SG165151A1 - Low defect density silicon - Google Patents

Low defect density silicon

Info

Publication number
SG165151A1
SG165151A1 SG200601430-2A SG2006014302A SG165151A1 SG 165151 A1 SG165151 A1 SG 165151A1 SG 2006014302 A SG2006014302 A SG 2006014302A SG 165151 A1 SG165151 A1 SG 165151A1
Authority
SG
Singapore
Prior art keywords
ingot
length
axially symmetric
symmetric region
central axis
Prior art date
Application number
SG200601430-2A
Other languages
English (en)
Inventor
Robert Falster
Joseph C Holzer
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21918645&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG165151(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of SG165151A1 publication Critical patent/SG165151A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/14Heating of the melt or the crystallised materials
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • C30B15/203Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • C30B15/206Controlling or regulating the thermal history of growing the ingot
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1004Apparatus with means for measuring, testing, or sensing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/21Circular sheet or circular blank

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG200601430-2A 1997-04-09 1998-04-09 Low defect density silicon SG165151A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4184597P 1997-04-09 1997-04-09

Publications (1)

Publication Number Publication Date
SG165151A1 true SG165151A1 (en) 2010-10-28

Family

ID=21918645

Family Applications (3)

Application Number Title Priority Date Filing Date
SG200105490A SG105509A1 (en) 1997-04-09 1998-04-09 Low defect density, self-interstitial dominated silicon
SG200105492A SG105510A1 (en) 1997-04-09 1998-04-09 Low defect density silicon
SG200601430-2A SG165151A1 (en) 1997-04-09 1998-04-09 Low defect density silicon

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG200105490A SG105509A1 (en) 1997-04-09 1998-04-09 Low defect density, self-interstitial dominated silicon
SG200105492A SG105510A1 (en) 1997-04-09 1998-04-09 Low defect density silicon

Country Status (10)

Country Link
US (11) US6287380B1 (ja)
EP (7) EP1118697B1 (ja)
JP (9) JP3544676B2 (ja)
KR (6) KR100508048B1 (ja)
CN (7) CN100547122C (ja)
DE (7) DE69813041T2 (ja)
MY (6) MY127584A (ja)
SG (3) SG105509A1 (ja)
TW (3) TW494146B (ja)
WO (3) WO1998045509A1 (ja)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG64470A1 (en) 1997-02-13 1999-04-27 Samsung Electronics Co Ltd Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby
US6503594B2 (en) 1997-02-13 2003-01-07 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects and slip
US6485807B1 (en) 1997-02-13 2002-11-26 Samsung Electronics Co., Ltd. Silicon wafers having controlled distribution of defects, and methods of preparing the same
US6045610A (en) * 1997-02-13 2000-04-04 Samsung Electronics Co., Ltd. Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnance
US5994761A (en) * 1997-02-26 1999-11-30 Memc Electronic Materials Spa Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
TW494146B (en) 1997-04-09 2002-07-11 Memc Electronic Materials Spa Process for growing a single crystal silicon ingot
US6379642B1 (en) * 1997-04-09 2002-04-30 Memc Electronic Materials, Inc. Vacancy dominated, defect-free silicon
JP3449729B2 (ja) * 1997-04-09 2003-09-22 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 単結晶シリコンウエハを製造する方法
JPH1179889A (ja) * 1997-07-09 1999-03-23 Shin Etsu Handotai Co Ltd 結晶欠陥が少ないシリコン単結晶の製造方法、製造装置並びにこの方法、装置で製造されたシリコン単結晶とシリコンウエーハ
US6514335B1 (en) * 1997-08-26 2003-02-04 Sumitomo Metal Industries, Ltd. High-quality silicon single crystal and method of producing the same
US6340392B1 (en) 1997-10-24 2002-01-22 Samsung Electronics Co., Ltd. Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface
JP3346249B2 (ja) * 1997-10-30 2002-11-18 信越半導体株式会社 シリコンウエーハの熱処理方法及びシリコンウエーハ
JP3407629B2 (ja) * 1997-12-17 2003-05-19 信越半導体株式会社 シリコン単結晶ウエーハの熱処理方法ならびにシリコン単結晶ウエーハ
JP3955375B2 (ja) * 1998-01-19 2007-08-08 信越半導体株式会社 シリコン単結晶の製造方法およびシリコン単結晶ウエーハ
JPH11349393A (ja) * 1998-06-03 1999-12-21 Shin Etsu Handotai Co Ltd シリコン単結晶ウエーハおよびシリコン単結晶ウエーハの製造方法
JP3943717B2 (ja) 1998-06-11 2007-07-11 信越半導体株式会社 シリコン単結晶ウエーハ及びその製造方法
DE69901115T2 (de) 1998-06-26 2002-12-19 Memc Electronic Materials, Inc. Verfahren zur herstellung fehlerfreier siliziumkristalle von willkürlichem grossen durchmesser
CN1155074C (zh) 1998-09-02 2004-06-23 Memc电子材料有限公司 从低缺陷密度的单晶硅上制备硅-绝缘体结构
KR100816696B1 (ko) 1998-09-02 2008-03-27 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 개선된 내부 게터링을 갖는 열어닐된 웨이퍼
CN1155064C (zh) 1998-09-02 2004-06-23 Memc电子材料有限公司 制备理想析氧硅晶片的工艺
CN1296526C (zh) * 1998-10-14 2007-01-24 Memc电子材料有限公司 热退火后的低缺陷密度单晶硅
DE69913731T2 (de) 1998-10-14 2004-10-14 Memc Electronic Materials, Inc. Im wesentlichen defektfreie epitaktische siliziumscheiben
US6312516B2 (en) 1998-10-14 2001-11-06 Memc Electronic Materials, Inc. Process for preparing defect free silicon crystals which allows for variability in process conditions
JP4233651B2 (ja) * 1998-10-29 2009-03-04 信越半導体株式会社 シリコン単結晶ウエーハ
JP2000154070A (ja) * 1998-11-16 2000-06-06 Suminoe Textile Co Ltd セラミックス三次元構造体及びその製造方法
TW505710B (en) 1998-11-20 2002-10-11 Komatsu Denshi Kinzoku Kk Production method for silicon single crystal and production device for single crystal ingot, and heat treating method for silicon single crystal wafer
US6284384B1 (en) * 1998-12-09 2001-09-04 Memc Electronic Materials, Inc. Epitaxial silicon wafer with intrinsic gettering
WO2000041227A1 (fr) * 1998-12-28 2000-07-13 Shin-Etsu Handotai Co.,Ltd. Procede de recuit thermique d'une plaquette de silicium, et plaquette de silicium
JP3601340B2 (ja) * 1999-02-01 2004-12-15 信越半導体株式会社 エピタキシャルシリコンウエーハおよびその製造方法並びにエピタキシャルシリコンウエーハ用基板
US6458202B1 (en) * 1999-09-02 2002-10-01 Memc Electronic Materials, Inc. Process for preparing single crystal silicon having uniform thermal history
US6391662B1 (en) 1999-09-23 2002-05-21 Memc Electronic Materials, Inc. Process for detecting agglomerated intrinsic point defects by metal decoration
US6635587B1 (en) 1999-09-23 2003-10-21 Memc Electronic Materials, Inc. Method for producing czochralski silicon free of agglomerated self-interstitial defects
JP2003510235A (ja) 1999-09-23 2003-03-18 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 冷却速度を制御することにより単結晶シリコンを成長させるチョクラルスキー法
KR100730806B1 (ko) * 1999-10-14 2007-06-20 신에쯔 한도타이 가부시키가이샤 Soi웨이퍼의 제조방법 및 soi 웨이퍼
JP2001118801A (ja) * 1999-10-18 2001-04-27 Mitsubishi Materials Silicon Corp エピタキシャルウェーハ用基板およびこれを用いた半導体装置
KR100801672B1 (ko) * 2000-06-30 2008-02-11 신에쯔 한도타이 가부시키가이샤 실리콘 단결정 웨이퍼 및 그 제조방법
KR100374703B1 (ko) 2000-09-04 2003-03-04 주식회사 실트론 단결정 실리콘 웨이퍼,잉곳 및 그 제조방법
DE60141611D1 (de) * 2000-09-19 2010-04-29 Memc Electronic Materials Mit stickstoff dotiertes silizium das im wesentlichen frei von oxidationsinduzierten stapelfehlern ist
EP1669478B1 (en) * 2000-09-19 2010-03-17 MEMC Electronic Materials, Inc. Nitrogen-doped silicon substantially free of oxidation induced stacking faults
US6663708B1 (en) * 2000-09-22 2003-12-16 Mitsubishi Materials Silicon Corporation Silicon wafer, and manufacturing method and heat treatment method of the same
KR20020024368A (ko) * 2000-09-25 2002-03-30 가와이 겐이찌 실리콘 웨이퍼
DE10066107B4 (de) * 2000-09-25 2008-11-27 Mitsubishi Materials Silicon Corp. Verfahren zur Wärmebehandlung eines Siliciumwafers
KR100687664B1 (ko) * 2000-11-03 2007-02-28 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 저 결함 밀도 실리콘 제조 방법
US6858307B2 (en) 2000-11-03 2005-02-22 Memc Electronic Materials, Inc. Method for the production of low defect density silicon
US7105050B2 (en) 2000-11-03 2006-09-12 Memc Electronic Materials, Inc. Method for the production of low defect density silicon
US6689209B2 (en) * 2000-11-03 2004-02-10 Memc Electronic Materials, Inc. Process for preparing low defect density silicon using high growth rates
US20110263126A1 (en) 2000-11-22 2011-10-27 Sumco Corporation Method for manufacturing a silicon wafer
EP1346086A2 (en) * 2000-11-30 2003-09-24 MEMC Electronic Materials, Inc. Process for controlling thermal history of vacancy-dominated, single crystal silicon
US20040055527A1 (en) * 2000-11-30 2004-03-25 Makoto Kojima Process for controlling thermal history of vacancy-dominated, single crystal silicon
US7008874B2 (en) * 2000-12-19 2006-03-07 Memc Electronics Materials, Inc. Process for reclaiming semiconductor wafers and reclaimed wafers
JP3624827B2 (ja) 2000-12-20 2005-03-02 三菱住友シリコン株式会社 シリコン単結晶の製造方法
JP3994665B2 (ja) * 2000-12-28 2007-10-24 信越半導体株式会社 シリコン単結晶ウエーハおよびシリコン単結晶の製造方法
US20020084451A1 (en) * 2000-12-29 2002-07-04 Mohr Thomas C. Silicon wafers substantially free of oxidation induced stacking faults
US6986925B2 (en) * 2001-01-02 2006-01-17 Memc Electronic Materials, Inc. Single crystal silicon having improved gate oxide integrity
CN100348782C (zh) * 2001-01-26 2007-11-14 Memc电子材料有限公司 具有基本上没有氧化诱生堆垛层错的空位为主的芯的低缺陷密度硅
US6743495B2 (en) 2001-03-30 2004-06-01 Memc Electronic Materials, Inc. Thermal annealing process for producing silicon wafers with improved surface characteristics
US6649883B2 (en) * 2001-04-12 2003-11-18 Memc Electronic Materials, Inc. Method of calibrating a semiconductor wafer drying apparatus
EP1423871A2 (en) * 2001-06-22 2004-06-02 MEMC Electronic Materials, Inc. Process for producing silicon on insulator structure having intrinsic gettering by ion implantation
EP1710830A3 (en) * 2001-06-22 2007-11-28 MEMC Electronic Materials, Inc. Silicon on insulator structure having intrinsic gettering
US20030033972A1 (en) * 2001-08-15 2003-02-20 Memc Electronic Materials, Inc. Controlled crown growth process for czochralski single crystal silicon
WO2003021011A1 (en) * 2001-08-29 2003-03-13 Memc Electronic Materials, Inc. Process for eliminating neck dislocations during czochralski crystal growth
JP4567251B2 (ja) * 2001-09-14 2010-10-20 シルトロニック・ジャパン株式会社 シリコン半導体基板およびその製造方法
US6866713B2 (en) * 2001-10-26 2005-03-15 Memc Electronic Materials, Inc. Seed crystals for pulling single crystal silicon
US6669775B2 (en) 2001-12-06 2003-12-30 Seh America, Inc. High resistivity silicon wafer produced by a controlled pull rate czochralski method
JP4092946B2 (ja) * 2002-05-09 2008-05-28 信越半導体株式会社 シリコン単結晶ウエーハ及びエピタキシャルウエーハ並びにシリコン単結晶の製造方法
US7244306B2 (en) * 2002-10-18 2007-07-17 Sumitomo Mitsubishi Silicon Corporation Method for measuring point defect distribution of silicon single crystal ingot
US8147613B2 (en) * 2002-11-12 2012-04-03 Memc Electronic Materials, Inc. Crystal puller and method for growing a monocrystalline ingot
US7125450B2 (en) * 2002-11-12 2006-10-24 Memc Electronic Materials, Inc. Process for preparing single crystal silicon using crucible rotation to control temperature gradient
JP4382438B2 (ja) * 2002-11-14 2009-12-16 株式会社東芝 半導体ウェーハの検査方法、半導体装置の開発方法、半導体装置の製造方法、および半導体ウェーハ処理装置
JP2004172391A (ja) * 2002-11-20 2004-06-17 Sumitomo Mitsubishi Silicon Corp シリコンウェーハおよびその製造方法
US6916324B2 (en) * 2003-02-04 2005-07-12 Zimmer Technology, Inc. Provisional orthopedic prosthesis for partially resected bone
EP1598452B1 (en) * 2003-02-25 2015-10-14 SUMCO Corporation Method for growing silicon single crystal, method for manufacturing silicon wafer, and method for manufacturing soi substrate.
JP4151474B2 (ja) * 2003-05-13 2008-09-17 信越半導体株式会社 単結晶の製造方法及び単結晶
US7559326B2 (en) * 2003-06-18 2009-07-14 Resmed Limited Vent and/or diverter assembly for use in breathing apparatus
JP2005015313A (ja) * 2003-06-27 2005-01-20 Shin Etsu Handotai Co Ltd 単結晶の製造方法及び単結晶
US6955718B2 (en) * 2003-07-08 2005-10-18 Memc Electronic Materials, Inc. Process for preparing a stabilized ideal oxygen precipitating silicon wafer
KR100531552B1 (ko) 2003-09-05 2005-11-28 주식회사 하이닉스반도체 실리콘 웨이퍼 및 그 제조방법
JP4432458B2 (ja) * 2003-10-30 2010-03-17 信越半導体株式会社 単結晶の製造方法
US7074271B2 (en) * 2004-02-23 2006-07-11 Sumitomo Mitsubishi Silicon Corporation Method of identifying defect distribution in silicon single crystal ingot
JP5117671B2 (ja) * 2004-10-19 2013-01-16 シルトロン インク 高品質単結晶及びその成長方法
KR100788018B1 (ko) 2004-11-29 2007-12-21 주식회사 실트론 실리콘 단결정 잉곳 및 그로부터 제조된 실리콘 웨이퍼
KR100709798B1 (ko) * 2004-10-19 2007-04-23 주식회사 실트론 고품질 단결정 성장 방법
GB0424505D0 (en) * 2004-11-05 2004-12-08 Gr Advanced Materials Ltd Emulsion ink
US7371283B2 (en) * 2004-11-23 2008-05-13 Siltron Inc. Method and apparatus of growing silicon single crystal and silicon wafer fabricated thereby
KR100714215B1 (ko) 2004-11-23 2007-05-02 주식회사 실트론 고품질 실리콘 단결정 잉곳 및 그로부터 제조된 고 품질 실리콘 웨이퍼
US20060138601A1 (en) * 2004-12-27 2006-06-29 Memc Electronic Materials, Inc. Internally gettered heteroepitaxial semiconductor wafers and methods of manufacturing such wafers
KR100840751B1 (ko) * 2005-07-26 2008-06-24 주식회사 실트론 고품질 실리콘 단결정 잉곳 제조 방법, 성장 장치 및그로부터 제조된 잉곳 , 웨이퍼
JP4743010B2 (ja) * 2005-08-26 2011-08-10 株式会社Sumco シリコンウェーハの表面欠陥評価方法
KR100831044B1 (ko) * 2005-09-21 2008-05-21 주식회사 실트론 고품질 실리콘 단결정 잉곳의 성장장치, 그 장치를 이용한성장방법
US7633307B2 (en) * 2005-12-16 2009-12-15 Freescale Semiconductor, Inc. Method for determining temperature profile in semiconductor manufacturing test
US7427325B2 (en) 2005-12-30 2008-09-23 Siltron, Inc. Method for producing high quality silicon single crystal ingot and silicon single crystal wafer made thereby
JP4853027B2 (ja) * 2006-01-17 2012-01-11 信越半導体株式会社 シリコン単結晶ウエーハの製造方法
JP2007194232A (ja) * 2006-01-17 2007-08-02 Shin Etsu Handotai Co Ltd シリコン単結晶ウエーハの製造方法
CN103147122B (zh) * 2006-05-19 2016-01-20 Memc电子材料有限公司 控制cz生长过程中由硅单晶侧面诱发的附聚点缺陷和氧簇的形成
DE102006034786B4 (de) 2006-07-27 2011-01-20 Siltronic Ag Monokristalline Halbleiterscheibe mit defektreduzierten Bereichen und Verfahren zur Ausheilung GOI-relevanter Defekte in einer monokristallinen Halbleiterscheibe
US7560355B2 (en) * 2006-10-24 2009-07-14 Vishay General Semiconductor Llc Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same
JP2009292662A (ja) * 2008-06-03 2009-12-17 Sumco Corp シリコン単結晶育成における肩形成方法
JP2009292663A (ja) * 2008-06-03 2009-12-17 Sumco Corp シリコン単結晶の育成方法
JP2010040587A (ja) * 2008-07-31 2010-02-18 Covalent Materials Corp シリコンウェーハの製造方法
IL204034A (en) * 2009-02-24 2015-05-31 Schott Ag Photovoltaic device with central optics
KR101275418B1 (ko) * 2010-03-16 2013-06-14 주식회사 엘지실트론 단결정 잉곳 제조방법 및 이에 의해 제조된 웨이퍼
CN101824649A (zh) * 2010-04-30 2010-09-08 中山大学 自动化光电晶体炉的生长前阶段控制方法
JP2012166979A (ja) * 2011-02-14 2012-09-06 Sumco Corp 多結晶シリコンの電磁鋳造方法および電磁鋳造装置
JP5733245B2 (ja) * 2012-03-16 2015-06-10 信越半導体株式会社 シリコン単結晶ウェーハの製造方法
CN102978688B (zh) * 2012-11-16 2015-07-08 晶科能源有限公司 一种直拉单晶法的冷却工艺
FR3005966B1 (fr) * 2013-05-27 2016-12-30 Commissariat Energie Atomique Procede de fabrication d'un lingot de silicium par reprise sur germes en four de solidification dirigee
FR3005967B1 (fr) * 2013-05-27 2017-06-02 Commissariat Energie Atomique Procede de fabrication d'un lingot de silicium dote de joints de grains symetriques
US9634098B2 (en) 2013-06-11 2017-04-25 SunEdison Semiconductor Ltd. (UEN201334164H) Oxygen precipitation in heavily doped silicon wafers sliced from ingots grown by the Czochralski method
US20150243494A1 (en) * 2014-02-25 2015-08-27 Texas Instruments Incorporated Mechanically robust silicon substrate having group iiia-n epitaxial layer thereon
EP3175021A1 (en) 2014-07-31 2017-06-07 Sunedison Semiconductor Limited Nitrogen doped and vacancy dominated silicon ingot and thermally treated wafer formed therefrom having radially uniformly distributed oxygen precipitation density and size
DE102015224983B4 (de) 2015-12-11 2019-01-24 Siltronic Ag Halbleiterscheibe aus einkristallinem Silizium und Verfahren zu deren Herstellung
DE102015226399A1 (de) 2015-12-22 2017-06-22 Siltronic Ag Siliciumscheibe mit homogener radialer Sauerstoffvariation
CN109346433B (zh) 2018-09-26 2020-10-23 上海新傲科技股份有限公司 半导体衬底的键合方法以及键合后的半导体衬底
KR20210150510A (ko) 2019-04-11 2021-12-10 글로벌웨이퍼스 씨오., 엘티디. 말기 본체 길이에서 감소된 왜곡을 갖는 잉곳을 준비하기 위한 프로세스
WO2020214531A1 (en) 2019-04-18 2020-10-22 Globalwafers Co., Ltd. Methods for growing a single crystal silicon ingot using continuous czochralski method
WO2021050176A1 (en) 2019-09-13 2021-03-18 Globalwafers Co., Ltd. Methods for growing a nitrogen doped single crystal silicon ingot using continuous czochralski method and a single crystal silicon ingot grown by this method
EP3929334A1 (de) 2020-06-23 2021-12-29 Siltronic AG Verfahren zur herstellung von halbleiterscheiben
FI3940124T3 (fi) 2020-07-14 2024-04-03 Siltronic Ag Kidekappale yksikiteisestä piistä
CN114599972B (zh) * 2020-07-21 2024-03-08 瓦克化学股份公司 用于测定硅中痕量金属的方法
KR102255421B1 (ko) * 2020-08-11 2021-05-24 충남대학교산학협력단 단결정 산화갈륨의 결함 평가방법
CN113138195A (zh) * 2021-04-16 2021-07-20 上海新昇半导体科技有限公司 晶体缺陷的监控方法及晶棒生长方法
CN113703411B (zh) * 2021-08-31 2022-08-30 亚洲硅业(青海)股份有限公司 多晶硅生长过程监测系统、方法及多晶硅生产系统
WO2023125206A1 (zh) * 2021-12-27 2023-07-06 中环领先半导体材料有限公司 单晶体的制备方法及硅晶体
CN115233296A (zh) * 2022-07-25 2022-10-25 北京麦竹吉科技有限公司 一种加热器、拉晶炉和消除大直径单晶硅自我间隙缺陷的方法
EP4321656A1 (de) 2022-08-09 2024-02-14 Siltronic AG Verfahren zum herstellen eines monokristallinen kristalls aus silizium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812493A (ja) * 1994-06-30 1996-01-16 Sumitomo Sitix Corp シリコン単結晶の製造方法
US5487354A (en) * 1993-12-16 1996-01-30 Wacker-Chemitronic Gesellschaft Fuer Eletronik-Grundstoffe Mbh Method for pulling a silicon single crystal
JPH08330316A (ja) * 1995-05-31 1996-12-13 Sumitomo Sitix Corp シリコン単結晶ウェーハおよびその製造方法
SG64470A1 (en) * 1997-02-13 1999-04-27 Samsung Electronics Co Ltd Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US622164A (en) * 1899-03-28 Carl august pfenning
US548735A (en) * 1895-10-29 Pile carpet
GB1456050A (en) * 1974-05-13 1976-11-17 British Aluminium Co Ltd Production of metallic articles
US3997368A (en) 1975-06-24 1976-12-14 Bell Telephone Laboratories, Incorporated Elimination of stacking faults in silicon devices: a gettering process
JPS583375B2 (ja) 1979-01-19 1983-01-21 超エル・エス・アイ技術研究組合 シリコン単結晶ウエハ−の製造方法
US4350560A (en) * 1981-08-07 1982-09-21 Ferrofluidics Corporation Apparatus for and method of handling crystals from crystal-growing furnaces
US4473795A (en) * 1983-02-23 1984-09-25 International Business Machines Corporation System for resist defect measurement
JPS59190300A (ja) 1983-04-08 1984-10-29 Hitachi Ltd 半導体製造方法および装置
JPS62105998A (ja) 1985-10-31 1987-05-16 Sony Corp シリコン基板の製法
CN86104069A (zh) * 1986-06-09 1987-02-11 电子工业部第四十四研究所 硅的多重吸杂技术及多重吸杂硅片
JPS63215041A (ja) 1987-03-04 1988-09-07 Toshiba Corp 結晶欠陥評価用エツチング液
US5264189A (en) 1988-02-23 1993-11-23 Mitsubishi Materials Corporation Apparatus for growing silicon crystals
US4981549A (en) 1988-02-23 1991-01-01 Mitsubishi Kinzoku Kabushiki Kaisha Method and apparatus for growing silicon crystals
JPH02137524A (ja) 1988-11-18 1990-05-25 Matsushita Electric Ind Co Ltd 電子チューナ
JPH02180789A (ja) 1989-01-05 1990-07-13 Kawasaki Steel Corp Si単結晶の製造方法
JPH0633235B2 (ja) 1989-04-05 1994-05-02 新日本製鐵株式会社 酸化膜耐圧特性の優れたシリコン単結晶及びその製造方法
JPH0633236B2 (ja) 1989-09-04 1994-05-02 新日本製鐵株式会社 シリコン単結晶の熱処理方法および装置ならびに製造装置
JPH0729878B2 (ja) 1990-06-07 1995-04-05 三菱マテリアル株式会社 シリコンウエーハ
JPH04108682A (ja) 1990-08-30 1992-04-09 Fuji Electric Co Ltd 化合物半導体単結晶製造装置および製造方法
JPH06103714B2 (ja) 1990-11-22 1994-12-14 信越半導体株式会社 シリコン単結晶の電気特性検査方法
JPH08760B2 (ja) 1991-03-14 1996-01-10 信越半導体株式会社 シリコンウェーハの品質検査方法
JP2613498B2 (ja) * 1991-03-15 1997-05-28 信越半導体株式会社 Si単結晶ウエーハの熱処理方法
JP3016897B2 (ja) * 1991-03-20 2000-03-06 信越半導体株式会社 シリコン単結晶の製造方法及び装置
JP2758093B2 (ja) * 1991-10-07 1998-05-25 信越半導体株式会社 半導体ウェーハの製造方法
JPH0684925A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体基板およびその処理方法
DE4490103T1 (de) 1993-01-06 1997-07-24 Nippon Steel Corp Verfahren und Vorrichtung zum Vorherbestimmen der Kristallqualität eines Halbleiter- Einkristalls
JPH0741383A (ja) 1993-07-29 1995-02-10 Nippon Steel Corp 半導体単結晶およびその製造方法
JPH07158458A (ja) * 1993-12-10 1995-06-20 Mitsubishi Motors Corp 多気筒内燃エンジンの吸気制御装置
DE4414947C2 (de) * 1993-12-16 1998-12-17 Wacker Siltronic Halbleitermat Verfahren zum Ziehen eines Einkristalls aus Silicium
JP3276500B2 (ja) 1994-01-14 2002-04-22 ワッカー・エヌエスシーイー株式会社 シリコンウェーハとその製造方法
US5474020A (en) 1994-05-06 1995-12-12 Texas Instruments Incorporated Oxygen precipitation control in czochralski-grown silicon cyrstals
KR960005669A (ko) 1994-07-21 1996-02-23 이헌조 흑백브라운관의 형광막 형성방법 및 장치
JP2874834B2 (ja) * 1994-07-29 1999-03-24 三菱マテリアル株式会社 シリコンウェーハのイントリンシックゲッタリング処理法
JP3285111B2 (ja) 1994-12-05 2002-05-27 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶の製造方法
US5966282A (en) * 1994-12-20 1999-10-12 A. C. Data Systems, Inc. Power surge protection assembly
JPH08208374A (ja) 1995-01-25 1996-08-13 Nippon Steel Corp シリコン単結晶およびその製造方法
US5593494A (en) 1995-03-14 1997-01-14 Memc Electronic Materials, Inc. Precision controlled precipitation of oxygen in silicon
JP2826589B2 (ja) 1995-03-30 1998-11-18 住友シチックス株式会社 単結晶シリコン育成方法
JPH08337490A (ja) 1995-06-09 1996-12-24 Shin Etsu Handotai Co Ltd 結晶欠陥の少ないシリコン単結晶及びその製造方法
JP3006669B2 (ja) 1995-06-20 2000-02-07 信越半導体株式会社 結晶欠陥の均一なシリコン単結晶の製造方法およびその製造装置
JP4020987B2 (ja) 1996-01-19 2007-12-12 信越半導体株式会社 ウエーハ周辺部に結晶欠陥がないシリコン単結晶およびその製造方法
US5958133A (en) * 1996-01-29 1999-09-28 General Signal Corporation Material handling system for growing high-purity crystals
JP3417515B2 (ja) 1996-03-22 2003-06-16 信越半導体株式会社 シリコン単結晶基板の結晶欠陥評価方法
DE19613282A1 (de) * 1996-04-03 1997-10-09 Leybold Ag Vorrichtung zum Ziehen von Einkristallen
DE19637182A1 (de) 1996-09-12 1998-03-19 Wacker Siltronic Halbleitermat Verfahren zur Herstellung von Halbleiterscheiben aus Silicium mit geringer Defektdichte
JPH10152395A (ja) 1996-11-21 1998-06-09 Komatsu Electron Metals Co Ltd シリコン単結晶の製造方法
US5789309A (en) 1996-12-30 1998-08-04 Memc Electronic Materials, Inc. Method and system for monocrystalline epitaxial deposition
KR100237829B1 (ko) 1997-02-06 2000-01-15 윤종용 웨이퍼의 결함 분석방법
US6045610A (en) 1997-02-13 2000-04-04 Samsung Electronics Co., Ltd. Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnance
US5994761A (en) * 1997-02-26 1999-11-30 Memc Electronic Materials Spa Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
DE19711922A1 (de) 1997-03-21 1998-09-24 Wacker Siltronic Halbleitermat Vorrichtung und Verfahren zum Ziehen eines Einkristalls
TW494146B (en) * 1997-04-09 2002-07-11 Memc Electronic Materials Spa Process for growing a single crystal silicon ingot
US6379642B1 (en) * 1997-04-09 2002-04-30 Memc Electronic Materials, Inc. Vacancy dominated, defect-free silicon
JP3449729B2 (ja) 1997-04-09 2003-09-22 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 単結晶シリコンウエハを製造する方法
JPH1179889A (ja) 1997-07-09 1999-03-23 Shin Etsu Handotai Co Ltd 結晶欠陥が少ないシリコン単結晶の製造方法、製造装置並びにこの方法、装置で製造されたシリコン単結晶とシリコンウエーハ
US5942032A (en) 1997-08-01 1999-08-24 Memc Electronic Materials, Inc. Heat shield assembly and method of growing vacancy rich single crystal silicon
US5922127A (en) 1997-09-30 1999-07-13 Memc Electronic Materials, Inc. Heat shield for crystal puller
JP3919308B2 (ja) 1997-10-17 2007-05-23 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶の製造方法ならびにこの方法で製造されたシリコン単結晶およびシリコンウエーハ
JP3596257B2 (ja) 1997-11-19 2004-12-02 三菱住友シリコン株式会社 シリコン単結晶ウェーハの製造方法
US6245430B1 (en) * 1997-12-12 2001-06-12 Sumitomo Sitix Corporation Silicon single crystal wafer and manufacturing method for it
JP3634133B2 (ja) 1997-12-17 2005-03-30 信越半導体株式会社 結晶欠陥の少ないシリコン単結晶の製造方法及びシリコン単結晶ウエーハ
JP4147599B2 (ja) 1997-12-26 2008-09-10 株式会社Sumco シリコン単結晶及びその製造方法
JP3627498B2 (ja) 1998-01-19 2005-03-09 信越半導体株式会社 シリコン単結晶の製造方法
JP3955375B2 (ja) 1998-01-19 2007-08-08 信越半導体株式会社 シリコン単結晶の製造方法およびシリコン単結晶ウエーハ
DE19823962A1 (de) 1998-05-28 1999-12-02 Wacker Siltronic Halbleitermat Verfahren zur Herstellung eines Einkristalls
US6077343A (en) 1998-06-04 2000-06-20 Shin-Etsu Handotai Co., Ltd. Silicon single crystal wafer having few defects wherein nitrogen is doped and a method for producing it
US6093913A (en) 1998-06-05 2000-07-25 Memc Electronic Materials, Inc Electrical heater for crystal growth apparatus with upper sections producing increased heating power compared to lower sections
CN1155074C (zh) 1998-09-02 2004-06-23 Memc电子材料有限公司 从低缺陷密度的单晶硅上制备硅-绝缘体结构
DE69913731T2 (de) * 1998-10-14 2004-10-14 Memc Electronic Materials, Inc. Im wesentlichen defektfreie epitaktische siliziumscheiben
CN1296526C (zh) * 1998-10-14 2007-01-24 Memc电子材料有限公司 热退火后的低缺陷密度单晶硅
US20020084451A1 (en) * 2000-12-29 2002-07-04 Mohr Thomas C. Silicon wafers substantially free of oxidation induced stacking faults

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5487354A (en) * 1993-12-16 1996-01-30 Wacker-Chemitronic Gesellschaft Fuer Eletronik-Grundstoffe Mbh Method for pulling a silicon single crystal
JPH0812493A (ja) * 1994-06-30 1996-01-16 Sumitomo Sitix Corp シリコン単結晶の製造方法
JPH08330316A (ja) * 1995-05-31 1996-12-13 Sumitomo Sitix Corp シリコン単結晶ウェーハおよびその製造方法
SG64470A1 (en) * 1997-02-13 1999-04-27 Samsung Electronics Co Ltd Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EFFECT OF CRYSTAL DEFECTS ON DEVICE CHARACTERISTICS *
THE DEPENDENCE OF BULK DEFECTS ON THE AXIAL TEMPERATURE GRADIENT OF SILICON CRYSTALS DURING CZOCHRALSKI GROWTH *

Also Published As

Publication number Publication date
US20020139294A1 (en) 2002-10-03
EP0973963A1 (en) 2000-01-26
US6287380B1 (en) 2001-09-11
CN1253610C (zh) 2006-04-26
JP3544676B2 (ja) 2004-07-21
JP4477569B2 (ja) 2010-06-09
CN1936113A (zh) 2007-03-28
WO1998045510A1 (en) 1998-10-15
KR20060002028A (ko) 2006-01-06
WO1998045509A1 (en) 1998-10-15
EP1273684A3 (en) 2003-11-26
EP0973963B1 (en) 2002-06-19
DE69807676D1 (de) 2002-10-10
CN1936112A (zh) 2007-03-28
JP4274973B2 (ja) 2009-06-10
JP2001500468A (ja) 2001-01-16
JP2006056779A (ja) 2006-03-02
EP1209258A2 (en) 2002-05-29
CN1280454C (zh) 2006-10-18
KR20040065306A (ko) 2004-07-21
EP0973964B1 (en) 2002-09-04
US6409826B2 (en) 2002-06-25
US6409827B2 (en) 2002-06-25
DE69807676T2 (de) 2003-04-24
EP1209259B1 (en) 2009-03-25
US5919302A (en) 1999-07-06
MY127383A (en) 2006-11-30
US20050205000A1 (en) 2005-09-22
KR20010006229A (ko) 2001-01-26
DE69840690D1 (de) 2009-05-07
CN1255169A (zh) 2000-05-31
KR100508048B1 (ko) 2005-08-17
EP1118697A3 (en) 2001-09-05
DE69831618D1 (de) 2005-10-20
EP1209258B1 (en) 2004-06-16
EP1209259A3 (en) 2003-08-20
DE69813041D1 (de) 2003-05-08
CN1257556A (zh) 2000-06-21
CN1280455C (zh) 2006-10-18
US20020170485A1 (en) 2002-11-21
EP0972094B1 (en) 2001-10-04
DE69824647T2 (de) 2005-06-09
KR20010006227A (ko) 2001-01-26
CN101070621B (zh) 2012-09-05
CN100595351C (zh) 2010-03-24
DE69813041T2 (de) 2004-01-15
EP0972094A1 (en) 2000-01-19
MY120036A (en) 2005-08-30
DE69824647D1 (de) 2004-07-22
JP3449731B2 (ja) 2003-09-22
KR20010006182A (ko) 2001-01-26
EP1118697B1 (en) 2003-04-02
JP2000513696A (ja) 2000-10-17
SG105509A1 (en) 2004-08-27
CN100547122C (zh) 2009-10-07
JP2003192492A (ja) 2003-07-09
CN1261928A (zh) 2000-08-02
EP1273684A2 (en) 2003-01-08
EP1209259A2 (en) 2002-05-29
DE69806137D1 (de) 2002-07-25
MY127584A (en) 2006-12-29
EP0973964A1 (en) 2000-01-26
JP3782387B2 (ja) 2006-06-07
TW577939B (en) 2004-03-01
JP2003192490A (ja) 2003-07-09
JP2001518874A (ja) 2001-10-16
US6605150B2 (en) 2003-08-12
JP2003192493A (ja) 2003-07-09
JP2006062960A (ja) 2006-03-09
WO1998045508A1 (en) 1998-10-15
US20010025597A1 (en) 2001-10-04
JP2004155655A (ja) 2004-06-03
SG105510A1 (en) 2004-08-27
JP4291559B2 (ja) 2009-07-08
US20010020437A1 (en) 2001-09-13
JP4299523B2 (ja) 2009-07-22
TWI257962B (en) 2006-07-11
TW494146B (en) 2002-07-11
MY127594A (en) 2006-12-29
CN1936112B (zh) 2011-05-11
EP1209258A3 (en) 2002-08-28
JP4313356B2 (ja) 2009-08-12
JP3449730B2 (ja) 2003-09-22
DE69801903T2 (de) 2002-03-28
MY120441A (en) 2005-10-31
US20040070012A1 (en) 2004-04-15
CN101070621A (zh) 2007-11-14
EP1118697A2 (en) 2001-07-25
DE69801903D1 (de) 2001-11-08
US20020007779A1 (en) 2002-01-24
DE69831618T2 (de) 2006-06-29
KR20050049561A (ko) 2005-05-25
CN1854353A (zh) 2006-11-01
DE69806137T2 (de) 2002-11-21
US6638357B2 (en) 2003-10-28
MY132874A (en) 2007-10-31
US6254672B1 (en) 2001-07-03
EP1273684B1 (en) 2005-09-14
US20040089224A1 (en) 2004-05-13
US6632278B2 (en) 2003-10-14

Similar Documents

Publication Publication Date Title
SG165151A1 (en) Low defect density silicon
KR100411571B1 (ko) 단결정 잉곳의 제조장치
KR100268712B1 (ko) 단결정 인발방법 및 그 장치
EP1688519A3 (en) Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults
US6197111B1 (en) Heat shield assembly for crystal puller
KR100295040B1 (ko) 핫존로에서의인상속도프로파일을조절하여단결정실리콘잉곳및웨이퍼를제조하는방법,그에따라제조된잉곳및웨이퍼
US6472040B1 (en) Semi-pure and pure monocrystalline silicon ingots and wafers
EP1148158A3 (en) Process for controlling thermal history of czochralski-grown silicon
WO2007137182A3 (en) Controlling agglomerated point defect and oxygen cluster formation induced by the lateral surface of a silicon single crystal during cz growth
EP1021598A1 (en) Heat shield for crystal puller
Wang et al. Analysis of crystal growth characteristics in a conventional vertical Bridgman configuration
US6086671A (en) Method for growing a silicon single crystal
US6458202B1 (en) Process for preparing single crystal silicon having uniform thermal history
JP3086850B2 (ja) 単結晶の成長方法及び装置
CN1162028A (zh) 拉单晶装置
JPH11130592A (ja) シリコン単結晶の製造方法
JPS5930792A (ja) 単結晶育成装置
US7208042B2 (en) Method of manufacturing silicon single crystal and silicon single crystal manufactured by the method
MY133116A (en) Process for preparing defect free silicon crystals which allows for variability in process conditions
GB2338909A (en) Heat and interface control during single crystal growth
US20060272570A1 (en) Method for producing a single crystal
EP1346086A2 (en) Process for controlling thermal history of vacancy-dominated, single crystal silicon
US5935327A (en) Apparatus for growing silicon crystals
JP3799865B2 (ja) 単結晶引上装置用黒鉛ルツボおよび単結晶引上装置
JPH03137090A (ja) シリコン単結晶引上げ方法