TW200934342A - Multilayer wiring board and its manufacturing method - Google Patents

Multilayer wiring board and its manufacturing method

Info

Publication number
TW200934342A
TW200934342A TW097110419A TW97110419A TW200934342A TW 200934342 A TW200934342 A TW 200934342A TW 097110419 A TW097110419 A TW 097110419A TW 97110419 A TW97110419 A TW 97110419A TW 200934342 A TW200934342 A TW 200934342A
Authority
TW
Taiwan
Prior art keywords
layer
electromagnetic shielding
concave portion
wiring board
multilayer wiring
Prior art date
Application number
TW097110419A
Other languages
English (en)
Chinese (zh)
Other versions
TWI345940B (cg-RX-API-DMAC7.html
Inventor
Sotaro Ito
Michimasa Takahashi
Yukinobu Mikado
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200934342A publication Critical patent/TW200934342A/zh
Application granted granted Critical
Publication of TWI345940B publication Critical patent/TWI345940B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
TW097110419A 2008-01-25 2008-03-24 Multilayer wiring board and its manufacturing method TW200934342A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2352308P 2008-01-25 2008-01-25

Publications (2)

Publication Number Publication Date
TW200934342A true TW200934342A (en) 2009-08-01
TWI345940B TWI345940B (cg-RX-API-DMAC7.html) 2011-07-21

Family

ID=40898066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110419A TW200934342A (en) 2008-01-25 2008-03-24 Multilayer wiring board and its manufacturing method

Country Status (6)

Country Link
US (1) US8168893B2 (cg-RX-API-DMAC7.html)
EP (1) EP2136610A4 (cg-RX-API-DMAC7.html)
JP (1) JP4876173B2 (cg-RX-API-DMAC7.html)
CN (1) CN101653053B (cg-RX-API-DMAC7.html)
TW (1) TW200934342A (cg-RX-API-DMAC7.html)
WO (1) WO2009093343A1 (cg-RX-API-DMAC7.html)

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CN102577646A (zh) * 2009-09-30 2012-07-11 株式会社村田制作所 电路基板及其制造方法
CN103779333A (zh) * 2012-10-17 2014-05-07 钰桥半导体股份有限公司 具有内嵌元件、及电磁屏障的线路板
CN103779333B (zh) * 2012-10-17 2016-11-30 钰桥半导体股份有限公司 具有内嵌元件及电磁屏障的线路板
TWI621378B (zh) * 2015-07-29 2018-04-11 乾坤科技股份有限公司 具有電磁屏蔽結構的電子模組及其製造方法
TWI684259B (zh) * 2018-09-07 2020-02-01 南韓商三星電機股份有限公司 具有嵌入式內連線結構之基板

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US8877074B2 (en) * 2006-12-15 2014-11-04 The Regents Of The University Of California Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards
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US8168893B2 (en) 2012-05-01
EP2136610A4 (en) 2011-07-13
CN101653053A (zh) 2010-02-17
EP2136610A1 (en) 2009-12-23
JP4876173B2 (ja) 2012-02-15
CN101653053B (zh) 2012-04-04
US20090188703A1 (en) 2009-07-30

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