JP2016066699A - 複合配線基板およびその実装構造体 - Google Patents
複合配線基板およびその実装構造体 Download PDFInfo
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- JP2016066699A JP2016066699A JP2014194613A JP2014194613A JP2016066699A JP 2016066699 A JP2016066699 A JP 2016066699A JP 2014194613 A JP2014194613 A JP 2014194613A JP 2014194613 A JP2014194613 A JP 2014194613A JP 2016066699 A JP2016066699 A JP 2016066699A
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- wiring board
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract
Description
第1の配線基板10は、絶縁板11と、配線導体12と、ソルダーレジスト層13とを具備している。絶縁板11は、例えばガラスクロス入りの熱硬化性樹脂板から成る。絶縁板11の上面から下面にかけては、複数のスルーホール14が形成されている。
図1に示すように、第2の配線基板20は、絶縁板21と、絶縁層22と、配線導体23と、ソルダーレジスト層24とを備えている。絶縁板21は、ガラスクロス入りの熱硬化性樹脂板から成る。絶縁板21の上面から下面にかけては、複数のスルーホール25が形成されている。絶縁板21の上下面およびスルーホール25内には配線導体23が被着されている。配線導体23は、銅から成る。
10a・・開口部
12a・・第1の接続パッド
12b・・第2の接続パッド
15・・・内壁導体層
16・・・外壁導体層
20・・・第2の配線基板
23a・・第3の接続パッド
27・・・グランド用の導体層
34・・・半田
35・・・半田
41・・・接続パッド
42・・・グランド導体層
Claims (2)
- 中央部に電子部品を収容するための開口部を有するとともに、上面に複数の第1の接続パッドおよび下面に複数の第2の接続パッドを有する枠状の第1の配線基板と、下面の中央部に前記電子部品を搭載するとともに、下面の外周部に前記第1の接続パッドに半田を介して接合された第3の接続パッドを有し、前記第1の配線基板上に前記開口部を覆うようにして配置された平板状の第2の配線基板と、を具備して成る複合配線基板であって、前記開口部の内壁の上面から下面にかけてグランド用の内壁導体層が前記電子部品を囲繞するようにして被着されているとともに前記第2の配線基板の下面に前記内壁導体層に半田を介して接続されたグランド用の導体層を有することを特徴とする複合配線基板。
- 前記電子部品が搭載された請求項1の複合配線基板を、上面に前記第2の接続パッドに半田を介して接合された接続パッドおよび前記内壁導体層に半田を介して接合されたグランド導体層を有する第3の配線基板上に実装してなることを特徴とする実装構造体。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014194613A JP2016066699A (ja) | 2014-09-25 | 2014-09-25 | 複合配線基板およびその実装構造体 |
TW104130065A TW201618611A (zh) | 2014-09-25 | 2015-09-11 | 複合佈線基板及其安裝構造體 |
US14/858,242 US20160095218A1 (en) | 2014-09-25 | 2015-09-18 | Composite wiring board and mounting structure of the same |
CN201510608868.4A CN105472863A (zh) | 2014-09-25 | 2015-09-22 | 复合布线基板及其安装构造体 |
KR1020150136584A KR20160036514A (ko) | 2014-09-25 | 2015-09-25 | 복합 배선 기판 및 그 실장 구조체 |
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JP2014194613A JP2016066699A (ja) | 2014-09-25 | 2014-09-25 | 複合配線基板およびその実装構造体 |
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JP2016066699A true JP2016066699A (ja) | 2016-04-28 |
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JP2014194613A Pending JP2016066699A (ja) | 2014-09-25 | 2014-09-25 | 複合配線基板およびその実装構造体 |
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US (1) | US20160095218A1 (ja) |
JP (1) | JP2016066699A (ja) |
KR (1) | KR20160036514A (ja) |
CN (1) | CN105472863A (ja) |
TW (1) | TW201618611A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018116781A1 (ja) * | 2016-12-20 | 2018-06-28 | 京セラ株式会社 | アンテナモジュール |
WO2018116867A1 (ja) * | 2016-12-22 | 2018-06-28 | 京セラ株式会社 | アンテナ基板 |
WO2018116886A1 (ja) * | 2016-12-22 | 2018-06-28 | 京セラ株式会社 | アンテナ基板およびその製造方法 |
JP2019161480A (ja) * | 2018-03-14 | 2019-09-19 | 株式会社東芝 | アンテナモジュール |
US11785718B2 (en) | 2019-04-02 | 2023-10-10 | Mitsubishi Electric Corporation | Composite printed wiring board and method of manufacturing the same |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108028232B (zh) * | 2015-10-27 | 2021-09-24 | 京瓷株式会社 | 布线基板、电子装置以及电子模块 |
US20180020547A1 (en) * | 2016-07-13 | 2018-01-18 | Alcatel-Lucent Canada Inc. | Underlying recessed component placement |
KR102692443B1 (ko) * | 2016-10-28 | 2024-08-07 | 삼성전자주식회사 | 생체 센서를 포함하는 전자 장치 |
US11017934B2 (en) * | 2016-12-09 | 2021-05-25 | Cyntec Co., Ltd. | Electronic module |
US20180374798A1 (en) | 2017-06-24 | 2018-12-27 | Amkor Technology, Inc. | Semiconductor device having emi shielding structure and related methods |
JP7001445B2 (ja) * | 2017-11-30 | 2022-01-19 | ローム株式会社 | 半導体装置およびその製造方法 |
JP7001175B2 (ja) * | 2018-09-19 | 2022-01-19 | 富士通株式会社 | 電子装置、電子機器、及び電子装置の設計支援方法 |
US10879191B2 (en) * | 2019-01-07 | 2020-12-29 | Qualcomm Incorporated | Conformal shielding for solder ball array |
US10827616B2 (en) * | 2019-01-30 | 2020-11-03 | Kyocera Corporation | Mounting structure |
CN110312363B (zh) * | 2019-06-24 | 2020-10-16 | 维沃移动通信有限公司 | 一种印刷电路板组件及终端 |
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CN110062982B (zh) * | 2016-12-22 | 2020-12-11 | 京瓷株式会社 | 天线基板及其制造方法 |
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Also Published As
Publication number | Publication date |
---|---|
TW201618611A (zh) | 2016-05-16 |
KR20160036514A (ko) | 2016-04-04 |
US20160095218A1 (en) | 2016-03-31 |
CN105472863A (zh) | 2016-04-06 |
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