12-31 2022-04-19 上海超硅半导体股份有限公司 一种抛光载具的修整方法
JP2024527711A (ja) 2021-06-30 2024-07-26 デルタ・デザイン・インコーポレイテッド 接触器アセンブリを含む温度制御システム
DE102021117095A1 (de) * 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
WO2023157900A1 (ja) * 2022-02-18 2023-08-24 ヌヴォトンテクノロジージャパン株式会社 プローブユニット、検査装置、検査システム、検査方法、及び半導体レーザ装置の製造方法

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
US3460238A (en) * 1967-04-20 1969-08-12 Motorola Inc Wire severing in wire bonding machines
US3509270A (en) * 1968-04-08 1970-04-28 Ney Co J M Interconnection for printed circuits and method of making same
US3616532A (en) * 1970-02-02 1971-11-02 Sperry Rand Corp Multilayer printed circuit electrical interconnection device
DE2119567C2 (de) * 1970-05-05 1983-07-14 International Computers Ltd., London Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung
US3844909A (en) * 1970-11-12 1974-10-29 Gen Electric Magnetic film plated wire and substrates therefor
US3753665A (en) * 1970-11-12 1973-08-21 Gen Electric Magnetic film plated wire
US3832632A (en) * 1971-11-22 1974-08-27 F Ardezzone Multi-point probe head assembly
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US3959874A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of forming an integrated circuit assembly
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
US4067104A (en) * 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
JPS5555985U (ja) * 1978-10-12 1980-04-16
JPS568081U (ja) * 1979-06-29 1981-01-23
US4418857A (en) * 1980-12-31 1983-12-06 International Business Machines Corp. High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
US4423376A (en) * 1981-03-20 1983-12-27 International Business Machines Corporation Contact probe assembly having rotatable contacting probe elements
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
US4488111A (en) * 1982-06-01 1984-12-11 At&T Technologies, Inc. Coupling devices for operations such as testing
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
GB8330391D0 (en) * 1983-11-15 1983-12-21 Gen Electric Co Plc Electrical interface arrangement
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
US4548451A (en) * 1984-04-27 1985-10-22 International Business Machines Corporation Pinless connector interposer and method for making the same
US4732313A (en) 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
JPS6149432A (ja) * 1984-08-18 1986-03-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
DE3536908A1 (de) * 1984-10-18 1986-04-24 Sanyo Electric Co., Ltd., Moriguchi, Osaka Induktivitaetselement und verfahren zur herstellung desselben
JPS61164038A (ja) * 1985-01-14 1986-07-24 Nissan Motor Co Ltd タ−ボチヤ−ジヤのサ−ジ防止装置
US4659437A (en) * 1985-01-19 1987-04-21 Tokusen Kogyo Kabushiki Kaisha Method of thermal diffusion alloy plating for steel wire on continuous basis
US4642889A (en) * 1985-04-29 1987-02-17 Amp Incorporated Compliant interconnection and method therefor
JPS61287155A (ja) * 1985-06-14 1986-12-17 Hitachi Ltd 半導体装置及び半導体装置の製造方法
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
US4793814A (en) * 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
US4764848A (en) * 1986-11-24 1988-08-16 International Business Machines Corporation Surface mounted array strain relief device
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
JP2533511B2 (ja) * 1987-01-19 1996-09-11 株式会社日立製作所 電子部品の接続構造とその製造方法
US5086337A (en) * 1987-01-19 1992-02-04 Hitachi, Ltd. Connecting structure of electronic part and electronic device using the structure
JPS63279477A (ja) * 1987-05-09 1988-11-16 Pioneer Electronic Corp ディスクプレ−ヤの情報読取装置
US4983907A (en) * 1987-05-14 1991-01-08 Intel Corporation Driven guard probe card
US5045975A (en) * 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
JPH0640106B2 (ja) * 1987-11-09 1994-05-25 株式会社日立製作所 半導体ｌｓｉ検査装置用プローブヘッド及びその製造方法
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
JPH063820B2 (ja) * 1988-07-25 1994-01-12 松下電器産業株式会社 半導体装置の実装方法
JPH01152271A (ja) * 1987-12-09 1989-06-14 Toshiba Corp スパッタ装置
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
DE3838413A1 (de) * 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JPH02226996A (ja) * 1989-02-28 1990-09-10 Seiko Instr Inc 圧電素子接着装置および圧電素子接着方法
JPH02237047A (ja) * 1989-03-09 1990-09-19 Mitsubishi Electric Corp 半導体試験装置
US4914814A (en) * 1989-05-04 1990-04-10 International Business Machines Corporation Process of fabricating a circuit package
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US5349495A (en) * 1989-06-23 1994-09-20 Vlsi Technology, Inc. System for securing and electrically connecting a semiconductor chip to a substrate
JP3038859B2 (ja) * 1989-09-29 2000-05-08 ジェイエスアール株式会社 異方導電性シート
US4998885A (en) * 1989-10-27 1991-03-12 International Business Machines Corporation Elastomeric area array interposer
JPH03142847A (ja) * 1989-10-30 1991-06-18 Hitachi Ltd 半導体集積回路装置
US5095187A (en) * 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder
US4989069A (en) * 1990-01-29 1991-01-29 Motorola, Inc. Semiconductor package having leads that break-away from supports
US5471151A (en) * 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
JP2781247B2 (ja) * 1990-02-28 1998-07-30 旭化成工業株式会社 微小突起電極付接続基板の製造方法
JPH03292406A (ja) * 1990-04-06 1991-12-24 Shiyuukou:Kk 基礎台調整用支持具
US5130779A (en) * 1990-06-19 1992-07-14 International Business Machines Corporation Solder mass having conductive encapsulating arrangement
US5187020A (en) * 1990-07-31 1993-02-16 Texas Instruments Incorporated Compliant contact pad
GB2247565B (en) * 1990-08-22 1994-07-06 Gen Electric Co Plc A method of testing a semiconductor device
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits
JPH04240570A (ja) * 1991-01-24 1992-08-27 Shimadzu Corp マイクロ・プローブ・ボード
JPH04273458A (ja) * 1991-02-28 1992-09-29 Ando Electric Co Ltd 測定ヘッドとプローブカードの水平出し機構
JPH04297050A (ja) * 1991-03-12 1992-10-21 Mitsubishi Electric Corp 半導体検査装置およびその平板状基板の製造方法
JP3092191B2 (ja) * 1991-03-27 2000-09-25 ジェイエスアール株式会社 回路基板検査装置
JP3135135B2 (ja) * 1991-04-18 2001-02-13 三菱電機株式会社 半導体装置，その製造方法，その試験方法及びその試験装置
US5076794A (en) * 1991-04-29 1991-12-31 Compaq Computer Corporation Space-saving mounting interconnection between electrical components and a printed circuit board
JPH0529406A (ja) * 1991-07-18 1993-02-05 Mitsubishi Electric Corp 半導体検査装置
US5345038A (en) * 1991-07-29 1994-09-06 Kyocera America, Inc. Multi-layer ceramic packages
AU661867B2 (en) * 1991-09-30 1995-08-10 General Dynamics Information Systems, Inc. Plated compliant lead
US5309324A (en) * 1991-11-26 1994-05-03 Herandez Jorge M Device for interconnecting integrated circuit packages to circuit boards
US5225777A (en) * 1992-02-04 1993-07-06 International Business Machines Corporation High density probe
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5299939A (en) * 1992-03-05 1994-04-05 International Business Machines Corporation Spring array connector
US5483421A (en) * 1992-03-09 1996-01-09 International Business Machines Corporation IC chip attachment
JPH05283494A (ja) * 1992-04-03 1993-10-29 Katsuyoshi Nakano 集積回路素子ウエハー用測定電極
US5210939A (en) * 1992-04-17 1993-05-18 Intel Corporation Lead grid array integrated circuit
US5237743A (en) * 1992-06-19 1993-08-24 International Business Machines Corporation Method of forming a conductive end portion on a flexible circuit member
US5248262A (en) * 1992-06-19 1993-09-28 International Business Machines Corporation High density connector
JPH0650990A (ja) * 1992-07-30 1994-02-25 Nec Corp プローブカード
DE4232745C2 (de) * 1992-09-30 2002-07-18 Univ Dresden Tech Bonddraht zum Ultraschallbonden
US5334804A (en) * 1992-11-17 1994-08-02 Fujitsu Limited Wire interconnect structures for connecting an integrated circuit to a substrate
JPH06213928A (ja) * 1993-01-18 1994-08-05 Tokyo Electron Ltd プローブヘッドの製造方法
US5386344A (en) * 1993-01-26 1995-01-31 International Business Machines Corporation Flex circuit card elastomeric cable connector assembly
CA2110472C (en) * 1993-03-01 1999-08-10 Anilkumar Chinuprasad Bhatt Method and apparatus for in-situ testing of integrated circuit chips
JPH06265577A (ja) * 1993-03-12 1994-09-22 Mitsubishi Electric Corp 半導体試験用電気的接続治具
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact
JPH06294818A (ja) * 1993-04-08 1994-10-21 Seiko Epson Corp パフォーマンスボード

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AU4159996A (en) 1996-06-17
DE69535629T2 (de) 2008-07-31
CN1495870A (zh) 2004-05-12
JP2003179110A (ja) 2003-06-27
KR100399210B1 (ko) 2003-09-26
WO1996015551A1 (en) 1996-05-23
JP2000067953A (ja) 2000-03-03
DE69530103D1 (de) 2003-04-30
JP3114999B2 (ja) 2000-12-04
JP3157134B2 (ja) 2001-04-16
JPH10506197A (ja) 1998-06-16
JP2001077250A (ja) 2001-03-23
JP2011069829A (ja) 2011-04-07
KR100408948B1 (ko) 2004-04-03
KR20060087616A (ko) 2006-08-02
DE69533336D1 (de) 2004-09-09
JPH11126800A (ja) 1999-05-11
DE69531996D1 (de) 2003-11-27
JP2002509639A (ja) 2002-03-26
JP2003177144A (ja) 2003-06-27
CN1251319C (zh) 2006-04-12
JP4540577B2 (ja) 2010-09-08
JP2007329491A (ja) 2007-12-20
JP2892505B2 (ja) 1999-05-17
JPH09508241A (ja) 1997-08-19
WO1996016440A1 (en) 1996-05-30
KR100394205B1 (ko) 2003-08-06
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