GB2247565B - A method of testing a semiconductor device - Google Patents

A method of testing a semiconductor device

Info

Publication number
GB2247565B
GB2247565B GB9018448A GB9018448A GB2247565B GB 2247565 B GB2247565 B GB 2247565B GB 9018448 A GB9018448 A GB 9018448A GB 9018448 A GB9018448 A GB 9018448A GB 2247565 B GB2247565 B GB 2247565B
Authority
GB
United Kingdom
Prior art keywords
testing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9018448A
Other versions
GB9018448D0 (en
GB2247565A (en
Inventor
David John Pedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
BAE Systems Electronics Ltd
Original Assignee
GEC Marconi Ltd
General Electric Co PLC
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Marconi Ltd, General Electric Co PLC, Marconi Co Ltd filed Critical GEC Marconi Ltd
Priority to GB9018448A priority Critical patent/GB2247565B/en
Publication of GB9018448D0 publication Critical patent/GB9018448D0/en
Publication of GB2247565A publication Critical patent/GB2247565A/en
Application granted granted Critical
Publication of GB2247565B publication Critical patent/GB2247565B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB9018448A 1990-08-22 1990-08-22 A method of testing a semiconductor device Expired - Fee Related GB2247565B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9018448A GB2247565B (en) 1990-08-22 1990-08-22 A method of testing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9018448A GB2247565B (en) 1990-08-22 1990-08-22 A method of testing a semiconductor device

Publications (3)

Publication Number Publication Date
GB9018448D0 GB9018448D0 (en) 1990-10-03
GB2247565A GB2247565A (en) 1992-03-04
GB2247565B true GB2247565B (en) 1994-07-06

Family

ID=10681072

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9018448A Expired - Fee Related GB2247565B (en) 1990-08-22 1990-08-22 A method of testing a semiconductor device

Country Status (1)

Country Link
GB (1) GB2247565B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
CA2110472C (en) * 1993-03-01 1999-08-10 Anilkumar Chinuprasad Bhatt Method and apparatus for in-situ testing of integrated circuit chips
EP0662709B1 (en) * 1994-01-11 1998-03-25 Siemens Aktiengesellschaft Method of testing semiconductor circuit layers
DE4400551C2 (en) * 1994-01-11 1997-04-10 Siemens Ag Device for reversible chip contacting and method for testing semiconductor circuit levels
DE4418679A1 (en) * 1994-05-28 1995-11-30 Telefunken Microelectron Integrated circuit interconnect system for wafer test
US5447264A (en) * 1994-07-01 1995-09-05 Mcnc Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon
AU4283996A (en) * 1994-11-15 1996-06-19 Formfactor, Inc. Electrical contact structures from flexible wire
TW308724B (en) * 1995-07-03 1997-06-21 Motorola Inc

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351581A1 (en) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG High-density integrated circuit and method for its production

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351581A1 (en) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG High-density integrated circuit and method for its production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Also Published As

Publication number Publication date
GB9018448D0 (en) 1990-10-03
GB2247565A (en) 1992-03-04

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee