JP4163689B2 - 電気光学組立品 - Google Patents
電気光学組立品 Download PDFInfo
- Publication number
- JP4163689B2 JP4163689B2 JP2004540075A JP2004540075A JP4163689B2 JP 4163689 B2 JP4163689 B2 JP 4163689B2 JP 2004540075 A JP2004540075 A JP 2004540075A JP 2004540075 A JP2004540075 A JP 2004540075A JP 4163689 B2 JP4163689 B2 JP 4163689B2
- Authority
- JP
- Japan
- Prior art keywords
- electro
- microelectronic
- optic
- coupler
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004377 microelectronic Methods 0.000 claims description 92
- 230000003287 optical effect Effects 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 14
- 239000008393 encapsulating agent Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 13
- 239000002356 single layer Substances 0.000 claims 2
- 230000001681 protective effect Effects 0.000 description 12
- 239000010409 thin film Substances 0.000 description 12
- 230000000712 assembly Effects 0.000 description 10
- 238000000429 assembly Methods 0.000 description 10
- 238000004891 communication Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- HOBRTVXSIVSXIA-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-phenylbenzene Chemical compound ClC1=C(Cl)C(Cl)=CC(Cl)=C1C1=CC=CC=C1 HOBRTVXSIVSXIA-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73209—Bump and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Description
Claims (14)
- 1つのアクティブ面を有する1つの超小型電子パッケージと、
前記超小型電子パッケージの前記アクティブ面上の1つのビルドアップ層と、
1つの導波路と、前記導波路に光学的に接続する1つのカプラーとを有する1つの光基板と、
前記超小型電子パッケージおよび前記光基板の一方から前記超小型電子パッケージおよび前記光基板の他方へ信号を変換して伝送するべく前記ビルドアップ層と接続する1つの電気光学素子と、
前記光基板を前記ビルドアップ層に接着する接着剤と
を備える電気光学組立品であって、
前記超小型電子パッケージは超小型電子チップが封入材により固着される1つの開口部を有する1つのコアを備え、
前記ビルドアップ層は1つの導電性トレースを備え、
前記電気光学素子の1つの表面上に、前記カプラーおよび前記導波路に隣接する屈折率整合材料が設けられ、
前記導電性トレースおよび前記ビルドアップ層上の1つのソルダーマスクのパターン開口部に、前記電気光学素子および前記超小型電子パッケージを固定するための複数のソルダーボールを備え、
前記パターン開口部は、前記ソルダーマスクのための単一層内に、単一フォトリソグラフマスクによってパターン形成される、
電気光学組立品。 - 前記アクティブ面は、前記超小型電子チップの1つのアクティブ表面および前記コアの1つのアクティブ表面によって画定される、請求項1に記載の電気光学組立品。
- 前記超小型電子パッケージの前記コア内の前記開口部内の前記封入材は、前記超小型電子チップの前記アクティブ表面と同一平面上にある、請求項2に記載の電気光学組立品。
- 前記超小型電子パッケージの前記アクティブ面上の前記ビルドアップ層は、前記超小型電子チップと電気的に接触する前記導電性トレースを支持する、請求項2に記載の電気光学組立品。
- 前記ビルドアップ層は1つの誘電層を含み、前記導電性トレースは、前記超小型電子パッケージの前記アクティブ面に前記電気光学素子を接点を介して電気的に接続させるべく前記誘電層を貫通して延在する、請求項4に記載の電気光学組立品。
- 前記電気光学素子は、前記超小型電子チップおよび前記カプラーの一方からの信号を変換し、前記信号を前記超小型電子チップおよび前記カプラーの他方へ伝送する、請求項1に記載の電気光学組立品。
- 前記電気光学素子は、前記超小型電子チップからの電気信号を光信号に変換し、前記光信号を前記カプラーへ伝送する、請求項1に記載の電気光学組立品。
- 前記電気光学素子は、前記カプラーからの光信号を電気信号に変換し、前記電気信号を前記超小型電子チップへ伝送する、請求項1に記載の電気光学組立品。
- 前記電気光学素子は、光信号を前記カプラーへ焦点を合わせて伝送する1つの一体型レンズを備える、請求項1に記載の電気光学組立品。
- 前記電気光学素子は、前記超小型電子パッケージと前記光基板との間にあって、1つのVCSELを備える、請求項1に記載の電気光学組立品。
- 前記電気光学素子は、前記超小型電子パッケージと前記光基板との間にあって、1つの光検出器を備える、請求項1に記載の電気光学組立品。
- 前記光基板は、1つのプリント回路基板内に1つのカプラーおよび1つの導波路を有する1つのプリント回路基板を備える、請求項1に記載の電気光学組立品。
- 1つの電気光学パッケージを製造する方法であって、
1つの超小型電子チップを有する1つの超小型電子パッケージの1つのアクティブ面上の1つのビルドアップ層に1つの電気光学素子を接着する段階と、
1つのカプラーおよび1つの導波路を有する1つの光基板を前記電気光学素子に直面するように位置付けする段階と、
前記電気光学素子が前記カプラーと正しい位置関係になるように前記超小型電子パッケージの前記ビルドアップ層を前記光基板に接着する段階と
を備え、
前記ビルドアップ層の少なくとも一部は前記超小型電子チップのアクティブ表面上にあり、
前記カプラーは前記導波路と光学的に接続し、
前記電気光学素子の1つの表面上に、前記カプラーおよび前記導波路に隣接する屈折率整合材料が設けられ、
前記電気光学素子および前記光基板は、前記超小型電子パッケージの前記アクティブ面上の前記ビルドアップ層上の1つのソルダーマスクの複数のパターン開口部に複数のソルダーボールによって接着され、
前記パターン開口部は、前記複数のソルダーマスクのための単一層内に、単一フォトリソグラフマスクによってパターン形成される方法。 - 前記電気光学素子と前記カプラーとの位置合わせに、はんだのセルフアライメントを利用する、請求項13に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/253,834 US7039263B2 (en) | 2002-09-24 | 2002-09-24 | Electrooptic assembly |
PCT/US2003/028811 WO2004029680A2 (en) | 2002-09-24 | 2003-09-12 | Electrooptic assembly |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005539274A JP2005539274A (ja) | 2005-12-22 |
JP2005539274A5 JP2005539274A5 (ja) | 2008-04-17 |
JP4163689B2 true JP4163689B2 (ja) | 2008-10-08 |
Family
ID=31993231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004540075A Expired - Fee Related JP4163689B2 (ja) | 2002-09-24 | 2003-09-12 | 電気光学組立品 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7039263B2 (ja) |
EP (1) | EP1543367A2 (ja) |
JP (1) | JP4163689B2 (ja) |
CN (1) | CN100468108C (ja) |
AU (1) | AU2003274975A1 (ja) |
MY (1) | MY134515A (ja) |
TW (1) | TWI228608B (ja) |
WO (1) | WO2004029680A2 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI254467B (en) * | 2005-03-01 | 2006-05-01 | Advanced Semiconductor Eng | Semiconductor package having an optical device and the method of making the same |
US9184131B2 (en) * | 2011-06-30 | 2015-11-10 | Murata Electronics Oy | Method of making a system-in-package device |
US8810024B2 (en) * | 2012-03-23 | 2014-08-19 | Stats Chippac Ltd. | Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units |
KR102009979B1 (ko) | 2012-06-07 | 2019-08-12 | 삼성전자주식회사 | 반도체 패키지 및 이를 포함하는 반도체 장치 |
US9254409B2 (en) | 2013-03-14 | 2016-02-09 | Icon Health & Fitness, Inc. | Strength training apparatus with flywheel and related methods |
EP3623020B1 (en) | 2013-12-26 | 2024-05-01 | iFIT Inc. | Magnetic resistance mechanism in a cable machine |
US10433612B2 (en) | 2014-03-10 | 2019-10-08 | Icon Health & Fitness, Inc. | Pressure sensor to quantify work |
CN106470739B (zh) | 2014-06-09 | 2019-06-21 | 爱康保健健身有限公司 | 并入跑步机的缆索系统 |
US10258828B2 (en) | 2015-01-16 | 2019-04-16 | Icon Health & Fitness, Inc. | Controls for an exercise device |
US10953305B2 (en) | 2015-08-26 | 2021-03-23 | Icon Health & Fitness, Inc. | Strength exercise mechanisms |
CN108140688B (zh) * | 2015-09-28 | 2021-01-29 | 曜晟光电有限公司 | 半导体结构 |
US10025033B2 (en) | 2016-03-01 | 2018-07-17 | Advanced Semiconductor Engineering, Inc. | Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same |
US10272317B2 (en) | 2016-03-18 | 2019-04-30 | Icon Health & Fitness, Inc. | Lighted pace feature in a treadmill |
US10561894B2 (en) | 2016-03-18 | 2020-02-18 | Icon Health & Fitness, Inc. | Treadmill with removable supports |
US10493349B2 (en) | 2016-03-18 | 2019-12-03 | Icon Health & Fitness, Inc. | Display on exercise device |
US10625137B2 (en) | 2016-03-18 | 2020-04-21 | Icon Health & Fitness, Inc. | Coordinated displays in an exercise device |
US10293211B2 (en) | 2016-03-18 | 2019-05-21 | Icon Health & Fitness, Inc. | Coordinated weight selection |
US10252109B2 (en) | 2016-05-13 | 2019-04-09 | Icon Health & Fitness, Inc. | Weight platform treadmill |
US10441844B2 (en) | 2016-07-01 | 2019-10-15 | Icon Health & Fitness, Inc. | Cooling systems and methods for exercise equipment |
US10241264B2 (en) | 2016-07-01 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages |
US10471299B2 (en) | 2016-07-01 | 2019-11-12 | Icon Health & Fitness, Inc. | Systems and methods for cooling internal exercise equipment components |
US10500473B2 (en) | 2016-10-10 | 2019-12-10 | Icon Health & Fitness, Inc. | Console positioning |
US10376736B2 (en) | 2016-10-12 | 2019-08-13 | Icon Health & Fitness, Inc. | Cooling an exercise device during a dive motor runway condition |
TWI646997B (zh) | 2016-11-01 | 2019-01-11 | 美商愛康運動與健康公司 | 用於控制台定位的距離感測器 |
US10661114B2 (en) | 2016-11-01 | 2020-05-26 | Icon Health & Fitness, Inc. | Body weight lift mechanism on treadmill |
TWI680782B (zh) | 2016-12-05 | 2020-01-01 | 美商愛康運動與健康公司 | 於操作期間抵銷跑步機的平台之重量 |
TWI722450B (zh) | 2017-08-16 | 2021-03-21 | 美商愛康運動與健康公司 | 用於抗馬達中之軸向衝擊載荷的系統 |
US10729965B2 (en) | 2017-12-22 | 2020-08-04 | Icon Health & Fitness, Inc. | Audible belt guide in a treadmill |
CN109683261B (zh) * | 2019-01-22 | 2020-12-01 | 国科光芯(海宁)科技股份有限公司 | 一种探测器电路板与光波导芯片的集成对准封装结构 |
US11372160B2 (en) * | 2020-01-31 | 2022-06-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package, optical device, and manufacturing method of package |
CN111934192A (zh) * | 2020-09-29 | 2020-11-13 | 常州纵慧芯光半导体科技有限公司 | 一种光发射模组及其封装方法 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5168537A (en) | 1991-06-28 | 1992-12-01 | Digital Equipment Corporation | Method and apparatus for coupling light between an optoelectronic device and a waveguide |
US5420954A (en) | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
JPH0926530A (ja) * | 1995-07-11 | 1997-01-28 | Nec Corp | 光モジュール |
KR100192760B1 (ko) * | 1996-02-29 | 1999-06-15 | 황인길 | 메탈 캐리어 프레임을 이용한 bag반도체 패키지의 제조방법 및 그반도체 패키지 |
DE69715504T2 (de) * | 1996-04-26 | 2003-06-05 | Dow Corning Toray Silicone | Elektrisch leitfähige Silikonkautschukzusammensetzung und ihre Anwendung zur Herstellung von Halbleiteranordnungen |
US5627931A (en) | 1996-05-28 | 1997-05-06 | Motorola | Optoelectronic transducer |
KR100236432B1 (ko) * | 1996-07-31 | 1999-12-15 | 미야즈 쥰이치로 | 광학 편광기, 이의 제조 방법 및 광학 편광기 제조용 블레이드 |
EP0950204B1 (en) * | 1996-12-31 | 2002-01-23 | Honeywell Inc. | Flexible optic connector assembly |
JPH10319278A (ja) * | 1997-05-16 | 1998-12-04 | Nec Corp | 光結合回路 |
US6009632A (en) * | 1997-12-12 | 2000-01-04 | Mercury Diagnostics, Inc. | Alignment system for optical analyte testing meter components |
JP4203152B2 (ja) * | 1998-09-11 | 2008-12-24 | 株式会社日立メディアエレクトロニクス | 弾性表面波装置 |
JP3775069B2 (ja) * | 1998-09-18 | 2006-05-17 | 住友電気工業株式会社 | 光受信モジュール |
US6684007B2 (en) * | 1998-10-09 | 2004-01-27 | Fujitsu Limited | Optical coupling structures and the fabrication processes |
US6785447B2 (en) * | 1998-10-09 | 2004-08-31 | Fujitsu Limited | Single and multilayer waveguides and fabrication process |
US6048755A (en) * | 1998-11-12 | 2000-04-11 | Micron Technology, Inc. | Method for fabricating BGA package using substrate with patterned solder mask open in die attach area |
US6243508B1 (en) | 1999-06-01 | 2001-06-05 | Picolight Incorporated | Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide |
JP2001021775A (ja) * | 1999-07-09 | 2001-01-26 | Sumitomo Electric Ind Ltd | 光学装置 |
DE19932430C2 (de) | 1999-07-12 | 2002-03-14 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Opto-elektronische Baugruppe sowie Bauteil für diese Baugruppe |
JP3728147B2 (ja) * | 1999-07-16 | 2005-12-21 | キヤノン株式会社 | 光電気混載配線基板 |
US6271469B1 (en) | 1999-11-12 | 2001-08-07 | Intel Corporation | Direct build-up layer on an encapsulated die package |
JP2001196643A (ja) * | 2000-01-11 | 2001-07-19 | Toppan Printing Co Ltd | 光・電気素子搭載用チップキャリア及びその実装方法並びに光・電気配線基板及びその製造方法並びに実装基板 |
US7061084B2 (en) * | 2000-02-29 | 2006-06-13 | Advanced Semiconductor Engineering, Inc. | Lead-bond type chip package and manufacturing method thereof |
US6809413B1 (en) * | 2000-05-16 | 2004-10-26 | Sandia Corporation | Microelectronic device package with an integral window mounted in a recessed lip |
US6586822B1 (en) * | 2000-09-08 | 2003-07-01 | Intel Corporation | Integrated core microelectronic package |
US6569248B1 (en) * | 2000-09-11 | 2003-05-27 | Allen David Hertz | Apparatus for selectively applying solder mask |
US6702413B2 (en) * | 2000-11-16 | 2004-03-09 | Canon Kabushiki Kaisha | Liquid discharge head, liquid discharge apparatus, and IC package structure |
NL1016779C2 (nl) * | 2000-12-02 | 2002-06-04 | Cornelis Johannes Maria V Rijn | Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs. |
JP4831901B2 (ja) * | 2000-12-06 | 2011-12-07 | イビデン株式会社 | 多層プリント配線板 |
JP2002270860A (ja) * | 2000-12-06 | 2002-09-20 | Ibiden Co Ltd | Icチップ実装用基板 |
US6785458B2 (en) * | 2001-02-11 | 2004-08-31 | Georgia Tech Research Corporation | Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package |
US7101091B2 (en) * | 2001-02-21 | 2006-09-05 | Zarlink Semiconductor, Inc. | Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same |
US6570259B2 (en) * | 2001-03-22 | 2003-05-27 | International Business Machines Corporation | Apparatus to reduce thermal fatigue stress on flip chip solder connections |
US6531767B2 (en) * | 2001-04-09 | 2003-03-11 | Analog Devices Inc. | Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture |
US6754407B2 (en) * | 2001-06-26 | 2004-06-22 | Intel Corporation | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
US7110640B2 (en) * | 2001-07-19 | 2006-09-19 | Evident Technologies | Reconfigurable optical add/drop filter |
US6498358B1 (en) * | 2001-07-20 | 2002-12-24 | Motorola, Inc. | Structure and method for fabricating an electro-optic system having an electrochromic diffraction grating |
US6845211B2 (en) * | 2001-09-06 | 2005-01-18 | Corona Optical Systems, Inc. | Method of attenuating an optical signal |
US6743153B2 (en) * | 2001-09-06 | 2004-06-01 | Icon Ip, Inc. | Method and apparatus for treadmill with frameless treadbase |
US6569712B2 (en) * | 2001-10-19 | 2003-05-27 | Via Technologies, Inc. | Structure of a ball-grid array package substrate and processes for producing thereof |
US20030113974A1 (en) * | 2001-12-14 | 2003-06-19 | Ning Xian J. | Stacked metal-insulator-metal capacitor structures in between interconnection layers |
SG115455A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Methods for assembly and packaging of flip chip configured dice with interposer |
US7418163B2 (en) * | 2002-03-28 | 2008-08-26 | Chakravorty Kishore K | Optoelectrical package |
US20040052468A1 (en) * | 2002-04-02 | 2004-03-18 | Pham Cuong Van | Alignable electro-optical microelectronic package and method |
US20030210865A1 (en) * | 2002-05-08 | 2003-11-13 | Kjetil Johannessen | Method and apparatus for coupling of optically active devices to a planar lightwave circuit |
JP2004031573A (ja) * | 2002-06-25 | 2004-01-29 | Oki Electric Ind Co Ltd | 光送受信モジュール |
US6673649B1 (en) * | 2002-07-05 | 2004-01-06 | Micron Technology, Inc. | Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
US7016569B2 (en) * | 2002-07-31 | 2006-03-21 | Georgia Tech Research Corporation | Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof |
-
2002
- 2002-09-24 US US10/253,834 patent/US7039263B2/en not_active Expired - Fee Related
-
2003
- 2003-05-07 MY MYPI20031719A patent/MY134515A/en unknown
- 2003-05-16 TW TW092113333A patent/TWI228608B/zh not_active IP Right Cessation
- 2003-09-12 CN CNB038225255A patent/CN100468108C/zh not_active Expired - Fee Related
- 2003-09-12 EP EP03759245A patent/EP1543367A2/en not_active Withdrawn
- 2003-09-12 WO PCT/US2003/028811 patent/WO2004029680A2/en active Application Filing
- 2003-09-12 AU AU2003274975A patent/AU2003274975A1/en not_active Abandoned
- 2003-09-12 JP JP2004540075A patent/JP4163689B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7039263B2 (en) | 2006-05-02 |
AU2003274975A1 (en) | 2004-04-19 |
EP1543367A2 (en) | 2005-06-22 |
CN100468108C (zh) | 2009-03-11 |
AU2003274975A8 (en) | 2004-04-19 |
WO2004029680A3 (en) | 2004-08-05 |
US20040057649A1 (en) | 2004-03-25 |
TW200408842A (en) | 2004-06-01 |
TWI228608B (en) | 2005-03-01 |
JP2005539274A (ja) | 2005-12-22 |
CN1685261A (zh) | 2005-10-19 |
MY134515A (en) | 2007-12-31 |
WO2004029680A2 (en) | 2004-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4163689B2 (ja) | 電気光学組立品 | |
US7915076B2 (en) | Hybrid module and method of manufacturing the same | |
US7842541B1 (en) | Ultra thin package and fabrication method | |
JP4260650B2 (ja) | 光電気複合基板及びその製造方法 | |
US6274391B1 (en) | HDI land grid array packaged device having electrical and optical interconnects | |
US7684660B2 (en) | Methods and apparatus to mount a waveguide to a substrate | |
KR101484786B1 (ko) | 집적회로 패키지 내장 인쇄회로기판 및 그 제조방법 | |
JP4351214B2 (ja) | 電子装置及びその製造方法 | |
US20110010932A1 (en) | Wiring board, semiconductor device having wiring board, and method of manufacturing wiring board | |
US20020158341A1 (en) | Semiconductor package | |
JP2004146602A (ja) | 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリット回路モジュール及びその製造方法 | |
KR20120109427A (ko) | 배선 기판 및 반도체 장치 | |
US7450793B2 (en) | Semiconductor device integrated with opto-electric component and method for fabricating the same | |
TWI718415B (zh) | 基板結構及電子裝置 | |
CN112188731B (zh) | 内埋式元件结构及其制造方法 | |
TWI707615B (zh) | 內埋式元件結構及其製造方法 | |
US20190380200A1 (en) | Embedded component structure and manufacturing method thereof | |
CN218350539U (zh) | 封装件 | |
JP5461356B2 (ja) | 配線基板 | |
US20230171895A1 (en) | Printed circuit board and printed circuit board package | |
JP3670220B2 (ja) | 半導体装置の製造方法 | |
TWI544846B (zh) | 封裝載板及其製作方法 | |
JP2006059882A (ja) | 光半導体モジュールおよびその製造方法およびインターフェイスモジュール付lsiパッケージ | |
JP2004146621A (ja) | 光電気プリント配線板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071225 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20080303 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080401 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080630 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080722 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080724 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110801 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120801 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130801 Year of fee payment: 5 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |