SG10201700805WA - Oxide semiconductor stacked film and semiconductor device - Google Patents

Oxide semiconductor stacked film and semiconductor device

Info

Publication number
SG10201700805WA
SG10201700805WA SG10201700805WA SG10201700805WA SG10201700805WA SG 10201700805W A SG10201700805W A SG 10201700805WA SG 10201700805W A SG10201700805W A SG 10201700805WA SG 10201700805W A SG10201700805W A SG 10201700805WA SG 10201700805W A SG10201700805W A SG 10201700805WA
Authority
SG
Singapore
Prior art keywords
stacked film
semiconductor device
oxide semiconductor
semiconductor
oxide
Prior art date
Application number
SG10201700805WA
Other languages
English (en)
Inventor
Shunpei Yamazaki
Masashi Tsubuku
Ryosuke Watanabe
Masashi Oota
Noritaka Ishihara
Koki Inoue
Original Assignee
Semiconductor Energy Lab Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Lab Co Ltd filed Critical Semiconductor Energy Lab Co Ltd
Publication of SG10201700805WA publication Critical patent/SG10201700805WA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/751Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/14Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H10D30/6756Amorphous oxide semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • H10D62/402Amorphous materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13069Thin film transistor [TFT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
SG10201700805WA 2012-08-03 2013-07-25 Oxide semiconductor stacked film and semiconductor device SG10201700805WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012173388 2012-08-03

Publications (1)

Publication Number Publication Date
SG10201700805WA true SG10201700805WA (en) 2017-02-27

Family

ID=50024598

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201700805WA SG10201700805WA (en) 2012-08-03 2013-07-25 Oxide semiconductor stacked film and semiconductor device
SG11201505225TA SG11201505225TA (en) 2012-08-03 2013-07-25 Oxide semiconductor stacked film and semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201505225TA SG11201505225TA (en) 2012-08-03 2013-07-25 Oxide semiconductor stacked film and semiconductor device

Country Status (8)

Country Link
US (3) US8890159B2 (enrdf_load_stackoverflow)
EP (1) EP2880690B1 (enrdf_load_stackoverflow)
JP (3) JP5980737B2 (enrdf_load_stackoverflow)
KR (1) KR102243843B1 (enrdf_load_stackoverflow)
IN (1) IN2015DN01663A (enrdf_load_stackoverflow)
SG (2) SG10201700805WA (enrdf_load_stackoverflow)
TW (1) TWI605591B (enrdf_load_stackoverflow)
WO (1) WO2014021442A1 (enrdf_load_stackoverflow)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101968855B1 (ko) * 2009-06-30 2019-04-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제조 방법
KR102113160B1 (ko) * 2012-06-15 2020-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9190525B2 (en) 2012-07-06 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor layer
WO2014024808A1 (en) 2012-08-10 2014-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20150043307A (ko) * 2012-08-10 2015-04-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제조 방법
JP6220597B2 (ja) 2012-08-10 2017-10-25 株式会社半導体エネルギー研究所 半導体装置
TW202422663A (zh) 2012-09-14 2024-06-01 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
US9263531B2 (en) 2012-11-28 2016-02-16 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film, film formation method thereof, and semiconductor device
US9153649B2 (en) 2012-11-30 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for evaluating semiconductor device
JP6320009B2 (ja) 2012-12-03 2018-05-09 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
WO2014103901A1 (en) 2012-12-25 2014-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8981374B2 (en) * 2013-01-30 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9190527B2 (en) 2013-02-13 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of semiconductor device
US9368636B2 (en) 2013-04-01 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device comprising a plurality of oxide semiconductor layers
KR102264971B1 (ko) 2013-05-20 2021-06-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6400336B2 (ja) 2013-06-05 2018-10-03 株式会社半導体エネルギー研究所 半導体装置
JP6435124B2 (ja) 2013-07-08 2018-12-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP6322503B2 (ja) 2013-07-16 2018-05-09 株式会社半導体エネルギー研究所 半導体装置
JP6401977B2 (ja) 2013-09-06 2018-10-10 株式会社半導体エネルギー研究所 半導体装置
TWI646690B (zh) 2013-09-13 2019-01-01 半導體能源研究所股份有限公司 半導體裝置及其製造方法
KR102183763B1 (ko) * 2013-10-11 2020-11-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
KR102220450B1 (ko) * 2013-12-02 2021-02-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
TWI666770B (zh) 2013-12-19 2019-07-21 日商半導體能源研究所股份有限公司 半導體裝置
US9401432B2 (en) 2014-01-16 2016-07-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US20150263140A1 (en) * 2014-03-14 2015-09-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP6486712B2 (ja) * 2014-04-30 2019-03-20 株式会社半導体エネルギー研究所 酸化物半導体膜
US9379190B2 (en) * 2014-05-08 2016-06-28 Flosfia, Inc. Crystalline multilayer structure and semiconductor device
TWI772799B (zh) * 2014-05-09 2022-08-01 日商半導體能源研究所股份有限公司 半導體裝置
TWI672804B (zh) * 2014-05-23 2019-09-21 日商半導體能源研究所股份有限公司 半導體裝置的製造方法
TWI663726B (zh) 2014-05-30 2019-06-21 Semiconductor Energy Laboratory Co., Ltd. 半導體裝置、模組及電子裝置
KR102437450B1 (ko) * 2014-06-13 2022-08-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 및 반도체 장치를 포함하는 전자 기기
DE112015003266T5 (de) * 2014-07-15 2017-04-13 Semiconductor Energy Laboratory Co., Ltd. Halbleitervorrichtung, Herstellungsverfahren dafür und Anzeigevorrichtung mit der Halbleitervorrichtung
TWI588978B (zh) * 2014-08-18 2017-06-21 群創光電股份有限公司 薄膜電晶體及顯示面板
US10396210B2 (en) * 2014-12-26 2019-08-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with stacked metal oxide and oxide semiconductor layers and display device including the semiconductor device
US9633710B2 (en) 2015-01-23 2017-04-25 Semiconductor Energy Laboratory Co., Ltd. Method for operating semiconductor device
US10199283B1 (en) 2015-02-03 2019-02-05 Pdf Solutions, Inc. Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage
US9799575B2 (en) 2015-12-16 2017-10-24 Pdf Solutions, Inc. Integrated circuit containing DOEs of NCEM-enabled fill cells
WO2016125052A1 (ja) * 2015-02-06 2016-08-11 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
WO2016139551A1 (en) * 2015-03-03 2016-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, or display device including the same
JP6705663B2 (ja) * 2015-03-06 2020-06-03 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
US10008609B2 (en) * 2015-03-17 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, or display device including the same
KR20160114511A (ko) 2015-03-24 2016-10-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
US9842938B2 (en) * 2015-03-24 2017-12-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including semiconductor device
US9806200B2 (en) 2015-03-27 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10714633B2 (en) 2015-12-15 2020-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
US10978438B1 (en) 2015-12-16 2021-04-13 Pdf Solutions, Inc. IC with test structures and E-beam pads embedded within a contiguous standard cell area
US10593604B1 (en) 2015-12-16 2020-03-17 Pdf Solutions, Inc. Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
WO2017141140A1 (en) 2016-02-18 2017-08-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, display device, and electronic device
WO2017149428A1 (en) 2016-03-04 2017-09-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device including the semiconductor device
WO2017153882A1 (en) 2016-03-11 2017-09-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, and display device including the semiconductor device
WO2017153862A1 (en) 2016-03-11 2017-09-14 Semiconductor Energy Laboratory Co., Ltd. Composite and transistor
US9929063B1 (en) 2016-04-04 2018-03-27 Pdf Solutions, Inc. Process for making an integrated circuit that includes NCEM-Enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
US9653446B1 (en) 2016-04-04 2017-05-16 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and AA-short-configured, NCEM-enabled fill cells
US9905553B1 (en) 2016-04-04 2018-02-27 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells
KR102320483B1 (ko) * 2016-04-08 2021-11-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR102506007B1 (ko) 2016-04-13 2023-03-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터의 제작 방법
CN106158978B (zh) * 2016-07-08 2019-05-21 武汉华星光电技术有限公司 薄膜晶体管、阵列基板及其制备方法
JP6558326B2 (ja) * 2016-08-23 2019-08-14 信越化学工業株式会社 ハーフトーン位相シフトマスクブランクの製造方法、ハーフトーン位相シフトマスクブランク、ハーフトーン位相シフトマスク及びフォトマスクブランク用薄膜形成装置
KR102755727B1 (ko) * 2016-12-30 2025-01-15 엘지디스플레이 주식회사 산화물 박막트랜지스터 및 그 제조 방법과, 이를 이용한 표시패널 및 표시장치
US9748153B1 (en) 2017-03-29 2017-08-29 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure
US9773774B1 (en) 2017-03-30 2017-09-26 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells
CN107146816B (zh) * 2017-04-10 2020-05-15 华南理工大学 一种氧化物半导体薄膜及由其制备的薄膜晶体管
US9768083B1 (en) 2017-06-27 2017-09-19 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells
US9786649B1 (en) 2017-06-27 2017-10-10 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells
US9865583B1 (en) 2017-06-28 2018-01-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including stitch open configured fill cells
US10096530B1 (en) 2017-06-28 2018-10-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells
CN107611085B (zh) * 2017-10-24 2019-12-24 深圳市华星光电半导体显示技术有限公司 Oled背板的制作方法
US12020517B2 (en) 2018-01-26 2024-06-25 Tadano Ltd. Wireless communication device, work vehicle, and work vehicle wireless communication system
JP7137979B2 (ja) * 2018-07-09 2022-09-15 キオクシア株式会社 半導体装置
WO2020084406A1 (ja) 2018-10-26 2020-04-30 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
US10978563B2 (en) 2018-12-21 2021-04-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US11107929B2 (en) 2018-12-21 2021-08-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102789312B1 (ko) 2019-04-05 2025-04-03 소니그룹주식회사 촬상 소자, 적층형 촬상 소자 및 고체 촬상 장치, 및, 촬상 소자의 제조 방법
JP7637619B2 (ja) 2019-06-21 2025-02-28 株式会社半導体エネルギー研究所 金属酸化物および半導体装置
KR102708310B1 (ko) * 2019-07-05 2024-09-24 주성엔지니어링(주) 박막 트랜지스터
KR102815117B1 (ko) * 2019-08-19 2025-06-04 주성엔지니어링(주) 박막 트랜지스터 및 이의 제조 방법
KR102216132B1 (ko) 2019-08-26 2021-02-16 에스케이하이닉스 주식회사 반도체 장치 및 반도체 장치의 제조 방법
US11379231B2 (en) 2019-10-25 2022-07-05 Semiconductor Energy Laboratory Co., Ltd. Data processing system and operation method of data processing system
JP7026717B2 (ja) * 2020-04-01 2022-02-28 株式会社半導体エネルギー研究所 半導体装置
CN111785656B (zh) * 2020-07-28 2023-08-15 哈尔滨工业大学 电子器件氧化层中固定负电荷陷阱的检测方法
JP2022038209A (ja) * 2020-08-26 2022-03-10 キオクシア株式会社 半導体装置
KR20230063666A (ko) 2021-11-02 2023-05-09 삼성전자주식회사 반도체 소자
CN114141788A (zh) * 2021-11-17 2022-03-04 惠州华星光电显示有限公司 显示面板及其制作方法
CN115050838B (zh) 2021-12-09 2024-12-24 友达光电股份有限公司 半导体装置及其制造方法
JPWO2023189002A1 (enrdf_load_stackoverflow) 2022-03-30 2023-10-05
KR20240151222A (ko) 2022-03-30 2024-10-17 가부시키가이샤 재팬 디스프레이 산화물 반도체막, 박막 트랜지스터 및 전자 기기
JP2023149085A (ja) 2022-03-30 2023-10-13 株式会社ジャパンディスプレイ 半導体装置の製造方法
JPWO2023189003A1 (enrdf_load_stackoverflow) 2022-03-30 2023-10-05
JP2023149086A (ja) 2022-03-30 2023-10-13 株式会社ジャパンディスプレイ 半導体装置の製造方法
JPWO2023223657A1 (enrdf_load_stackoverflow) 2022-05-19 2023-11-23
JP2025517297A (ja) * 2022-05-24 2025-06-05 ジュスン エンジニアリング カンパニー リミテッド 酸化物トランジスタ及びその製造方法
KR20240169711A (ko) 2022-05-26 2024-12-03 가부시키가이샤 재팬 디스프레이 반도체 장치
CN119422456A (zh) 2022-06-10 2025-02-11 株式会社日本显示器 薄膜晶体管及电子设备
JP2024008440A (ja) 2022-07-08 2024-01-19 株式会社ジャパンディスプレイ 半導体装置
JP2024011504A (ja) 2022-07-14 2024-01-25 株式会社ジャパンディスプレイ 半導体装置
JPWO2024029429A1 (enrdf_load_stackoverflow) 2022-08-01 2024-02-08
KR20250023567A (ko) 2022-08-01 2025-02-18 가부시키가이샤 재팬 디스프레이 산화물 반도체막, 박막 트랜지스터, 및 전자 기기
JPWO2024029437A1 (enrdf_load_stackoverflow) 2022-08-01 2024-02-08
JP2024039361A (ja) 2022-09-09 2024-03-22 株式会社ジャパンディスプレイ 半導体装置
JP2024040960A (ja) 2022-09-13 2024-03-26 株式会社ジャパンディスプレイ 半導体装置
JP2024048269A (ja) 2022-09-27 2024-04-08 株式会社ジャパンディスプレイ 半導体装置の製造方法
JP2024051551A (ja) 2022-09-30 2024-04-11 株式会社ジャパンディスプレイ 半導体装置
JP2024053987A (ja) 2022-10-04 2024-04-16 株式会社ジャパンディスプレイ 半導体装置及びその製造方法
JP2024077307A (ja) 2022-11-28 2024-06-07 株式会社ジャパンディスプレイ 半導体装置
WO2024154544A1 (ja) 2023-01-19 2024-07-25 株式会社ジャパンディスプレイ 酸化物半導体膜、薄膜トランジスタ、および電子機器
WO2024154543A1 (ja) 2023-01-19 2024-07-25 株式会社ジャパンディスプレイ 積層構造体、薄膜トランジスタ、および電子機器
JP2024121394A (ja) 2023-02-27 2024-09-06 株式会社ジャパンディスプレイ 半導体装置
WO2024195631A1 (ja) 2023-03-17 2024-09-26 株式会社ジャパンディスプレイ 酸化物半導体膜、積層構造体、薄膜トランジスタ、および電子機器
WO2024195629A1 (ja) 2023-03-17 2024-09-26 株式会社ジャパンディスプレイ 薄膜トランジスタおよび電子機器
WO2024195630A1 (ja) 2023-03-17 2024-09-26 株式会社ジャパンディスプレイ 薄膜トランジスタおよび電子機器
JP2024139916A (ja) 2023-03-28 2024-10-10 株式会社ジャパンディスプレイ 半導体装置、表示装置、及び半導体装置の製造方法
JP2024139917A (ja) 2023-03-28 2024-10-10 株式会社ジャパンディスプレイ 半導体装置及び表示装置
JP2024145744A (ja) 2023-03-31 2024-10-15 株式会社ジャパンディスプレイ 半導体装置及び半導体装置の作製方法
JP2024145782A (ja) 2023-03-31 2024-10-15 株式会社ジャパンディスプレイ 半導体装置及びその製造方法
JP2024163588A (ja) 2023-05-12 2024-11-22 株式会社ジャパンディスプレイ 半導体装置
JP2024163719A (ja) 2023-05-12 2024-11-22 株式会社ジャパンディスプレイ 半導体装置及びその製造方法
JP2025012144A (ja) 2023-07-12 2025-01-24 株式会社ジャパンディスプレイ 半導体装置及び表示装置
JP2025058431A (ja) 2023-09-28 2025-04-09 株式会社ジャパンディスプレイ 半導体装置およびその製造方法
JP2025058604A (ja) 2023-09-28 2025-04-09 株式会社ジャパンディスプレイ 放射線検出装置
JP2025059891A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置
JP2025059551A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置
JP2025059912A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置
JP2025059911A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置
JP2025060044A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置
JP2025059540A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置及び表示装置
JP2025059883A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 表示装置
JP2025059541A (ja) 2023-09-29 2025-04-10 株式会社ジャパンディスプレイ 半導体装置及び表示装置

Family Cites Families (152)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198861A (ja) 1984-03-23 1985-10-08 Fujitsu Ltd 薄膜トランジスタ
JPH0244256B2 (ja) 1987-01-28 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPS63210023A (ja) 1987-02-24 1988-08-31 Natl Inst For Res In Inorg Mater InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法
JPH0244258B2 (ja) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244260B2 (ja) 1987-02-24 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244262B2 (ja) 1987-02-27 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH0244263B2 (ja) 1987-04-22 1990-10-03 Kagaku Gijutsucho Mukizaishitsu Kenkyushocho Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho
JPH05251705A (ja) 1992-03-04 1993-09-28 Fuji Xerox Co Ltd 薄膜トランジスタ
JP3397928B2 (ja) * 1995-03-08 2003-04-21 三洋電機株式会社 半導体デバイス
JP3479375B2 (ja) 1995-03-27 2003-12-15 科学技術振興事業団 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法
DE69635107D1 (de) 1995-08-03 2005-09-29 Koninkl Philips Electronics Nv Halbleiteranordnung mit einem transparenten schaltungselement
JP3625598B2 (ja) 1995-12-30 2005-03-02 三星電子株式会社 液晶表示装置の製造方法
JP4170454B2 (ja) 1998-07-24 2008-10-22 Hoya株式会社 透明導電性酸化物薄膜を有する物品及びその製造方法
JP2000150861A (ja) 1998-11-16 2000-05-30 Tdk Corp 酸化物薄膜
JP3276930B2 (ja) 1998-11-17 2002-04-22 科学技術振興事業団 トランジスタ及び半導体装置
JP2000182976A (ja) * 1998-12-18 2000-06-30 Tdk Corp 半導体の製造方法
TW460731B (en) 1999-09-03 2001-10-21 Ind Tech Res Inst Electrode structure and production method of wide viewing angle LCD
JP4089858B2 (ja) 2000-09-01 2008-05-28 国立大学法人東北大学 半導体デバイス
KR20020038482A (ko) 2000-11-15 2002-05-23 모리시타 요이찌 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널
JP3997731B2 (ja) 2001-03-19 2007-10-24 富士ゼロックス株式会社 基材上に結晶性半導体薄膜を形成する方法
JP2002289859A (ja) 2001-03-23 2002-10-04 Minolta Co Ltd 薄膜トランジスタ
JP3925839B2 (ja) 2001-09-10 2007-06-06 シャープ株式会社 半導体記憶装置およびその試験方法
JP4090716B2 (ja) 2001-09-10 2008-05-28 雅司 川崎 薄膜トランジスタおよびマトリクス表示装置
US7061014B2 (en) 2001-11-05 2006-06-13 Japan Science And Technology Agency Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film
JP4164562B2 (ja) 2002-09-11 2008-10-15 独立行政法人科学技術振興機構 ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ
JP4083486B2 (ja) 2002-02-21 2008-04-30 独立行政法人科学技術振興機構 LnCuO(S,Se,Te)単結晶薄膜の製造方法
CN1445821A (zh) 2002-03-15 2003-10-01 三洋电机株式会社 ZnO膜和ZnO半导体层的形成方法、半导体元件及其制造方法
JP3933591B2 (ja) 2002-03-26 2007-06-20 淳二 城戸 有機エレクトロルミネッセント素子
US7339187B2 (en) 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
JP2004022625A (ja) 2002-06-13 2004-01-22 Murata Mfg Co Ltd 半導体デバイス及び該半導体デバイスの製造方法
US7105868B2 (en) 2002-06-24 2006-09-12 Cermet, Inc. High-electron mobility transistor with zinc oxide
US7067843B2 (en) 2002-10-11 2006-06-27 E. I. Du Pont De Nemours And Company Transparent oxide semiconductor thin film transistors
JP4166105B2 (ja) 2003-03-06 2008-10-15 シャープ株式会社 半導体装置およびその製造方法
JP2004273732A (ja) 2003-03-07 2004-09-30 Sharp Corp アクティブマトリクス基板およびその製造方法
JP4108633B2 (ja) 2003-06-20 2008-06-25 シャープ株式会社 薄膜トランジスタおよびその製造方法ならびに電子デバイス
US7262463B2 (en) 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
KR20060060696A (ko) * 2003-08-29 2006-06-05 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 Ito박막 및 그 제조방법
EP1737044B1 (en) 2004-03-12 2014-12-10 Japan Science and Technology Agency Amorphous oxide and thin film transistor
US7145174B2 (en) 2004-03-12 2006-12-05 Hewlett-Packard Development Company, Lp. Semiconductor device
US7282782B2 (en) 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
US7297977B2 (en) 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US7211825B2 (en) 2004-06-14 2007-05-01 Yi-Chi Shih Indium oxide-based thin film transistors and circuits
JP2006100760A (ja) 2004-09-02 2006-04-13 Casio Comput Co Ltd 薄膜トランジスタおよびその製造方法
US7285501B2 (en) 2004-09-17 2007-10-23 Hewlett-Packard Development Company, L.P. Method of forming a solution processed device
US7298084B2 (en) 2004-11-02 2007-11-20 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
CA2585190A1 (en) 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
WO2006051994A2 (en) 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Light-emitting device
US7453065B2 (en) 2004-11-10 2008-11-18 Canon Kabushiki Kaisha Sensor and image pickup device
US7791072B2 (en) 2004-11-10 2010-09-07 Canon Kabushiki Kaisha Display
US7829444B2 (en) 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
US7863611B2 (en) 2004-11-10 2011-01-04 Canon Kabushiki Kaisha Integrated circuits utilizing amorphous oxides
RU2358355C2 (ru) 2004-11-10 2009-06-10 Кэнон Кабусики Кайся Полевой транзистор
US7579224B2 (en) 2005-01-21 2009-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a thin film semiconductor device
TWI569441B (zh) 2005-01-28 2017-02-01 半導體能源研究所股份有限公司 半導體裝置,電子裝置,和半導體裝置的製造方法
TWI505473B (zh) 2005-01-28 2015-10-21 Semiconductor Energy Lab 半導體裝置,電子裝置,和半導體裝置的製造方法
US7858451B2 (en) 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
US7948171B2 (en) 2005-02-18 2011-05-24 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US20060197092A1 (en) 2005-03-03 2006-09-07 Randy Hoffman System and method for forming conductive material on a substrate
US8681077B2 (en) 2005-03-18 2014-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and display device, driving method and electronic apparatus thereof
WO2006105077A2 (en) 2005-03-28 2006-10-05 Massachusetts Institute Of Technology Low voltage thin film transistor with high-k dielectric material
US7645478B2 (en) 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US8300031B2 (en) 2005-04-20 2012-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element
JP2006344849A (ja) 2005-06-10 2006-12-21 Casio Comput Co Ltd 薄膜トランジスタ
US7402506B2 (en) 2005-06-16 2008-07-22 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7691666B2 (en) 2005-06-16 2010-04-06 Eastman Kodak Company Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby
US7507618B2 (en) 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
KR100711890B1 (ko) 2005-07-28 2007-04-25 삼성에스디아이 주식회사 유기 발광표시장치 및 그의 제조방법
JP2007059128A (ja) 2005-08-23 2007-03-08 Canon Inc 有機el表示装置およびその製造方法
JP4280736B2 (ja) 2005-09-06 2009-06-17 キヤノン株式会社 半導体素子
JP2007073705A (ja) 2005-09-06 2007-03-22 Canon Inc 酸化物半導体チャネル薄膜トランジスタおよびその製造方法
JP5116225B2 (ja) 2005-09-06 2013-01-09 キヤノン株式会社 酸化物半導体デバイスの製造方法
JP4850457B2 (ja) 2005-09-06 2012-01-11 キヤノン株式会社 薄膜トランジスタ及び薄膜ダイオード
JP4981283B2 (ja) * 2005-09-06 2012-07-18 キヤノン株式会社 アモルファス酸化物層を用いた薄膜トランジスタ
JP5078246B2 (ja) 2005-09-29 2012-11-21 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
EP1998373A3 (en) 2005-09-29 2012-10-31 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device having oxide semiconductor layer and manufacturing method thereof
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
JP5037808B2 (ja) 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置
KR101397571B1 (ko) 2005-11-15 2014-05-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그의 제조방법
TWI292281B (en) 2005-12-29 2008-01-01 Ind Tech Res Inst Pixel structure of active organic light emitting diode and method of fabricating the same
US7867636B2 (en) 2006-01-11 2011-01-11 Murata Manufacturing Co., Ltd. Transparent conductive film and method for manufacturing the same
JP4977478B2 (ja) 2006-01-21 2012-07-18 三星電子株式会社 ZnOフィルム及びこれを用いたTFTの製造方法
US7576394B2 (en) 2006-02-02 2009-08-18 Kochi Industrial Promotion Center Thin film transistor including low resistance conductive thin films and manufacturing method thereof
US7977169B2 (en) 2006-02-15 2011-07-12 Kochi Industrial Promotion Center Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof
KR20070101595A (ko) 2006-04-11 2007-10-17 삼성전자주식회사 ZnO TFT
US20070252928A1 (en) 2006-04-28 2007-11-01 Toppan Printing Co., Ltd. Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof
JP5028033B2 (ja) 2006-06-13 2012-09-19 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4609797B2 (ja) 2006-08-09 2011-01-12 Nec液晶テクノロジー株式会社 薄膜デバイス及びその製造方法
JP4999400B2 (ja) 2006-08-09 2012-08-15 キヤノン株式会社 酸化物半導体膜のドライエッチング方法
JP4332545B2 (ja) 2006-09-15 2009-09-16 キヤノン株式会社 電界効果型トランジスタ及びその製造方法
JP5164357B2 (ja) 2006-09-27 2013-03-21 キヤノン株式会社 半導体装置及び半導体装置の製造方法
JP4274219B2 (ja) 2006-09-27 2009-06-03 セイコーエプソン株式会社 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置
US7622371B2 (en) 2006-10-10 2009-11-24 Hewlett-Packard Development Company, L.P. Fused nanocrystal thin film semiconductor and method
US7772021B2 (en) 2006-11-29 2010-08-10 Samsung Electronics Co., Ltd. Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays
JP2008140984A (ja) * 2006-12-01 2008-06-19 Sharp Corp 半導体素子、半導体素子の製造方法、及び表示装置
JP2008140684A (ja) 2006-12-04 2008-06-19 Toppan Printing Co Ltd カラーelディスプレイおよびその製造方法
KR101303578B1 (ko) 2007-01-05 2013-09-09 삼성전자주식회사 박막 식각 방법
US8207063B2 (en) 2007-01-26 2012-06-26 Eastman Kodak Company Process for atomic layer deposition
KR100851215B1 (ko) 2007-03-14 2008-08-07 삼성에스디아이 주식회사 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치
US7795613B2 (en) 2007-04-17 2010-09-14 Toppan Printing Co., Ltd. Structure with transistor
KR101325053B1 (ko) 2007-04-18 2013-11-05 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR20080094300A (ko) 2007-04-19 2008-10-23 삼성전자주식회사 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이
KR101334181B1 (ko) 2007-04-20 2013-11-28 삼성전자주식회사 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법
CN101663762B (zh) 2007-04-25 2011-09-21 佳能株式会社 氧氮化物半导体
KR101345376B1 (ko) 2007-05-29 2013-12-24 삼성전자주식회사 ZnO 계 박막 트랜지스터 및 그 제조방법
US8202365B2 (en) 2007-12-17 2012-06-19 Fujifilm Corporation Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film
JP4555358B2 (ja) 2008-03-24 2010-09-29 富士フイルム株式会社 薄膜電界効果型トランジスタおよび表示装置
KR100941850B1 (ko) 2008-04-03 2010-02-11 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치
KR100963026B1 (ko) 2008-06-30 2010-06-10 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치
KR100963027B1 (ko) 2008-06-30 2010-06-10 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치
JP5345456B2 (ja) 2008-08-14 2013-11-20 富士フイルム株式会社 薄膜電界効果型トランジスタ
JP4623179B2 (ja) 2008-09-18 2011-02-02 ソニー株式会社 薄膜トランジスタおよびその製造方法
JP5451280B2 (ja) 2008-10-09 2014-03-26 キヤノン株式会社 ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置
JP5606682B2 (ja) 2009-01-29 2014-10-15 富士フイルム株式会社 薄膜トランジスタ、多結晶酸化物半導体薄膜の製造方法、及び薄膜トランジスタの製造方法
JP4415062B1 (ja) 2009-06-22 2010-02-17 富士フイルム株式会社 薄膜トランジスタ及び薄膜トランジスタの製造方法
JP4571221B1 (ja) 2009-06-22 2010-10-27 富士フイルム株式会社 Igzo系酸化物材料及びigzo系酸化物材料の製造方法
KR102153841B1 (ko) 2009-07-31 2020-09-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR101506124B1 (ko) * 2009-09-04 2015-03-25 가부시끼가이샤 도시바 박막 트랜지스터 및 그 제조 방법
KR101980505B1 (ko) * 2009-10-08 2019-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체층, 반도체 장치 및 그 제조 방법
JP5497417B2 (ja) 2009-12-10 2014-05-21 富士フイルム株式会社 薄膜トランジスタおよびその製造方法、並びにその薄膜トランジスタを備えた装置
KR101035357B1 (ko) * 2009-12-15 2011-05-20 삼성모바일디스플레이주식회사 산화물 반도체 박막 트랜지스터, 그 제조방법 및 산화물 반도체 박막 트랜지스터를 구비한 유기전계 발광소자
WO2011081009A1 (en) 2009-12-28 2011-07-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2011138934A (ja) 2009-12-28 2011-07-14 Sony Corp 薄膜トランジスタ、表示装置および電子機器
JP2011187506A (ja) 2010-03-04 2011-09-22 Sony Corp 薄膜トランジスタおよびその製造方法、並びに表示装置
CN105810752B (zh) 2010-04-02 2019-11-19 株式会社半导体能源研究所 半导体装置
KR102436902B1 (ko) 2010-04-02 2022-08-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
TWI443829B (zh) * 2010-04-16 2014-07-01 Ind Tech Res Inst 電晶體及其製造方法
JP5606787B2 (ja) * 2010-05-18 2014-10-15 富士フイルム株式会社 薄膜トランジスタの製造方法、並びに、薄膜トランジスタ、イメージセンサー、x線センサー及びx線デジタル撮影装置
US8759820B2 (en) * 2010-08-20 2014-06-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2012029596A1 (en) 2010-09-03 2012-03-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR102637010B1 (ko) * 2010-12-03 2024-02-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
KR101680768B1 (ko) * 2010-12-10 2016-11-29 삼성전자주식회사 트랜지스터 및 이를 포함하는 전자장치
JP2012160679A (ja) 2011-02-03 2012-08-23 Sony Corp 薄膜トランジスタ、表示装置および電子機器
US9166055B2 (en) 2011-06-17 2015-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR20130007426A (ko) 2011-06-17 2013-01-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR102546888B1 (ko) 2011-06-17 2023-06-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 디스플레이 장치
US8748886B2 (en) 2011-07-08 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US9214474B2 (en) 2011-07-08 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8952377B2 (en) 2011-07-08 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8847220B2 (en) 2011-07-15 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5925634B2 (ja) * 2011-08-18 2016-05-25 株式会社半導体エネルギー研究所 半導体の欠陥評価方法
TWI562361B (en) 2012-02-02 2016-12-11 Semiconductor Energy Lab Co Ltd Semiconductor device
US8901556B2 (en) * 2012-04-06 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Insulating film, method for manufacturing semiconductor device, and semiconductor device
KR101621644B1 (ko) * 2012-05-09 2016-05-16 가부시키가이샤 고베 세이코쇼 박막 트랜지스터 및 표시 장치
KR102119914B1 (ko) 2012-05-31 2020-06-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR102071545B1 (ko) 2012-05-31 2020-01-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102113160B1 (ko) 2012-06-15 2020-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US8901557B2 (en) 2012-06-15 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102161077B1 (ko) 2012-06-29 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9190525B2 (en) 2012-07-06 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor layer
KR20140009023A (ko) 2012-07-13 2014-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US20140027762A1 (en) 2012-07-27 2014-01-30 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device
JP6134598B2 (ja) 2012-08-02 2017-05-24 株式会社半導体エネルギー研究所 半導体装置

Also Published As

Publication number Publication date
JP2016184771A (ja) 2016-10-20
JP2014045178A (ja) 2014-03-13
US9583570B2 (en) 2017-02-28
IN2015DN01663A (enrdf_load_stackoverflow) 2015-07-03
US20150349133A1 (en) 2015-12-03
JP2018011077A (ja) 2018-01-18
JP5980737B2 (ja) 2016-08-31
KR102243843B1 (ko) 2021-04-22
US20140034946A1 (en) 2014-02-06
EP2880690B1 (en) 2019-02-27
SG11201505225TA (en) 2015-08-28
EP2880690A1 (en) 2015-06-10
TW201419537A (zh) 2014-05-16
US9123573B2 (en) 2015-09-01
US20150048368A1 (en) 2015-02-19
US8890159B2 (en) 2014-11-18
JP6212179B2 (ja) 2017-10-11
EP2880690A4 (en) 2016-03-30
TWI605591B (zh) 2017-11-11
KR20150038279A (ko) 2015-04-08
WO2014021442A1 (en) 2014-02-06
JP6479118B2 (ja) 2019-03-06

Similar Documents

Publication Publication Date Title
SG10201700805WA (en) Oxide semiconductor stacked film and semiconductor device
TWI562365B (en) Oxide semiconductor film and semiconductor device
SG10201610711UA (en) Semiconductor device
SG11201504940RA (en) Semiconductor device
SG11201503639YA (en) Semiconductor device and manufacturing method thereof
GB201506501D0 (en) Semiconductor device
EP2704189A4 (en) SEMICONDUCTOR DEVICE
SG11201502586QA (en) Semiconductor device, and display device
EP2858110A4 (en) POWER SEMICONDUCTOR COMPONENT
SG10201911825SA (en) Insulating film, method for manufacturing semiconductor device, and semiconductor device
SG11201504825RA (en) Semiconductor device and method for manufacturing the same
TWI560880B (en) Semiconductor device
EP2894952A4 (en) Power semiconductor device
SG10201600065TA (en) Method for manufacturing oxide semiconductor film, method for manufacturing semiconductor device, and semiconductor device
PL2904124T3 (pl) Urządzenie manipulacyjne
AU345700S (en) Cell encapsulation device
GB201213673D0 (en) Semiconductor device and fabrication method
SG11201405097QA (en) Resin composition and semiconductor device
GB2487917B (en) Semiconductor devices and fabrication methods
SG10201504486PA (en) Semiconductor device with biased feature
GB2488587B (en) Semiconductor devices and fabrication methods
EP3046141A4 (en) EVALUATION DEVICE FOR OXIDE SEMICONDUCTOR THIN LAYER
IL238263B (en) A non-volatile semiconductor storage device
SG11201601627XA (en) Semiconductor storage device
SG11201603049WA (en) Semiconductor device fabrication