GB8426926D0 - Electrical interface arrangement - Google Patents

Electrical interface arrangement

Info

Publication number
GB8426926D0
GB8426926D0 GB848426926A GB8426926A GB8426926D0 GB 8426926 D0 GB8426926 D0 GB 8426926D0 GB 848426926 A GB848426926 A GB 848426926A GB 8426926 A GB8426926 A GB 8426926A GB 8426926 D0 GB8426926 D0 GB 8426926D0
Authority
GB
United Kingdom
Prior art keywords
electrical interface
interface arrangement
arrangement
electrical
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB848426926A
Other versions
GB2149980B (en
GB2149980A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to EP84307904A priority Critical patent/EP0145327B1/en
Priority to AT84307904T priority patent/ATE36212T1/en
Priority to DE8484307904T priority patent/DE3473205D1/en
Publication of GB8426926D0 publication Critical patent/GB8426926D0/en
Publication of GB2149980A publication Critical patent/GB2149980A/en
Application granted granted Critical
Publication of GB2149980B publication Critical patent/GB2149980B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
GB08426926A 1983-11-15 1984-10-24 Packaging intergrated circuits for connection to hybrid circuits Expired GB2149980B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP84307904A EP0145327B1 (en) 1983-11-15 1984-11-14 Electrical interface arrangement
AT84307904T ATE36212T1 (en) 1983-11-15 1984-11-14 ARRANGEMENT OF AN ELECTRICAL INTERFACE.
DE8484307904T DE3473205D1 (en) 1983-11-15 1984-11-14 Electrical interface arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838330391A GB8330391D0 (en) 1983-11-15 1983-11-15 Electrical interface arrangement

Publications (3)

Publication Number Publication Date
GB8426926D0 true GB8426926D0 (en) 1984-11-28
GB2149980A GB2149980A (en) 1985-06-19
GB2149980B GB2149980B (en) 1987-08-19

Family

ID=10551745

Family Applications (2)

Application Number Title Priority Date Filing Date
GB838330391A Pending GB8330391D0 (en) 1983-11-15 1983-11-15 Electrical interface arrangement
GB08426926A Expired GB2149980B (en) 1983-11-15 1984-10-24 Packaging intergrated circuits for connection to hybrid circuits

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB838330391A Pending GB8330391D0 (en) 1983-11-15 1983-11-15 Electrical interface arrangement

Country Status (1)

Country Link
GB (2) GB8330391D0 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
GB2203270B (en) * 1987-03-05 1991-09-11 Seiko Epson Corp Timepiece assembly.
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
US5369627A (en) * 1987-07-21 1994-11-29 Seiko Epson Corporation Improvements in bearing and frame structure of a timepiece
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
JPH07105174B2 (en) * 1990-08-30 1995-11-13 信越ポリマー株式会社 Method for manufacturing anisotropic conductive film
JP3173171B2 (en) * 1991-12-19 2001-06-04 カシオ計算機株式会社 Information transfer system
DE4417586A1 (en) * 1993-08-03 1995-02-09 Hewlett Packard Co Family of removable hybrid assemblies of various sizes with microwave bandwidth connectors
AU4160096A (en) * 1994-11-15 1996-06-06 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
JP2988589B2 (en) * 1995-12-14 1999-12-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Semiconductor device for surface mounting suitable for relatively high voltage and method of manufacturing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648002A (en) * 1970-05-04 1972-03-07 Essex International Inc Current control apparatus and methods of manufacture
DE2119567C2 (en) * 1970-05-05 1983-07-14 International Computers Ltd., London Electrical connection device and method for making the same
GB1587416A (en) * 1977-09-01 1981-04-01 Toray Industries Anisotropically electroconductive sheets
JPS5555985U (en) * 1978-10-12 1980-04-16
GB2114821B (en) * 1982-01-19 1985-10-23 Plessey Co Plc Semiconductor chip package carrier

Also Published As

Publication number Publication date
GB8330391D0 (en) 1983-12-21
GB2149980B (en) 1987-08-19
GB2149980A (en) 1985-06-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee