GB8330391D0 - Electrical interface arrangement - Google Patents
Electrical interface arrangementInfo
- Publication number
- GB8330391D0 GB8330391D0 GB838330391A GB8330391A GB8330391D0 GB 8330391 D0 GB8330391 D0 GB 8330391D0 GB 838330391 A GB838330391 A GB 838330391A GB 8330391 A GB8330391 A GB 8330391A GB 8330391 D0 GB8330391 D0 GB 8330391D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrical interface
- interface arrangement
- arrangement
- electrical
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB838330391A GB8330391D0 (en) | 1983-11-15 | 1983-11-15 | Electrical interface arrangement |
GB08426926A GB2149980B (en) | 1983-11-15 | 1984-10-24 | Packaging intergrated circuits for connection to hybrid circuits |
AT84307904T ATE36212T1 (en) | 1983-11-15 | 1984-11-14 | ARRANGEMENT OF AN ELECTRICAL INTERFACE. |
DE8484307904T DE3473205D1 (en) | 1983-11-15 | 1984-11-14 | Electrical interface arrangement |
EP84307904A EP0145327B1 (en) | 1983-11-15 | 1984-11-14 | Electrical interface arrangement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB838330391A GB8330391D0 (en) | 1983-11-15 | 1983-11-15 | Electrical interface arrangement |
Publications (1)
Publication Number | Publication Date |
---|---|
GB8330391D0 true GB8330391D0 (en) | 1983-12-21 |
Family
ID=10551745
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB838330391A Pending GB8330391D0 (en) | 1983-11-15 | 1983-11-15 | Electrical interface arrangement |
GB08426926A Expired GB2149980B (en) | 1983-11-15 | 1984-10-24 | Packaging intergrated circuits for connection to hybrid circuits |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08426926A Expired GB2149980B (en) | 1983-11-15 | 1984-10-24 | Packaging intergrated circuits for connection to hybrid circuits |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB8330391D0 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
GB2203270B (en) * | 1987-03-05 | 1991-09-11 | Seiko Epson Corp | Timepiece assembly. |
US5416752A (en) * | 1987-07-21 | 1995-05-16 | Seiko Epson Corporation | Timepiece |
US5369627A (en) * | 1987-07-21 | 1994-11-29 | Seiko Epson Corporation | Improvements in bearing and frame structure of a timepiece |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
JPH07105174B2 (en) * | 1990-08-30 | 1995-11-13 | 信越ポリマー株式会社 | Method for manufacturing anisotropic conductive film |
JP3173171B2 (en) * | 1991-12-19 | 2001-06-04 | カシオ計算機株式会社 | Information transfer system |
DE4417586A1 (en) * | 1993-08-03 | 1995-02-09 | Hewlett Packard Co | Family of removable hybrid assemblies of various sizes with microwave bandwidth connectors |
WO1996015551A1 (en) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Mounting electronic components to a circuit board |
US20100065963A1 (en) | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
WO1997022145A1 (en) * | 1995-12-14 | 1997-06-19 | Philips Electronics N.V. | Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3648002A (en) * | 1970-05-04 | 1972-03-07 | Essex International Inc | Current control apparatus and methods of manufacture |
DE2119567C2 (en) * | 1970-05-05 | 1983-07-14 | International Computers Ltd., London | Electrical connection device and method for making the same |
GB1587416A (en) * | 1977-09-01 | 1981-04-01 | Toray Industries | Anisotropically electroconductive sheets |
JPS5555985U (en) * | 1978-10-12 | 1980-04-16 | ||
GB2114821B (en) * | 1982-01-19 | 1985-10-23 | Plessey Co Plc | Semiconductor chip package carrier |
-
1983
- 1983-11-15 GB GB838330391A patent/GB8330391D0/en active Pending
-
1984
- 1984-10-24 GB GB08426926A patent/GB2149980B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB8426926D0 (en) | 1984-11-28 |
GB2149980A (en) | 1985-06-19 |
GB2149980B (en) | 1987-08-19 |
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