JP5461356B2 - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP5461356B2 JP5461356B2 JP2010222330A JP2010222330A JP5461356B2 JP 5461356 B2 JP5461356 B2 JP 5461356B2 JP 2010222330 A JP2010222330 A JP 2010222330A JP 2010222330 A JP2010222330 A JP 2010222330A JP 5461356 B2 JP5461356 B2 JP 5461356B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- solder resist
- resist layer
- wiring board
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Description
2,9a,9b 接続パッド
3,8 ソルダーレジスト層
4 開口部
6 ガイド孔
7 位置決め孔
10,20,30,40 配線基板
Claims (1)
- 絶縁基板の上面に、外部との接続に用いられる接続パッドがその外周部をソルダーレジスト層で覆われるとともにその中央部を前記ソルダーレジスト層に設けられた開口部内に露出させるようにして形成されているとともに、前記絶縁基板に位置決め用のガイド孔が形成されて成る配線基板であって、前記ソルダーレジスト層は、前記ガイド孔上に該ガイド孔よりも小径でかつ前記開口部と同時にフォトリソグラフィ技術により形成された位置決め孔を有していることを特徴とする配線基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010222330A JP5461356B2 (ja) | 2010-09-30 | 2010-09-30 | 配線基板 |
US13/248,224 US8698007B2 (en) | 2010-09-30 | 2011-09-29 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010222330A JP5461356B2 (ja) | 2010-09-30 | 2010-09-30 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012079850A JP2012079850A (ja) | 2012-04-19 |
JP5461356B2 true JP5461356B2 (ja) | 2014-04-02 |
Family
ID=45888815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010222330A Expired - Fee Related JP5461356B2 (ja) | 2010-09-30 | 2010-09-30 | 配線基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8698007B2 (ja) |
JP (1) | JP5461356B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016096246A (ja) * | 2014-11-14 | 2016-05-26 | 株式会社東芝 | フレキシブルプリント配線板のソルダーレジスト形成方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10270815A (ja) * | 1997-03-21 | 1998-10-09 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
JP2002250846A (ja) * | 2001-02-26 | 2002-09-06 | Seiko Epson Corp | 光モジュール及びその製造方法並びに光伝達装置 |
US7150569B2 (en) * | 2003-02-24 | 2006-12-19 | Nor Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
JP3807385B2 (ja) | 2003-05-14 | 2006-08-09 | セイコーエプソン株式会社 | 光モジュール及びその製造方法、光通信装置、電子機器 |
JP4606063B2 (ja) * | 2004-05-14 | 2011-01-05 | パナソニック株式会社 | 光学デバイスおよびその製造方法 |
JP2009515352A (ja) * | 2005-11-09 | 2009-04-09 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 少なくとも1つのマイクロエレクトロニクス素子を密封するパッケージキャリアの製造方法及び診断素子の製造方法 |
JP5248795B2 (ja) * | 2007-03-27 | 2013-07-31 | 日本特殊陶業株式会社 | 光電気混載パッケージ及びその製造方法、光素子付き光電気混載パッケージ、光電気混載モジュール |
-
2010
- 2010-09-30 JP JP2010222330A patent/JP5461356B2/ja not_active Expired - Fee Related
-
2011
- 2011-09-29 US US13/248,224 patent/US8698007B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20120080223A1 (en) | 2012-04-05 |
JP2012079850A (ja) | 2012-04-19 |
US8698007B2 (en) | 2014-04-15 |
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